JP2007235791A5 - - Google Patents

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Publication number
JP2007235791A5
JP2007235791A5 JP2006057308A JP2006057308A JP2007235791A5 JP 2007235791 A5 JP2007235791 A5 JP 2007235791A5 JP 2006057308 A JP2006057308 A JP 2006057308A JP 2006057308 A JP2006057308 A JP 2006057308A JP 2007235791 A5 JP2007235791 A5 JP 2007235791A5
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JP
Japan
Prior art keywords
circuit board
chip
piezoelectric element
piezoelectric device
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006057308A
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Japanese (ja)
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JP2007235791A (en
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Publication date
Application filed filed Critical
Priority to JP2006057308A priority Critical patent/JP2007235791A/en
Priority claimed from JP2006057308A external-priority patent/JP2007235791A/en
Publication of JP2007235791A publication Critical patent/JP2007235791A/en
Publication of JP2007235791A5 publication Critical patent/JP2007235791A5/ja
Withdrawn legal-status Critical Current

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Claims (2)

圧電素子が収容された圧電素子パッケージと、ＩＣチップが搭載された回路基板とを備え、前記圧電素子パッケージの底面に前記回路基板が接続された圧電デバイスであって、 前記回路基板には底壁と側壁を有する凹部が形成され、さらに前記底壁の一部が貫通された開口部を備え、前記開口部に前記ＩＣチップが固定部材により固定され、前記回路基板の底壁に形成された端子と前記ＩＣチップのパッドとが金属ワイヤで接続されていることを特徴とする圧電デバイス。   A piezoelectric device comprising a piezoelectric element package containing a piezoelectric element and a circuit board on which an IC chip is mounted, wherein the circuit board is connected to the bottom surface of the piezoelectric element package, wherein the circuit board has a bottom wall A terminal formed on the bottom wall of the circuit board, wherein the IC chip is fixed to the opening by a fixing member. And a pad of the IC chip connected by a metal wire. 請求項１に記載の圧電デバイスにおいて、
前記回路基板の凹部に前記ＩＣチップおよび前記金属ワイヤを覆う保護用樹脂が充填されていることを特徴とする圧電デバイス。 The piezoelectric device according to claim 1.
A piezoelectric device, wherein a concave portion of the circuit board is filled with a protective resin that covers the IC chip and the metal wire .
JP2006057308A 2006-03-03 2006-03-03 Piezoelectric device Withdrawn JP2007235791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006057308A JP2007235791A (en) 2006-03-03 2006-03-03 Piezoelectric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006057308A JP2007235791A (en) 2006-03-03 2006-03-03 Piezoelectric device

Publications (2)

Publication Number Publication Date
JP2007235791A JP2007235791A (en) 2007-09-13
JP2007235791A5 true JP2007235791A5 (en) 2009-03-26

Family

ID=38555878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006057308A Withdrawn JP2007235791A (en) 2006-03-03 2006-03-03 Piezoelectric device

Country Status (1)

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JP (1) JP2007235791A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104283524B (en) * 2014-10-22 2017-07-14 应达利电子股份有限公司 A kind of piezoelectric quartz crystal resonator and preparation method thereof
JP6543456B2 (en) * 2014-10-24 2019-07-10 京セラ株式会社 Crystal oscillator

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471986A (en) * 1977-11-18 1979-06-08 Toshiba Corp Semiconductor device and production thereof
JPS613436A (en) * 1984-06-18 1986-01-09 Nec Corp Manufacture of package for mounting semiconductor element
JPH0763079B2 (en) * 1985-02-04 1995-07-05 株式会社日立製作所 Semiconductor device
JPH0738422B2 (en) * 1986-03-11 1995-04-26 日本電気株式会社 Method for manufacturing container for semiconductor device
JPH0228349A (en) * 1988-07-18 1990-01-30 Mitsubishi Electric Corp Aluminum nitride package and its manufacture
JPH0273740A (en) * 1988-09-09 1990-03-13 Nippon Hoso Kyokai <Nhk> Frame synchronizing system
JPH06314928A (en) * 1993-04-28 1994-11-08 Nippon Dempa Kogyo Co Ltd Piezoelectric oscillator
JP2960374B2 (en) * 1996-06-17 1999-10-06 松下電器産業株式会社 Piezoelectric oscillator
JP3262765B2 (en) * 1999-06-18 2002-03-04 東洋通信機株式会社 Structure of sheet substrate for piezoelectric oscillator
JP2001177005A (en) * 1999-12-17 2001-06-29 Fujitsu Ltd Semiconductor device and manufacturing method thereof
JP3853219B2 (en) * 2002-01-18 2006-12-06 イビデン株式会社 Semiconductor element built-in substrate and multilayer circuit board
JP2004032456A (en) * 2002-06-27 2004-01-29 Nippon Dempa Kogyo Co Ltd Crystal oscillator for surface mounting
JP3941654B2 (en) * 2002-10-09 2007-07-04 ソニー株式会社 Manufacturing method of semiconductor package
JP4403821B2 (en) * 2004-02-17 2010-01-27 ソニー株式会社 Package substrate and manufacturing method thereof, semiconductor device and manufacturing method thereof, and laminated structure

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