JP2007234345A - Organic el display and manufacturing method of organic el display as well as mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing technology of an organic EL display and related technologies capable of accurately aligning center positions of pixels. <P>SOLUTION: The manufacturing method of the organic EL display comprises a process of positioning a mask with a plurality of openings onto a substrate to be treated, and a process of forming an organic film corresponding to each of a plurality of pixels by deposition using the mask. A center position of each opening of the mask is shifted toward a side of the reference position inside the mask from an ideal center position of the correspondent pixel. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an organic EL (Electroluminescent) display and a related technology.

  At present, organic EL displays, plasma displays, liquid crystal displays, etc. are mainly known as thin flat displays. Among these, the organic EL display uses a self-luminous element and has various advantages such as small visual dependency, power saving, low cost, and simplified manufacturing process. Is expected to become the mainstream.

  The organic EL display has an organic film used as a light emitting layer. Such an organic film is formed by vapor deposition using a mask (also referred to as a shadow mask) (see Patent Document 1). For the vapor deposition, a mask in which openings are accurately provided at positions corresponding to the pixels of the organic EL display is used.

JP 2005-302457 A

  By the way, in vapor deposition as described above, for example, it is assumed that a linear vapor deposition source is used. The inventor of the present application, when performing vapor deposition using the above-described technique, that is, a mask having an opening at an accurate position corresponding to a pixel of an organic EL display, makes the pixel uniform depending on the position in the substrate. It was clarified that the center position of the region is shifted, that is, the position of the light emission center of the pixel is shifted from the original position. In this case, there is a problem that the emission center position of the pixel of the organic EL display cannot be arranged with sufficient positional accuracy due to the shift of the center position. The principle of misalignment will be described later.

  Moreover, such a problem is a problem that may occur not only when a linear deposition source is used but also when another deposition source is used.

  Accordingly, an object of the present invention is to provide a manufacturing technique of an organic EL display and a technique related thereto that can more accurately arrange the light emission center position of a pixel.

  In order to solve the above problems, the invention of claim 1 is a method of manufacturing an organic EL display, wherein a plurality of masks having a plurality of openings are positioned with respect to a substrate to be processed, and a plurality of vapor depositions are performed by vapor deposition using the masks. Forming an organic film corresponding to each of the pixels, and the center position of each opening of the mask is shifted from the ideal center position of the corresponding pixel toward the reference position side in the mask. It is characterized by that.

  According to a second aspect of the present invention, in the method for manufacturing an organic EL display according to the first aspect of the present invention, the shift amount of the center position of each opening from the ideal center position to the predetermined reference position side is from the reference position. It is determined according to the distance to each opening.

  According to a third aspect of the present invention, in the organic EL display manufacturing method according to the first or second aspect of the present invention, the vapor deposition is performed using a linear vapor deposition source extending in the first direction, and the reference position is , Set in the center of the mask in the first direction, and the center position of each opening is shifted from the ideal center position of the corresponding pixel toward the center side of the mask in the first direction. It is characterized by.

  According to a fourth aspect of the present invention, in the method for manufacturing an organic EL display according to the third aspect of the invention, the interval between the openings of the mask becomes smaller as the position where the openings exist is farther from the center in the first direction of the mask. It is characterized by becoming.

  According to a fifth aspect of the present invention, in the method for manufacturing an organic EL display according to the third or fourth aspect of the present invention, in the second direction orthogonal to the first direction, the linear deposition source and the substrate to be processed The mask integrated with the mask moves relative to the mask.

  According to a sixth aspect of the present invention, in the method for manufacturing an organic EL display according to the fifth aspect of the present invention, in the second direction, the linear vapor deposition source and the mask relatively move at a substantially constant speed during vapor deposition. The center position of each opening in the second direction is shifted from the ideal center position of the corresponding pixel toward the center side of the mask in the second direction.

  According to a seventh aspect of the present invention, in the method of manufacturing an organic EL display according to the sixth aspect of the invention, the opening interval of the mask becomes smaller as the position where the openings are located is farther from the center in the second direction of the mask. It is characterized by becoming.

  According to an eighth aspect of the present invention, in the method for manufacturing an organic EL display according to the first or second aspect of the present invention, vapor deposition is performed using a point-shaped vapor deposition source, and the point-shaped vapor deposition source is the first In the direction, no relative movement occurs between the mask and the mask integrated with the substrate to be processed at the time of vapor deposition, and the reference position is determined as the position of the point-shaped vapor deposition source in the first direction, The center position of the opening is shifted from the ideal center position of the corresponding pixel toward the reference position side in the first direction.

  According to a ninth aspect of the present invention, in the method for manufacturing an organic EL display according to the eighth aspect of the present invention, the opening interval of the mask decreases as the position of the opening moves away from the reference position in the first direction. It is characterized by that.

  According to a tenth aspect of the present invention, in the method for manufacturing an organic EL display according to the eighth or ninth aspect of the invention, the dotted vapor deposition source is present at the center in the first direction.

  According to an eleventh aspect of the present invention, in the method for manufacturing an organic EL display according to the first or second aspect of the present invention, vapor deposition is performed using a point-shaped vapor deposition source. Relative to the mask integrated with the substrate to be processed at the time of vapor deposition in a direction, the reference position is determined at the center of the substrate to be processed, and the center position of each opening Is shifted from the ideal center position of the corresponding pixel toward the reference position in the first direction.

  According to a twelfth aspect of the present invention, in the method for manufacturing an organic EL display according to the first or second aspect of the present invention, vapor deposition is performed using a planar vapor deposition source having a vapor deposition source array arranged two-dimensionally. The planar vapor deposition source causes relative movement with respect to the mask integrated with the substrate to be processed during vapor deposition in both the first direction and the second direction orthogonal to the first direction. The reference position is determined at the center of the planar evaporation source, and the center position of each opening is the ideal center position of the corresponding pixel in both the first direction and the second direction. It is shifted toward the reference position side.

  The invention of claim 13 is a method of manufacturing an organic EL display including a step of forming an organic film corresponding to each of a plurality of pixels by vapor deposition using a mask having a plurality of openings, wherein the plurality of pixels include: The masks are arranged at an equal pitch in a predetermined direction, and the opening interval of the mask is different from the pixel interval in the organic EL display.

  The invention of claim 14 is a method of manufacturing an organic EL display including a step of forming an organic film corresponding to each of a plurality of pixels by vapor deposition using a mask having a plurality of openings. The masks are arranged at equal pitches in each of the first direction and the second direction orthogonal to the first direction, and the opening pitch of the mask is different from the arrangement pitch of the plurality of pixels. .

  According to a fifteenth aspect of the present invention, in the method of manufacturing an organic EL display according to the fourteenth aspect of the present invention, the opening distance between the masks decreases as the position where the openings exist is farther from the reference position in the mask. And

  The invention according to claim 16 is characterized in that the center positions of the film thickness uniform regions of the organic film generated corresponding to each of the plurality of pixels are arranged at regular intervals.

  The invention according to claim 17 is a mask for forming an organic film of an organic EL display having a plurality of openings and having a plurality of pixels arranged at substantially equal pitches, It differs from the arrangement pitch of a plurality of pixels.

  The invention according to claim 18 is the method of manufacturing an organic EL display according to any one of claims 1 to 12, wherein the ideal center position is a center position of a light emitting region of each pixel. .

  According to the invention described in claims 1 to 18, the emission center position of the pixel can be more accurately arranged.

<A. First Embodiment>
<Outline of configuration>
FIG. 1 is a schematic perspective view showing a vapor deposition apparatus 1 used for manufacturing an organic EL display. In FIG. 1 and the like, directions and the like are shown using an orthogonal XYZ coordinate system fixed to the apparatus 1.

  As shown in FIG. 1, the vapor deposition apparatus 1 includes a vapor deposition source 2 for vapor deposition of an organic film in a chamber. A substrate (substrate to be processed) 10 masked by a mask 30 is disposed above the vapor deposition source 2. The vapor deposition apparatus 1 can make the inside of a chamber into a vacuum state, and can perform vacuum vapor deposition.

  The vapor deposition apparatus 1 also includes a holder (not shown) that holds the substrate 10 and the mask 30 together after the mask 30 is accurately positioned with respect to the substrate 10, and the substrate that is integrally held. 10 and the mask 30 are further provided with a moving mechanism (not shown) for integrally moving in the Y direction. As this holder, a magnet-type one provided with a magnet portion on the upper side of the substrate 10 and sandwiching the substrate 10 between the magnet portion and the metal mask 30 is used. Vapor deposition is performed in a state where the substrate 10 and the mask 30 are integrated by such a holder.

  Here, the vapor deposition source 2 is a linear vapor deposition source extending in the X direction. A plurality of holes (for example, circular holes) 22 are provided along the X direction in the supply pipe 21 to which the gaseous organic compound is supplied, and the organic compound is directed from the plurality of holes 22 toward the upper substrate 10. Supplied. As described above, the plurality of holes 22 function as a deposition source in the deposition of the organic film. The plurality of holes 22 are also expressed as a vapor deposition source array arranged along the X direction. Further, the plurality of holes 22 are provided from a position substantially directly below the −X side end of the substrate 10 to a position immediately below the + X side end.

  The mask 30 is a plate-like member made of metal. The mask 30 has a plurality of openings, and each opening has a predetermined width (for example, 50 μm to 100 μm (micrometer)), and is provided at a position substantially corresponding to each pixel in the organic EL display. . The arrangement of the openings will be described in detail later.

  FIG. 2 is a conceptual view of the vapor deposition apparatus 1 as seen from the side. As shown in FIG. 2, the vapor deposition source 2, the mask 30, and the substrate 10 are arranged from the bottom to the top in this order. The vapor deposition source 2 and the mask 30 are arranged at a predetermined distance D (for example, 200 mm (millimeters)).

  In the vapor deposition process, first, the mask 30 and the substrate 10 are integrally held in a state where the mask 30 is accurately positioned with respect to the substrate 10, and the both 10 and 30 are integrated. A gaseous organic compound is supplied from the plurality of holes 22 (evaporation source row) of the vapor deposition source 2 and passes through the opening 31 of the mask 30 to be deposited on the lower surface side of the substrate, whereby the vapor deposition film (organic film) is formed. It is formed. Moreover, since the relative movement in the Y direction occurs between the mask 30 (and the substrate 10) and the vapor deposition source 2 by the moving mechanism described above, a large number of openings 31 arranged in the X direction and the Y direction in the mask 30 are formed. An organic compound is deposited on the lower surface side of the substrate. As a result, a plurality of organic films (including a light emitting layer) arranged in large numbers in both the X direction and the Y direction are formed on the substrate 10.

<Deviation of pixel center position>
Here, before describing the case of performing vapor deposition using the mask 30 (30A or the like) according to the present embodiment, first, the case of performing vapor deposition using the mask 30 (30Z) according to the reference example will be described.

  FIG. 41 is a top view showing a mask 30Z according to a reference example. The mask 30Z has a plurality of openings 31, and each of the plurality of openings 31 is provided at a position that accurately corresponds to a pixel of the organic EL display. Specifically, assuming that the pixels of the organic EL display are arranged at a predetermined pitch in the X direction and the Y direction, the openings 31 of the mask 30Z are also arranged at a predetermined pitch in the X direction and the Y direction, respectively. Yes. After the mask 30 is integrated with the substrate 10 during vapor deposition, the center position of each opening of the mask 30Z coincides with the center position of each corresponding pixel in the organic EL display.

  FIG. 3 is a schematic diagram showing a cross-sectional shape of the organic film MK formed on the substrate (more specifically, on the electrode layer or the like formed on the substrate surface). In FIG. 3, the cross-sectional shape of the organic film MK actually formed on the lower surface side of the substrate 10 is independent above the substrate 10 while showing the relationship with the position of the opening 31 of the mask 30 in the X direction. It is expressed. Further, the positions of the plurality of holes 22 (evaporation source row) in FIG. 3 do not represent the actual positions, but are positioned obliquely below the holes 22 located immediately below the openings 31 of the mask 30. 22 conceptually shows the existence. FIG. 3 shows the cross-sectional shape of the organic film formed in the opening on the peripheral edge side of the substrate.

  As shown in FIG. 3, the organic compound (deposited material) coming from the hole 22 obliquely below among the plurality of holes 22 (evaporation source row) is shielded at the edge portion ED of the opening 31 of the mask 30, and the organic layer The film thickness at the peripheral edge of the (deposition layer) decreases.

  4 to 8 are conceptual diagrams showing a state in which the deposited material is shielded by the edge portions ED in the plurality of openings 31 provided at different positions from the center of the substrate. 4 to 8 show the state of shielding at the opening 31 in which the X-direction position is 0 mm, −41 mm, −83 mm, −100 mm, and −150 mm (millimeters) when the center of the substrate is the origin. Corresponding to In these drawings, a straight line connecting each of the plurality of holes 22 and the apex of the edge portion ED is shown. When this straight line is drawn closer to the center in the opening, the degree of shielding is shown. It means big.

  The present inventor first performed a simulation in order to clarify the state of such shielding.

  9 to 13 are simulation results of the organic film deposited in the opening 31 corresponding to FIGS. 4 to 8, respectively. 9 to 13 are shown upside down as compared with FIG. 3 and the like.

  As shown in FIGS. 2 and 4, in the opening 31 (31M) at the center of the mask 30, the number of holes 22 on the lower left side (−X side) and the number of holes 22 on the lower right side (+ X side) are the same. The number of organic compounds (deposits) coming from the lower left side and the organic compounds (deposits) coming from the lower right side are almost the same. Therefore, even if the vapor deposition is shielded at the edge portion of the opening of the mask 30, the amount of reduction due to the shielding of the deposition amount is the same at the left and right edges of the organic film, and the organic film is opened. Is formed so as to have a center position MP as a center position MP (see FIG. 9).

  On the other hand, as shown in FIGS. 2 and 8, in the opening 31 (31S) on the left side (−X side) peripheral side of the mask 30, the number of the right holes 22 is larger than the position directly below the opening 31S. The amount of the organic compound (deposited material) coming from the lower right side increases. For this reason, when the deposit is shielded at the edge of the opening of the mask 30, the shielding amount of the deposit coming from the right side is relatively increased, and the decrease due to the shielding of the deposition amount is the left side of the organic film. It is relatively larger at the right edge than at the edge.

  As a result, the center position MP of the region where the film thickness is substantially constant, in other words, the substantial center position MP of the organic film is located on the left side of the substrate (also referred to as the opening center) AP (also referred to as the opening center). It will shift to the peripheral side (see FIG. 13).

  Here, the center position in a predetermined direction (here, the X direction) of a region (also referred to as “film thickness uniform region”) having a film thickness within a predetermined allowable range (herein, within 5%) with respect to the maximum film thickness. The substantial center position MP is assumed.

  FIG. 14 is a diagram showing the relationship between the position X in the substrate of the opening and the shift amount ΔX (relative to the opening center AP) of the substantial center position MP of the organic film formed in the opening.

  As shown in FIG. 14, in the opening existing at a position 150 mm (millimeters) away from the center on the −X side (left side), the substantial center position MP is about −X side (left side) from the opening center AP. It is shown that it is shifted by 4 μm (micrometer). It can also be seen that the shift amount ΔX increases as the distance in the X direction from the center of the substrate increases. In FIG. 14, an approximate curve (secondary regression curve) CL indicating the relationship between the position X and the shift amount ΔX is also shown.

  As described above, when the mask 30Z is used, it can be seen that the deviation of the center position MP of the uniform film thickness region occurs according to the position X in the substrate.

  In addition, the inventor of the present application measured the cross-sectional shape of the organic film actually formed by vapor deposition using the mask 30Z. 15 to 21 are diagrams showing measurement results of the cross-sectional shape of the organic film actually formed in the plurality of openings 31 having different planar positions in the substrate. 15 to 21, the (X, Y) coordinates of the centers are (−130, 0), (−85, 0), (−45, 0), (0, 0), (45, The shape of the vertical cross section along the X direction of the organic film formed in each opening 31 arranged at the positions of (0), (85, 0), (130, 0) is shown. Here, the center position of the substrate is the origin of the coordinate system.

  As shown in FIGS. 15 to 21, in the opening (FIGS. 15 to 17) on the left side of the substrate, that is, on the −X side (FIGS. 15 to 17), the deposition amount decreases relatively on the right side of the organic film. MP is shifted to the left from the opening center AP. In addition, in the opening on the right side of the substrate, that is, on the + X side (FIGS. 19 to 21), the deposition amount is relatively reduced on the left side of the organic film, and the substantial center position MP is on the right side of the opening center AP. It is off. As described above, the substantial center position MP of the organic film formed in each opening is shifted from the center position AP of the opening toward the peripheral side of the substrate.

  For reference, FIGS. 22 to 28 show the shapes of vertical sections along the Y direction of the organic films formed in the openings 31 arranged at the positions corresponding to FIGS. 15 to 21, respectively. As shown in FIGS. 22 to 28, since the positions in the Y direction of the openings are the same (Y = 0), the cross section of the organic film formed in the openings has a substantially similar shape. Yes. Since each opening is located at the center of the substrate in the Y direction, the cross section of the organic film formed in each opening has a substantially bilaterally symmetric shape.

<Vapor Deposition Using Mask 30A of the Present Invention>
As described above, it is understood that when the vapor deposition is performed using the mask 30Z according to the reference example, the substantial center position MP of the organic film is shifted from the original position. This means that the position of the light emission center of the pixel deviates from the original position.

  Therefore, in order to eliminate such a shift of the center position MP, the present inventor has devised a mask 30A as shown in FIG.

  FIG. 29 is a top view showing a mask 30A according to the present embodiment. In FIG. 29, in order to express the characteristics of the mask 30A in an easy-to-understand manner, the difference in opening interval according to the planar position (specifically, the position in the X direction) is exaggerated.

  As shown in FIG. 29, the opening interval of the mask 30A is different from the pixel interval in the organic EL display. Specifically, the opening interval of the mask 30A varies depending on the planar position of the mask 30A. The center position of each opening of the mask 30A is an ideal center position in design of the corresponding pixel (also referred to as “ideal center position”, usually the center position in the light emitting region of each pixel). The position is shifted from the position) toward the center of the substrate. Hereinafter, the arrangement of openings in the mask 30A will be described in detail.

  In the present application, the “pixel interval in the organic EL display” means an interval between pixels formed by a vapor deposition process (mask vapor deposition process) with one masking. For example, when a full color panel is generated, when R (red) pixels, G (green) pixels, and B (blue) pixels are formed by separate mask vapor deposition processes, the interval between adjacent R pixels is set. Is regarded as a “pixel interval” in an organic EL display. Similarly, an interval between adjacent G pixels or an interval between adjacent B pixels is regarded as a “pixel interval” in the organic EL display.

  30 and 31 are schematic diagrams for explaining the opening position and opening interval of the mask 30A. FIG. 30 is a diagram showing a state near the opening arranged on the left side of the center of the substrate, and FIG. 31 is a diagram showing a state near the opening arranged on the right side of the center of the substrate. In FIGS. 30 and 31, the state near the opening of the mask 30Z according to the reference example is indicated by a broken line on the lower side of each figure for comparison.

  As shown in FIGS. 30 and 31, after the substrate 10 and the mask 30 are positioned and integrated, the center position AP of each opening of the mask 30A is the ideal center position BP of the corresponding pixel in each organic EL display. It is arrange | positioned in the position shifted to the center side with respect to. In other words, the center position AP of each opening is shifted from the ideal center position BP of the corresponding pixel toward the reference position (here, the center position of the substrate) in the mask.

  This is because the substantial center position MP of the organic film is shifted to the peripheral side of the substrate with respect to the center position (AP) of the corresponding opening. It is shifted toward the center side of the substrate. As a result, the substantial center position MP of the organic film formed in the vicinity of each opening can be made closer to the desired center position (ideal center position) BP (ideally matched with the ideal center position BP). become.

  For example, as shown in FIG. 30, in the region on the left side of the center of the mask 30A, the center position AP of the opening 31 is shifted from the ideal center position BP of the pixel toward the center side of the mask 30A (right side in FIG. 30). Has been. As a result, the substantial center position MP of the organic film formed in the vicinity of each opening can be closer to the ideal center position BP (ideally coincides with the ideal center position BP).

  As shown in FIG. 31, in the region on the right side of the center of the mask 30A, the center position AP of the opening 31 is shifted from the ideal center position BP of the pixel toward the center of the mask 30A (left side in FIG. 31). Has been. As a result, the substantial center position MP of the organic film formed in the vicinity of each opening can be closer to the ideal center position BP (ideally coincides with the ideal center position BP).

Further, the shift amount in each opening is preferably the same as the shift amount ΔX in each opening. Specifically, the value of the equation (1) approximating the shift amount ΔX at the position x _n can be set as the shift amount Δx _n . However, the values α and β are respectively predetermined positive numbers, and the lower right subscript in the expression (1) and the like represents the numbers of the openings sequentially attached from the opening on the center side of the substrate. The center position of the mask 30A (also the center position of the substrate) is set as the origin of the coordinate system.

In the mask 30A, a value β that satisfies β> 1 is used in Equation (1), and a shift amount Δx _n that increases as the separation distance x _n from the center of the substrate increases is set. .

  Next, the opening interval q of the mask will be considered.

  Usually, the pixel interval in the organic EL display is a constant value p (see Expression (2)). That is, the plurality of pixels in the organic EL display are arranged at an equal pitch in a predetermined direction.

  Therefore, the opening interval q of the mask is expressed by Expression (3). For simplification of reference numerals, the right side (plus side) of the substrate (FIG. 31) will be considered.

  When the right side of Expression (3) is transformed using Expression (1) and Expression (2), Expression (4) is obtained.

  Since the values α and β are positive numbers, it can be seen from the equation (4) that the opening interval q in the X direction of the mask 30A is smaller than the pixel interval p (q <p).

Further, in this mask 30A, the shift amount Δx _n is determined using a value β (for example, β = 2) that satisfies β> 1 in the equation (1). Therefore, it can be seen from the equation (4) that the opening interval q in the X direction of the mask 30A becomes smaller as the position of the opening moves away from the center in the X direction of the mask 30A.

  According to the mask vapor deposition process using the mask 30A as described above, the center position AP of each opening is shifted to the center side of the substrate, whereby the substantial center position of the organic film formed near each opening. It is possible to bring MP close to the ideal center position BP (ideally, to match the ideal center position BP). That is, the light emission center position of the pixel can be arranged more accurately.

<Modification of First Embodiment>
The value β is not limited to the above value (β> 1), and may be, for example, β = 1. When β = 1, equation (4) is transformed into equation (5) using equation (2).

  A mask 30C (not shown) using such a shift amount may be created, and the mask 30C may be used. The opening interval q in the X direction of the mask 30C is a constant value regardless of the position of the opening, as in 30Z according to the reference example (see FIG. 41) (see Expression (5)). However, the opening interval q in the X direction of the mask 30C is smaller than the pixel interval p (q <p). In this respect, the mask 30C is different from the mask 30Z.

  Also by performing vapor deposition using such a mask 30C, the substantial center position MP of the organic film formed in the vicinity of each opening can be brought close to the ideal center position BP.

  Moreover, in the said 1st Embodiment, although the thing of the type by which the some hole 22 which is a vapor deposition source row | line | column is arranged in the X direction was illustrated as a linear vapor deposition source, it is not limited to this. For example, as shown in FIG. 32, an elongated hole (slit) 23 extending in the X direction is provided on the upper surface of the supply pipe 21 extending in the X direction, and the slit 23 is used as the line-shaped vapor deposition source 2. Good. The linear vapor deposition source 2 in FIG. 32 corresponds to an infinite number of vapor deposition source arrays arranged in the X direction, and the same processing as the vapor deposition processing by the linear vapor deposition source in the first embodiment is performed. Can be regarded as being. Therefore, even in such a case, by performing vapor deposition using the above-described masks 30A, 30C, etc., it is possible to suppress a substantial shift of the center position MP in the X direction of the organic film.

  Moreover, in the said 1st Embodiment, although the case where a linear vapor deposition source was used was illustrated, this invention is not limited to this. For example, a point-like vapor deposition source may be used. Specifically, a point-like vapor deposition source may be fixed at the center position of the substrate in the X direction. Also in this case, when the mask 30Z according to the reference example is used, the substantial center position MP of the organic film is shifted in the X direction as described above. However, by using the above-described masks 30A, 30C, etc. Such “displacement” can be suppressed.

  Alternatively, the above-described idea may be applied when the point-like deposition source is moved in the X direction (in other words, when the position of the point-like deposition source is changed over time). Specifically, when the point-like vapor deposition source is moved at a substantially constant speed from one end of the substrate 10 to the other end in the X direction of the substrate 10, the vapor deposition is performed using the masks 30A, 30C and the like similar to the above. It may be. In such vapor deposition, if processing in the movement time from one end to the other end in the X direction is viewed as one unit process, an infinite number of vapor deposition source arrays are arranged in the X direction within the unit process. Correspondingly, it can be considered that the same process as the vapor deposition process by the linear vapor deposition source in the first embodiment is performed. Therefore, even in such a case, by performing vapor deposition using the above-described masks 30A, 30C, etc., it is possible to suppress a substantial shift of the center position MP in the X direction of the organic film.

<B. Second Embodiment>
In the first embodiment, the case where the displacement of the center position MP in the X direction is suppressed is illustrated. However, in the second embodiment, the displacement of the center position MP in the Y direction is also illustrated. To do.

  The second embodiment is the same as the first embodiment except that a mask 30B is used as the mask 30 instead of the mask 30A. Below, it demonstrates centering around difference.

  In the second embodiment, in the above-described vapor deposition apparatus 1, the integrated substrate 10 and mask 30 move (relatively move) at a substantially constant speed in the Y direction with respect to the linear vapor deposition source 2. The case where vapor deposition is performed is assumed. Specifically, relative movement of the integrated product and the vapor deposition source 2 is performed so that the position immediately above the vapor deposition source 2 passes from one end to the other end of the integrated product of the substrate 10 and the mask 30. At this time, it can be expressed that the center in the Y direction of the mask 30 corresponds to the center of this relative movement.

  In such vapor deposition, an infinite number of vapor deposition source arrays are arranged in the Y direction within a unit process when the process in the movement time in the Y direction from one end of the substrate to the other end is viewed as one unit process. It corresponds to that. Accordingly, “shift” occurs in the substantial center position MP in the Y direction of the organic film as in the X direction.

  Therefore, in the second embodiment, the mask 30B is used. FIG. 33 is a top view showing a mask 30B according to the second embodiment. Here again, it is assumed that the pixel interval in the organic EL display is a constant value in each of the X direction and the Y direction. That is, the plurality of pixels in the organic EL display are arranged at an equal pitch in the X direction and at an equal pitch in the Y direction.

  As shown in FIG. 33, in the mask 30B, in addition to the adjustment of the opening position (and opening interval) in the X direction as in the mask 30A (FIG. 29), the opening position (and opening interval in the Y direction) is adjusted. ) Has also been adjusted. The opening position and the like in the Y direction are adjusted in the same manner as the opening position and the like in the X direction based on the above concept.

  Specifically, the center position of each opening of the mask 30B is arranged at a position shifted from the ideal center position of the corresponding pixel to the center side of the mask 30B in the Y direction. Further, the opening interval in the Y direction of the mask 30B is different from the pixel interval in the Y direction in the organic EL display. Furthermore, the opening interval of the mask 30B differs according to the planar position (particularly the Y direction position) of the opening in the mask 30B.

  For the shift amount in the Y direction, the same idea as that used when correcting the shift amount of the substantial center position MP in the X direction is applied to the Y direction, and the substantial center position in the Y direction is applied. A value suitable for correcting the deviation amount of MP may be set.

  By performing vapor deposition using such a mask 30B, it is possible to suppress a substantial shift of the center position MP in both the X direction and the Y direction.

<Modification of Second Embodiment>
The second embodiment described above can be further modified.

  For example, regarding the shift amount in the Y direction, a mask 30D (not shown) created by setting β to 1 (β = 1) in the same equation as the equation (1) and setting the shift amount of each opening is used. May be. The mask 30D is similar to 30Z (FIG. 41) according to the reference example, but is different in the opening interval.

  About the opening space | interval in the X direction of mask 30D, it is the same as that of mask 30C which concerns on the above-mentioned modification. The opening interval q in the Y direction of the mask 30D is a constant value regardless of the position where the opening exists, but is smaller than the pixel interval p in the Y direction (q <p).

  Also in the second embodiment, a linear deposition source as shown in FIG. 32 may be used.

  Further, instead of a linear vapor deposition source, a dot vapor deposition source or the like may be used.

  Specifically, as shown in FIG. 34, the point-like deposition source is fixed to the center of the substrate in the X direction, and the substrate 10 and the mask 30 are moved in the Y direction with respect to the point-like deposition source 2 (see white arrows). ). Alternatively, the spot-like deposition source 2 may be fixed at the center of the substrate in the Y direction, and the substrate 10 and the mask 30 may be moved in the X direction with respect to the spot-like deposition source 2. In these cases, when the mask 30Z according to the reference example is used, a substantial shift of the center position MP occurs in both the X direction and the Y direction as described above. However, by using the masks 30B, 30D, etc. For example, such “deviation” can be suppressed in both the X direction and the Y direction.

  Alternatively, as shown in FIG. 35, without performing relative movement of the substrate 10 and the mask 30 and the vapor deposition source 2 described above, the point-shaped vapor deposition source is located at the substrate center in the X direction and the substrate center in the Y direction. The deposition may be performed at a certain position. In this case, when the mask 30Z according to the reference example is used, a substantial shift of the center position MP occurs in both the X direction and the Y direction as described above. However, depending on the use of the above-described masks 30B, 30D, and the like. Thus, it is possible to suppress such “deviation”.

  Further, the above idea may be applied when the point-like deposition source is moved in both the X direction and the Y direction.

  Specifically, as shown in FIG. 36, when the point-like deposition source 2 reciprocates between one end and the other end in the X direction of the substrate 10 at a substantially constant speed in the X direction (see white double arrows). At the same time, when the substrate 10 moves with respect to the vapor deposition source 2 at a substantially constant speed in the Y direction (see white arrows), vapor deposition may be performed using the masks 30B, 30D and the like. That is, when the spot-like vapor deposition source 2 moves relative to the substrate 10 in a zigzag manner (see the broken line), vapor deposition may be performed using the masks 30B and 30D described above.

  Alternatively, as shown in FIG. 37, the point-like vapor deposition source 2 reciprocates between the one end and the other end in the X direction of the substrate 10 at a substantially constant speed in the X direction (see white double arrows), and When the position in the Y direction of the substrate 10 with respect to the vapor deposition source 2 is sequentially moved at predetermined intervals (see white arrows) for each one-way movement (or one reciprocal movement), the above-described masks 30B and 30D are used. Alternatively, vapor deposition may be performed. In FIG. 37, the locus of the relative movement of the vapor deposition source 2 with respect to the substrate 10 is indicated by a broken line.

  As described above, the substrate 10 and the spot-like vapor deposition source are relatively moved in the X direction so that the position immediately above the vapor deposition source 2 moves from one side to the other end in the X direction of the substrate 10 at a substantially constant speed. When the substrate 10 and the spot-like vapor deposition source are relatively moved in the Y direction so that one end in the Y direction passes through the position immediately above the vapor deposition source 2 at a substantially constant speed in the Y direction. Vapor deposition may be performed using masks 30B and 30D.

  Further, as shown in FIG. 38, a planar deposition source 2 that is two-dimensionally arranged so that a plurality of holes 22 (evaporation source row) are distributed in both the X direction and the Y direction may be used. Good. Specifically, vapor deposition may be performed with the planar vapor deposition source 2 facing the substrate 10. At the time of vapor deposition, the center of the planar vapor deposition source 2 is preferably matched with the center of the substrate 10, and preferably has an area substantially equal to that of the substrate 10.

<C. Other>
The present invention is not limited to the contents described above, and further modifications and the like are possible.

  For example, in each of the above embodiments, the case where the shift amount of the center position AP of the opening is continuously changed according to the position in the X direction and / or the position in the Y direction is illustrated, but the present invention is not limited to this. The shift amount of the center position AP may be changed stepwise according to the position in the X direction and / or the position in the Y direction. Specifically, the mask 30 may be divided into a plurality of divided regions in the X direction and / or the Y direction, and the shift amount may be set for each divided region. It is also possible to perform vapor deposition using a mask having a plurality of openings shifted by such stepwise shift amounts.

  In addition, each of the above embodiments can be applied to the case where a single panel for an organic EL display is manufactured from a single substrate 10, but the present invention is not limited to this, and a plurality of organic EL displays from a single substrate. Panels (also referred to as “cells”) may be manufactured. Specifically, on the substrate 10, a plurality of cells may be arranged in the X direction and / or the Y direction. For example, as shown in FIG. 39, N cells 11 are arranged in the X direction and M cells 11 are arranged in the Y direction, so that a total of (N × M) cells are formed from one substrate 10. 11 can also be manufactured.

  In this case, the shift amount of the center position AP is set for each cell 11 in accordance with the position of each cell 11 in the substrate 10 in the X direction and / or the Y direction. The shift amount of the center position AP may not be changed. This corresponds to the case where the above-described stepwise shift amount is set, and the region corresponding to each cell in the mask 30 corresponds to the partitioned region partitioned in the X direction and the Y direction described above.

  Further, in each of the above embodiments, the center position of the deposition source in the predetermined direction (X direction and / or Y direction) (the center position of the line deposition source, the center position of the point deposition source, or the moving range of the moving deposition source) The center position of the mask corresponding to the center position is set as the reference position, and the position shifted from the ideal center position BP of each pixel to the reference position side in the predetermined direction becomes the center position AP. Although the case where the mask in which each opening is arrange | positioned was illustrated, it is not limited to this.

  For example, another plane position in the mask 30 (here, the lower left end position of the mask 30) is set as the reference position RF, and the center position AP of each opening is the reference position in a predetermined direction (here, the X direction and the Y direction). The mask 30E shifted to the RF side (see FIG. 40) may be used. Specifically, when the dot-like deposition source 2 is arranged at the position on the lower left side (the −X end side in the X direction and the −Y end side in the Y direction), deposition is performed using such a mask 30E. It can be performed.

  In the mask 30E, the shift amount in the X direction is set according to the distance in the X direction from the reference position RF, which is a position almost directly above the point-like deposition source 2. Specifically, as the distance from the reference position at the left end (−X end side) in the X direction (to the right side) increases, the shift amount of the center position AP of each opening toward the reference position increases. As a result, as shown in FIG. 40, in this mask 30E, as the distance from the reference position RF at the left end (−X end side) in the X direction increases (that is, the opening on the right side), the opening interval decreases. The same applies to the Y direction.

  As described above, the predetermined position of the mask is set as the reference position according to the position of the vapor deposition source in the predetermined direction, and the vapor deposition is performed using the mask in which the center position of each opening is shifted to the reference position side. May be. As a result, the same effects as described above can be obtained.

It is a schematic perspective view which shows the vapor deposition apparatus used for manufacture of an organic electroluminescent display. It is the conceptual diagram which looked at the vapor deposition apparatus from the side. It is a schematic diagram which shows the cross-sectional shape of an organic film. It is a conceptual diagram which shows a mode that a vapor deposit is shielded (X = 0mm). It is a conceptual diagram which shows a mode that a vapor deposit is shielded (X = -41mm). It is a conceptual diagram which shows a mode that a vapor deposit is shielded (X = -83mm). It is a conceptual diagram which shows a mode that a deposit is shielded (X = -100mm). It is a conceptual diagram which shows a mode that a vapor deposit is shielded (X = -150mm). It is a figure which shows the simulation result of an organic film cross section (corresponding to FIG. 4). It is a figure which shows the simulation result of an organic film cross section (corresponding to FIG. 5). It is a figure which shows the simulation result of an organic film cross section (corresponding to FIG. 6). It is a figure which shows the simulation result of an organic film cross section (corresponding to FIG. 7). It is a figure which shows the simulation result of an organic film cross section (corresponding to FIG. 8). It is a figure which shows the relationship between position X in a board | substrate, and the deviation | shift amount (DELTA) X of a substantial opening center position. It is a figure which shows the cross-sectional shape (X direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (X direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (X direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (X direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (X direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (X direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (X direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (Y direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (Y direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (Y direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (Y direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (Y direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (Y direction) of the organic film actually formed. It is a figure which shows the cross-sectional shape (Y direction) of the organic film actually formed. It is a top view which shows the mask which concerns on 1st Embodiment. It is a figure explaining the center position and space | interval of opening of the left side rather than the center of a board | substrate. It is a figure explaining the center position and space | interval of an opening of the right side rather than the center of a board | substrate. It is a perspective view which shows the vapor deposition source which concerns on a modification. It is a top view which shows the mask which concerns on 2nd Embodiment. It is a conceptual diagram which shows the relative movement of a vapor deposition source and a board | substrate. It is a conceptual diagram which shows arrangement | positioning of a vapor deposition source. It is a conceptual diagram which shows the relative movement of a vapor deposition source and a board | substrate. It is a conceptual diagram which shows the relative movement of a vapor deposition source and a board | substrate. It is a figure which shows a planar vapor deposition source. It is a figure which shows that several panels (cell) are manufactured from the board | substrate of 1 sheet. It is a top view which shows the mask which concerns on a modification. It is a top view which shows the mask which concerns on a reference example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Deposition apparatus 2 Deposition source 10 Substrate 21 Supply pipe 23 Slit 30, 30A-30E, 30Z Mask 31, 31M, 31S Aperture AP Center position of opening BP Pixel ideal center position ED Edge portion MP Substantially center position of organic film p Pixel spacing q Aperture spacing ΔX Shift amount Δx _n Shift amount

Claims (18)

An organic EL display manufacturing method comprising:
Positioning a mask having a plurality of openings with respect to the substrate to be processed;
Forming an organic film corresponding to each of a plurality of pixels by vapor deposition using the mask;
Including
The method of manufacturing an organic EL display, wherein the center position of each opening of the mask is shifted from the ideal center position of the corresponding pixel toward the reference position side in the mask. In the manufacturing method of the organic electroluminescent display of Claim 1,
Manufacturing of an organic EL display, characterized in that the shift amount of the center position of each opening from the ideal center position to the predetermined reference position side is determined according to the distance from the reference position to each opening. Method. In the manufacturing method of the organic electroluminescent display of Claim 1 or Claim 2,
The vapor deposition is performed using a linear vapor deposition source extending in the first direction,
The reference position is set to the center of the mask in the first direction;
The method of manufacturing an organic EL display, wherein the center position of each opening is shifted from the ideal center position of the corresponding pixel toward the center side of the mask in the first direction. In the manufacturing method of the organic electroluminescent display of Claim 3,
The method of manufacturing an organic EL display, characterized in that the opening interval of the mask becomes smaller as the position of the opening moves away from the center in the first direction of the mask. In the manufacturing method of the organic electroluminescent display of Claim 3 or Claim 4,
In the second direction orthogonal to the first direction, the linear vapor deposition source and the mask integrated with the substrate to be processed relatively move during vapor deposition. . In the manufacturing method of the organic electroluminescent display of Claim 5,
In the second direction, at the time of vapor deposition, the linear vapor deposition source and the mask relatively move at a substantially constant speed,
The center position of each opening in the second direction is shifted from the ideal center position of the corresponding pixel toward the center side of the mask in the second direction. Production method. In the manufacturing method of the organic electroluminescent display of Claim 6,
The method of manufacturing an organic EL display, characterized in that the opening interval of the mask becomes smaller as the position of the opening moves away from the center in the second direction of the mask. In the manufacturing method of the organic electroluminescent display of Claim 1 or Claim 2,
Vapor deposition is performed using a point-shaped vapor deposition source,
The point-like vapor deposition source does not cause relative movement in the first direction with the mask integrated with the substrate to be processed at the time of vapor deposition,
The reference position is determined at a position of the point-like vapor deposition source in the first direction,
The method of manufacturing an organic EL display, wherein the center position of each opening is shifted from the ideal center position of the corresponding pixel toward the reference position side in the first direction. In the manufacturing method of the organic electroluminescent display of Claim 8,
The method of manufacturing an organic EL display, characterized in that the opening interval of the mask becomes smaller as the position of the opening is further away from the reference position in the first direction. In the manufacturing method of the organic electroluminescent display of Claim 8 or Claim 9,
The method for manufacturing an organic EL display, wherein the point-like vapor deposition source is present in the center in the first direction. In the manufacturing method of the organic electroluminescent display of Claim 1 or Claim 2,
Vapor deposition is performed using a point-shaped vapor deposition source,
The point-like vapor deposition source performs relative movement at a substantially constant speed with the mask integrated with the substrate to be processed at the time of vapor deposition in the first direction.
The reference position is determined at the center of the substrate to be processed,
The method of manufacturing an organic EL display, wherein the center position of each opening is shifted from the ideal center position of the corresponding pixel toward the reference position side in the first direction. In the manufacturing method of the organic electroluminescent display of Claim 1 or Claim 2,
Deposition is performed using a planar deposition source having a deposition source array arranged two-dimensionally,
The planar vapor deposition source does not cause relative movement with respect to the mask integrated with the substrate to be processed at the time of vapor deposition in both the first direction and the second direction orthogonal to the first direction. ,
The reference position is determined at the center of the planar deposition source,
The organic EL display, wherein the center position of each opening is shifted from the ideal center position of the corresponding pixel toward the reference position side in both the first direction and the second direction. Manufacturing method. A method of manufacturing an organic EL display including a step of forming an organic film corresponding to each of a plurality of pixels by vapor deposition using a mask having a plurality of openings,
The plurality of pixels are arranged at an equal pitch in a predetermined direction,
The method of manufacturing an organic EL display, wherein an opening interval of the mask is different from a pixel interval in the organic EL display. A method of manufacturing an organic EL display including a step of forming an organic film corresponding to each of a plurality of pixels by vapor deposition using a mask having a plurality of openings,
The plurality of pixels are arranged at an equal pitch in each of a first direction and a second direction orthogonal to the first direction,
The method of manufacturing an organic EL display, wherein an opening pitch of the mask is different from an arrangement pitch of the plurality of pixels. In the manufacturing method of the organic electroluminescent display of Claim 14,
The method of manufacturing an organic EL display, wherein the opening interval of the mask becomes smaller as the position of the opening moves away from the reference position in the mask.   An organic EL display, characterized in that the center positions of the film thickness uniform regions of the organic film generated corresponding to each of the plurality of pixels are arranged at regular intervals. A mask for forming an organic film of an organic EL display having a plurality of openings and a plurality of pixels arranged at substantially equal pitches,
The pitch of the openings is different from the arrangement pitch of the plurality of pixels. In the manufacturing method of the organic electroluminescent display in any one of Claims 1 thru | or 12,
The method of manufacturing an organic EL display, wherein the ideal center position is a center position of a light emitting region of each pixel.

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