JP2007216342A - Polisher - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polisher, polishing the inner wall surfaces of small-diameter to large-diameter work holes in simple constitution. <P>SOLUTION: While a liquid abrasive 6 is supplied to a gap between a linear material and the inner wall of a work hole, polishing material 1 is rotated in one direction, whereby while a liquid abrasive 6 is fed in the work hole 3, the inner wall surface of the work hole is polished. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention inserts a continuous linear polishing tool into a work hole by combining a plurality of wire rods in a spiral shape, rotates the linear polishing tool in one direction, and feeds the abrasive liquid in the work hole. The present invention relates to a polishing apparatus for polishing a wall surface.

As a wire for cutting a fragile workpiece (workpiece), a core wire made of a metal wire such as a piano wire and electrodeposited with diamond abrasive grains is used and reciprocated while being wound between reels. An apparatus for cutting a workpiece has been proposed (see Patent Document 1).
Further, a grindstone has been proposed in which a large number of abrasive grains are bonded to the surface of a flexible metal wire (wire) via an adhesive as a grindstone for polishing the inner surface of a minute work hole (see Patent Document 2). ).
Alternatively, using a polishing tool in which a synthetic resin is mixed with abrasive grains and sandwiched by an even number of cores, one end of the polishing tool is fixed and the other end is connected to a rotary drive shaft Thus, a technique for polishing the inner surface of the pipe and the inner surface of the hole of the workpiece by rotating the shaft has been proposed (see Patent Document 3).
Japanese Patent Laid-Open No. 11-277398 Japanese Patent Laid-Open No. 8-39435 JP-A-5-245765

However, when cutting a workpiece, it is necessary to affix abrasive grains serving as a cutting blade to the wire, but this is not necessary, for example, when polishing a precision optical component having a through hole formed in the workpiece. In addition, if the hole diameter is reduced, it becomes difficult to uniformly fix the abrasive grains to the metal wire. In particular, if a grindstone that electrodeposits or adheres abrasive grains to the surface of a metal wire is used, it slides in a reciprocating motion after being inserted into the work hole, so depending on how the work hole is applied to the inner wall surface The amount of polishing may vary.
Further, if a polishing tool in which a sheet containing abrasive grains is sandwiched between core materials is inserted into the work hole and rotated, the polishing tool does not enter the small-diameter work hole and cannot be processed.

  An object of the present invention is to solve the above-described problems of the prior art and provide a polishing apparatus capable of accurately polishing the inner wall surface of a work hole having a small diameter to a large diameter with a simple configuration.

In order to achieve the above object, the present invention comprises the following arrangement.
A plurality of wire rods are spirally entangled and a continuous linear polishing tool is inserted into the work hole to fix both ends, and the linear polishing tool can be rotated in one direction by a drive source while tension is applied to the linear polishing tool through the fixing portion. A polishing part, and an abrasive liquid supply part for supplying an abrasive liquid to the gap between the linear polishing tool and the work hole,
While supplying the abrasive liquid from the abrasive liquid supply part to the gap between the linear polishing tool and the work hole, the work hole while rotating the linear polishing tool in one direction in the polishing part and feeding the abrasive liquid in the work hole The inner wall surface is polished.
In addition, the inner wall surface of the work hole is polished by rotating the linear polishing tool and moving the linear polishing tool or the work in the axial direction of the work hole while feeding the abrasive liquid.
The polishing section has a work holding section for holding a work, and a linear polishing tool is guided on both sides of the work hole held by the work holding section, and has a central hole concentric with the axis of the work hole. A guide portion is provided.
Further, the linear polishing tool is characterized in that a plurality of wire rods are wound together and spirally wound.
The linear polishing tool is characterized in that a wire is spirally wound around the core wire and the periphery thereof.
Further, the polishing unit is characterized in that the one end side fixing portion of the linear polishing tool is connected to a driving source and rotated in one direction, and the other end side fixing portion is driven to rotate.
Further, the polishing unit is characterized by rotating in one direction in synchronization with each drive source linked to the both end side fixing portions of the wire.

If the above-described polishing apparatus is used, the linear polishing tool is rotated in one direction while the abrasive liquid is supplied from the abrasive liquid supply unit to the gap between the linear polishing tool and the work hole, and the abrasive grains are rotated in the work hole. Since the work hole inner wall surface is polished while feeding the liquid, the abrasive liquid is fed along the screw-like spiral groove by the rotation of the linear polishing tool, so that the work hole inner wall surface can be uniformly polished. Therefore, the inner wall surface of the work hole having a small diameter to a large diameter can be accurately polished with a simple configuration.
Further, when the linear polishing tool or the workpiece is moved in the axial direction of the workpiece hole while rotating the linear polishing tool to feed the abrasive liquid, the work hole inner wall surface is polished. The inner wall surface of the workpiece hole can be uniformly polished by changing the contact speed.
Further, when a linear polishing tool that is inserted into the work hole and is tensioned on both sides of the work hole is guided by a guide portion having a central hole concentric with the axis of the work hole, the linear polishing tool is moved to the work hole. Therefore, it is possible to uniformly polish the inner wall surface of the workpiece.
Further, the linear polishing tool may be either a spiral wound by winding a plurality of wires, or a wire wound spirally around the core wire and the abrasive liquid by rotation. Can be selected from a wide range of materials such as fiber wires and resin wires.
Further, the polishing unit may be configured such that one end side fixing portion of the linear polishing tool is connected to a driving source and rotated in one direction, and the other end side fixing portion is driven to rotate. The drive sources connected to the both end side fixed portions may be synchronized to rotate in one direction. As a result, it is possible to feed the polishing liquid by rotating it along the spiral groove in the work hole with a simple configuration.

  Hereinafter, the best embodiment of the polishing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. The polishing apparatus of this embodiment can be used for a metal material, a glass material, a ceramic material, or the like as a work, and a polishing apparatus for polishing an inner wall surface of the work hole in which a through hole is formed in the work will be described.

The schematic configuration of the polishing apparatus will be described with reference to FIGS.
First, the configuration of the polishing unit will be described. In FIG. 1, a linear polishing tool 1 that is spirally entangled using a plurality of wires is used. Specifically, the linear polishing tool 1 may be formed by winding a plurality of wire rods 1a and 1b as shown in FIG. 1 and spirally wound, or the core wire 1c as shown in FIG. Further, the wire 1d may be spirally wound around the wire 1d.

  As the wire rods 1a to 1d, in addition to metal wires such as metal wires (for example, piano wires), synthetic resin wires (for example, fishing lines), plant or animal fiber wires (for example, cotton yarn, hemp yarn, wool yarn, intestinal wires), resin wires and various fibers Any of hard and soft materials such as wire can be used.

  The linear polishing tool 1 is inserted into a through hole (work hole) 3 of the work 2. Although the radial size of the linear polishing tool 1 depends on the material of the workpiece 2, the size of the workpiece hole 3 is approximately the same diameter (abuts against the inner wall surface of the hole) or a slight gap is present between the hole inner wall surface and the workpiece hole 3. It may be a size. In the present embodiment, the work 2 is assumed to be a glass lens or a plastic lens. In this case, the linear polishing tool 1 does not have to abut on the work hole inner wall surface. In FIG. 3, both ends of the linear polishing tool 1 are fixed by fixing portions 4 and 5. Appropriate tension is applied to the linear polishing tool 1 without sagging through the fixing portions 4 and 5. At least one side of the fixed portions 4 and 5 is connected to a drive source and rotates in one direction as will be described later.

  In addition, the abrasive liquid 6 is supplied to the work hole 3 from the abrasive liquid supply unit into the gap between the linear polishing tool 1 and the inner wall surface of the work. The abrasive liquid 6 is a fluid (for example, pure water) mixed with abrasive grains. In some cases, chemical liquid such as alkali or acid is also added. The abrasive grains are cerium oxide, silicon oxide, aluminum oxide, manganese dioxide, iron oxide, zinc oxide, silicon carbide, and diamond. In particular, in cerium oxide, polishing is performed using a hydration reaction in which Ce (cerium) atoms themselves are replaced with Si (silicon) atoms in the glass, so that it is not necessary to add a chemical solution to the polishing solution.

  The polishing unit is provided with a workpiece holding unit 7 that holds the workpiece 2. A guide portion (for example, a guide ring such as a washer) 8 that guides the linear polishing tool 1 is provided at both ends of the work holding portion 7. A central hole 9 concentric with the axis of the work hole 3 is formed in the guide portion 8. The guide portion 8 can prevent the linear polishing tool 1 from being inclined with respect to the axis of the workpiece hole 3, so that uniform polishing of the inner wall surface of the workpiece can be performed.

  Further, the one end side fixing portion 4 of the linear polishing tool 1 is connected to a driving source and rotated in one direction, and the other end side fixing portion 5 is driven to rotate. Or you may make it rotate in one direction in synchronization with each drive source which the both ends side fixing | fixed part 4 and 5 of the linear grinding | polishing tool 1 connects. When the both ends of the linear polishing tool 1 are rotated in different directions, the entanglement of the wire rod is broken and the feed of the abrasive liquid 6 is hindered, so it is necessary to rotate in one direction. In this case, in FIG. 4, the fixing parts 4 and 5 may be reciprocated in synchronization. Thereby, the feed direction of the abrasive liquid 6 is changed, and more uniform polishing can be performed.

  1 and 2, while supplying the abrasive liquid 6 from the abrasive liquid supply unit to the gap between the linear polishing tool 1 and the inner wall of the work hole, the linear polishing tool 1 is rotated in one direction to work holes 3. The inner wall surface of the workpiece hole is polished while feeding the abrasive liquid 6 inside. The abrasive liquid supply unit may be any one that can continuously supply the abrasive liquid 6 to the workpiece hole 3, and includes the case where the abrasive liquid 6 immerses the work 2 in the storage tank. Since the abrasive liquid 6 is fed along the spiral groove like a screw pump by the rotation of the linear polishing tool 1, the inner wall surface of the work hole can be uniformly polished. Therefore, the inner wall surface of the work hole having a small diameter to a large diameter can be accurately polished with a simple configuration.

Further, the linear polishing tool 1 may be moved in the axial direction of the work hole 3 to polish the inner wall surface of the work hole. In FIG. 4, the linear polishing tool 1 and the work 2 constituting the polishing unit are immersed in the abrasive liquid 6. FIG. 4A shows that the workpiece 2 is left as it is, and the linear polishing tool 1 is rotated counterclockwise with respect to the traveling direction (the arrow left direction) while maintaining the tension between the fixing portions 4 and 5. The case where it moves is shown. FIG. 4B shows a case in which the linear polishing tool 1 is moved while being rotated counterclockwise with respect to the traveling direction (arrow right direction) while maintaining the tension between the fixing portions 4 and 5. . By repeating this movement alternately, the direction of the abrasive liquid 6 passing through the workpiece hole 3 is switched, so that the inner wall surface of the workpiece hole is uniformly polished.
If the workpiece 2 is moved in the same direction as or opposite to the movement direction of the linear polishing tool 1 separately from the operation of the linear polishing tool 1 or in conjunction with the operation of the linear polishing tool 1, Since the flow rate of the abrasive liquid 6 that moves is changed, the polishing rate and the polishing amount can be finely adjusted.

  In the above-described embodiment, the apparatus configuration in which the axial direction of the workpiece 2 is held sideways has been described. FIG. 5 illustrates an apparatus configuration for holding and polishing the workpiece 2 such that the axial direction is vertical. In FIG. 5, the work 2 is held by a work holding unit (not shown) so that the axial direction is vertical. An abrasive liquid supply unit 10 is provided close to the upper end side of the work 2. The abrasive liquid supply unit 10 includes a supply pipe 11 that supplies the abrasive liquid 6 and a storage unit 12 that temporarily stores the abrasive liquid 6.

  Further, the linear polishing tool 1 is inserted through the work hole 3 and has fixing portions 4 and 5 provided vertically. The upper fixing portion 4 is connected to a motor as a driving source and is rotated, for example, in the clockwise direction. On the other hand, the lower fixing portion 5 is driven to rotate clockwise. The linear polishing tool 1 is given an appropriate tension between the fixing portions 4 and 5 in addition to its own weight.

  The abrasive liquid 6 stored in the storage unit 12 is guided to the work hole 3 by its own weight, and the work is performed while rotating the linear polishing tool 1 in one direction (clockwise direction) and feeding the abrasive liquid 6 in the work hole. Polish the inner wall surface of the hole. At this time, when the linear polishing tool 1 is moved up and down in the axial direction, the flow rate of the abrasive liquid 6 moving in the workpiece hole 3 changes, so that the polishing speed and the polishing amount can be finely adjusted. For example, when the linear polishing tool 1 is moved upward, the flow rate of the abrasive liquid 6 is increased. Therefore, the polishing rate and the amount of polishing are increased, and when moved downward, the flow rate of the abrasive liquid 6 is decreased. For this reason, the polishing rate and the polishing amount become slow. Moreover, if the sealing performance between the storage unit 12 and the workpiece 2 is maintained, the workpiece 2 may be moved upward or downward.

  The above-described polishing apparatus can be set to optimum polishing conditions by adjusting the type of abrasive liquid, the type of abrasive grain, the temperature of the abrasive liquid, etc. according to the type of workpiece, so that it is more complicated. Shaped workpieces can be polished with high accuracy. Further, the polishing apparatus can polish not only a perfect circular hole but also an elliptical hole by using a linear polishing tool or a workpiece in a horizontal direction in addition to a vertical movement.

It is a schematic diagram of the principal part of a grinding | polishing apparatus. It is a schematic diagram of the principal part of the grinding | polishing apparatus using the linear polishing tool which concerns on another example. It is sectional drawing of a grinding | polishing apparatus. It is a trial explanatory drawing of grinding | polishing operation | movement. It is explanatory drawing of the grinding | polishing apparatus which concerns on another example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Linear polishing tool 1a, 1b, 1c, 1d Wire 2 Workpiece 3 Workpiece hole 4, 5 Fixed part 6 Abrasive liquid 7 Workpiece holding part 8 Guide part 9 Center hole 10 Abrasive liquid supply part 11 Supply pipe 12 Storage part

Claims (7)

A plurality of wire rods are spirally entangled and a continuous linear polishing tool is inserted into the work hole to fix both ends, and the linear polishing tool can be rotated in one direction by a drive source while tension is applied to the linear polishing tool through the fixing portion. A polishing part, and an abrasive liquid supply part for supplying an abrasive liquid to the gap between the linear polishing tool and the work hole,
While supplying the abrasive liquid from the abrasive liquid supply part to the gap between the linear polishing tool and the work hole, the work hole while rotating the linear polishing tool in one direction in the polishing part and feeding the abrasive liquid in the work hole A polishing apparatus for polishing an inner wall surface.   2. The polishing apparatus according to claim 1, wherein the inner wall surface of the workpiece hole is polished by rotating the linear polishing tool and moving the linear polishing tool or the workpiece in the axial direction of the workpiece hole while feeding the abrasive liquid. .   The polishing unit includes a workpiece holding unit that holds a workpiece, and a guide unit that guides the linear polishing tool on both sides of the workpiece hole held by the workpiece holding unit and has a central hole that is concentric with the axis of the workpiece hole. The polishing apparatus according to claim 1, wherein the polishing apparatus is provided.   The polishing apparatus according to claim 1, wherein the linear polishing tool is formed by winding a plurality of wire rods in a spiral shape.   The polishing apparatus according to claim 1, wherein the linear polishing tool includes a core wire and a wire wound around the core wire in a spiral shape.   2. The polishing unit according to claim 1, wherein the one end side fixing portion of the linear polishing tool is connected to a drive source to rotate in one direction, and the other end side fixing portion is driven to rotate. Polishing equipment.   The polishing apparatus according to claim 1, wherein the polishing unit rotates in one direction in synchronization with each drive source connected to the fixing portions on both ends of the wire.

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