JP2007207965A - Optical semiconductor device, its manufacturing method, and electronic equipment - Google Patents

Optical semiconductor device, its manufacturing method, and electronic equipment Download PDF

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JP2007207965A
JP2007207965A JP2006024247A JP2006024247A JP2007207965A JP 2007207965 A JP2007207965 A JP 2007207965A JP 2006024247 A JP2006024247 A JP 2006024247A JP 2006024247 A JP2006024247 A JP 2006024247A JP 2007207965 A JP2007207965 A JP 2007207965A
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optical semiconductor
semiconductor device
light receiving
plate portion
shield case
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Junji Oka
順治 岡
Shigenori Kitanishi
繁徳 北西
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Sharp Corp
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Sharp Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent defective soldering which is derived from insufficient adhesion to a shielding case. <P>SOLUTION: In a front panel board 13 of a shielding case 11, cut-outs 18 and 19 are formed having the same shapes as a part of a cross-section perpendicular to the optic axis of a light receiving lens 5 and a light emitting lens 6 of a device 12. Further, a notch 21 is formed along a boundary line of a back board 15 and an upper board 14 of the shielding case 11, so that preparatory bending may be carried out to the back board 15 in the position of the notch 21. Moreover, after placing temporarily the device 12 in the shielding case 11, the back board 15 is bent to the inner side in the position of the notch 21 so that the device 12 may be fixed to the shielding case 11 by caulking the device 12 without using adhesives. In this way, the flatness of the connection surface of a shield case terminal 20 and the connection surface of a device terminal 7 is assured so as to prevent the defective soldering of both the connection surfaces. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、基板の片面に光半導体素子を搭載して樹脂成型して成る光半導体装置、上記光半導体装置の製造方法、および、上記光半導体装置を搭載した電子機器に関する。   The present invention relates to an optical semiconductor device in which an optical semiconductor element is mounted on one side of a substrate and molded by resin, a method for manufacturing the optical semiconductor device, and an electronic apparatus in which the optical semiconductor device is mounted.

従来より、基板の片面に光半導体素子を搭載して樹脂成型して成る受発光一体型光半導体デバイスとして、例えば、特開平１１‐４０８５９号公報(特許文献１)に開示された赤外線データ通信モジュールのようなものがある。図４および図５に、受発光一体型光半導体デバイスの作成手順を示す。また、図６に、受発光一体型光半導体デバイスにおける正面図,側面図および背面図を示す。また、図７に、受発光一体型光半導体デバイスに、従来のシールドケースを取り付けた状態を示す。   Conventionally, an infrared data communication module disclosed in, for example, Japanese Patent Laid-Open No. 11-40859 (Patent Document 1) is an example of a light receiving / emitting integrated optical semiconductor device in which an optical semiconductor element is mounted on one side of a substrate and molded by resin. There is something like this. 4 and 5 show a procedure for producing a light receiving / emitting integrated optical semiconductor device. FIG. 6 shows a front view, a side view, and a rear view of the optical semiconductor device integrated with light receiving and emitting. FIG. 7 shows a state where a conventional shield case is attached to the light receiving and emitting integrated optical semiconductor device.

先ず、図４に示すように、基板１上に、発光素子２,受光素子３および信号処理用のＩＣチップ４を導電性樹脂によってボンディングした後、金線等によって電気的に接続される。次に、図５に示すように、透光性樹脂によって封止して上記透光性樹脂でなる受光レンズ５および発光レンズ６を形成し、樹脂封止後のダイシングによって、図６に示すように個片に分割される。図６中において、７はデバイス端子部である。分割された後、光および電磁ノイズによるＩＣチップ４の誤動作を防止するために、図７に示すように、デバイスの分割面とシールドケース８の内面とが接着剤９によって接着されることによって、デバイスにシールドケース８が取り付けられる。   First, as shown in FIG. 4, after the light emitting element 2, the light receiving element 3, and the signal processing IC chip 4 are bonded to each other on the substrate 1 with a conductive resin, they are electrically connected by a gold wire or the like. Next, as shown in FIG. 5, the light-receiving lens 5 and the light-emitting lens 6 made of the light-transmitting resin are formed by sealing with a light-transmitting resin, and dicing after resin sealing is performed as shown in FIG. It is divided into pieces. In FIG. 6, 7 is a device terminal part. After the division, in order to prevent malfunction of the IC chip 4 due to light and electromagnetic noise, the divided surface of the device and the inner surface of the shield case 8 are bonded by an adhesive 9 as shown in FIG. A shield case 8 is attached to the device.

ここで、上記シールドケース８は、デバイスを実装する基板のＧＮＤパターンに半田付けされるため、シールドケース端子部１０の接続面とデバイス端子部７の接続面とは１つの平面上に配列されるように設計されている。   Here, since the shield case 8 is soldered to the GND pattern of the substrate on which the device is mounted, the connection surface of the shield case terminal portion 10 and the connection surface of the device terminal portion 7 are arranged on one plane. Designed to be

しかしながら、上記従来の受発光一体型光半導体デバイスにおいては、シールドケース８とデバイスとの接着が不十分である場合には、シールドケース８が上記デバイスから浮いた状態となり、シールドケース端子部１０の接続面とデバイス端子部７の接続面とは１つの平面上に配列されず、半田付け不良の原因になるという問題がある。
特開平１１‐４０８５９号公報 However, in the conventional light receiving and emitting integrated optical semiconductor device, when the shield case 8 and the device are not sufficiently bonded, the shield case 8 is lifted from the device, and the shield case terminal portion 10 There is a problem that the connection surface and the connection surface of the device terminal portion 7 are not arranged on one plane, which causes a soldering failure.
Japanese Patent Laid-Open No. 11-40859

そこで、この発明の課題は、シールドケースとの接着不十分に起因する半田付け不良を防止できる光半導体装置、この光半導体装置の製造方法、および、上記光半導体装置を搭載した電子機器を提供することにある。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an optical semiconductor device capable of preventing poor soldering due to insufficient adhesion to a shield case, a method for manufacturing the optical semiconductor device, and an electronic apparatus equipped with the optical semiconductor device. There is.

上記課題を解決するため、この発明の光半導体装置は、
基板の片面に搭載された受発光一体型光半導体素子を透光性樹脂で封止して、受光レンズおよび発光レンズを形成して成る受発光一体型光半導体デバイスと、
上記受発光一体型光半導体デバイスを覆って光および磁気ノイズを防止する金属板性のシールドケースと
を備え、
上記シールドケースは、
上記受発光一体型光半導体デバイスにおける上記受光レンズおよび上記発光レンズが存在する前側を覆う前板部を有すると共に、
上記前板部の両側には、上記受光レンズおよび上記発光レンズにおける光軸に垂直な断面形状の一部に略一致する形状を有する抜き部が設けられている
ことを特徴としている。 In order to solve the above problems, an optical semiconductor device of the present invention is
A light receiving / emitting integrated optical semiconductor device formed by sealing a light receiving / emitting integrated optical semiconductor element mounted on one side of a substrate with a translucent resin to form a light receiving lens and a light emitting lens;
A metal plate shield case that covers the light receiving and emitting integrated optical semiconductor device and prevents light and magnetic noise;
The shield case is
In the light receiving and emitting integrated optical semiconductor device, having a front plate portion covering the front side where the light receiving lens and the light emitting lens are present,
On both sides of the front plate portion, there is provided a cutout portion having a shape substantially matching a part of a cross-sectional shape perpendicular to the optical axis of the light receiving lens and the light emitting lens.

上記構成によれば、上記シールドケースにおける上記前板部の両側には、上記受発光一体型光半導体デバイスの上記受光レンズおよび上記発光レンズにおける光軸に垂直な断面形状の一部に合わせた形状の抜き部が設けられている。したがって、上記受発光一体型光半導体デバイスを上記シールドケース内に挿入した際に、上記前板部の上記抜き部に上記受光レンズおよび上記発光レンズを嵌合させることによって、上記受発光一体型光半導体デバイスに対する上記シールドケースの位置を正しく決めることができる。   According to the above configuration, on both sides of the front plate portion in the shield case, the light receiving lens of the light receiving and emitting integrated optical semiconductor device and a shape that matches a part of a cross-sectional shape perpendicular to the optical axis in the light emitting lens Is provided. Therefore, when the light receiving / emitting integrated optical semiconductor device is inserted into the shield case, the light receiving lens and the light emitting lens are fitted into the cut-out portion of the front plate portion, thereby the light receiving / emitting integrated light. The position of the shield case with respect to the semiconductor device can be determined correctly.

また、１実施の形態の光半導体装置では、
上記シールドケースは、
上記受発光一体型光半導体デバイスにおける上記前側に対向する後側を覆う後板部と、上記前板部および上記後板部に連なって上記受発光一体型光半導体デバイスにおける上側を覆う上板部とを有すると共に、
上記後板部と上記上板部との境界線に沿ってノッチが形成されている。 In the optical semiconductor device of one embodiment,
The shield case is
A rear plate portion covering the rear side facing the front side in the light receiving / emitting integrated optical semiconductor device, and an upper plate portion covering the upper side of the light receiving / emitting integrated optical semiconductor device connected to the front plate portion and the rear plate portion. And having
A notch is formed along a boundary line between the rear plate portion and the upper plate portion.

この実施の形態によれば、上記受発光一体型光半導体デバイスにおける上記後板部と上記上板部との境界線に沿ってノッチが形成されている。したがって、上記後板部を、上記ノッチの位置で内側へ簡単に折り曲げることができ、上記後板部によって上記受発光一体型光半導体デバイスをかしめることが可能になる。すなわち、上記受発光一体型光半導体デバイスを、上記シールドケースに対して接着剤を用いることなく固定することが可能になる。   According to this embodiment, the notch is formed along the boundary line between the rear plate portion and the upper plate portion in the light receiving and emitting integrated optical semiconductor device. Accordingly, the rear plate portion can be easily bent inward at the position of the notch, and the light receiving and emitting integrated optical semiconductor device can be crimped by the rear plate portion. That is, the light emitting / receiving integrated optical semiconductor device can be fixed to the shield case without using an adhesive.

したがって、この発明によれば、上記受発光一体型光半導体デバイスと上記シールドケースとの接着不十分に起因して、上記シールドケースの端子部の接続面と上記受発光一体型光半導体デバイスの端子部の接続面とが１つの平面上に配列されないこと(以下、平坦度不良と言う)を防止することができる。したがって、本光半導体装置における上記シールドケースの端子部および上記受発光一体型光半導体デバイスの端子部のＧＮＤパターン等への半田付け不良を防止することができるのである。   Therefore, according to the present invention, due to insufficient adhesion between the light receiving / emitting integrated optical semiconductor device and the shield case, the connection surface of the terminal portion of the shield case and the terminal of the light receiving / emitting integrated optical semiconductor device It is possible to prevent the connection surfaces of the portions from being arranged on one plane (hereinafter referred to as poor flatness). Therefore, it is possible to prevent poor soldering to the GND pattern or the like of the terminal portion of the shield case and the terminal portion of the light receiving and emitting integrated optical semiconductor device in the present optical semiconductor device.

また、１実施の形態の光半導体装置では、
上記後板部は、上記上板部に対して所定角度だけ上記ノッチの位置で内側に予め折り曲げられている。 In the optical semiconductor device of one embodiment,
The rear plate portion is bent inward at the notch position by a predetermined angle with respect to the upper plate portion.

この実施の形態によれば、上記後板部に対して、上記ノッチの位置で所定角度だけ内側に予備曲げが行われている。したがって、上記後板部による上記受発光一体型光半導体デバイスのかしめに先だって、上記シールドケースに対して上記受発光一体型光半導体デバイスを仮固定することができる。さらに、上記後板部を、上記ノッチの位置で内側へ簡単に折り曲げることができる。すなわち、上記後板部による上記受発光一体型光半導体デバイスのかしめを容易に行うことができるのである。   According to this embodiment, preliminary bending is performed inward by a predetermined angle at the position of the notch with respect to the rear plate portion. Therefore, prior to caulking of the light receiving / emitting integrated optical semiconductor device by the rear plate portion, the light receiving / emitting integrated optical semiconductor device can be temporarily fixed to the shield case. Furthermore, the rear plate portion can be easily folded inward at the position of the notch. That is, the light receiving and emitting integrated optical semiconductor device can be easily caulked by the rear plate portion.

また、この発明の光半導体装置の製造方法は、
上記光半導体装置の製造方法であって、
上記シールドケース内に、上記受発光一体型光半導体デバイスを挿入し、
上記シールドケースにおける上記前板部の上記抜き部に、上記受発光一体型光半導体デバイスにおける上記受光レンズおよび上記発光レンズを嵌合させて、上記受発光一体型光半導体デバイスに対する上記シールドケースの位置を決め、
上記シールドケースにおける上記後板部を上記ノッチの位置で内側へ折り曲げて、上記後板部で上記受発光一体型光半導体デバイスをかしめることによって、上記受発光一体型光半導体デバイスを上記シールドケース内に固定する
ことを特徴としている。 In addition, the method of manufacturing the optical semiconductor device of the present invention includes
A method for manufacturing the optical semiconductor device, comprising:
Inserting the light receiving and emitting integrated optical semiconductor device into the shield case,
The position of the shield case with respect to the light receiving / emitting integrated optical semiconductor device by fitting the light receiving lens and the light emitting lens in the light receiving / emitting integrated optical semiconductor device to the extracted portion of the front plate portion in the shield case Decide
The back plate portion of the shield case is bent inward at the position of the notch, and the light receiving / emitting integrated optical semiconductor device is caulked by the rear plate portion, whereby the light receiving / emitting integrated optical semiconductor device is connected to the shield case. It is characterized by being fixed inside.

上記構成によれば、上記受発光一体型光半導体デバイスを上記シールドケース内に挿入した際に、上記前板部の上記抜き部に上記受光レンズおよび上記発光レンズを嵌合させるので、上記受発光一体型光半導体デバイスに対する上記シールドケースの位置を正しく決めることができる。さらに、上記シールドケースの後板部を上記ノッチの位置で内側へ折り曲げて、上記受発光一体型光半導体デバイスを上記後板部でかしめるので、上記受発光一体型光半導体デバイスを、上記シールドケースに対して接着剤を用いることなく固定することができる。   According to the above configuration, when the light receiving / emitting integrated optical semiconductor device is inserted into the shield case, the light receiving lens and the light emitting lens are fitted into the cut-out portion of the front plate portion. The position of the shield case with respect to the integrated optical semiconductor device can be correctly determined. Further, since the rear plate portion of the shield case is bent inward at the position of the notch and the light receiving / emitting integrated optical semiconductor device is crimped by the rear plate portion, the light receiving / emitting integrated optical semiconductor device is It can be fixed to the case without using an adhesive.

すなわち、この発明によれば、上記受発光一体型光半導体デバイスと上記シールドケースとの接着不十分に起因する上記シールドケースの端子部の接続面と上記受発光一体型光半導体デバイスの端子部の接続面との平坦度不良を防止することができる。したがって、本光半導体装置における上記シールドケースの端子部および上記受発光一体型光半導体デバイスの端子部のＧＮＤパターン等への半田付け不良を防止し、信頼性の高い安定した電子機器を得ることが可能になるのである。   That is, according to the present invention, the connection surface of the terminal part of the shield case and the terminal part of the light receiving / emitting integrated optical semiconductor device due to insufficient adhesion between the light receiving / emitting integrated optical semiconductor device and the shield case. It is possible to prevent poor flatness with the connection surface. Therefore, it is possible to prevent poor soldering to the GND pattern or the like of the terminal portion of the shield case and the terminal portion of the light receiving and emitting integrated optical semiconductor device in the optical semiconductor device, and to obtain a highly reliable and stable electronic device. It becomes possible.

また、この発明の電子機器は、
上記光半導体装置を用いたことを特徴としている。 The electronic device of the present invention is
The optical semiconductor device is used.

上記構成によれば、上記シールドケースの端子部の接続面と上記受発光一体型光半導体デバイスの端子部の接続面とが１つの平面上に配列されて、上記両接続面の平坦度を確保できる光半導体装置を用いるので、上記シールドケースの端子部および上記受発光一体型光半導体デバイスの端子部の半田付け不良を防止し、信頼性の高い安定した電子機器を得ることができる。   According to the said structure, the connection surface of the terminal part of the said shield case and the connection surface of the terminal part of the said light-receiving / emitting integrated optical semiconductor device are arranged on one plane, and the flatness of both the said connection surfaces is ensured. Since an optical semiconductor device that can be used is used, it is possible to prevent poor soldering of the terminal portion of the shield case and the terminal portion of the light receiving and emitting integrated optical semiconductor device, and to obtain a highly reliable and stable electronic device.

以上より明らかなように、この発明によれば、受発光一体型光半導体デバイスを覆って光および磁気ノイズを防止するシールドケースにおける前板部の両側には、上記受発光一体型光半導体デバイスの受光レンズおよび発光レンズにおける光軸に垂直な断面形状の一部に略一致する形状の抜き部を設けたので、上記受発光一体型光半導体デバイスを上記シールドケース内に挿入した際に、上記受発光一体型光半導体デバイスに対する上記シールドケースの位置を正しく決めることができる。   As is clear from the above, according to the present invention, the light receiving / emitting integrated optical semiconductor device is disposed on both sides of the front plate portion of the shield case that covers the light receiving / emitting integrated optical semiconductor device and prevents light and magnetic noise. Since the light-receiving lens and the light-emitting lens are provided with a cutout portion that substantially matches a part of the cross-sectional shape perpendicular to the optical axis, the light-receiving and light-emitting integrated optical semiconductor device is inserted into the shield case. The position of the shield case relative to the light emitting integrated optical semiconductor device can be determined correctly.

さらに、上記シールドケースにおける後板部と上板部との境界線に沿ってノッチを形成することによって、上記後板部を、上記ノッチの位置で内側へ簡単に折り曲げて、上記受発光一体型光半導体デバイスをかしめることが可能になる。すなわち、上記受発光一体型光半導体デバイスを、上記シールドケースに対して接着剤を用いることなく固定することが可能になる。したがって、上記受発光一体型光半導体デバイスと上記シールドケースとの接着不十分に起因する上記シールドケースの端子部の接続面と上記受発光一体型光半導体デバイスの端子部の接続面との平坦度不良を防止することができ、上記シールドケースの端子部および上記受発光一体型光半導体デバイスの端子部の半田付け不良を防止することができるのである。   Further, by forming a notch along a boundary line between the rear plate portion and the upper plate portion in the shield case, the rear plate portion can be easily bent inward at the position of the notch, and the light receiving and emitting integrated type It becomes possible to crimp an optical semiconductor device. That is, the light emitting / receiving integrated optical semiconductor device can be fixed to the shield case without using an adhesive. Accordingly, the flatness between the connection surface of the terminal part of the shield case and the connection surface of the terminal part of the light receiving / emitting integrated optical semiconductor device due to insufficient adhesion between the light receiving / emitting integrated optical semiconductor device and the shield case Defects can be prevented, and poor soldering of the terminal part of the shield case and the terminal part of the light receiving and emitting integrated optical semiconductor device can be prevented.

さらに、上記後板部に対して、上記ノッチの位置で所定角度だけ内側に予備曲げを行うことにより、上記後板部による上記受発光一体型光半導体デバイスのかしめに先だって、上記シールドケースに対して上記受発光一体型光半導体デバイスを仮固定することができる。また、上記後板部を上記ノッチの位置で内側へ簡単に折り曲げることができる。   Furthermore, by performing preliminary bending inward by a predetermined angle at the position of the notch with respect to the rear plate portion, prior to caulking of the light receiving and emitting integrated optical semiconductor device by the rear plate portion, Thus, the light receiving / emitting integrated optical semiconductor device can be temporarily fixed. Further, the rear plate portion can be easily folded inward at the position of the notch.

さらに、上記光半導体装置を用いて電子機器を構成することによって、上記シールドケースの端子部および上記受発光一体型光半導体デバイスの端子部の半田付け不良を防止して、信頼性の高い安定した電子機器を得ることができる。   Furthermore, by configuring an electronic device using the optical semiconductor device, it is possible to prevent poor soldering of the terminal part of the shield case and the terminal part of the light receiving and emitting integrated optical semiconductor device, and to be highly reliable and stable. An electronic device can be obtained.

以下、この発明を図示の実施の形態により詳細に説明する。図１は、本実施の形態の光半導体装置における正面図,側面図および背面図である。この光半導体装置は、基板の片面に光半導体素子を搭載して樹脂成型して成る光半導体装置であり、以下のようにして形成される。   Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is a front view, a side view, and a rear view of the optical semiconductor device of the present embodiment. This optical semiconductor device is an optical semiconductor device in which an optical semiconductor element is mounted on one surface of a substrate and molded by resin, and is formed as follows.

図４及び図５に示す従来の受発光一体型光半導体デバイスの場合と同様に、基板上に、発光素子,受光素子および信号処理用ＩＣチップを導電性樹脂によってボンディングした後に、金線等によって電気的に接続される。そして、透光性樹脂によって封止して上記透光性樹脂でなる受発光レンズが形成され、ダイシングによって図６に示すように受発光一体型光半導体デバイス(以下、単にデバイスと言う)１２の個片に分割される。   As in the case of the conventional light receiving / emitting integrated optical semiconductor device shown in FIGS. 4 and 5, a light emitting element, a light receiving element, and a signal processing IC chip are bonded on a substrate with a conductive resin, and then a gold wire or the like is used. Electrically connected. Then, a light receiving / emitting lens made of the light transmitting resin is formed by sealing with a light transmitting resin, and by dicing, a light receiving / emitting integrated optical semiconductor device (hereinafter simply referred to as a device) 12 is formed as shown in FIG. Divided into pieces.

図２は、本実施の形態におけるシールドケース１１における正面図.側面図および底面図を示す。シールドケース１１は、デバイス１２における受光レンズ５および発光レンズ６が存在する前面を覆う前板部１３と、デバイス１２におけるデバイス端子部７側とは反対側の上面を覆う上板部１４と、デバイス１２における上記前面に対向する背面の上部を覆う後板部１５と、デバイス１２における両側面の上部を覆う側板部１６,１７とを有しいる。   FIG. 2 shows a front view, a side view, and a bottom view of the shield case 11 in the present embodiment. The shield case 11 includes a front plate portion 13 that covers the front surface of the device 12 where the light receiving lens 5 and the light emitting lens 6 are present, an upper plate portion 14 that covers the upper surface of the device 12 opposite to the device terminal portion 7 side, 12 includes a rear plate portion 15 that covers the upper portion of the back surface facing the front surface, and side plate portions 16 and 17 that cover upper portions of both side surfaces of the device 12.

上記前板部１３の両側には、デバイス１２における受光レンズ５および発光レンズ６の光軸に垂直な断面の一部と同一形状を有する抜き部１８,１９を設け、この抜き部１８,１９の箇所で両レンズ５,６を介してデバイス１２との位置決めを行うようにしている。さらに、前板部１３における抜き部１８と抜き部１９との間における下端には、前板部１３に対して略直角に外側へ折り曲げられて成るシールドケース端子部２０を設けている。   On both sides of the front plate portion 13, there are provided cutout portions 18 and 19 having the same shape as a part of the cross section perpendicular to the optical axis of the light receiving lens 5 and the light emitting lens 6 in the device 12. Positioning with the device 12 is performed at both positions via both lenses 5 and 6. Further, a shield case terminal portion 20 is provided at the lower end of the front plate portion 13 between the cutout portion 18 and the cutout portion 19 and is bent outward at a substantially right angle to the front plate portion 13.

また、上記後板部１５は、上板部１４と連続して形成されている。また、両側板部１６,１７は、上板部１４と連続して形成されており、上板部１４に対して略直角に内側へ折り曲げられている。尚、後板部１５と両側板部１６,１７との間は切り離されている。   The rear plate portion 15 is formed continuously with the upper plate portion 14. Further, the side plate portions 16 and 17 are formed continuously with the upper plate portion 14 and are bent inward at substantially right angles to the upper plate portion 14. The rear plate portion 15 and the side plate portions 16 and 17 are separated from each other.

図３は、図２におけるＡ‐Ａ'矢視断面図である。図３に示すように、後板部１５と上板部１４との境界線に沿って、浅い溝で成るノッチ２１が形成されている。そして、後板部１５は、上板部１４に対して角度θだけノッチ２１の位置で予め折り曲げられている。   3 is a cross-sectional view taken along the line AA ′ in FIG. As shown in FIG. 3, a notch 21 formed of a shallow groove is formed along the boundary line between the rear plate portion 15 and the upper plate portion 14. Then, the rear plate portion 15 is bent in advance at the position of the notch 21 by an angle θ with respect to the upper plate portion 14.

上記構成を有するシールドケース１１には、図６に示すデバイス１２が、以下のようにして装着される。   The device 12 shown in FIG. 6 is attached to the shield case 11 having the above configuration as follows.

先ず、上記後板部１５がノッチ２１の位置で上板部１４に対して予備曲げされたシールドケース１１に対して、図２において矢印(Ａ)で示すように、後斜め下方からデバイス１２を挿入して、シールドケース１１における前板部１３の抜き部１８,１９にデバイス１２における受光レンズ５および発光レンズ６を嵌合させて、デバイス１２に対するシールドケース１１の位置決めを行う。こうして、デバイス１２をシールドケース１１内に仮置きした後、シールドケース１１の後板部１５を、図２において矢印(Ｂ)で示すように、ノッチ２１の位置で内側へ折り曲げ、後板部１５でデバイス１２をかしめることによって、デバイス１２をシールドケース１１内に固定する。   First, with respect to the shield case 11 in which the rear plate portion 15 is pre-bent with respect to the upper plate portion 14 at the position of the notch 21, as shown by an arrow (A) in FIG. The light receiving lens 5 and the light emitting lens 6 in the device 12 are fitted to the extracted portions 18 and 19 of the front plate portion 13 in the shield case 11 to position the shield case 11 with respect to the device 12. After the device 12 is temporarily placed in the shield case 11 in this manner, the rear plate portion 15 of the shield case 11 is bent inward at the position of the notch 21 as shown by an arrow (B) in FIG. The device 12 is fixed in the shield case 11 by caulking the device 12.

このように、本実施の形態においては、接着剤を使用せずにデバイス１２をシールドケース１１に固定し、且つ、受光レンズ５および発光レンズ６によって位置決めを行なうので、シールドケース端子部２０の接続面とデバイス端子部７の接続面とを１つの平面上に配列されるようにして、両接続面の平坦度を確保することができる。その際に、後板部１５と上板部１４との境界にノッチ２１を設けると共に、後板部１５に対してノッチ２１の位置で内側に予備曲げを行っているので、後板部１５によるデバイス１２のかしめを容易にすることができる。   Thus, in the present embodiment, the device 12 is fixed to the shield case 11 without using an adhesive, and the positioning is performed by the light receiving lens 5 and the light emitting lens 6, so that the connection of the shield case terminal portion 20 is performed. The flatness of both connection surfaces can be ensured by arranging the surfaces and the connection surfaces of the device terminal portions 7 on one plane. At that time, the notch 21 is provided at the boundary between the rear plate portion 15 and the upper plate portion 14 and the inner side is preliminarily bent at the position of the notch 21 with respect to the rear plate portion 15. Caulking of the device 12 can be facilitated.

さらに、上記シールドケース１１の後板部１５に予備曲げを行っているので、後板部１５によるデバイス１２のかしめに先だって、シールドケース１１に対してデバイス１２を仮固定することができる。   Further, since the rear plate portion 15 of the shield case 11 is preliminarily bent, the device 12 can be temporarily fixed to the shield case 11 before the device 12 is caulked by the rear plate portion 15.

以上のごとく、この実施の形態によれば、上記シールドケース端子部２０の接続面とデバイス端子部７の接続面との平坦度を確保しつつデバイス１２を実装した光半導体装置を得ることができ、シールドケース１１とデバイス１２との接着不十分に起因するシールドケース端子部２０およびデバイス端子部７のＧＮＤパターン等への半田付け不良を防止することができる。さらに、この光半導体装置を使用することによって、信頼性の高い安定した電子機器を得ることができる。   As described above, according to this embodiment, an optical semiconductor device in which the device 12 is mounted while ensuring the flatness between the connection surface of the shield case terminal portion 20 and the connection surface of the device terminal portion 7 can be obtained. In addition, it is possible to prevent poor soldering of the shield case terminal portion 20 and the device terminal portion 7 to the GND pattern or the like due to insufficient adhesion between the shield case 11 and the device 12. Further, by using this optical semiconductor device, a highly reliable and stable electronic device can be obtained.

この発明の光半導体装置における正面図,側面図および背面図である。It is the front view, side view, and back view in the optical semiconductor device of this invention. 図１におけるシールドケースの正面図.側面図および底面図である。The front view of the shield case in FIG. 1. It is the side view and bottom view. 図２におけるＡ‐Ａ'矢視断面図である。It is AA 'arrow sectional drawing in FIG. 受発光一体型光半導体デバイスの作成手順を示す図である。It is a figure which shows the preparation procedure of a light receiving / emitting integrated optical semiconductor device. 図４に続く受発光一体型光半導体デバイスの作成手順を示す図である。It is a figure which shows the preparation procedure of the light-receiving / emitting integrated optical semiconductor device following FIG. 受発光一体型光半導体デバイスの正面図,側面図および背面図である。It is a front view, a side view, and a rear view of a light receiving and emitting integrated optical semiconductor device. 図６に示す受発光一体型光半導体デバイスに従来のシールドケースを取り付けた状態を示す図である。It is a figure which shows the state which attached the conventional shield case to the light-receiving / emitting integrated optical semiconductor device shown in FIG.

符号の説明Explanation of symbols

５…受光レンズ、
６…発光レンズ、
７…デバイス端子部、
１１…シールドケース、
１２…デバイス、
１３…前板部、
１４…上板部、
１５…後板部、
１６,１７…側板部、
１８,１９…抜き部、
２０…シールドケース端子部、
２１…ノッチ。
5. Light receiving lens,
6 ... Luminescent lens,
7: Device terminal,
11 ... Shield case,
12 ... Device,
13 ... front plate part,
14 ... upper plate part,
15 ... rear plate part,
16, 17 ... side plate part,
18, 19 ... unplugged part,
20 ... Shield case terminal,
21 ... Notch.

Claims (5)

基板の片面に搭載された受発光一体型光半導体素子を透光性樹脂で封止して、受光レンズおよび発光レンズを形成して成る受発光一体型光半導体デバイスと、
上記受発光一体型光半導体デバイスを覆って光および磁気ノイズを防止する金属板性のシールドケースと
を備え、
上記シールドケースは、
上記受発光一体型光半導体デバイスにおける上記受光レンズおよび上記発光レンズが存在する前側を覆う前板部を有すると共に、
上記前板部の両側には、上記受光レンズおよび上記発光レンズにおける光軸に垂直な断面形状の一部に略一致する形状を有する抜き部が設けられている
ことを特徴とする光半導体装置。 A light receiving / emitting integrated optical semiconductor device formed by sealing a light receiving / emitting integrated optical semiconductor element mounted on one side of a substrate with a translucent resin to form a light receiving lens and a light emitting lens;
A metal plate shield case that covers the light receiving and emitting integrated optical semiconductor device and prevents light and magnetic noise;
The shield case is
In the light receiving and emitting integrated optical semiconductor device, having a front plate portion covering the front side where the light receiving lens and the light emitting lens are present,
2. An optical semiconductor device according to claim 1, wherein a cutout portion having a shape substantially matching a part of a cross-sectional shape perpendicular to the optical axis of the light receiving lens and the light emitting lens is provided on both sides of the front plate portion. 請求項１に記載の光半導体装置において、
上記シールドケースは、
上記受発光一体型光半導体デバイスにおける上記前側に対向する後側を覆う後板部と、上記前板部および上記後板部に連なって上記受発光一体型光半導体デバイスにおける上側を覆う上板部とを有すると共に、
上記後板部と上記上板部との境界線に沿ってノッチが形成されている
ことを特徴とする光半導体装置。 The optical semiconductor device according to claim 1,
The shield case is
A rear plate portion covering the rear side facing the front side in the light receiving / emitting integrated optical semiconductor device, and an upper plate portion covering the upper side of the light receiving / emitting integrated optical semiconductor device connected to the front plate portion and the rear plate portion. And having
An optical semiconductor device, wherein a notch is formed along a boundary line between the rear plate portion and the upper plate portion. 請求項２に記載の光半導体装置において、
上記後板部は、上記上板部に対して所定角度だけ上記ノッチの位置で内側に予め折り曲げられている
ことを特徴とする光半導体装置。 The optical semiconductor device according to claim 2,
The optical semiconductor device, wherein the rear plate portion is bent inward at the notch position by a predetermined angle with respect to the upper plate portion. 請求項３に記載の光半導体装置の製造方法であって、
上記シールドケース内に、上記受発光一体型光半導体デバイスを挿入し、
上記シールドケースにおける上記前板部の上記抜き部に、上記受発光一体型光半導体デバイスにおける上記受光レンズおよび上記発光レンズを嵌合させて、上記受発光一体型光半導体デバイスに対する上記シールドケースの位置を決め、
上記シールドケースにおける上記後板部を上記ノッチの位置で内側へ折り曲げて、上記後板部で上記受発光一体型光半導体デバイスをかしめることによって、上記受発光一体型光半導体デバイスを上記シールドケース内に固定する
ことを特徴とする光半導体装置の製造方法。 It is a manufacturing method of the optical semiconductor device according to claim 3,
Inserting the light receiving and emitting integrated optical semiconductor device into the shield case,
The position of the shield case with respect to the light receiving / emitting integrated optical semiconductor device by fitting the light receiving lens and the light emitting lens in the light receiving / emitting integrated optical semiconductor device to the extracted portion of the front plate portion in the shield case Decide
The back plate portion of the shield case is bent inward at the position of the notch, and the light receiving / emitting integrated optical semiconductor device is caulked by the rear plate portion, whereby the light receiving / emitting integrated optical semiconductor device is connected to the shield case. A method of manufacturing an optical semiconductor device, wherein the method is fixed inside. 請求項１乃至請求項３の何れか一つに記載の光半導体装置を用いた
ことを特徴とする電子機器。
An electronic apparatus using the optical semiconductor device according to any one of claims 1 to 3.
JP2006024247A 2006-02-01 2006-02-01 Optical semiconductor device, its manufacturing method, and electronic equipment Pending JP2007207965A (en)

Priority Applications (1)

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Country Link
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009250087A (en) * 2008-04-03 2009-10-29 Aisan Ind Co Ltd Fuel pump

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160596A (en) * 1999-12-01 2001-06-12 Sharp Corp Member for shield case and method of manufacturing semiconductor device
JP2002023022A (en) * 2000-07-03 2002-01-23 Yazaki Corp Hybrid connector
JP2004031475A (en) * 2002-06-24 2004-01-29 Sharp Corp Infrared data communication module and electronic equipment mounted therewith
JP2005142530A (en) * 2003-10-16 2005-06-02 Sharp Corp Optical semiconductor equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160596A (en) * 1999-12-01 2001-06-12 Sharp Corp Member for shield case and method of manufacturing semiconductor device
JP2002023022A (en) * 2000-07-03 2002-01-23 Yazaki Corp Hybrid connector
JP2004031475A (en) * 2002-06-24 2004-01-29 Sharp Corp Infrared data communication module and electronic equipment mounted therewith
JP2005142530A (en) * 2003-10-16 2005-06-02 Sharp Corp Optical semiconductor equipment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009250087A (en) * 2008-04-03 2009-10-29 Aisan Ind Co Ltd Fuel pump

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