JP2007207949A - Mounting substrate and method for sealing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting substrate and a method for shielding it capable of magnetically shielding a through-hole without fitting a shield coating the whole connector and an exclusive shield for the through-hole. <P>SOLUTION: In connectors 1 connected at terminals 2 for the substrate 3, surfaces excepting a surface directed toward the substrate in a main body formed of a molding resin are coated with a sealing material composed of a conductive material or a conductive board. At least parts of the through-holes 4 formed at the substrate 3 are arranged at places in lower sections of the connectors 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting board on which electronic components are mounted and a method for sealing the mounting board.

  2. Description of the Related Art Conventionally, in a board on which electronic components are mounted, in order to prevent noise intrusion due to electromagnetic waves to a signal transmitted through a wiring provided on the board and emission of noise from the signal, the signal and noise that are easily affected by noise Signals that are easy to emit are wired in the inner layer of the substrate, and the upper and lower sides of the wiring are sandwiched between ground wirings, and electromagnetic shielding is performed on signals transmitted through the inner layer wiring by the ground wiring.

  However, in order to connect to the mounted electronic component, it is necessary to provide wiring on the surface layer of the substrate. For this reason, it is necessary to provide a through hole in the substrate. However, a signal that is susceptible to noise and a signal that is likely to generate noise are inevitably exposed on the surface layer.

  In the mounting board, the electronic component is shielded so as to surround the mounted electronic component. In view of this, it is conceivable to arrange a plurality of through holes in a specific location on the substrate and arrange the shield parts so as to collectively surround these through holes.

  For example, Patent Document 1 discloses a shield structure in which a case is fixed on a parent substrate, a child substrate is disposed and fixed in the case, and a cover 1 is installed on the case so as to confine the child substrate. It is disclosed. Thus, this prior art shields the whole sub board | substrate by covering the whole sub board | substrate with a metal plate.

  Further, in Patent Document 2, in a board connection structure in which a connector provided on a printed circuit board is connected to a connector provided on a printed circuit board for signal processing to connect a signal wiring, the contact piece on the printed circuit board side and the printed circuit board side Are connected to each other, and the rear surface of the connector is magnetically shielded by a pair of contact pieces.

Japanese Patent Laid-Open No. 10-341095 Japanese Patent Laid-Open No. 10-92490

  However, the connector for connecting the mounting board and the flexible board and the connector for connecting the mounting boards often connect or disconnect the connector manually. For this reason, when the shield component is mounted so as to surround the connector, the workability of inserting / removing the connector deteriorates, so that it is difficult to mount the shield component covering the entire connector.

  The present invention has been made in view of such problems, and a mounting substrate and a mounting that can magnetically shield a through hole without providing a shield component covering the entire connector and a dedicated shield component for the through hole. An object is to provide a method for shielding a substrate.

  The mounting substrate according to the present invention is a mounting substrate having a substrate and a connector connected to a terminal of the substrate, wherein the connector has a surface other than the surface facing the substrate made of a conductive material or a conductive plate. And at least a part of the through hole provided in the substrate is disposed at a position below the connector.

  The mounting substrate sealing method according to the present invention includes a through hole provided in the substrate by covering a surface of the connector connected to the terminal of the substrate other than the surface facing the substrate with a sealing material made of a conductive material or a conductive plate. Is arranged below the connector to seal the through hole.

  In the mounting substrate or the sealing method, the connector includes, for example, a molded resin main body and a metal or alloy plate as the sealing material that covers a surface of the main body other than the surface facing the substrate. can do.

  The sealing material is preferably connected to ground.

  According to the present invention, the surface of the connector is covered with a sealing material, and the substrate is connected to the terminal on the substrate by collecting and arranging the through holes at a position below the connector on the substrate. Since the connector covers the upper part of the through hole provided in the connector, and the connector is covered with a sealing material made of a conductive material or a conductive material other than the surface facing the substrate, the through hole is magnetically shielded by the connector sealing material. Is done. Thus, the through hole can be magnetically shielded without providing a dedicated shield part.

  In the present invention, it is not necessary to magnetically shield all the through holes. Only the signal wiring through holes that are susceptible to noise and the signal wiring through holes that are likely to generate noise are collected in the vicinity of the connector. The magnetic shielding may be achieved by covering with the connector.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. FIG. 1A is a view showing a connector portion of a mounting board and a sealing method thereof according to the first embodiment of the present invention, and FIG. 1B is a view showing a conventional connector portion. Conventionally, as shown in FIG. 1B, a plurality of terminals 2 are arranged side by side on a substrate 3, and the terminals 2 are connected to the terminals of the connector 50. The connector 50 has a plurality of terminals arranged on the lower surface of a resin-molded main body, and leads (not shown) are led out from the connector 50 or the connector 50 is a flexible wiring board (not shown). Z)).

  In the embodiment of the present invention, as shown in FIG. 1A, a plurality of through holes 4 (for example, TH10, TH11,. ..TH20) are collected and arranged. That is, the device is designed so that the through hole 4 is in the vicinity of the terminal 2.

  In the embodiment of the present invention, as shown in FIG. 2A, the connector 1 has a plurality of terminals (not shown) arranged on the lower surface of the resin-molded main body 1a. The surface on which the terminal is provided, that is, the surface other than the surface facing the substrate 3 is covered with a sealing material 1b made of a conductive material or a conductive plate. A metal or alloy plate may be used as the sealing material 1b, and the resin mold main body 1a may be surrounded by the metal or alloy plate. The connector 1 may be assembled by externally fitting the sealing material 1b molded on the case to the main body 1a. The lower end of the sealing material 1b is connected to the terminal 2 connected to the ground (GND) on the surface of the substrate 3, and therefore the sealing material 1b becomes GND.

  As shown in FIGS. 2A and 2B, the multilayer wiring board 3 includes three wiring layers 3a, 3b, and 3c, and a first wiring 7a is formed on the insulating film of the lower wiring layer 3a. The second layer wiring 7b is formed on the insulating film of the middle wiring layer 3b, and the terminals 2 are formed on the upper wiring layer 3c and on the lower surface of the substrate. The through hole 4 is formed so as to penetrate the substrate 3, and a conductor (not shown) is embedded therein. For example, a wiring 7 a is connected to the through hole 4, and the wiring 7 a is led to the upper surface and the lower surface of the substrate 3 through the through hole 4.

  Next, the operation of the mounting substrate and the sealing method of the present embodiment configured as described above will be described. As shown in FIG. 2B, in the case of the conventional mounting board, as described above, the wiring that is easily affected by noise is sandwiched between the wiring connected to the installation at the top and bottom, thereby providing a magnetic shield. However, the through hole 4 is exposed on the front surface and the back surface of the substrate 3. For this reason, noise 5 from the outside enters the through hole 4 or noise 6 from a signal transmitted through the through hole 4 is emitted to the outside.

  On the other hand, as shown in FIG. 2A, in the case of the embodiment of the present invention, the terminal 2 is designed to be disposed in the vicinity of the through hole 4 in the substrate 3. Since the surface other than the surface facing the substrate 3 of the molded resin main body 1a is covered with a sealing material 1b such as a metal or alloy plate, and the sealing material 1b is connected to the ground, the external noise 5 is The connector 1 is blocked by the connector 1 so that it does not reach the through hole 4 and the terminal located below the connector 1, and radiation noise 6 generated from a signal transmitted through the through hole 4 is also generated by the sealing material of the connector 1. It is blocked by 1b and is not released to the outside. Therefore, according to the present embodiment, a magnetic shield can be applied to the through hole 4 without installing a shield part for the connector and the through hole, and the connector insertion / removal operation is not hindered.

  Furthermore, by using a metal or alloy plate as the sealing material 1b, the sealing material 1b functions as a reinforcing plate for the molded resin main body 1a. In other words, the connector made of molded resin is likely to be cracked and twisted, but this main body 1 can be formed by using a sealing material 1b as a metal or alloy plate, for example, a metal or alloy case or a metal or alloy frame. The strength and rigidity of the connector 1 as a whole can be increased.

  FIG. 3 is a diagram showing a second embodiment of the present invention. 3, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted. In the present embodiment, when there is a wiring prohibited area 6 (indicated by hatching in the figure) in the vicinity of the connector 1, all the through holes are not arranged under the connector 1 but are affected by noise. Only through-holes 7 that transmit easy signals and signals that easily generate noise are arranged below the connector 1, and through-holes 8 that transmit signals that are not easily affected by noise and signals that do not generate noise are removed from below the connector 1. Place it at the specified position.

  Thus, in the present invention, since at least a part of the through hole is disposed below the connector 1 with the sealing material, the flexibility of the arrangement mode of the through hole 4 is improved. Even if the wiring prohibition region 6 is present on the substrate 3, at least the through hole 7 for transmitting a signal that is easily affected by noise and a signal that is likely to generate noise is disposed below the connector 1, so that external noise is present. And the influence of the radiation nozzle can be eliminated.

  The present invention can eliminate noise intrusion and radiation with respect to a signal transmitted through the through hole of the mounting board, and thus can prevent leakage of electromagnetic wave noise on the mounting board, and is useful for improving the mounting density of a printed board or the like.

(A) is a figure which shows the mounting board | substrate and its sealing method which concern on 1st Embodiment of this invention, (b) is a figure which shows the conventional mounting board | substrate. (A) is sectional drawing which shows the mounting substrate which concerns on 1st Embodiment of this invention, (b) is sectional drawing of the conventional mounting substrate. It is a figure which shows the mounting substrate which concerns on 2nd Embodiment of this invention, and its sealing method.

Explanation of symbols

1: Connector 2: Terminal 3: Board 4: Through hole 5: External noise 6: Radiation noise 6: Wiring prohibited area 7, 8: Through hole

Claims (6)

A mounting substrate having a substrate and a connector connected to a terminal of the substrate, wherein the connector is covered with a sealing material made of a conductive material or a conductive plate on a surface other than the surface facing the substrate. A mounting board, wherein at least a part of the through hole provided in the connector is disposed at a position below the connector. 2. The mounting board according to claim 1, wherein the connector includes a main body made of mold resin, and a metal or alloy plate as the sealing material that covers a surface of the main body other than a surface facing the substrate. . The mounting board according to claim 1, wherein the sealing material is connected to ground. By covering a surface other than the surface facing the substrate of the connector connected to the terminal of the substrate with a sealing material made of a conductive material or a conductive plate, and arranging a through hole provided in the substrate below the connector, A mounting substrate sealing method, wherein the through hole is sealed. 5. The mounting board according to claim 4, wherein the connector includes a main body made of mold resin, and a metal or alloy plate as the sealing material that covers a surface of the main body other than the surface facing the substrate. Sealing method. The mounting substrate sealing method according to claim 4, wherein the sealing material is connected to ground.

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