JP2007207776A - Method of manufacturing circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board which never sacrifices the number of good products even if it comprises a plurality of processes in each of which positioning holes are used. <P>SOLUTION: The manufacturing method of a circuit board includes a first and a second punching process wherein punching is conducted using first and second positioning holes 111 and 131, respectively. The first and the second positioning holes 111 and 131 to be used for the first and the second punching process, respectively, use positioning positions at the same coordinates. The second positioning holes 131 to be used for the second punching process have a larger diameter than the first positioning holes 111 to be used for the first punching process. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a circuit board manufacturing method.

  In recent years, the density of electronic devices has been increased, as represented by mobile phones and personal computers, and as a result, the required quality of circuit boards used has been varied. Under these circumstances, the demand for flexible printed circuit boards that are thin, light, and small is increasing.

  A general manufacturing method of a flexible printed circuit board uses a metal-clad laminate in which a metal foil is laminated on at least one surface side of a base material. First, after forming a wiring circuit on the metal layer, a surface coating layer is formed, and then the surface coating layer is selectively removed, and surface treatment is performed on a land portion used for component mounting or the like. Then, a flexible printed circuit board is completed by bonding together a reinforcing plate or the like that partially reinforces the flexible printed circuit board, which is said to be a continuity test or backing, and punching the outer diameter. Depending on the product specifications, a process for forming a plurality of different coating layers and an electromagnetic wave shielding layer is appropriately added.

  During production, a plurality of products are placed on a single conductor-clad laminate or a roll-like conductor-clad laminate, cut to an optimal size as needed in the middle of the process, and finally in the outer shape machining process. It becomes a piece of the product. When performing component mounting or the like, a product may not be completely separated into individual pieces, but may be formed in a state in which a plurality of products are connected and processed into individual pieces after component mounting.

  Here, in the surface coating layer formation, punching process, continuity inspection process, etc. in the middle process, a positioning hole is provided by using a portion to be discarded that does not become a product of a flexible printed circuit board in advance. Has a positioning pin. And a product can be processed with high accuracy by inserting a positioning hole into the positioning pin and processing it.

Although the positioning hole depends on the required position accuracy, the positioning hole is generally opened with a diameter substantially the same as the diameter of the inserted pin. For this reason, if the pin is inserted into or removed from the positioning hole even once, the positioning hole is deformed. Therefore, when performing processing that requires positioning multiple times, it is necessary to process the positioning hole in a different place each time. Therefore, in order to use a limited space, it is necessary to provide positioning holes at the expense of the number of products. As a result, the number of products obtained from a predetermined size is reduced, which in turn increases the product cost.
JP 07-052096 A

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a method of manufacturing a circuit board without sacrificing the number of products to be obtained even in processing using a plurality of positioning holes. .

  A method of manufacturing a circuit board according to the present invention is a method of manufacturing a circuit board having first and second punching steps in which punching is performed using first and second positioning holes, wherein the first and second The first and second positioning holes used in the punching step use the same coordinate positioning position, and the second positioning hole has a diameter larger than that of the first positioning hole used in the first punching step. The diameter of the second positioning hole used in the punching step is larger.

  According to the present invention, since the same position can be used again by re-opening the positioning holes at the same coordinates before the second punching step, the circuit does not sacrifice the number of products. A method for manufacturing a substrate can be provided.

  ADVANTAGE OF THE INVENTION According to this invention, even if it is a process which uses the positioning hole of multiple times, the manufacturing method of the circuit board which does not sacrifice the product picking number can be provided.

  Hereinafter, the manufacturing method of the circuit board of this invention is demonstrated. In all the drawings, common constituent elements are denoted by the same reference numerals, and detailed description thereof will be appropriately omitted in the following description.

  The manufacturing method of the flexible circuit board of the present invention is a manufacturing method of a flexible circuit board including a first punching process and a second punching process of the flexible circuit board, and has a common guide hole used during the punching process, In addition, this is a method for manufacturing a flexible circuit board without reducing productivity.

  Next, an example of a method for manufacturing the flexible circuit board according to the present embodiment will be described.

The circuit board manufacturing method shown in the present embodiment is a circuit board manufacturing method having first and second punching steps in which punching is performed using the first and second positioning holes 111 and 131, The first and second positioning holes 111 and 131 used in the first and second punching steps use the same coordinate positioning positions and are compared with the hole diameters of the first positioning holes 111 used in the first punching step. Then, the circuit board manufacturing method is characterized in that the hole diameter of the second positioning hole 131 used in the second punching step is larger.

As shown in FIG. 1A, a product region 101 to be a circuit board 151 is arranged, and first and second positioning hole symbols 103 and 104 for punching the product region 101 are formed. . The circuit board 151 is not illustrated, but will be described with the simplest configuration of a flexible circuit board that includes a substrate, a conductor circuit, and a coating layer.

  The substrate is, for example, a resin film base material. Examples of the resin film substrate include polyimide resin films such as polyimide resin films, polyetherimide resin films, polyamideimide resin films, polyamide resin films such as polyamide resin films, and polyester resin films such as polyester resin films. Is mentioned. Among these, a polyimide resin film is particularly preferable from the viewpoint of improving flexibility, elastic modulus, and heat resistance.

Although the thickness of the board | substrate 10 is not specifically limited, Preferably it is 5-50 micrometers, More preferably, it is 1
2.5 to 25 μm. When the thickness is within this range, the flexibility is particularly excellent, while sufficient hardness is obtained to ensure good workability.

  A conductor circuit is provided on one surface of the substrate. In the present embodiment, the conductor circuit is a single-sided substrate having only one surface of the substrate, but the conductor circuit may be provided on the other surface, that is, both surfaces of the substrate. The substrate may be provided with a through hole, and the conductor circuits on both sides may be electrically connected to each other through the through hole.

  A coating layer is provided on the upper surface of the substrate to cover the conductor circuit while leaving a part of the conductor circuit. The coating layer is a cover lay film that includes an adhesive and an insulating resin film. However, it is not essential to use a coverlay film as the coating layer. For example, as the coating layer, a liquid resin composition containing a thermosetting resin may be formed by screen printing or the like and then heat cured. From the viewpoint of bending properties, it is preferable to use a coverlay film.

  The adhesive is preferably composed of a resin composition containing a thermosetting resin such as an epoxy resin, a polyester resin, a polyimide resin, a polyamide resin, a polyamideimide resin, or a polyurethane resin. Among these, epoxy resins are particularly preferable from the viewpoint of improving adhesion and heat resistance.

  As the material of the insulating resin film, the same material as the substrate can be used. Also about an insulating resin film, the film containing a polyimide resin is especially preferable from a viewpoint of improving an elasticity modulus and heat resistance.

  Next, the first positioning hole 111 is processed at the center of the first positioning hole symbol 103 using a magnifying glass or the like (FIG. 1B). Although it does not specifically limit as a processing method, A drill, a punch, etc. are used. The hole diameter of the first positioning hole 111 is not particularly limited, but it is necessary to consider that the second positioning hole 131 is subsequently opened. That is, the first positioning hole 111 needs to have a smaller hole diameter than the second positioning hole 131. The hole diameter is preferably φ1.0 mm or more and φ3.0 mm or less in consideration of maintaining the number of products within a predetermined size and workability. Within this range, the punching accuracy can be maintained without impairing the number of products. Further, the place where the first positioning hole 111 is disposed is not particularly limited, but it is preferable that it is separated from the product by about 2 mm or more and 5 mm or less in consideration of the processing accuracy at the time of punching. Within this range, the product can be placed without impairing the number of products.

  Next, the first punching portion 121 is punched using the first positioning hole 111 that has been punched (FIG. 1C). As the range of the first punching portion 121, a punching range that maintains the external accuracy and considers the burden on the mold may be appropriately determined according to the shape of the product.

  After the first punching process is completed, the positioning hole 111 used at the time of the first punching process is used again (FIG. 1D). At this time, since the first positioning hole 111 is used in the first punching step, the first positioning hole 111 is often deformed. If the second positioning hole 131 is processed on the same coordinates using the deformed first positioning hole 111, it may not be processed to an accurate position. In order to prevent this, the second positioning hole symbol 104 larger than the hole diameter of the first positioning hole 111 is formed, and the second positioning hole 131 is formed using the second positioning hole symbol 104. Is processed. Although the hole diameter of the positioning hole 131 to be reworked is not particularly limited, it is larger than the hole diameter of the first positioning hole 111 by 1 mm or more and 3 mm or less. If there is a hole diameter within this range, the number of products within a predetermined size will not be affected.

  Next, a second punching step is performed using the reworked second positioning hole 131 to process the second punched portion 141. The second punched portion 141 may be appropriately determined in accordance with the shape of the product while maintaining the outer shape accuracy in the same manner as the first punched portion 121 and considering the burden on the mold (FIG. 1 (e)). .

  In this way, the product 151 is obtained (FIG. 1 (f)). The order in which the first and second punching steps are performed may be determined as appropriate, but it is desirable to process a portion that requires punching accuracy in the first punching step in which drilling can be performed with higher accuracy.

  2 (a) to 2 (f) show a conventional example, but it is necessary to open a plurality of positioning holes at different coordinates, and a processing region necessary to obtain one product is according to the present invention. Compared to one embodiment, the number of products is greatly reduced.

It is process drawing which shows the manufacturing method of the circuit board explaining one Embodiment of this invention. It is process drawing which shows the manufacturing method of the circuit board explaining a prior art example.

Explanation of symbols

101, 201: Product area 102, 202: Out-of-product area 103, 203: First positioning hole symbol 104, 204: Second positioning hole symbol 111, 211: First positioning hole 121, 221: First Punching part (first punching process)
131, 231: Second positioning hole 141, 241: Second punching portion (second punching step)
151,251: Product (circuit board)

Claims (3)

A method of manufacturing a circuit board having first and second punching steps, in which punching is performed using first and second positioning holes,
The first and second positioning holes used in the first and second punching steps use the same coordinate positioning positions and are compared with the hole diameters of the first positioning holes used in the first punching step. A method of manufacturing a circuit board, wherein the second positioning hole used in the second punching step has a larger hole diameter.   The method for manufacturing a circuit board according to claim 1, wherein a hole diameter of the second positioning hole is larger than a hole diameter of the second positioning hole. 3. The circuit board manufacturing method according to claim 1, wherein the second positioning hole is formed after the first punching step is completed.

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