JP2007201041A5 - - Google Patents

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Publication number
JP2007201041A5
JP2007201041A5 JP2006015988A JP2006015988A JP2007201041A5 JP 2007201041 A5 JP2007201041 A5 JP 2007201041A5 JP 2006015988 A JP2006015988 A JP 2006015988A JP 2006015988 A JP2006015988 A JP 2006015988A JP 2007201041 A5 JP2007201041 A5 JP 2007201041A5
Authority
JP
Japan
Prior art keywords
support
semiconductor element
back surface
mounting
element according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006015988A
Other languages
English (en)
Japanese (ja)
Other versions
JP4940669B2 (ja
JP2007201041A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006015988A priority Critical patent/JP4940669B2/ja
Priority claimed from JP2006015988A external-priority patent/JP4940669B2/ja
Publication of JP2007201041A publication Critical patent/JP2007201041A/ja
Publication of JP2007201041A5 publication Critical patent/JP2007201041A5/ja
Application granted granted Critical
Publication of JP4940669B2 publication Critical patent/JP4940669B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006015988A 2006-01-25 2006-01-25 半導体素子搭載用の支持体 Expired - Fee Related JP4940669B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006015988A JP4940669B2 (ja) 2006-01-25 2006-01-25 半導体素子搭載用の支持体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015988A JP4940669B2 (ja) 2006-01-25 2006-01-25 半導体素子搭載用の支持体

Publications (3)

Publication Number Publication Date
JP2007201041A JP2007201041A (ja) 2007-08-09
JP2007201041A5 true JP2007201041A5 (https=) 2009-01-08
JP4940669B2 JP4940669B2 (ja) 2012-05-30

Family

ID=38455343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006015988A Expired - Fee Related JP4940669B2 (ja) 2006-01-25 2006-01-25 半導体素子搭載用の支持体

Country Status (1)

Country Link
JP (1) JP4940669B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5167977B2 (ja) * 2007-09-06 2013-03-21 日亜化学工業株式会社 半導体装置
JP5656247B2 (ja) * 2010-10-05 2015-01-21 シチズン電子株式会社 半導体発光装置及び半導体発光装置の組み込み構造
JP6015052B2 (ja) * 2011-10-13 2016-10-26 日亜化学工業株式会社 半導体装置
WO2017026093A1 (ja) 2015-08-10 2017-02-16 パナソニックＩｐマネジメント株式会社 発光装置及び半田接合体
JP6668656B2 (ja) * 2015-09-28 2020-03-18 日亜化学工業株式会社 パッケージ、発光装置、発光モジュール、及び、パッケージの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3286917B2 (ja) * 1999-05-06 2002-05-27 株式会社村田製作所 電子部品用パッケージおよび電子部品
JP2001203554A (ja) * 2000-01-21 2001-07-27 Murata Mfg Co Ltd 圧電共振部品およびその製造方法
JP4068367B2 (ja) * 2002-03-08 2008-03-26 シチズンホールディングス株式会社 圧電デバイス用集合基板、圧電デバイス及びその製造方法
JP3864417B2 (ja) * 2003-09-29 2006-12-27 株式会社大真空 電子部品用パッケージ
JP4670251B2 (ja) * 2004-04-13 2011-04-13 日亜化学工業株式会社 発光装置

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