JP2007199657A - Optical wiring module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent light from being undesirably made incident on an optical element installed in an optical semiconductor element. <P>SOLUTION: An optical wiring module 1 includes: an optical wiring board 20 containing an optical waveguide member 2; and a first and a second optical semiconductor element 3 flip-chip-mounted on the optical wiring board 20. The optical waveguide member 2 comprises: clad layers 6, 8; and a plurality of core layers 7 laminated on the clad layers 6, 8 and provided with an optical path conversion means 40, and a light shielding member 62 which is installed between the optical elements 4 of the first and second optical semiconductor elements 3 respectively and which is composed of a non-light transmissive resin is arranged on the optical wiring board 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical wiring module, for example, a technique that can apply an electrical wiring or a part thereof to an optical wiring.

  The amount of communication information handled by companies and homes has become enormous, and is becoming an amount that cannot be distributed by electrical signals. That is, in order to transmit and receive high-speed signals (high-frequency digital signals) electrically, pre-emphasis and equalizing techniques are required, and a circuit for this purpose must be added. This circuit increases power consumption, increases heat generation of the silicon chip, and enormously increases the cooling system. In order to solve such problems, a technique using an optical signal suitable for distributing a large amount of information has been disclosed. A technique using an optical signal for communication between devices, and a silicon chip such as a backplane and a board. Various techniques using an optical signal have been disclosed to the nearest.

  In order to allow the optical signal to reach the vicinity of the silicon chip, it is necessary to guide the light guided through the optical waveguide in the substrate on which the silicon chip is mounted to the light receiving element provided in the silicon chip. Therefore, it is necessary to increase the alignment accuracy between the light emitting element or the light receiving element provided on the silicon chip and the optical waveguide in the substrate on which the silicon chip is mounted. As a technique for easily aligning with high accuracy, a technique is disclosed in which a concave portion is formed at a predetermined position of a substrate and a light emitting element or the like is mounted in the concave portion to facilitate positioning of the light emitting element ( For example, see Patent Document 1).

Japanese Patent Application Laid-Open No. 2005-265885

  A technology for mounting a plurality of optical semiconductor elements on an optical wiring board to reduce the size of the optical wiring module as a whole is desired, but when mounting a plurality of optical semiconductor elements at high density, up to adjacent optical semiconductor elements The distance becomes smaller. Thus, in the case of an optical wiring module configured by mounting a plurality of optical semiconductor elements on an optical wiring board, light emitted from a light emitting element provided in each optical semiconductor element or light incident on a light receiving element is adjacent to light. There is a possibility that light may undesirably enter the semiconductor element and crosstalk may occur. In order to prevent the occurrence of this crosstalk, it is possible to prevent light from being emitted to the outer periphery to some extent by using concave portions formed in the substrate of the prior art. It is difficult to form at a desired position with high accuracy. Therefore, such conventional techniques cannot reliably prevent the occurrence of crosstalk.

  Accordingly, an object of the present invention is to provide an optical wiring module that prevents light from being undesirably incident on a light receiving element or a light emitting element provided in an adjacent optical semiconductor element.

  The present invention is a first optical wiring module having an optical wiring board including an optical waveguide member and first and second optical semiconductor elements flip-chip mounted on the optical wiring board, The waveguide member includes a clad layer and a plurality of core layers stacked on the clad layer and having an optical path changing unit. The light provided on the first optical semiconductor element is provided on the optical wiring substrate. A light-shielding member made of a non-light-transmissive resin is disposed between the element and the optical element of the second optical semiconductor element.

  According to another aspect of the present invention, there is provided an optical wiring board including an optical waveguide member, and an optical semiconductor element that is flip-chip mounted on the optical wiring board and includes a plurality of optical elements on a surface facing the optical wiring board. The optical waveguide member includes a clad layer and a plurality of core layers stacked on the clad layer and having an optical path changing unit. A light shielding member made of a non-light-transmitting resin is disposed on the opposing surface and between the adjacent optical elements.

  Furthermore, the present invention provides an optical wiring board including an optical waveguide member, an optical semiconductor element that is flip-chip mounted on an upper surface of the optical wiring board, and includes a plurality of optical elements on a surface facing the optical wiring board. , Wherein the optical waveguide member includes a cladding layer and a plurality of core layers stacked on the cladding layer and having an optical path changing unit, and the optical wiring A light-shielding member made of a non-light-transmitting resin is disposed on the upper surface of the substrate and between the adjacent optical elements.

  In the second optical wiring module according to the present invention, the surface of the light shielding member is located closer to the optical wiring board than the surface of the optical element.

  According to the present invention, in the third optical wiring module, the surface of the light shielding member is located closer to the optical semiconductor element than the surface of the optical element.

  Furthermore, the present invention is characterized in that, in the second or third optical wiring module, the light shielding member surrounds an outer periphery of the optical element.

  In the first to third optical wiring modules according to the present invention, the optical element is a light emitting element or a light receiving element.

  Furthermore, the present invention is characterized in that, in the first optical wiring module, the light shielding member surrounds the first and second optical semiconductor elements along an outer periphery thereof.

  According to the present invention, in any one of the first to third optical wiring modules, the light shielding member is provided in a gap between the first and / or second optical semiconductor element and the optical wiring board. It is characterized by that.

  Furthermore, the present invention is characterized in that, in any of the first to third optical wiring modules, the optical path changing means is a reflecting means for reflecting light.

  According to the present invention, in any one of the first to third optical wiring modules, the reflecting means reflects light incident on the reflecting means from the optical element in a direction along the core layer. Or a function of reflecting light incident on the reflecting means from the core layer toward the optical element.

  Furthermore, in the present invention, in any one of the first to third optical wiring modules, the surface of the core layer on which the reflecting means is provided and the surface of the reflecting means are inclined with respect to the surface of the cladding layer. It is characterized by being.

  According to the present invention, in any one of the first to third optical wiring modules, the surface of the core layer on which the reflection unit is provided and the surface of the reflection unit are travel directions of light reflected by the reflection unit. It is characterized by being formed in a convex curved shape protruding in the opposite direction.

  Furthermore, according to the present invention, in any one of the first to third optical wiring modules, an inclination angle of a surface of the core layer on which the reflecting means is provided with respect to a surface of the cladding layer is defined to be 41 degrees or more and 49 degrees or less. It is characterized by that.

  According to the present invention, in any one of the first to third optical wiring modules, the optical element and the cladding layer of the optical waveguide member are held in a non-contact state.

  Furthermore, according to the present invention, in any one of the first to third optical wiring modules, a light-transmitting member made of a light-transmitting resin is provided at least between the optical element and the optical path changing unit. It is characterized by that.

  According to the present invention, in any one of the first to third optical wiring modules, the translucent member mechanically connects the first and / or second optical semiconductor element and the optical wiring board. It is characterized by that.

  Furthermore, in the present invention, in any one of the first to third optical wiring modules, the cladding layer collects light from the optical element or light directed to the optical element at a position facing the optical element. A light collecting means is included.

  According to the present invention, in any one of the first to third optical wiring modules, the condensing unit is formed integrally with the clad layer.

  Further, according to the present invention, in any one of the first to third optical wiring modules, the optical element and the clad layer of the optical waveguide member positioned on the optical path changing unit are kept in contact with each other. It is characterized by being.

  According to the present invention, by providing a light blocking member in a region between adjacent optical elements or a region between adjacent optical semiconductor elements, the adjacent optical semiconductor elements are emitted from the optical elements of the first optical semiconductor element. The light is undesirably incident on the second optical semiconductor element or the optical element, or the light incident on the optical element of the first optical semiconductor element is the second optical semiconductor element or It is possible to satisfactorily prevent the optical element from being undesirably incident and to prevent occurrence of crosstalk. As a result, even if the number of optical semiconductor elements connected to the optical wiring board per unit area is increased and the distance to the adjacent optical semiconductor elements is reduced, the optical elements of the adjacent optical semiconductor elements are reduced. It is possible to prevent the occurrence of crosstalk due to incident light. Therefore, the optical semiconductor element can be mounted on the optical wiring board with high density, and the optical wiring module can be miniaturized.

  Further, according to the present invention, since the light shielding member surrounds each optical semiconductor element or the outer periphery of each optical element, it is possible to further suppress the occurrence of crosstalk. Since only the light shielding member is surrounded along the outer periphery of the optical semiconductor element or each optical element, the condition for suppressing the crosstalk is satisfied, so that the manufacturing process of the light shielding member can be simplified.

  Furthermore, according to the present invention, since the light shielding member is provided in the gap between each optical semiconductor element and the optical wiring board except for the light emitting portion and the light receiving portion, it is possible to easily suppress the occurrence of crosstalk. It becomes. For example, compared to the prior art that suppresses the occurrence of crosstalk using a plurality of mirror pieces and diffraction gratings, the manufacturing of the optical wiring module can be simplified and the manufacturing cost can be reduced.

  Furthermore, according to the present invention, the surface of the core layer (reflecting surface) on which the reflecting means is provided and the surface of the reflecting means have a convex curved shape that protrudes in the direction opposite to the traveling direction of the light reflected by the reflecting means. Since it is formed, the light condensing characteristic can be improved as compared with the case where the surface of the reflecting means and the reflecting surface of the core layer are formed flat. Therefore, the optical path conversion can be realized without increasing the positioning accuracy of the reflecting means with respect to the optical element of the optical semiconductor element as compared with the prior art. Therefore, the manufacturing of the optical wiring board can be further simplified, and the manufacturing cost can be further reduced.

  Further, according to the present invention, the surface of the core layer on which the reflecting means is provided and the surface of the reflecting means are inclined with respect to the surface of the cladding layer, and the inclination angle is not less than 41 degrees and not more than 49 degrees. By being prescribed | regulated, it becomes possible to propagate light linearly, making an optical waveguide member thin. As a result, when the optical wiring board is multi-layered, the dimension in the thickness direction of the substrate can be reduced, and versatility to an apparatus on which the optical wiring board is mounted can be improved.

  Further, according to the present invention, since the optical element of the optical semiconductor element and the cladding layer of the optical wiring board are held in a non-contact state, the optical semiconductor element Even if thermal stress is applied between the optical wiring board and the optical element, the optical element is prevented from coming into contact with the surface of the optical wiring board and being damaged.

  Furthermore, according to the present invention, since the light transmitting member made of a light transmitting resin is provided between the optical element of the optical semiconductor element and the optical path changing means, the optical semiconductor element and the optical wiring board It becomes easy to hold in a non-contact state.

  Furthermore, according to the present invention, the translucent member mechanically connects the optical semiconductor element and the optical wiring board, so that the mounting strength of the optical semiconductor element to the optical wiring board is increased, and the optical semiconductor Even if a thermal stress is applied between the element and the optical wiring board, it is possible to prevent the relative position of the optical semiconductor element from the optical wiring board from being undesirably displaced.

  Further according to the invention, the clad layer includes a condensing means for condensing light from the optical element or light directed to the optical element at a position facing the optical element. Therefore, it is possible to improve the light condensing characteristics, relax the accuracy required for positioning the optical path changing means with respect to the optical element, and contribute to the improvement of the productivity of the optical wiring board.

  Furthermore, according to the present invention, since the light collecting means is formed integrally with the cladding layer, the light collecting means can be manufactured more easily than when the light collecting means is provided separately. Therefore, the manufacturing of the optical wiring board can be further simplified, and the manufacturing cost can be further reduced.

  Furthermore, according to the present invention, the optical element provided in the optical semiconductor element and the clad layer of the optical waveguide member located on the optical path changing means are held in contact with each other, so that the optical element And the optical path changing means can be shortened. Therefore, the light coupling efficiency between the optical element and the optical path changing means can be improved.

  Hereinafter, a plurality of embodiments for carrying out the present invention will be described with reference to the drawings. Portions corresponding to the matters described in the preceding forms in each embodiment are denoted by the same reference numerals, and overlapping description may be omitted. When only a part of the configuration is described, the other parts of the configuration are the same as those described in the preceding section. Not only the combination of the parts specifically described in each embodiment, but also the embodiments can be partially combined as long as the combination does not hinder.

(First embodiment)
FIG. 1 is a perspective view showing an optical wiring module 1 according to the first embodiment of the present invention, and a part thereof is shown in cross section. FIG. 2 is a plan view showing the optical wiring module 1. FIG. 3 is a partially enlarged cross-sectional view of FIG.

  The optical wiring module 1 generally includes an optical wiring substrate 20 and a plurality of (four in this embodiment) optical semiconductor elements that are flip-chip mounted on the optical wiring substrate 20 via bumps 24 such as Au. 3 and a light shielding member 62 formed on the optical wiring board 20 so as to surround the periphery of the optical semiconductor element 3. Such an optical wiring module 1 transmits light of an optical element 4 (for example, a light emitting element) emitted from the optical semiconductor element 3 through an optical wiring substrate 20 to an optical element 4 (for example, a light receiving element) of another optical semiconductor element 3. , The optical signal is transmitted between the different optical semiconductor elements 3.

  The optical wiring substrate 20 constituting the optical wiring module 1 includes a support substrate 5 and an optical waveguide member 2 fixed to the support substrate 5.

  The support substrate 5 has the optical waveguide member 2 and a printed board (not shown) mounted on the upper surface thereof. The support substrate 5 is formed of an insulating material such as a synthetic resin, alumina ceramic, glass ceramic, or the like, and is formed in various shapes such as a flat plate shape or a rectangular parallelepiped shape.

  The optical waveguide member 2 is electrically connected to the first and second cladding layers 6, 8, the plurality of core layers 7 interposed between the first cladding layer 6 and the second cladding layer 8, and the optical semiconductor element 3. The optical waveguide member 2 has a thickness h1 of, for example, 50 μm or more and 100 μm or less.

  Of the first and second cladding layers 6, 8, the second cladding layer 8 is interposed between the core layer 7 and the support substrate 5, and the first cladding layer 6 is more optical semiconductor element 3 than the second cladding layer 8. It is arranged to be located on the side.

  In addition, a region (peripheral portion 9) of the optical wiring board located around the core layer 7 and the through electrode 10 is made of a translucent material such as epoxy resin, acrylic resin, polysilanol resin, polysilane, and glass (including quartz). ) And are made of the same material. On the other hand, the first and second cladding layers 6 and 8 are made of a light-transmitting material having a small refractive index with respect to the core layer 7 and the peripheral portion 9, for example, epoxy resin, acrylic resin, polysilanol resin, polysilane, and glass ( (Including quartz). On the other hand, the through electrode 10 is formed of a conductive material such as copper, silver, gold, aluminum, nickel, chromium, iron, tungsten, or molybdenum.

  Each core layer 7 is, for example, elongated along the direction in which light should travel (for example, the X direction), and along the Y direction perpendicular to the substrate thickness direction (denoted as the Z direction) and the X direction, respectively. They are arranged in the direction with a predetermined pitch and at intervals. Here, a virtual plane including the X and Y directions is referred to as an XY plane.

  Each core layer 7 has optical path changing means 40 at the end in the X direction. The optical path conversion means 40 includes an inclined portion 13 that is an end face of the core layer 7 and a reflective film 14 as a reflecting means that is attached to the inclined portion 13.

  The reflective film 14 has a function of reflecting light emitted from an optical element 4 (for example, a light emitting element) provided in the optical semiconductor element 3 toward the core layer 7, and provides light transmitted through the core layer 7 to the optical semiconductor element 3. And has a function of reflecting toward the optical element 4 (for example, a light receiving element). Such a reflective film 14 is formed by, for example, depositing a reflective material such as aluminum on the inclined portion 13 using a thin film forming technique such as vapor deposition. In the present embodiment, the inclined portion 13 of the core layer 7 is defined to have an inclination angle α with respect to the surface of the first cladding layer 6 of, for example, 41 degrees or more and 49 degrees or less.

  Further, a connection pad 11 is formed on the surface of the through electrode 10, and the connection pad 11 is connected to the optical semiconductor element 3 through a bump 24. The connection pad 11 is disposed on the same plane as the surface of the first cladding layer 6, that is, on the XY plane.

  The optical wiring board 20 as described above is formed as follows. First, a transfer sheet is prepared, and a constituent material (for example, a photosensitive resin) of the first cladding layer 6 is applied on the transfer sheet, and this is processed by a photolithography technique, an etching technique, or the like to process the first cladding layer 6. Form. Next, a constituent material (for example, photosensitive resin) of the core layer is applied on the first cladding layer 6 and processed by a photolithography technique, an etching technique, or the like, and the inclined portion 13 is pressed by a tool or the like. The core layer 7 is formed by forming a corresponding slope and forming a reflective film 14 by depositing a reflective material such as aluminum on the slope using a physical vapor deposition method or the like. Subsequently, the constituent material (for example, photosensitive resin) of the second cladding layer 8 is applied onto the core layer 7 and the first cladding layer 8, and if necessary, this is processed by a photolithography technique, etching, or the like. Two cladding layers 6 are formed. Next, a through hole in which the through electrode 10 is provided is formed by using laser processing or the like, a conductive paste such as a copper paste is filled in the through hole, and this is heated to form the through electrode 10. Waveguide member 2 is formed on the transfer sheet. Finally, the optical waveguide member 2 is transferred to a separately prepared support substrate 5, and the transfer sheet is peeled off from the optical waveguide member 2 to form the optical wiring substrate 20.

  A light shielding member 62 is attached on the optical wiring board 20 described above. The light shielding member 62 is provided between the optical element 4 such as a light emitting element or a light receiving element provided in the optical semiconductor element 3 and the optical element 4 of the adjacent optical semiconductor element 3 and protrudes toward the semiconductor element 3 side. It is formed as follows.

  The light shielding member 62 is made of a non-light transmissive resin. Examples of the non-light-transmitting resin include a resin obtained by mixing a carbon powder, a graphite powder, or the like with an epoxy resin, a cyanate resin, a polyphenylene ether resin, a bismaleimide triazine resin, a polyimide resin, or the like. Other examples of the non-light-transmitting resin include a resin material blackened with a staining agent or a colorant, and a resin obtained by mixing a silica filler and carbon powder in an epoxy resin.

  Such a non-light-transmitting resin preferably has a ratio of the amount of transmitted light to the amount of light input per 1 cm of resin with respect to light having a wavelength to be used (for example, 850 nm), more preferably −40 dB. The following are good.

  For example, the first and second optical fibers are prepared, the resin is interposed between the two optical fibers, and light such as a laser or LED is transmitted from the first optical fiber to the second optical fiber. The amount of light emitted from the second optical fiber is obtained by measuring with a power meter. On the other hand, as a method for measuring the light transmission amount of the resin, for example, the second optical fiber is configured such that light is transmitted from the first optical fiber to the second optical fiber in a state where the resin is not interposed between the first and second optical fibers. It is calculated | required by measuring the light quantity of the emitted light from. And the ratio of the light transmission amount with respect to the light input amount of resin is calculated | required using the two light quantity obtained by this measurement.

  Since the light shielding member 62 formed of such a non-light-transmissive resin is provided between the optical elements of the adjacent optical semiconductor elements 3 as described above, the optical element 4 (for example, a light emitting element). The light emitted from the light and toward the optical element 4 (for example, the light receiving element) is well shielded from the outside. As a result, the light of the optical element 4 of the optical semiconductor element 3 is undesirably emitted toward the other optical semiconductor element 3 or the other optical element 4, or other than the optical element 4 of the optical semiconductor element 3. This prevents the light from the optical element 4 from entering undesirably.

  In the present embodiment, the light shielding member 62 is formed so as to surround the outer periphery of the optical semiconductor element 3, and is separated from the outer periphery of the optical semiconductor element 3 by a predetermined distance δ in the XY plane, as shown in FIG. Are arranged. The predetermined distance δ (see FIG. 2) is set to a distance that prevents light emitted from each optical semiconductor element 3 from being undesirably scattered outward, and is set to, for example, 0.3 μm or more and 10 μm or less. Note that, from the viewpoint of satisfactorily blocking light, the projection dimension h2 (see FIG. 3) of the light shielding member 62 is set to be larger than the height dimension h3 from the surface of the first cladding layer 6 to the optical semiconductor element 3. Is done.

  Such a light shielding member 62 may be provided on the optical wiring board 20 before mounting each optical semiconductor element 3 on the optical wiring board 20, or after mounting each optical semiconductor element 3 on the optical wiring board 20, It may be provided on the optical wiring board 20.

  Before mounting each optical semiconductor element 3 on the optical wiring board 20, as a processing method for providing the light shielding member 62 on the optical wiring board 20, for example, a photosensitive resin material (for example, a dry film resist) is bonded to the board, Exposure and development are performed using a photolithography technique to form a desired gap. Next, the space where the precursor of the light shielding member 62 or the precursor of the light shielding member 62 made of a liquid resin is formed is filled. The filling may be applied to the surface, may be screen printed, or a predetermined amount of resin may be injected using a dispenser. Next, the filled precursor of the light shielding member 62 is dried or cured to form the light shielding member 62, and the whole is immersed in an alkali solution to remove and remove the dry film resist. Thereby, the light shielding member 62 is formed. The light shielding member 62 can also be formed by punching a sheet-like resin with a mold or the like and bonding it to the optical wiring board 20.

  On the other hand, as a method of providing the light shielding member 62 on the optical wiring substrate 20 after the optical semiconductor element 3 is mounted on the optical wiring substrate 20, a resin precursor constituting the light shielding member 62 is dispensed to a predetermined portion of the optical wiring substrate 20. An example is a method in which the coating is applied and thermally cured.

  The optical semiconductor element 3 disposed on the optical wiring substrate 20 has a configuration in which an optical element 4 (light emitting element and / or light receiving element) is provided on one main surface of the semiconductor substrate. It is flip-chip mounted on the optical wiring substrate 20 so as to face the substrate 20. The optical semiconductor element 3 has an electrode pad (not shown) connected to the through electrode 10 of the optical wiring substrate 20 via a bump 24 made of a conductive material such as Au or solder on one main surface of the semiconductor substrate. Yes. Further, a plurality of dummy pads are provided on one main surface of the semiconductor substrate of the optical semiconductor element 3, and dummy bumps 25 are interposed between the dummy pads and the optical wiring substrate 20. Each dummy bump 25 is made of, for example, Au, solder, or the like, and is disposed at a distance from each bump 24. The optical semiconductor element 3 is supported from below by such bumps 24 and dummy bumps 25.

  Such an optical semiconductor element 3 is aligned with the optical wiring substrate 20 so that the region immediately below the optical element 4 is positioned on the inclined portion 13 and the reflective film 14 of the core layer 7.

Examples of the light emitting element that is an example of the optical element 4 include a laser such as a surface emitting semiconductor laser (Vertical Cavity Surface-Emitting Laser: abbreviated as VCSEL) and an edge emitting laser diode. An example of the light receiving element as an example of the optical element 4 is a photodiode.

  According to the present embodiment, by providing the light shielding member 62 as described above, light is undesirably incident on the optical element 4 of the adjacent optical semiconductor element 3 or light is undesirably leaked from the optical element 4. This can be prevented well and the occurrence of crosstalk can be prevented. Thus, even when the number of the optical semiconductor elements 3 connected to the optical wiring board 20 per unit area is increased and the distance to the adjacent optical semiconductor elements 3 is reduced, the adjacent optical semiconductor elements 3 It is possible to prevent the occurrence of crosstalk due to the incoming / outgoing light of the optical element. Therefore, the optical semiconductor element 3 can be mounted on the optical wiring board 20 with high density, and the optical wiring module 1 can be miniaturized.

  In the present embodiment, since the light shielding member 62 surrounds each optical semiconductor element 3 along the outer periphery thereof, the occurrence of crosstalk can be further suppressed. In this case, even if another optical wiring module 1 is mounted adjacently, the occurrence of crosstalk can be prevented very well by the light shielding member 62.

  Further, in the present embodiment, the inclined portion 13 is formed at the end of the core layer 7, the reflective film 14 that reflects light is formed on the inclined portion 13, and the inclined portion 13 and the reflective film 14 form the core layer 7. The optical path conversion means 40 is comprised. The inclined portion 13 is defined to have an inclination angle of 41 degrees or more and 49 degrees or less with respect to the surface of the first cladding layer 6, so that the light incident on the optical path changing means 40 is incident on the core layer 7 even if the optical waveguide member 2 is thinned. It is possible to propagate well. Therefore, when the optical wiring board 20 is multi-layered, the thickness can be reduced.

  In the present embodiment, since the optical element 4 provided in the optical semiconductor element 3 is flip-chip mounted, the distance between the optical element 4 and the surface of the first cladding layer 6 is close, and the light between them is transmitted. The amount of attenuation is slight. Therefore, even when a microlens is provided for the optical element 4, the accuracy required for positioning is relaxed. Depending on the application, it can be used without a microlens. Thus, the production of the optical wiring module 1 can be simplified, and the production cost can be reduced.

(Second Embodiment)
Next, an optical wiring module 1A according to the second embodiment of the present invention will be described. Here, the configuration different from the first embodiment will be mainly described, the description of the configuration common to the first embodiment is omitted, and the same reference numeral is used for the configuration common to the first embodiment. . FIG. 4 is an enlarged cross-sectional view showing a part of the optical wiring module 1A.

  Unlike the first embodiment, the optical wiring module 1A of the present embodiment has an inclined portion 13A of the core layer 7A that constitutes the optical path changing means 40A and a reflective film 14A that is deposited on the inclined portion 13A. It is formed in a shape.

  The inclined portion 13A is formed in a convex curved shape that protrudes in the direction opposite to the traveling direction of the light reflected by the reflective film 14A. As a result, it is possible to improve the light condensing characteristics as compared with the inclined portion 13 of the first embodiment. Therefore, the positioning accuracy of the optical element 4 and the reflective film 14A required for the first embodiment can be relaxed. Therefore, the productivity of the optical wiring board 20A can be improved and the manufacturing cost can be reduced.

(Third embodiment)
Next, an optical wiring module 1B according to the third embodiment of the present invention will be described. Here, the configuration different from the first embodiment will be mainly described, the description of the configuration common to the first embodiment is omitted, and the same reference numeral is used for the configuration common to the first embodiment. . FIG. 5 is a partially enlarged sectional view of the optical wiring module 1B.

  Unlike the first embodiment described above, the optical wiring module 1B of the present embodiment is provided with a translucent member 101B made of a transparent resin having optical transparency in the gap between the optical semiconductor element 3 and the optical wiring substrate 20. It has been.

  The translucent member 101B has a light attenuation amount (loss) ratio of 6 dB or less with respect to the amount of light input per 1 cm of the translucent member with respect to light having a wavelength to be used (for example, 850 nm). Desirably, 3 dB or less is suitably used, and 0.5 dB or less is optimal. In addition, for example, the first and second optical fibers are prepared, a resin is interposed between both optical fibers, and light such as a laser and an LED is transmitted from the first optical fiber to the second optical fiber. And the amount of light emitted from the second optical fiber is determined by measuring with a power meter. The amount of light attenuation is measured by transmitting light from the first optical fiber to the second optical fiber with no resin interposed between the first and second optical fibers and measuring the amount of light emitted from the second optical fiber. Is obtained by subtracting the light transmission amount from the light input amount described above. The ratio of the amount of light attenuation (loss) to the amount of light input can be obtained from the ratio of the two light quantities obtained by this measurement.

  Such a translucent member 101B is formed, for example, by injecting a predetermined amount of epoxy resin, acrylic resin, silicon resin or the like with a dispenser or the like and curing it. The translucent member 101 </ b> B is provided so as to contact both the optical semiconductor elements 3 and the optical wiring board 20. Therefore, each optical semiconductor element 3 and the optical wiring board 20 are mechanically connected by the translucent member 101B.

  By providing the translucent member 101B, the optical semiconductor element 3 and the first cladding layer 6 can be easily held in a non-contact state. Therefore, it is possible to satisfactorily prevent the optical element 4 from coming into contact with the optical wiring substrate 20 and being damaged due to thermal expansion or the like.

(Fourth embodiment)
Next, an optical wiring module 1C according to the fourth embodiment of the present invention will be described. Here, the configuration different from the first embodiment will be mainly described, the description of the configuration common to the first embodiment will be omitted, and the same reference numeral will be used for the configuration common to the first embodiment. . FIG. 6 is an enlarged cross-sectional view showing a part of the optical wiring module 1C.

  Unlike the first embodiment, the optical wiring module 1C of the present embodiment has a light incident on the optical element 4 at the positions of the first cladding layer 6C and the core layer 7C facing the optical element 4 of the optical semiconductor element 3. Alternatively, a microlens 100 </ b> C that collects light emitted from the optical element 4 is provided.

  The microlens 100C is configured by projecting the interface between the first cladding layer 6C and the core layer 7C toward the support substrate 5 side.

  Thus, by providing the microlens 100C on the first cladding layer 6C, it is possible to improve the light collection characteristics, to reduce the accuracy required for positioning the optical element 4 and the reflective film 14, and to improve the productivity of the optical wiring module 1C. Will improve.

  Further, since the microlens 100C is formed integrally with the first cladding layer 6C, the number of parts can be reduced as compared with the case where the microlens 100C is provided separately, and the configuration of the optical wiring module 1C is simply maintained. be able to. Therefore, the manufacturing cost can be kept low.

(Fifth embodiment)
Next, an optical wiring module 1D according to the fifth embodiment of the present invention will be described. Here, the configuration different from the first embodiment will be mainly described, the description of the configuration common to the first embodiment is omitted, and the same reference numeral is used for the configuration common to the first embodiment. . FIG. 7 is an enlarged sectional view showing a part of the optical wiring module 1D.

  Unlike the first embodiment, the optical wiring module 1D of the present embodiment is provided with a light shielding member 62D in the gap between the optical semiconductor element 3 and the optical wiring substrate 20, and the light shielding member 62D is accommodated in the optical element 4. A hole 61D is provided, and a light transmitting member 101D is filled between the hole 61D and the optical element 4. As a result, the optical element 4 and the first cladding layer 6 can always be kept in a non-contact state while ensuring the optical path of the light emitted from the optical element 4 of each optical semiconductor element 3 or the incident light to the optical element 4.

  The light shielding member 62D is made of an underfill resin having non-translucency. The translucent member 101D is provided so as to contact both the optical semiconductor element 3 and the optical wiring board 20. Therefore, each optical semiconductor element 3 and the optical wiring board 20 are mechanically connected by the translucent member 101D. In other words, the translucent member 101 </ b> D is provided so as to regulate relative displacement between each optical semiconductor element 3 and the surface of the first cladding layer 6. Therefore, the positional relationship of the optical semiconductor element 3 with respect to the optical wiring board 20 due to the thermal stress between the optical semiconductor element 3 and the optical wiring board 20 due to the difference in linear expansion coefficient is favorably suppressed.

  Any material can be used for the translucent member 101D as long as it is a translucent resin such as an epoxy resin, an acrylic resin, and a silicon resin. Further, the resin of the translucent member 101D may be solid, liquid, or rubber. This resin is applied to the optical element 4 of the optical semiconductor element 3, the surface of the corresponding optical wiring board 20, or both. Thereafter, the optical semiconductor element 3 is mounted. A portion other than the translucent member 101D may be coated with a normal underfill agent.

  In the optical wiring module 1D as described above, the light emitted from the optical element 4 or the incident light to the optical element 4 is prevented from leaking to the outside of the optical semiconductor element 3 due to the presence of the light shielding member 62D. Due to the presence of the hole 61D and the translucent member 101D of the member 62D, the amount of the incident light and the emitted light is suppressed from being reduced. As a result, it is possible to easily suppress the occurrence of crosstalk. For example, compared to the prior art that suppresses the occurrence of crosstalk using a plurality of mirror pieces and diffraction gratings, the manufacturing of the optical wiring module 1D can be simplified and the manufacturing cost can be reduced.

  In the present embodiment, the translucent member 101D is arranged in the hole 61D. However, as shown in FIG. 8, the translucent member 101D is not arranged in the hole 61D, and the inside of the hole 61D may be a space.

  In the present embodiment, the light shielding member 62D may be provided so as to abut on the gap between the adjacent optical semiconductor elements 3. As a result, even if the distance to the adjacent optical semiconductor elements 3 is very small, light can be reliably shielded between the adjacent optical semiconductor elements 3.

(Sixth embodiment)
Next, an optical wiring module 1E according to the sixth embodiment of the present invention will be described. Here, the configuration different from the first embodiment will be mainly described, the description of the configuration common to the first embodiment is omitted, and the same reference numeral is used for the configuration common to the first embodiment. . FIG. 9 is an enlarged cross-sectional view showing a part of the optical wiring module 1E.

  Unlike the first embodiment, the optical wiring module 1E of the present embodiment is in a state where the optical element 4E provided in the optical semiconductor element 3 is in contact with the surface of the first cladding layer 6 (hereinafter, “ It is sometimes referred to as “contact state”).

  In such a contact state, even if the projection dimension h2 of the light shielding member 62E is made smaller than in the case where the optical element 4E and the surface of the first cladding layer 6 are not in contact, the light shielding member. The incident light to the optical element 4E or the outgoing light from the optical element 4E is satisfactorily shielded by 62E, and as a result, crosstalk can be favorably prevented.

  In addition, in this case, the distance between the optical element 4E and the reflective film 14 can be shortened as compared with the case of the non-contact state. Therefore, it becomes possible to prevent the incident light to the optical element 4E and the outgoing light from the optical element 4E from leaking to the surroundings, and the light coupling efficiency can be improved.

(Seventh embodiment)
Next, an optical wiring module 1F according to a seventh embodiment of the present invention will be described. Here, the configuration different from the first embodiment will be mainly described, the description of the configuration common to the first embodiment is omitted, and the same reference numeral is used for the configuration common to the first embodiment. . FIG. 10 is an enlarged cross-sectional view showing a part of the optical wiring module 1F, and FIG. 11 is a plan view of the optical semiconductor element 3F constituting the optical wiring module 1F of FIG.

  Unlike the first embodiment, in the optical wiring module 1F of the present embodiment, a plurality of optical elements 4F provided in the optical semiconductor element 3F are arranged in a straight line, and further, when viewed in plan, the light shielding member 62F. Is attached to the optical wiring board 20 so as to surround the outer periphery of each optical element 4F.

  Therefore, even when the optical semiconductor element 3F has a plurality of optical elements 4F, the light emitted from each optical element 4F and the incident light to the optical element 4F are in contrast to the other optical elements 4F. Interference is favorably suppressed by the light shielding member 62F.

  The surface of the light shielding member 62F is preferably located on the optical semiconductor element 3F side with respect to the surface of the optical element 4F. In this case, since the light path of the light with respect to the optical element 4F can be satisfactorily surrounded by the light blocking member 62F, light interference is less likely to occur.

  In the seventh embodiment, each light element 4F is surrounded by the light shielding member 62F. However, the light shielding member 62F may be interposed between the adjacent optical elements 4F.

  Further, in the seventh embodiment, the light shielding members 62F surrounding the individual optical elements 4F may be continuously connected.

  Furthermore, in the seventh embodiment, the light shielding member 62F is formed on the optical wiring board 20, but instead, it is formed on one main surface of the optical semiconductor element 3F as shown in FIG. You may make it do. In this case, it is preferable from the viewpoint of shielding light that the surface of the light shielding member 62F is positioned closer to the optical wiring board 20 than the surface of the optical element 4F.

  Furthermore, in the seventh embodiment, as shown in FIG. 13, if the light shielding member 62F is mechanically connected to both the optical semiconductor element 3F and the optical wiring board 20, the optical path of light to the optical element 4F is changed. It can be ensured very well, and light interference between the adjacent optical elements 4F hardly occurs.

It is a perspective view which shows the optical wiring module 1 which concerns on the 1st Embodiment of this invention, Comprising: A part is shown with a cross section. It is a top view of the optical wiring module 1 shown in FIG. It is a partial expanded sectional view of the optical wiring module 1 shown in FIG. It is sectional drawing of the optical wiring module 1A which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the optical wiring module 1B which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the optical wiring module 1C which concerns on the 4th Embodiment of this invention. It is sectional drawing of optical wiring module 1D which concerns on the 5th Embodiment of this invention. It is sectional drawing which shows the modification of optical wiring module 1D which concerns on the 5th Embodiment of this invention. It is sectional drawing of the optical wiring module 1E which concerns on the 6th Embodiment of this invention. It is sectional drawing of the optical wiring module 1F which concerns on the 7th Embodiment of this invention. It is a top view of the optical semiconductor element 4F which comprises the optical wiring module 1F shown in FIG. It is sectional drawing which shows the 1st modification of the optical wiring module 1F which concerns on the 7th Embodiment of this invention. It is sectional drawing which shows the 2nd modification of the optical wiring module 1F which concerns on the 7th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A-1F Optical wiring module 2 Optical waveguide member 20 Optical wiring board 3, 3F Optical semiconductor element 4, 4E, 4F Optical element 5 Support substrate 6 1st cladding layer 7 Core layer 8 2nd cladding layer 9 Peripheral part 10 Through Electrode 11 Connection pad 13, 13A Inclined portion 14, 14A Reflective film 24 Bump 25 Dummy bump 40, 40A Optical path changing means 61D Hole portion 62, 62D-62F Light shielding member 100C Microlens 101B, 101D Translucent member

Claims (20)

An optical wiring module having an optical wiring board including an optical waveguide member, and first and second optical semiconductor elements flip-chip mounted on the optical wiring board,
The optical waveguide member includes a clad layer, and a plurality of core layers laminated on the clad layer and having optical path changing means,
A light shielding member made of a non-light-transmissive resin is disposed on the optical wiring board between the optical element provided in the first optical semiconductor element and the optical element of the second optical semiconductor element. An optical wiring module characterized by that. An optical wiring board including an optical waveguide member;
An optical wiring module having an optical semiconductor element flip-chip mounted on the optical wiring board and having a plurality of optical elements on a surface facing the optical wiring board,
The optical waveguide member includes a clad layer, and a plurality of core layers laminated on the clad layer and having optical path changing means,
An optical wiring module comprising: a light shielding member made of a non-light-transmitting resin, disposed on the facing surface of the optical semiconductor element and between the adjacent optical elements. An optical wiring board including an optical waveguide member;
An optical wiring module having an optical semiconductor element flip-chip mounted on an upper surface of the optical wiring board and having a plurality of optical elements on a surface facing the optical wiring board,
The optical waveguide member includes a clad layer, and a plurality of core layers laminated on the clad layer and having optical path changing means,
An optical wiring module, wherein a light shielding member made of a non-light-transmitting resin is disposed on an upper surface of the optical wiring board and between the adjacent optical elements.   The optical wiring module according to claim 2, wherein the surface of the light shielding member is located closer to the optical wiring substrate than the surface of the optical element.   The optical wiring module according to claim 3, wherein a surface of the light shielding member is located closer to the optical semiconductor element than a surface of the optical element.   The optical wiring module according to claim 2, wherein the light shielding member surrounds an outer periphery of the optical element.   The optical wiring module according to claim 1, wherein the optical element is a light emitting element or a light receiving element.   2. The optical wiring module according to claim 1, wherein the light shielding member surrounds the first and second optical semiconductor elements along an outer periphery thereof.   9. The optical wiring according to claim 1, wherein the light shielding member is provided in a gap between the first and / or second optical semiconductor element and the optical wiring substrate. module.   The optical wiring module according to claim 1, wherein the optical path changing unit is a reflecting unit that reflects light.   The reflecting means has a function of reflecting light incident on the reflecting means from the optical element in a direction along the core layer, or light incident on the reflecting means from the core layer. The optical wiring module according to claim 10, which has a function of reflecting toward an element.   The optical wiring module according to claim 10 or 11, wherein the surface of the core layer on which the reflecting means is provided and the surface of the reflecting means are inclined with respect to the surface of the cladding layer.   The surface of the core layer on which the reflecting means is provided and the surface of the reflecting means are formed in a convex curved shape that protrudes in a direction opposite to the traveling direction of the light reflected by the reflecting means. The optical wiring module as described in any one of Claims 10-12.   13. The optical wiring module according to claim 12, wherein an inclination angle of the surface of the core layer on which the reflecting means is provided with respect to the surface of the cladding layer is defined to be 41 degrees or more and 49 degrees or less.   The optical wiring module according to claim 1, wherein the optical element and the clad layer of the optical waveguide member are held in a non-contact state.   The optical wiring according to claim 1, wherein a light transmissive member made of a light transmissive resin is provided at least between the optical element and the optical path changing means. module.   17. The optical wiring module according to claim 16, wherein the translucent member mechanically connects the first and / or second optical semiconductor element and the optical wiring board.   The said clad layer contains the condensing means which condenses the light from the said optical element, or the light which goes to the said optical element in the position facing the said optical element. The optical wiring module as described in one.   The optical wiring module according to claim 18, wherein the condensing unit is formed integrally with the cladding layer. The optical device and the clad layer of the optical waveguide member located on the optical path changing means are held in contact with each other. Optical wiring module.

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