JP2007199338A - Liquid crystal device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal device in which influence on a liquid crystal alignment state can be reduced and the liquid crystal can be efficiently heated. <P>SOLUTION: The liquid crystal display 100 has a substrate 101, wiring 111X, 111Y formed on the substrate, an element 11T connected to the wiring, an electrode 114 connected to the element, and the liquid crystal 104 arranged on the electrode, and the liquid crystal display 100 includes a heater layer 116 arranged in the wiring, the element and the substrate side of the electrode, and an insulating film 117 arranged in the wiring, the element and between the electrode and the heater layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a liquid crystal device and an electronic apparatus, and more particularly to a structure of a liquid crystal device having a heating function for heating a liquid crystal.

Generally, a liquid crystal device is used as a display body in a vehicle-mounted device such as a car navigation device, and a predetermined image such as a map is displayed by the liquid crystal device. As a liquid crystal device, a liquid crystal cell in which liquid crystal is sealed between a pair of glass substrates is usually formed, and a drive region (display region) in which a plurality of pixels are arranged vertically and horizontally is formed in the liquid crystal cell. .

The above liquid crystal device has no particular problem when used at room temperature, but the response speed of the liquid crystal becomes slow in a low temperature environment exceeding -10 degrees. There is a known problem that the quality may be lowered. In view of this, conventionally known is a method in which a heater for heating a liquid crystal device is provided, and the liquid crystal is heated by the heater to suppress deterioration in display quality (see, for example, Patent Documents 1 and 2 below).

As described in Patent Document 1, the liquid crystal device including the heater described above is caused to generate heat by flowing a current through at least one of a pair of liquid crystal driving electrodes arranged to face each other with the liquid crystal interposed therebetween. There is a way. Further, as described in Patent Document 2, a method of using a transparent sheet heater provided separately from a liquid crystal device so as to overlap the liquid crystal device has been devised.
JP 50-68687 A JP-A-6-283261

However, in the method of flowing current to the electrode for applying an electric field to the liquid crystal described in Patent Document 1 described above, it is necessary to flow current to the liquid crystal driving electrode to generate heat, so a liquid crystal driving circuit (for example, There is a problem that the load on the liquid crystal driving IC) becomes too large to be practical, and it is difficult to reduce the size of the circuit in order to increase the current capacity. In addition, since a large current flows through the liquid crystal driving electrode, the electromagnetic influence due to the current cannot be ignored. Therefore, the alignment state of the liquid crystal may be deteriorated, and the display quality may be deteriorated.

In addition, when the transparent planar heater shown in Patent Document 2 is used, it is necessary to superimpose a heater having a plurality of laminated structures separately provided on the liquid crystal device, and thus the transmittance tends to decrease. Since the liquid crystal must be heated from the outside of the liquid crystal device (on the outer surface of the substrate), the heating efficiency is low, which increases power consumption and makes it difficult to quickly heat the liquid crystal. .

Further, when the heater is provided in the liquid crystal device, it is necessary to configure the heater and the power supply line for supplying electric power to the existing wiring, elements, electrodes, etc. It is considered that the manufacturing process becomes complicated and the manufacturing cost increases.

Therefore, the present invention solves the above-described problems, and the problem is to provide a liquid crystal device that can reduce the influence on the alignment state of the liquid crystal and can efficiently heat the liquid crystal. It is in. Still another object is to provide a liquid crystal device including a heater structure capable of suppressing an increase in manufacturing cost.

In view of such circumstances, the liquid crystal device of the present invention is disposed on a substrate, a wiring formed on the substrate, an element connected to the wiring, an electrode connected to the element, and the electrode. And a heater layer disposed on the substrate side of the wiring, the element, and the electrode, and the wiring, the element, the electrode, and the heater layer. And an insulating film.

According to this invention, since the heater layer is disposed on the substrate side with respect to the wiring, the element, and the electrode, the heater layer is provided at a position separated from the electrode with respect to the liquid crystal. The influence on the alignment state can be reduced. Here, since the heater layer is insulated from the wiring, the element, and the electrode by the insulating film interposed therebetween, electrical interference between the heater layer and the wiring, the element, and the electrode is also prevented. Further, since the heater layer is disposed on the liquid crystal side with respect to the substrate, the liquid crystal can be heated more efficiently than the case where the heater is provided outside the liquid crystal device, and the substrate is interposed. Since the liquid crystal can be directly heated without heating, it can be quickly heated.

In the present invention, it is preferable to further include a power feeding layer that is conductively connected to the heater layer. According to this, by further providing a power supply layer that is conductively connected to the heater layer, it is possible to reliably and efficiently supply power to the heater layer with a power supply layer with less material and structural restrictions. Become.

In this invention, it is preferable that the said electric power feeding layer is comprised with the same material as at least any one of the said wiring, the said element, or the said electrode. According to this, by configuring the power feeding layer with the same material as at least one of the wiring, the element, or the electrode, it becomes possible to simultaneously form the power feeding layer in the process of forming the wiring, the element, or the electrode. The complexity of the structure can be suppressed and an increase in manufacturing cost can be suppressed.

In the present invention, it is preferable that the power feeding layer is disposed on the insulating film and is electrically connected to the heater layer through a contact portion penetrating at least the insulating film. According to this, since there is no need to draw out the heater layer to the outside, the heater layer and the power feeding layer can be conductively connected on the substrate, so that the enlargement of the liquid crystal device can be suppressed and the structure on the substrate is manufactured. In this case, since the contact portions can be formed at the same time, the manufacturing process can be avoided and the manufacturing cost can be reduced.

In this invention, it is preferable to have a pair of said electric power feeding layers each conductively connected in the space | interval position of the said heater layer. According to this, it is possible to cause a current to flow through the heater layer by causing a current to flow from one of the pair of power supply layers toward the other, thereby generating heat.

In this invention, it is preferable that the said heater layer is comprised by the integral planar shape. According to this, since the heater layer is formed in a planar shape, the heat generation region is configured in a planar shape, so that uniform and efficient heating can be performed. In this case, when the liquid crystal device is a transmissive device, the heater layer is particularly preferably formed of a transparent conductive film made of a transparent conductor (transparent resistance layer) such as ITO (indium tin oxide).

In the present invention, the heater layer is preferably formed by arranging a plurality of heater wires arranged in parallel with each other in a stripe shape. According to this, even when the liquid crystal device is a transmissive device, it is not necessary to configure the heater wire with a transparent material, so that a material with high heat generation efficiency such as a metal material can be used. Can be increased. Moreover, the structure which uses the said heater wire as a light shielding layer is also attained.

In this case, it is preferable that the driving region further includes wiring extending along a predetermined arrangement direction of the plurality of pixels, and the heater layer overlaps the wiring and extends along the wiring. According to this, since the heater layer overlaps with the wiring and extends along the wiring, a decrease in light transmittance in each pixel can be suppressed.

In the present invention, the heater layer is preferably disposed in a region between the pixels in the driving region. According to this, since the heater layer is disposed in a region (boundary portion) between the pixels, it is possible to suppress a decrease in light transmittance in each pixel and to shield the region.

In this case, the driving region further includes a wiring extending along a predetermined arrangement direction of the plurality of pixels. The heater layer overlaps the wiring and extends along the wiring. It is preferable to have a wide width. According to this, since the heater layer overlaps with the wiring and is configured to be wider than the wiring, the function as the light shielding layer can be more completely realized while reducing the influence on the transmittance of each pixel. .

In the present invention, the pixel is provided with a transmissive display region and a reflective display region including a reflective layer, and the heater layer is disposed behind the reflective layer in the reflective display region as viewed from the viewing side. Preferably it is. According to this, since the heater layer is arranged in the reflective display region, the influence on the transmittance of the transmissive display region can be suppressed, and the heater layer is arranged behind the reflective layer, so that the heater layer This can also prevent the reflection display area from being affected.
In addition, since the heater layer only needs to be formed behind the reflective layer, the heater layer can be brought close to the liquid crystal layer and efficiently heated.

Next, an electronic apparatus according to the present invention includes the liquid crystal device according to any one of the above. Examples of the electronic device include various devices including a liquid crystal device as a display body, such as a computer device, a monitor device, a television device, a projector device, and a mobile phone. In particular, vehicle-mounted electronic devices such as a car navigation device, various electronic devices used outdoors, and the like are suitable examples for applying the present invention.

[First Embodiment]
Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic plan view showing a planar configuration of a liquid crystal device 100 according to the first embodiment of the present invention, and FIG.
3 is an enlarged partial sectional view of FIG. 3, FIG. 3 is an enlarged partial sectional view seen from a different direction from FIG. 2, and FIG. 12 is a schematic perspective view showing the entire configuration of the liquid crystal device 100.

As shown in FIG. 12, a liquid crystal device 100 includes a transparent substrate 101 and 102 made of glass, plastic, or the like, bonded together with a seal material 103, and a liquid crystal 104 arranged between the substrates 101 and 102 is sealed. The structure sealed with 103 is provided. Substrate 101 is substrate 102
Substrate projecting portions 101S and 101T projecting outward from the outer shape of the substrate. here,
The substrate overhanging portions 101S and 101T are each formed in a strip shape along two adjacent peripheries of the substrate 102, and the two are combined to form an L shape as a whole. On these substrate projecting portions 101S and 101T, semiconductor devices 131 and 132 composed of a liquid crystal driving IC chip or the like having a liquid crystal driving circuit are mounted. A polarizing plate 105 is disposed (attached) on the outer surface of the substrate 101 (the surface opposite to the substrate 102), and the polarizing plate 106 is disposed on the outer surface of the substrate 102 (the surface opposite to the substrate 101). Is placed (attached).

As shown in FIG. 1, on the inner surface of the substrate 101 (the surface on the substrate 102 side), a plurality of wirings 111X extending in the horizontal direction in the figure are arranged in stripes at predetermined intervals, and these wirings 111X are formed on the substrate overhanging portion 101S. The semiconductor device 131 is electrically connected to the semiconductor device 131.
Further, on the substrate 101, the vertical direction in the figure (that is, the direction orthogonal to the wiring 111X).
A plurality of wirings 111Y extending in the form of stripes are arranged at predetermined intervals in a stripe shape, and these wirings 111
Y is drawn on the substrate extending portion 101T and is conductively connected to the semiconductor device 132. Then, a drive region (display region) 10 in which these wirings 111X and 111Y are arranged.
In 0A, a plurality of pixels respectively corresponding to the intersections of the wiring 111X and the wiring 111Y are arranged in a matrix.

As shown in FIG. 2, in the present embodiment, a driving element 111 </ b> T composed of a three-terminal nonlinear element such as a TFT (thin film transistor) is formed for each pixel, and this driving element 111 is formed.
T is configured so that the wiring 111X functions as a gate line (for example, a scanning line) and the wiring 111Y functions as a source line (for example, a data line). The drive element 111T is connected to the wiring 111.
A gate 111x (constituted by a part of the wiring 111X) conductively connected to X, a semiconductor layer 111s composed of amorphous silicon or the like opposed to the gate 111x via an insulating layer 112, and the semiconductor layer The wiring 111 is conductively connected to the source region of 111s.
A source electrode 111y conductively connected to Y (consisting of a part of the wiring 111Y) and a drain electrode 111z conductively connected to the drain region of the semiconductor layer 111s are provided. The drain electrode 111z is conductively connected to a drive electrode 114 made of a transparent conductor such as ITO (indium tin oxide) through a contact hole provided in the insulating layer 113. An alignment film 115 is formed on the drive electrode 114, and this alignment film 115 regulates the initial alignment state of the molecules of the liquid crystal 104.

The semiconductor devices 131 and 132 are also conductively connected to input terminals 119x and 119y formed at the edges of the substrate overhanging portions 101S and 101T, respectively. These input terminals 1
19x and 119y are electrically conductively connected to wiring boards 133 and 134 (for example, flexible wiring board; FPC) mounted on the edge of the board overhanging portions 101S and 101T as indicated by two-dot chain lines in FIG.

In this embodiment, two types of semiconductor devices 131 and 132 are provided. However, a semiconductor device in which these circuit configurations are combined is formed, and the wirings 111X and 111Y are conductively connected to the semiconductor device in common. It is also possible.

In the present embodiment, a heater layer 116 is formed below the drive element 111T (on the substrate 101 side). In practice, a heater layer 116 is formed on the substrate 101, an insulating film 117 is formed on the heater layer 116, and a gate electrode 111x which is the lowest layer structure of the driving element 111T is formed on the insulating film 117. . In the case of this embodiment, the heater layer 116 is configured as an integral surface that overlaps at least the entire drive region 100A in a planar manner. However, it is preferable that the heater layer 116 is formed in a plane range that is slightly larger over the entire circumference than the drive region 100A, as shown as a hatched region in FIG. It is desirable to be configured to overlap the entire liquid crystal sealing region in a planar manner. With this configuration, it is possible to prevent the temperature at the peripheral portion of the drive region 100A from being lowered as compared with the central portion, and it is possible to uniformly heat the liquid crystal in the drive region 100A. In the illustrated example, the heater layer 116 is configured to spread further outward than the arrangement region of the sealing material 103.

The heater layer 116 is formed of a transparent conductor (transparent resistor) such as ITO. In this case, the thickness of the heater layer 116 is preferably 1000 to 2000 mm, and particularly 130.
It is desirable to be about 0 to 1700 mm. Since the heater layer 116 is made of a transparent material in this way, the liquid crystal device 100 can be configured as a transmissive liquid crystal display body or a transflective liquid crystal display body as shown in the illustrated example. However, although different from the illustrated example, in the case of a reflective liquid crystal display having a reflective layer on the substrate 101 side of the liquid crystal 104, the heater layer 116 does not need to be made of a transparent material. You may comprise with a light-shielding material.

The heater layer 116 is conductively connected to the pair of power supply layers 118A and 118B. Each of these power supply layers is disposed in the drive region 100A. The power feeding layers 118A and 118B are arranged on both sides (opposite sides) of the drive region 100A, respectively, and are opposed to one end region of the heater layer 116 with respect to the one end region with the drive region 100A interposed therebetween. Are electrically connected to the other end region. In the illustrated example, both end regions of the heater layer 116 are configured to overlap the power supply layers 118A and 118B in a plan view, and the power supply layers 118A and 118B are provided on the insulating film 117 as shown in FIG. Contact hole 117
A is electrically connected to the heater layer 116 through a. FIG. 2 shows only the conductive connection portion between the power feeding layer 118A and the heater layer 116, but the conductive connection structure between the power feeding layer 118B and the heater layer 116 is configured in exactly the same manner.

In the present embodiment, the power feeding layers 118A and 118B and the heater layer 116 are conductively connected through a plurality of contact holes 117a arranged in the extending direction of the power feeding layer, so that the power supply to the heater layer 116 is efficiently performed. Can be done. However, instead of the plurality of contact holes 117a, an integral opening extending in the extending direction of the power feeding layer may be provided.

The insulating film 117 is made of an insulator such as silicon oxide (SiO ₂ ) or silicon nitride (Si ₃ N ₄ ), and has a light transmitting property when forming a transmissive liquid crystal device. Thickness is 20
It is preferable to form a relatively thick film of about 00 to 4000 mm, particularly 2500 to 3500.
It is desirable to make it about Å. In this way, the heater layer 116 and the TFT array (
Insulation with the wirings 111X and 111Y and the driving element 111T is ensured, and the parasitic capacitance between them is also reduced.

The power feeding layers 118A and 118B are both made of a conductor, but in the present embodiment, the wiring 1
The same conductive material as that of 11X (gate electrode 111x) is formed in the same layer. As this material, a laminated structure of Mo and Al is typically preferable, but other metal materials such as Cu, Al, Ti, and W may be used. By configuring the wiring 111X with the same material as described above, it is not necessary to provide a separate process for forming the power feeding layers 118A and 118B, so that an increase in manufacturing cost can be suppressed and a stacked structure on the substrate 101 can be formed. There is no complexity.

The power supply layers 118A and 118B are configured so as not to intersect the wiring 111X. As a result, the wiring 111X and the power feeding layers 118A and 118B can be formed of the same material and in the same process as described above. For example, a wiring material is formed by a vapor deposition method, a sputtering method, a CVD method, or the like, and then a patterning process such as etching is performed on the wiring material, whereby the wiring 111X and the power feeding layers 118A and 118B are formed at the same time.

In particular, in the case of the illustrated example, at least a portion of the power supply layers 118A and 118B that are conductively connected to the heater layer 116 is formed in a strip shape extending in parallel with the wiring 111X. In this way, the wiring layers 111A and 118B and the wiring layer 111X are secured with a sufficient interval.
The liquid crystal device 100 can be reduced in size while reducing the electrical influence on X.

Further, the length of the power feeding layers 118A and 118B viewed in the extending direction is configured to be longer than the range of the driving region 100A in the same direction, and between the power feeding layers 118A and 118B (for example, all from the power feeding layer 118A to the power feeding layer 118B). The range occupied by the straight line) is configured to include the entire drive region 100A. If it does in this way, electric power can be efficiently supplied to the heater layer 116 by an electric power feeding layer.

In the case of the present embodiment, the power feeding layers 118A and 118B are formed in a region overlapping the sealing material 103 in a planar manner. As a result, the external appearance in the drive region 100A is not different from the conventional structure having no heater function, and the drive region 100A can be largely secured inside the sealant 103. It is possible to dispose the power feeding layer on the outside of the sealing material 103, but if this is done, the area outside the sealing material 103 (so-called frame area) becomes large, which is against the downsizing of the liquid crystal panel. There is.

The power feeding layers 118A and 118B are drawn out on the substrate overhanging portion 101T, and as shown in FIG. 3, connection terminals 118s are respectively formed. These connection terminals 118s are arranged side by side with the connection terminals 111s of the wiring 111Y shown in FIG. In the case of this embodiment, the connection terminal 111 s and the connection terminal 118 s are conductively connected to the common wiring board 134. However, the connection terminal 118s may be conductively connected to another wiring board or other wiring member prepared separately from the wiring board 134.

On the other hand, on the inner surface of the substrate 102 (the surface on the substrate 101 side), a light shielding layer 121b and a plurality of colored layers 121c are arranged, and a color filter 121 is formed by laminating a protective film 121d thereon. Has been. A counter electrode 122 made of ITO or other transparent conductor is formed on the color filter 121. An alignment film 123 similar to the above is formed on the counter electrode 122. A common potential is applied to the counter electrode 122.

According to the liquid crystal device 100 having the configuration described above, a predetermined voltage is applied between the pair of connection terminals 118s, so that the heater layer 1 can be applied from one of the power supply layers 118A and 118B.
16, the current flows to the other side, and the heater layer 116 generates heat.
04 is heated. Therefore, the response speed of the liquid crystal can be maintained even at a low temperature, and deterioration of display quality can be suppressed.

In the present embodiment, the heater layer 116 is disposed on the inner surface of the substrate 101, that is, on the liquid crystal 104 side of the substrate 101, so that the liquid crystal 104 is more directly compared with the case where the heater layer 116 is disposed on the outer surface of the substrate 101. Therefore, the temperature can be controlled efficiently and quickly.

Also, the wirings 111X and 111Y, the driving element 111T, the driving electrode 114, and the heater layer 11
6 is provided with an insulating film 117, so that the heater layer 116 is energized with the wiring 111X.
, 111Y, the drive element 111T, and the drive electrode 114 are not substantially affected electrically. Furthermore, since the heater layer 116 is disposed closer to the substrate 101 than the wirings 111X and 111Y, the driving element 111T, and the driving electrode 114, the liquid crystal 104 is not affected electromagnetically. Inconveniences (for example, deterioration of display quality) are not caused.

Furthermore, since the heater layer 116 receives power supply via the power feeding layers 118A and 118B,
Electric power is supplied efficiently and uniformly. In particular, since the power feeding layer is configured to cover the entire drive region 100A, the heating by the heater layer 116 can be efficiently and uniformly performed as a whole. In addition, the power supply layers 118A and 118B are provided outside the drive region 100A so as to extend in parallel with the wiring 111X, and in particular, are configured to overlap the sealing material 103 in a planar manner, so that the liquid crystal device 100 can be made compact. Will not be disturbed.

Since the power feeding layers 118A and 118B are made of the same material and in the same layer as the wiring 111X, it is possible to cope with the problem by changing the formation pattern of the wiring 111X without increasing the number of manufacturing steps. The increase can be suppressed and the internal structure is not unnecessarily complicated.

In the present embodiment, as shown in FIGS. 2 and 3, the connection terminal 118 s is connected to the connection terminal 11.
Since it is set to the same height as 1 s, it can be conductively connected to the wiring material such as the wiring board 134 in the same mounting process.

[Second Embodiment]
Next, a liquid crystal device according to a second embodiment of the invention will be described with reference to FIG. Since this embodiment is basically configured in substantially the same manner as the liquid crystal device 100 of the first embodiment, the same reference numerals are given to corresponding portions, and descriptions of the same portions are omitted.

In the second embodiment, the power feeding layers 118A and 118B are basically configured in the same manner as in the first embodiment, but the power feeding layer 118A is drawn on the substrate overhanging portion 101S,
A connection terminal 118s is provided here. On the other hand, the power feeding layer 118B is pulled out on the substrate overhanging portion 101T as in the first embodiment, and a connection terminal 118s is provided there.
Therefore, in this embodiment, the connection terminal 118s of the power supply layer 118A and the connection terminal 118s of the power supply layer 118B are different (separately formed along the adjacent periphery of the substrate 102, respectively) on the substrate overhanging portions 101S and 101T. Each is formed.

The arrangement of the connection terminals of the power supply layer is arbitrary, and is not limited to the aspect of the present embodiment. For example, the right end of the power supply layer 118B is extended in the extension direction as it is in FIG. May be provided.

[Third Embodiment]
Next, a liquid crystal device 100 ′ according to a third embodiment of the present invention will be described with reference to FIGS. 5 and 6. FIG. 5 is a schematic plan view of the present embodiment, and FIG. 6 is an enlarged partial sectional view. Since the liquid crystal device 100 ′ is basically configured in the same manner as in the first embodiment except for the structure of the power feeding layer, the same portions are denoted by the same reference numerals, and description thereof is omitted.

The liquid crystal device 100 ′ is different from the first embodiment in that the power feeding layers 118A ′ and 118B ′ are formed of the same material and in the same layer as the wiring 111Y. The power feeding layer 118A ′
And 118B ′ are electrically connected to the heater layer 116 through the contact hole 117a of the insulating film 117 and the contact hole 112a of the insulating layer 112.

The first embodiment is also different in that the power feeding layers 118A ′ and 118B ′ are respectively arranged on the left and right sides of the drive region 100A in FIG. 5 and have a shape extending in parallel with the wiring 111Y. Different. That is, in this embodiment, the power feeding layers 118A ′ and 118B
'Is arranged so as not to cross the wiring 111Y.

This embodiment differs from the first embodiment in that the power feeding layers 118A ′ and 118B ′ are formed of the same material and in the same layer as the wiring 111Y, and are configured so as not to intersect the wiring 111Y. Since the technical meaning is the same only by replacing 111X with the wiring 111Y, the same operational effects as the first embodiment are basically obtained.

The power feeding layers 118A ′ and 118B ′ of the present embodiment described above are made of the same material and in the same layer as the wiring 111Y, but are made of the same material and in the same layer as other conductors, for example, the drive electrode 114. It may be. In addition, the power feeding layer can be formed, for example, by stacking at least two of the wiring 111X, the wiring 111Y, and the drive electrode 114 that do not intersect the power feeding layer. If it does in this way, it will become possible to further reduce the electrical resistance of a feed layer.

In this embodiment, as in the second embodiment, the connection terminal 118s ′ of the power feeding layer 118A ′ is formed on the substrate overhanging portion 101S, and the connection terminal 118s ′ of the power feeding layer 118B ′ is formed on the substrate overhanging portion 101T. However, as in the first embodiment, both connection terminals may be arranged on the same substrate overhanging portion.

[Fourth Embodiment]
Next, a liquid crystal device 100 ″ according to a fourth embodiment of the present invention will be described with reference to FIGS. 7 and 8. FIG. 7 is a schematic plan view of this embodiment, and FIG. 8 is an enlarged partial sectional view. The liquid crystal device 100 ″ is basically configured in the same manner as in the first embodiment except for the wiring structure, the element structure, and the structure of the power feeding layer. Therefore, the same portions are denoted by the same reference numerals, and description thereof is omitted. To do.

Unlike the first embodiment, the liquid crystal device 100 ″ is provided with a drive element 111T ″ composed of a two-terminal nonlinear element such as a TFD (thin film diode). This drive element 1
11T ″ is conductively connected to the wiring 111Y ″ or integrally formed Ta, Ta−.
A first metal layer 111y ″ made of W or the like, an insulating film 111a ″ made of Ta ₂ O ₅ or the like made of an anodic oxide film or the like formed on the first metal layer 111y ″, and the insulating film 111a ″. And a second metal layer 112 ″ made of Cr or the like formed thereon, and a diode junction is formed by an MIM structure composed of these laminated structures. The second metal layer 112 ″ is formed of the drive electrode 114. Conductive connection is made.

In the present embodiment, the power supply layers 118A "and 1A are the same material and the same layer as the second metal layer 112".
18B ″ is provided and is electrically connected to the heater layer 116 through the contact hole 117a of the insulating film 117. The power supply layers 118A ″ and 118B ″ are wired outside the drive region 100A ″ so as not to cross the wiring 111Y ″. It is configured in a strip shape so as to extend substantially parallel to 111Y ″. It should be noted that the power feeding layers 118A ″ and 118B ″ serve as the drive region 100.
The points arranged on both sides of A are the same as in the previous embodiment.

On the other hand, the wiring 111X ″ extends from the substrate overhanging portion 101S toward the drive region 100A ″, and a plurality of strip-like counter electrodes 12 provided on the substrate 102 outside the drive region 100A ″.
The conductive connection portion (vertical conductive portion) P of the wiring 111X ″ and the counter electrode 122 ″ is electrically connected to the sealing material 103, for example, by mixing conductive particles in the sealing material 103.
Alternatively, a conductive connection may be provided via 03, or a conductor (preferably an anisotropic conductor) provided separately from the sealing material 103 may be used. In either case, the wiring 111
X ″ is not arranged inside the drive region 100A ″. In particular, the wiring 111X ″ is connected to the power feeding layer 11.
It is preferable to configure so as not to cross 8B ″.

Also in this embodiment, the same operational effects as those in the first embodiment can be obtained.
In this embodiment, the drive element 111T ″ which is a two-terminal nonlinear element is used, but the heater layer 1
16 and the power supply layers 118A ″ and 118B ″ have basically the same technical significance as the above embodiment.

In the present embodiment, the power feeding layers 118A ″ and 118B ″ are made of the same material and in the same layer as the second metal layer 112 ″. For example, the wiring 111Y ″ (first metal layer 111y ″) and the drive electrode 114 are used. In the present embodiment, the power supply layers 118A ″ and 118B ″ are configured not to intersect the wiring 111X ″ in a plane, The wiring 111X ″ may be made of the same material and in the same layer.

[Fifth Embodiment]
Next, a fifth embodiment according to the present invention will be described with reference to FIG. This embodiment
Since the portion excluding the heater layer 116 ′ can be configured in the same manner as in each of the above-described embodiments, the case where the portion is configured in the same manner as in the first embodiment will be described as an example, and the same portion is the same. Reference numerals are assigned and their explanation is omitted.

In the present embodiment, the heater layer 116 ′ formed in a range that overlaps at least the driving region 100A in a plan view has a heater wire 116a ′ configured in a line connecting the power feeding layers 118A and 118B.
It differs from the heater layer 116 of each said embodiment by the point which has the structure which arranged two or more in parallel and was comprised in the stripe form as a whole. The heater wire 116a 'constituting the heater layer 116'
Although there is no particular limitation, it is typically preferable to be composed of a metal thin film such as Mo. This is because the cross-sectional area of the heater wire 116a 'is significantly smaller than that of the heater layer 116 described above, and therefore it is required to use a material (metal) having good electrical conductivity in order to obtain a sufficient amount of heat generation. It is. When the heater wire 116a 'is made of a metal such as Mo, the thickness is preferably in the range of 500 to 1200 mm, and particularly preferably in the range of 700 to 9000 mm.

The heater wires 116a 'are provided in contact holes 117a provided independently.
′ Through the conductive layers 118A and 118B. However, as in the previous embodiments, an integral opening may be provided in the insulating film 117 instead of the plurality of contact holes 117a ′.

In this embodiment, there is an advantage that it is not necessary to use a transparent material as a material of the heater layer by using a plurality of heater wires 116a '. Further, if the heater wire 116a 'is configured to pass through the light shielding region in the driving region 100A, there is no possibility of reducing the transmittance of the liquid crystal device. It is also possible to configure the heater wire 116a ′ itself to function as a light shielding layer for constituting a light shielding region. In this case, the heater line 116a 'is configured to be wider than another light-shielding structure, for example, the wiring 111Y, so that a necessary light-shielding region can be secured without forming a separate light-shielding film. .

FIG. 10 shows a drive region 1 when the heater wire 116a 'is configured as a light shielding layer as described above.
It is an enlarged partial plan view showing a part of 00A in an enlarged manner. Here, the pixels G are arranged vertically and horizontally in the drive region 100A, and the heater line 116a 'extends along the region between the pixels G (inter-pixel region) and is disposed so as to overlap the inter-pixel region. ing. In this case, the wiring 111Y
Is also arranged so as to extend along the inter-pixel region and overlap the inter-pixel region. The heater wire 116a 'overlaps with the wiring 111Y. Also, the heater wire 116a 'is connected to the wiring 11
It is formed wider than 1Y. This makes it possible to perform light shielding in the inter-pixel region more completely.

In addition, as indicated by dotted lines in FIG. 10, a plurality of heater wires 116b ′ intersecting with the plurality of heater wires 116a ′ may be provided, and the heater 116 ′ may be configured in a stitch shape. In this case, since the heater wire 116a 'extending vertically is conductively connected at a plurality of locations in the horizontal direction by the heater wire 116b', variation in resistance value of the vertical heater wire 116a 'can be equalized. . In the illustrated example, the horizontal heater line 116b 'is also arranged in the inter-pixel region, so that the light shielding function can be further enhanced.

In the above example, the heater line is disposed in the inter-pixel region. However, in the present invention, the heater line may not be disposed in the inter-pixel region in the drive region. That is, the heater line may be formed so as to overlap with a portion that contributes to the display of each pixel.

In addition, the present embodiment has been described on the assumption that it is a transmissive liquid crystal device. However, in the case of a reflective liquid crystal device, if the heater wire 116a 'is disposed below the reflective layer, what is optically considered? There will be no trouble. In the case of a transflective liquid crystal device, it is preferable to arrange the heater wire 116a 'so as to overlap with the light reflection region (so as not to overlap with the light transmission region).

Fig. 11 shows an example in which power supply layers 118A 'and 118B' and a heater 116 "different from the configuration shown in Fig. 9 are formed in the same basic configuration as that of the embodiment shown in Fig. 9. Fig. 11 (a) shows the whole. Fig. 11 (b) is an enlarged partial plan view schematically showing the configuration, and Fig. 11 (b) is an enlarged partial plan view of the drive region 100A. A pair of power supply layers 118A ″ and 118B ″ are formed on the left and right sides of the region 100A in the figure so as to extend in the vertical direction in the figure, and the heater 116 ″ is electrically connected to these power supply layers 118A ″ and 118B ″. A plurality of heater wires 116a ″ extending in the direction are formed in a stripe shape.

In this example, a transflective liquid crystal device is configured, and each pixel G arranged vertically and horizontally includes a transmissive display region Gt having the same configuration as the transmissive liquid crystal device, and a reflective layer on the substrate 101. R
And a reflective display region Gr provided with Here, the reflective display region Gr is configured so as to be arranged in the horizontal direction in the drawing across the plurality of pixels G. And the above heater wire 1
16a ″ extends in the lateral direction and is disposed at a position passing through the reflective display region Gr of the plurality of pixels G. In this case, the heater line 116a ″ is behind the reflective layer R as viewed from the viewing side. Since they are arranged, neither the transmissive display nor the reflective display is affected at all.

In this case, the reflective layer R may be provided also as a pixel electrode that defines the planar range of the pixel G, or may be disposed immediately below the pixel electrode, or insulated under the pixel electrode. You may arrange | position through a layer. In any case, since the heater wire 116a ″ only needs to be disposed behind the reflective layer R, it is possible to dispose the heater wire 116a ″ closer to the liquid crystal layer, thereby further improving the heater function. be able to.

The heater wires 116a ', 116b', 116a '' in the illustrated example are all formed in a straight line, but may be formed in a curved line or may be refracted in the middle.

[Electronics]
Finally, an embodiment of an electronic apparatus equipped with the liquid crystal device will be described with reference to FIG. FIG. 13 is a schematic perspective view showing an appearance of an example of an electronic apparatus according to the present invention. The electronic apparatus 1000 in the illustrated example is an in-vehicle car navigation system, and includes a main body 1010 and a display unit 1020 connected to the main body 1010. The main body 1010 is provided with an operation surface 1011 provided with operation buttons and the like, and an inlet 1012 for a recording medium such as a DVD.
Is provided. The liquid crystal device 100 is stored inside the display unit 1020, and the display by the liquid crystal device 100, that is, the display of the navigation image can be visually recognized on the display screen 1020a of the display unit 1020.

By mounting the liquid crystal device 100 on the electronic device 1000, the liquid crystal 1 can be used even at low temperatures.
Since 04 is heated efficiently and quickly by the heater layer 116, deterioration of display quality can be suppressed from the beginning. In addition, the electronic device 1000 can be downsized and the display screen can be enlarged because it can be made compact despite having a built-in heater function.

In addition, the liquid crystal device and the electronic apparatus of the present invention are not limited to the above illustrated examples,
Of course, various modifications can be made without departing from the scope of the present invention. For example, the liquid crystal device has been described on the assumption that it is a direct-view type transmissive liquid crystal device. However, the liquid crystal device may be a reflective liquid crystal device or a transflective liquid crystal device, and an optical shutter used in a projection liquid crystal device (projector). A liquid crystal panel structure or the like that can control the transmittance for use in an apparatus, a window, a wall surface, or the like may be used.

1 is a schematic plan view of a liquid crystal device according to a first embodiment. The expanded partial sectional view of a 1st embodiment (sectional view which met the II-II line of Drawing 1). The expanded partial sectional view of a 1st embodiment (sectional view which met an III-III line of Drawing 1). The schematic plan view of 2nd Embodiment. The schematic plan view of 3rd Embodiment. The expanded fragmentary sectional view of 3rd Embodiment (sectional drawing along the VI-VI line of FIG. 1). The schematic plan view of 4th Embodiment. The expanded fragmentary sectional view of 4th Embodiment (sectional drawing along the VIII-VIII line of FIG. 1). The schematic plan view of 5th Embodiment. The enlarged partial top view of a drive area. The schematic structure top view (a) which shows the modification of 5th Embodiment, and the expanded partial top view (b) of a drive area | region. 1 is a schematic perspective view of a first embodiment. The schematic perspective view which shows an example of an electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Liquid crystal device, 101 ... Board | substrate, 104 ... Liquid crystal, 111X, 111Y ... Wiring, 111T
... driving element 112, 113 ... insulating layer, 114 ... driving electrode, 116 ... heater layer, 117 ...
Insulating film, 117a ... contact hole, 118A, 118B ... feed layer

Claims (9)

In a liquid crystal device comprising a substrate, a wiring formed on the substrate, an element connected to the wiring, an electrode connected to the element, and a liquid crystal disposed on the electrode,
A heater layer disposed on the substrate side of the wiring, the element and the electrode;
An insulating film disposed between the wiring, the element and the electrode, and the heater layer;
A liquid crystal device comprising: The liquid crystal device according to claim 1, further comprising a power feeding layer electrically connected to the heater layer. The liquid crystal device according to claim 2, wherein the power feeding layer is made of the same material as at least one of the wiring, the element, and the electrode. 4. The liquid crystal device according to claim 3, wherein the power feeding layer is disposed on the insulating film and is electrically connected to the heater layer through at least a contact portion penetrating the insulating film. 5. The liquid crystal device according to claim 2, further comprising a pair of the power supply layers that are conductively connected to each of the heater layers at a distance from each other. 6. The liquid crystal device according to claim 1, wherein the heater layer is formed as an integral surface.   The liquid crystal device according to claim 6, wherein the heater layer is a transparent conductive film. 6. The liquid crystal device according to claim 1, wherein the heater layer is formed by arranging a plurality of heater wires arranged in parallel to each other in a stripe shape. An electronic apparatus comprising the liquid crystal device according to any one of claims 1 to 8.

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