JP2007194523A - Light-emitting module, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve processability by using a lead frame and an insulator, a light reflection resin, and a reflection section comprising the light reflection resin instead of a ceramic substrate. <P>SOLUTION: In a light-emitting module, a plurality of lead frames 100 partially having a thin section 120 are partially fixed by the light reflection resin 106, the reflection section 114 and a wall section 112 are formed by the light reflection resin 106, and further in a state where it is fixed to a metal plate 108 via a heat-conductive resin 102 a light-emitting element 104 is packaged in the lead frame 100 exposed to a part surrounded by the reflection section 114. Thus light emitted from the light-emitting element 104 is reflected forward by the reflection section 114 and heat generated from the light-emitting element 104 is transferred to the metal plate 108 from the lead frame 100 via the heat-conductive resin 102, thus enhancing the luminous efficiency and heat generation efficiency of the light-emitting module. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting module used for a backlight of a display device having a backlight such as a liquid crystal television and a manufacturing method thereof.

  Conventionally, a cold cathode tube or the like has been used for a backlight of a liquid crystal television or the like, but in recent years, it has been proposed to mount a semiconductor light emitting element such as an LED or a laser on a heat dissipating substrate ( For example, see Patent Document 1).

  FIG. 17 is a cross-sectional view showing an example of a conventional light emitting module. In FIG. 17, the light emitting element 2 is mounted in the recess formed in the ceramic substrate 1. The plurality of ceramic substrates 1 are fixed on the heat sink 3. Further, the plurality of ceramic substrates 1 are electrically connected by a connection substrate 5 having a window portion 4. The light 6 emitted from the LED is emitted to the outside through the window portion 4 formed on the connection substrate 5. In FIG. 17, the wiring in the ceramic substrate 1 having the recesses and the connection substrate 5, the LED wiring, and the like are not shown. Such light emitting modules are used as backlights for liquid crystals and the like. However, since the ceramic substrate 1 is difficult to process and expensive, there has been a demand for a heat dissipation substrate that is less expensive and has excellent workability.

  On the other hand, the display device side including the liquid crystal TV is desired to expand the color display range. In order to meet these needs, white LEDs and the like have limitations. In recent years, red (red), green (green), and blue (blue) single-color light emitting elements, and further purple, orange, red purple, and cobalt blue are used. Attempts have been made to extend the color display range (specifically, the CIE color system or the like) by adding a special color light emitting element that emits a special color.

  When such a light emitting module as shown in FIG. 17 is used for such needs, while mounting each of these light emitting elements one by one in the recess of the ceramic substrate 1, a uniform color mixture (mixed white color) is produced as a whole. It is necessary to adjust the color balance (for example, white balance described later). On the other hand, it is known that the luminous efficiency of solid light emitting devices such as LEDs decreases as the temperature rises. Furthermore, the degree of decrease in luminous efficiency with respect to temperature varies depending on the emission color of the LED. For this reason, for example, immediately after the liquid crystal TV is turned on, the LED portion is at room temperature (for example, 25 ° C.), and thus the temperature of the LED portion increases (for example, 40 ° C. → 50 ° C.) even if white balance is maintained. → 60 ° C.), for example, a phenomenon such as a reduction in red light emission efficiency may occur, and color reproducibility and backlight luminance may also change.

  On the other hand, as shown in FIG. 17, when the ceramic substrate 1 on which the light emitting elements 2 such as LEDs are mounted one by one is arranged on the heat radiating plate 3, it is advantageous from the heat radiating surface. It becomes difficult to produce a white color by mixing light using (or a white color having high color rendering properties by mixing RGB + special colors).

Therefore, it is possible to mount a large number of light-emitting elements that can handle higher brightness of the light-emitting elements (necessary to pass a large current) and multi-LEDs (mounting a plurality of LEDs with high density). There is a demand for light-emitting modules that have high processability and excellent heat dissipation.
JP 2004-311791 A

  However, the conventional configuration has a problem that the heat dissipation substrate on which the light emitting element is mounted is a ceramic substrate, which is disadvantageous in terms of workability and cost.

  The present invention solves the above-described conventional problems, and uses a lead frame, an insulator, and a reflective portion made of a light-reflecting resin or the light-reflecting resin instead of a ceramic substrate, thereby improving workability. An object is to provide a good light emitting module and a manufacturing method thereof.

  In order to solve the above problems, the present invention directly mounts a light emitting element such as an LED on a lead frame having high heat dissipation, and the light of the light emitting element is reflected forward by a reflecting portion surrounding the light emitting element. The heat generated in the light emitting element is transmitted from the lead frame to the heat radiating metal plate formed on the back surface through the heat conducting resin.

  The light emitting module obtained by the light emitting module of the present invention and the manufacturing method thereof can efficiently diffuse the heat generated by the light emitting elements such as LEDs and semiconductor lasers, and can effectively cool the light emitting elements such as LEDs.

(Embodiment 1)
Hereinafter, the light emitting module according to Embodiment 1 of the present invention will be described with reference to FIGS.

  FIG. 1 is a cross-sectional view of the light emitting module in the first embodiment. In FIG. 1, 100 is a lead frame, 102 is a heat conducting resin, 104 is a light emitting element, and 106 is a light reflecting resin. Reference numeral 108 denotes a metal plate, 110 denotes a spacer portion, 112 denotes a wall portion, 114 denotes a reflecting portion, and 116 denotes an arrow. Reference numeral 118 denotes a dotted line, which means an auxiliary line. Reference numeral 120 denotes a thin portion, and 122 denotes a thick portion, which means the thickness of the lead frame 100. As described above, in the present invention, the lead frame 100 includes the thin portion 120 and the thick portion 122. Then, by making a part of the lead frame 100 the thin portion 120, the lead frame 100 can be processed into a fine pitch. Similarly, by forming a part of the lead frame 100 as the thick portion 122, it is possible to increase the strength of the lead frame (particularly the terminal strength during mounting) or to improve the heat dissipation. Thus, by using a part of one lead frame as the thin part 120 (in other words, by setting the remaining part as the thick part 122), the usage of the light emitting module can be expanded. Reference numeral 124 denotes a processing angle.

  In FIG. 1, the spacer portion 110, the wall portion 112, and the reflecting portion 114 are all formed of the light reflecting resin 106. The plurality of lead frames 100 are reinforced by the wall portion 112 made of the light reflecting resin 106, the reflecting portion 114, and the like, and the light reflecting resin 106 is filled in the gaps between the plurality of lead frames 100. Bonded to the metal plate 108 by 102. Even when the spacer portion 110 formed between the metal plate 108 and the lead frame 100 reduces the thickness of the heat conducting resin 102 to enhance the heat dissipation effect, the thickness accuracy can be obtained.

  As shown in FIG. 1A, the light emitted from the light emitting element 104 is reflected forward by the reflecting portion 114 as shown by an arrow 116, and the light emission efficiency of the light emitting module is increased. Further, the wall portion 112 serves as a dam when the lead frame 100 is fixed or the resin protecting the light emitting element 104 overflows as will be described later.

  FIG. 1B shows a cross section of a lead frame in which a thin portion 120 is formed in part. As shown in FIG. 1B, a part of the lead frame 100 (corresponding to 120 that is sandwiched between dotted lines 118) can be the thin part 120. When a part of the lead frame 100 is the thin portion 120, the lead frame 100 having a predetermined thickness (or the entire surface corresponds to the thick portion 122) is partially applied with a press device (for example, a stretching device using a roller). Can be stretched. In this way, a part of one lead frame 100 can be processed into a thin (thin) thin portion 120 (in other words, a portion formed by stretching becomes a thin portion 120). In this case, an unstretched portion is left as the thick portion 122. In this way, a part of the lead frame member mainly composed of copper, which will be described later, can be processed into the striped thin portion 120. In this case, the processing angle 124 of the stretched portion is preferably 0 ° to 45 ° (desirably 5 ° to 30 °). When the processing angle 124 is 0 degree or less, variation is likely to occur and processing is difficult. Further, when the processing angle 124 is larger than 45 degrees, processing unevenness of the lead frame (or it becomes difficult to narrow the width of the thin portion 120) may occur. Here, the processing angle 124 is an angle from the perpendicular of the lead frame 100 as shown in FIG. A part of the lead frame 100 shown in FIG. 1B can be formed by processing a part of the thin film in this manner and then punching it into a predetermined shape so that the light emitting elements 104 can be mounted with high density.

  Next, the heat dissipation mechanism of the light emitting module will be described with reference to FIGS. FIG. 2 is a cross-sectional view showing how heat is diffused. In FIG. 2A, an arrow 116a is an arrow indicating a direction in which heat is transmitted from the light-emitting element 104. 2A that heat generated in the light-emitting element 104 is diffused along the lead frame 100 in the direction of the arrow 116a.

  FIG. 2B is a cross-sectional view illustrating a state of heat diffusion in the cross section of FIG. In FIG. 2B, it can be seen that the heat transmitted to the lead frame 100 diffuses to the metal plate 108 through the heat conductive resin 102 in the direction of the arrow 116b.

As the heat conducting resin 102, it is desirable to use a resin in which a highly heat dissipating inorganic filler is dispersed in a curable resin. The inorganic filler has a substantially spherical shape, and its diameter is suitably from 0.1 to 100 microns (if it is less than 0.1 microns, it becomes difficult to disperse in the resin, and if it exceeds 100 microns, the heat conductive resin The thickness of 102 increases and affects the thermal diffusivity). Therefore, the amount of the inorganic filler in the heat conducting resin 102 is filled at a high concentration of 70 to 95% by weight in order to increase the thermal conductivity. In particular, in the present embodiment, the inorganic filler is a mixture of two types of Al ₂ O ₃ having an average particle size of 3 microns and an average particle size of 12 microns. By using the Al ₂ O ₃ of the large and small two types of particle size, it is possible to fill the Al ₂ O ₃ of small particle size in the gap Al ₂ O ₃ of large particle size, Al ₂ O ₃ 90 wt% near Can be filled to a high concentration. As a result, the thermal conductivity of the heat conducting resin 102 is about 5 W / (m · K). The inorganic filler may include at least one selected from the group consisting of MgO, BN, SiO ₂ , SiC, Si ₃ N ₄ , and AlN instead of Al ₂ O ₃ .

  The thermosetting insulating resin contains at least one kind of resin among epoxy resin, phenol resin and cyanate resin. These resins are excellent in heat resistance and electrical insulation. If the thickness of the heat conducting resin 102 is reduced, the heat generated in the light emitting element 104 mounted on the lead frame 100 can be easily transferred to the metal plate 108, but conversely, the withstand voltage becomes a problem, and if it is too thick, the thermal resistance increases. In view of the withstand voltage and thermal resistance, the optimum thickness may be set to 50 microns or more and 500 microns or less.

  As described above, in the first embodiment, the heat conductive resin 102 is added with a filler having good thermal conductivity, and the light reflecting resin 106 is added with a filler having excellent light reflectivity. (Or the formation of white light by mixing different monochromatic lights).

  Note that the color of the heat conducting resin 102 is desirably white. This is to increase the reflection efficiency of light that could not be reflected by the light reflecting resin 106.

  The reflecting portion 114 has a ring shape (or donut shape), and the light emitting element 104 is mounted therein. The shape of the side surface of the reflecting portion 114 is preferably a shape that becomes narrower toward the bottom portion, but this is for increasing the light reflection efficiency. It goes without saying that the light reflection direction can be optimized by making the side surface of the reflecting portion 114 radial, quadratic curve, cubic curve or the like.

  Next, a description will be given with reference to FIGS. FIG. 3 is a first top view of the light emitting module. FIG. 3A shows that the light reflecting resin 106 is filled in the gaps between the plurality of lead frames 100. In FIG. 3A, a light reflecting resin 106 is filled between a plurality of lead frames 100, and a wall portion 112 and a reflecting portion 114 are formed on the lead frame 100 by the light reflecting resin 106. The light from the light emitting element 104 is reflected forward. In addition, the light emitting element 104 is mounted on the exposed surface of the lead frame 100 within the range surrounded by the ring-shaped reflecting portion 114. The lead frame 100 is prevented from being short-circuited by the light reflecting resin 106 filled in the gap, and the mechanical strength is enhanced by the wall portion 112 and the reflecting portion 114 formed thereon. . Under this, the heat conducting resin 102 and the metal plate 108 as shown in FIG. 1 are formed (these are not visible in FIG. 3A).

  FIG. 3B corresponds to a top view of the state where the light-emitting element 104, the reflective portion 114, and the wall portion 112 are omitted from FIG. 3B, the light reflecting resin 106 is filled between the plurality of lead frames 100, and the plurality of lead frames 100 are fixed by the light reflecting resin 106 without contacting each other. I understand that. The heat conducting resin 102 and the metal plate 108 shown in FIG. 1 are formed under the plurality of lead frames 100 fixed by the light reflecting resin 106 (these are not visible in FIG. 3B). An arrow 116 in FIG. 3B shows how heat generated from the light emitting element 104 (not shown in FIG. 3B) is efficiently diffused in the planar direction through the lead frame 100. Thus, the light emitting element 104 can be efficiently cooled.

  FIG. 4 is a second top view of the light emitting module. In the first top view shown in FIG. 3, a light reflecting resin 106 is formed in the gap between the plurality of lead frames 100. On the other hand, in the second top view shown in FIG. 4, both the heat conducting resin 102 and the light reflecting resin 106 are formed in the gaps between the plurality of lead frames 100. As shown in FIG. 4A, the light reflecting resin 106 is formed in the gap between the lead frames 100 in the portion where the light emitting elements 104 of the plurality of lead frames 100 are mounted (for example, the portion surrounded by the reflecting portion 114). The light emitted from the light emitting element 104 is reflected forward. Then, by filling a part of the gap between the plurality of lead frames 100 with the heat conducting resin 102, the contact area between the lead frame 100 and the heat conducting resin 102 is increased, and the heat dissipation effect is enhanced. Under this, the heat conductive resin 102 and the metal plate 108 as shown in FIG. 1 are formed (these are not visible in FIG. 4A). As described above, the first embodiment shown in FIG. 3 and the second embodiment shown in FIG. 4 can be selected as necessary.

  FIG. 4B corresponds to a top view of the state in which the light emitting element 104, the reflection portion 114, and the wall portion 112 are omitted from FIG. 4A. As shown in FIG. 4B, a light reflecting resin 106 is formed in a gap between the lead frames 100 (for example, a portion surrounded by the reflecting portion 114) in the vicinity where the light emitting element 104 is mounted. In other portions, the heat conducting resin 102 is filled so as to take heat from the lead frame 100. In addition, the spacer portion 110 is visible outside the heat conducting resin 102 in FIG. An arrow 116 a in FIG. 4B indicates how heat generated from the light emitting element 104 (not shown in FIG. 4B) is efficiently diffused through the lead frame 100. An arrow 116 b indicates the diffusion of heat from the lead frame 100 to the heat conducting resin 102. Thus, the light emitting element 104 can be efficiently cooled. As described above, by filling the light reflecting resin 106 in the gaps between the plurality of lead frames 100 inside the reflecting portion 114 and filling the heat conducting resin 102 outside the reflecting portion 114, the characteristics of each other can be utilized. Note that both the heat conducting resin 102 and the light reflecting resin 106 are white, so that the light emitting properties of the light emitting module are not affected even if the formation positions of the heat conducting resin 102 and the light reflecting resin 106 are shifted.

  Note that the light emission efficiency of the light emitting module can be increased by selecting the shape shown in the first top view. Moreover, since the cooling efficiency of the light emitting module can be increased by selecting the shape shown in the second top view, it can be properly used depending on the application.

  As described above, in the first embodiment, as shown in FIGS. 1 to 4, the light emitting element 104 is formed so as to straddle a plurality of lead frames 100 (note that the light emitting element 104 is not necessarily mounted so as to be straddled). Need not be). Note that members such as a wire wire for mounting the light emitting element 104 (wire wire is in the case of wire bonding connection), conductive resin, solder (in the case of flip chip mounting, etc.) are also not shown in FIG. .

  The vicinity of the lead frame 100 where the light emitting element 104 is mounted is fixed by a light reflecting resin 106 instead of the heat conducting resin 102. This reflects the reflectance of light from the light emitting element 104 forward. This is to increase the luminous efficiency. Further, by installing a light reflecting resin 106 around the portion of the lead frame 100 where the light emitting element 104 is mounted, the light emitted from the light emitting element 104 is reflected forward by the reflecting portion 114.

  In the first embodiment, the light emitting element 104 is mounted inside the ring-shaped (or donut-shaped) reflecting portion 114 formed of the light reflecting resin 106, and light emitted from the light emitting element 104 is light Reflected forward by the reflective resin 106 and the reflective portion 114.

  As shown in FIGS. 3 and 4, the light reflectance in the vicinity of the light emitting element 104 can be increased by forming the light reflecting resin 106 between the lead frames 100. For this reason, even when a plurality of light emitting elements each having a different emission color are mounted inside the reflection portion 114 formed in a ring shape, the color mixture (or white formation by color mixture) can be facilitated.

(Embodiment 2)
Hereinafter, an example of the manufacturing method of the light emitting module in Embodiment 2 of this invention is demonstrated using FIGS. 5-7 is sectional drawing which shows an example of the manufacturing method of the light emitting module in Embodiment 2, 126a and 126b are transparent resins, and 128 is a lens.

  FIG. 5A is a cross section of the lead frame 100 and the light reflecting resin 106. A part of the lead frame 100 is a mold or the like and a mounting portion of the light emitting element 104 (the light emitting element 104 is not shown). A portion to be punched into a fine pattern and mounted on a circuit board or the like is further bent. In addition, a reflection portion 114 and a wall portion 112 are formed at the upper portion of the light reflection resin 106, and a spacer portion 110 is formed at the lower portion. The light reflecting resin 106 is integrated with the lead frame 100 as indicated by an arrow 116. Here, for the integration, injection molding using a mold can be used (note that the mold and the injection molding machine are not shown in FIG. 5). Specifically, an injection-moldable thermoplastic material obtained by adding a highly light-reflective member to a thermoplastic resin can be used for the light-reflecting resin 106. Such members can be selected from commercially available materials for LEDs. By fixing the lead frame 100 with the light reflecting resin 106 in this way, deformation of the lead frame 100 can be prevented and the light reflectance can be increased.

  In the present invention, the light reflecting resin 106 is a thermoplastic resin to which a highly light reflective member (details will be described later) is added, and the heat conducting resin 102 is a thermosetting resin to which a highly heat conductive member is added. Will be used. As described above, by properly using the resin for the light reflecting resin 106 and the heat conducting resin 102, workability and reliability can be improved. In selecting the thermoplastic resin, the deformation of the reflecting portion 114 and the wall portion 112 can be prevented by considering the processing temperature and soldering temperature of the heat conducting resin.

  FIG. 5B is a cross-sectional view showing a state in which the lead frame 100 is injection-molded using the light reflecting resin 106. From FIG. 5B, it can be seen that the lead frame 100 has a reflective portion 114 and a wall portion 112 formed on the upper surface, and a spacer portion 110 formed on the lower surface. Next, as shown in FIG. 6, the lead frame 100 and the metal plate 108 are integrated using the heat conductive resin 102.

  FIG. 6A is a cross-sectional view showing a state in which the lead frame 100 and the metal plate 108 are integrated using the heat conductive resin 102. The lead frame 100 fixed by the light reflecting resin 106 and the metal plate 108 are integrally molded by the heat radiating resin 102 using a mold (not shown) by a method indicated by an arrow 116. Note that the heat conducting resin 102 may be heat-cured in a state where the heat conducting resin 102 is sandwiched between the lead frame 100 and the metal plate 108 from the upper and lower sides in the middle. In the case of molding as shown in FIG. 6A, for example, in order to prevent the generation of voids between the metal plate 108 and the heat conductive resin 102 (the void is an air layer generated due to insufficient adhesion). It is desirable to prevent the remaining air by thickening the central portion of the resin 102 or making it a bowl shape. In this integral molding, it is desirable to use a press device using a mold. For example, the heat conductive resin 102 is cured by heating at an arbitrary temperature in the range of 80 ° C. to 200 ° C., for example, 180 ° C. In this way, the state shown in FIG.

  Next, a light emitting element or the like is mounted using FIG. FIG. 7A is a cross-sectional view after the light emitting element 104 is mounted. The light emitting element 104 can be mounted on the lead frame 100 by solder mounting, wire bonder mounting, flip chip mounting, or the like.

  Next, as shown in FIG. 7B, a transparent resin 126a is poured into the portion surrounded by the light reflecting resin 106 and cured. Note that as shown in FIG. 7B, the transparent resin 126a may be formed by appropriately filling the portion surrounded by the reflecting portion 114. Moreover, the whole part enclosed by the reflection part 114 can be covered with the transparent resin 126a as needed. In this case, as shown in FIG. 7B, the transparent resin 126b overflowing from the light reflecting portion 114 can be received using the gap between the reflecting portion 114 and the wall portion 112 like a dam. With such a structure, the sealing process can be stabilized.

  FIG. 7C is a cross-sectional view showing a state in which the lens 128 is set on the transparent resin 126a. By receiving the overflowing transparent resin 126a in the gap between the reflecting portion 114 and the wall portion 112, the influence on the mountability of the lens 128 can be prevented.

  Note that the transparent resin 126a that covers the light-emitting element 104 is preferably PMMA (polymethyl methacrylate) or a silicon-based transparent resin. When an epoxy resin is used here, it is necessary to add a UV inhibitor for preventing yellowing of the epoxy. This is because the LED is white, and further, the epoxy resin may be yellowed by blue light. Also, it is desirable to use a soft material such as silicon (having at least a lower hardness than epoxy). By using a soft (flexible) resin material, the light-emitting element 104 generates heat, and stress concentration on the connection portion between the light-emitting element 104 and the lead frame 100 can be prevented when the light-expanded element 104 is thermally expanded. Similarly, stress concentration on the gold wire when the light emitting element 104 and the lead frame 100 are bonded to each other can be reduced (the gold wire is less likely to be cut).

  Note that the light-emitting element mounted on the light-emitting module is preferably a light-emitting element having at least one different emission color. The color rendering properties can be improved by using a plurality of light emitting elements 104 having different emission colors, and the color mixing property can be improved by mounting a plurality of these in a region surrounded by one light reflecting resin at a high density. It is done. In addition, one or more emission colors of the plurality of light emitting elements 104 may be white. As described above, in the configuration of Embodiment 2, even if the light emitting element 104 is easily affected by the temperature (or the degree of the influence is different) by utilizing the excellent heat dissipation, the influence of the temperature can be reduced. It is hard to receive. It goes without saying that the light emitting elements 104 can be individually controlled via the lead frame 100 even when the temperature of the light emitting module itself rises.

(Embodiment 3)
Hereinafter, an example of the manufacturing method of the light emitting module in Embodiment 3 of this invention is demonstrated using FIGS. 8-16. 8-16 is a perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG.

  FIG. 8 is a perspective view showing an example of a punched lead frame. By using an appropriate mold, it is possible to punch a plurality of pieces at once. As shown in FIG. 8, it is desirable to stretch a lead frame (not shown) before pressing in a stripe shape. As shown in FIG. 8, a part of the completed lead frame 100 can be a thin part 120 and the rest can be a thick part 122.

  FIG. 9 is a perspective view showing an example of a bent lead frame. By using an appropriate mold, a part of the lead frame can be bent with high accuracy. As shown in FIG. 9, the thick portion 122 (this portion corresponds to a lead terminal of a light emitting module or a portion attached to a circuit board or the like) is bent to form a terminal of the light emitting module. Increases heat dissipation.

  FIG. 10 is a perspective view showing a state in which the center portion of the lead frame is punched out. As shown in FIG. 10, a portion where the light emitting element 104 (not shown) is mounted can be punched with high accuracy. By punching in this way, the lead frame 100 is prevented from falling apart. Here, as shown in FIG. 10, the mounting portion of the light emitting element 104 requires a fine pattern (or fine pitch), and thus it is desirable to use a thin portion 120 for this portion. The reason why the mounting portion of the light emitting elements 104 is a fine pattern (or fine pitch) is to mount a plurality of light emitting elements 104 in a limited area with high density.

  As shown in FIG. 11, a wall portion 112 and a reflecting portion 114 are molded with a light reflecting resin 106 at the center portion of the lead frame 100 (or the mounting portion of the light emitting element 104). Injection molding or the like can be used for this molding.

  FIG. 12 is a perspective view showing a state where unnecessary portions of the lead frame 100 are removed. As shown in FIG. 12, by fixing the lead frame 100 with the light reflecting resin 106 in advance, the deformation of the lead frame 100 can be prevented in the process.

  FIG. 13 is a perspective view showing the back surface of FIG. From FIG. 13, it can be seen that the lead frame 100 is fixed by the spacer portion 110.

  In FIG. 14, the metal plate 108 is set and fixed as indicated by an arrow 116 through the heat conductive resin 102. At this time, a mold or a hot press can be used as described with reference to FIG. Further, by using the spacer 110, it is possible to define the positioning of the metal plate 108 and the thickness of the heat conductive resin 102 to be cured by being sandwiched in the middle.

  FIG. 15 is a perspective view showing a state in which the metal plate 108 is fitted into the spacer portion 110 through the heat conducting resin 102 (not shown). Thus, the metal plate 108 is fitted into the spacer portion 110 formed on the lead frame 100 via the heat conductive resin 102 (the thickness of the heat conductive resin 102 filled between the metal plate 108 and the lead frame 100 is further controlled. By doing so, it is possible to reduce the thickness variation of the heat conductive resin 102 and to reduce the thickness of the heat conductive resin 102, so that the heat conduction can be increased.

  16A and 16B are perspective views of the light-emitting module after the light-emitting element is mounted, in which FIG. 16A corresponds to a top view and FIG. 16B corresponds to a back view. In FIG. 16A, reference numeral 130 denotes a gold wire, which corresponds to a wiring used in wire bond mounting. As shown in FIG. A plurality of light emitting elements 104 are mounted with gold wires 130 or the like surrounded by the reflecting portion 114. Then, as shown in FIG. 7, the transparent resin 126a is filled to protect the light emitting element 104. By forming the wall portion 112, the lead frame 100 can be fixed and a kind of dam function that can hold the transparent resin 126b overflowing from the reflecting portion 114 can be provided. Further, by devising the shape of the wall part 112 (for example, a part of the reflection part 114 in FIG. 16A is connected to the wall part 112), the reflection part 114 can be increased in strength and positioned. . By integrating the wall portion 112 and the reflection portion 114 in this manner, the strength can be increased and the moldability can be improved.

  The light reflecting resin 106 may cover the side surface and bottom surface of the lead frame 100 or may cover only the side surface of the lead frame 100. When the bottom and side surfaces of the lead frame 100 are also covered with the light reflecting resin 106, the lead frame 100 can be prevented from being deformed, and a short circuit between the lead frame 100 and the metal plate 108 can be prevented. This is because the lead frame 100 and the metal plate 108 are insulated by the multilayer of the light reflecting resin 106 and the heat conducting resin 102.

  Further, a portion of the lead frame 100 where the light emitting element 104 is mounted (corresponding to the back surface of the lead frame 100, directly below the lead frame 100 where the light emitting element 104 is mounted, and between the lead frame 100 and the heat conductive resin 102). Alternatively, the light reflecting resin 106 may not be formed. By avoiding the light-emitting element 104 directly under the lead frame 100, that is, between the lead frame 100 and the heat-conductive resin 102, it is possible to prevent the heat diffusion of the light-emitting element 104 into the heat-conductive resin 102 from being affected.

  In this way, by covering a part of the light reflecting resin 106 not only on the side surface but also the back surface of the lead frame 100, the lead frame 100 can be securely fixed, and the lead frame 100 and the metal plate 108 can be short-circuited. Therefore, the heat conducting resin 102 can be thinned.

Next, the insulating material will be described in more detail. The heat conducting resin 102 is composed of a filler and a resin. The filler is preferably an inorganic filler. The inorganic filler desirably contains at least one selected from the group consisting of Al ₂ O ₃ , MgO, BN, SiO ₂ , SiC, Si ₃ N ₄ , and AlN. When an inorganic filler is used, heat dissipation can be improved, but when using MgO in particular, the linear thermal expansion coefficient can be increased. Further, when SiO ₂ is used, the dielectric constant can be reduced, and when BN is used, the linear thermal expansion coefficient can be reduced. In this way, the heat conductive resin 102 having a thermal conductivity of 1 W / (m · K) or more and 20 W / (m · K) or less can be formed. In addition, when heat conductivity is less than 1 W / (m * K), it influences the heat dissipation of a light emitting module. Moreover, when it is going to make thermal conductivity higher than 20 W / (m * K), it is necessary to increase the amount of fillers and may affect the workability at the time of a press.

  The resin is preferably a thermosetting resin, and specifically includes at least one selected from the group consisting of an epoxy resin, a phenol resin, and an isocyanate resin.

The inorganic filler has a substantially spherical shape and a diameter of 0.1 to 100 μm. The smaller the particle size, the better the filling rate into the resin. Therefore, the filling amount (or content) of the inorganic filler in the heat conducting resin 102 is filled at a high concentration of 70 to 95% by weight in order to increase the heat conductivity. In particular, in the present embodiment, the inorganic filler is a mixture of two types of Al ₂ O ₃ having an average particle size of 3 microns and an average particle size of 12 microns. By using the Al ₂ O ₃ of the large and small two types of particle size, it is possible to fill the Al ₂ O ₃ of small particle size in the gap Al ₂ O ₃ of large particle size, Al ₂ O ₃ 90 wt% near Can be filled to a high concentration. As a result, the thermal conductivity of the heat conducting resin 102 is about 5 W / (m · K). In addition, when the filling rate of a filler is less than 70 weight%, thermal conductivity may fall. Further, if the filling rate (or content rate) of the filler exceeds 95% by weight, the moldability of the heat conducting resin 102 before curing may be affected, and the adhesion between the heat conducting resin 102 and the lead frame 100 (for example, when embedded) Or if it is attached to the surface).

  The thermosetting insulating resin contains at least one kind of resin among epoxy resin, phenol resin and cyanate resin. These resins are excellent in heat resistance and electrical insulation.

  If the thickness of the insulator made of the heat conductive resin 102 is reduced, heat generated in the light emitting element 104 attached to the lead frame 100 can be easily transferred to the metal plate 108, but conversely, the withstand voltage becomes a problem. Since the thermal resistance increases, the optimum thickness may be set in consideration of the withstand voltage and the thermal resistance.

  Next, the material of the lead frame 100 will be described. The lead frame is preferably made mainly of copper. This is because copper has both excellent thermal conductivity and electrical conductivity. In order to improve the workability and thermal conductivity as a lead frame, the copper material used as the lead frame 100 is selected from a group of at least Sn, Zr, Ni, Si, Zn, P, Fe, etc. other than copper. It is desirable to use an alloy comprising at least one material. For example, an alloy (hereinafter referred to as Cu + Sn) in which Cu is a main component and Sn is added thereto can be used. In the case of a Cu + Sn alloy, for example, by adding Sn to 0.1 wt% or more and less than 0.15 wt%, the softening temperature can be increased to 400 ° C. For comparison, the lead frame 100 was fabricated using Sn-free copper (Cu> 99.96 wt%). However, although the electrical conductivity was low, distortion might occur in the completed heat dissipation board. Therefore, when a detailed examination was made, the softening point of the material was as low as about 200 ° C., so that reliability (repetition of heat generation / cooling, etc.) at the time of subsequent component mounting (soldering) or after mounting of the light emitting element 104 was improved. It was expected that it could be deformed. On the other hand, when a copper-based material with Cu + Sn> 99.96 wt% was used, it was not particularly affected by the heat generated by various mounted components and a plurality of LEDs. There was no effect on solderability and die bondability. Therefore, when the softening point of this material was measured, it was found to be 400 ° C. Thus, it is desirable to add some elements mainly composed of copper. In the case of Zr as an element added to copper, a range of 0.015 wt% or more and 0.15 wt% is desirable. When the amount added is less than 0.015 wt%, the effect of increasing the softening temperature may be small. On the other hand, if the amount added is more than 0.15 wt%, the electrical characteristics may be affected. Also, the softening temperature can be increased by adding Ni, Si, Zn, P or the like. In this case, Ni is preferably 0.1 wt% or more and less than 5 wt%, Si is 0.01 wt% or more and 2 wt% or less, Zn is 0.1 wt% or more and less than 5 wt%, and P is preferably 0.005 wt% or more and less than 0.1 wt%. . And these elements can make the softening point of a copper raw material high by adding single or multiple in this range. In addition, when there are few addition amounts than the ratio described here, the softening point raise effect may be low. Moreover, when there are more than the ratio described here, there exists a possibility of affecting the electrical conductivity. Similarly, in the case of Fe, 0.1 wt% or more and 5 wt% or less is desirable, and in the case of Cr, 0.05 wt% or more and 1 wt% or less are desirable. These elements are the same as those described above.

The tensile strength of the copper alloy used for the lead frame 100 is desirably 600 N / mm ² or less. In the case of a material having a tensile strength exceeding 600 N / mm ² , the workability of the lead frame 100 may be affected. Further, such a material having a high tensile strength tends to increase its electric resistance, so that it may not be suitable for high current applications such as LEDs used in the first embodiment. On the other hand, by setting the tensile strength to 600 N / mm ² or less (and if the lead frame 100 requires fine and complicated processing, desirably 400 N / mm ² or less), the springback (pressure even if bent to the required angle) If it is removed, it will be repelled by the reaction force), and the formation accuracy can be improved. As described above, as the lead frame material, the electrical conductivity can be lowered by using Cu as a main component, the workability can be improved by further softening, and the heat dissipation effect by the lead frame 100 can also be enhanced. The tensile strength of the copper alloy used for the lead frame 100 is desirably 10 N / mm ² or more. This is because the copper alloy used for the lead frame 100 needs to have a strength higher than the tensile strength (about 30 to 70 N / mm ² ) of general lead-free solder. When the tensile strength of the copper alloy used for the lead frame 100 is less than 10 N / mm ² , when the light emitting element 104, the driving semiconductor component, the chip component, etc. are soldered and mounted on the lead frame 100, the lead frame is not the solder portion. There is a possibility of cohesive failure at 100 parts.

  A solder layer is provided on the surface of the lead frame 100 that is exposed from the heat conductive resin 102 (the light emitting element 104 or a mounting surface of a control IC or a chip component (not shown)) to improve solderability in advance. By forming the tin layer, the heat capacity is larger than that of the glass-epoxy substrate and the like, and soldering can be improved, and the component mountability to the lead frame 100 can be improved and the rust of the wiring can be prevented. It is desirable that no solder layer be formed on the surface of the lead frame 100 that is in contact with the heat conductive resin 102 (or the embedded surface). When a solder layer or a tin layer is formed on the surface in contact with the heat conducting resin 102 in this way, this layer becomes soft during soldering, which may affect the adhesion (or bond strength) between the lead frame 100 and the heat conducting resin 102. . 1 to 16, the solder layer and the tin layer are not shown.

The metal metal plate 108 is made of aluminum, copper, or an alloy containing them as a main component, which has good thermal conductivity. In particular, in the present embodiment, the thickness of the metal plate 108 is 1 mm, but the thickness can be designed according to the specifications of a backlight or the like (in addition, when the thickness of the metal plate 108 is 0.1 mm or less, heat dissipation and The strength may be insufficient, and if the thickness of the metal plate 108 exceeds 50 mm, it is disadvantageous in terms of weight). The metal plate 108 is not limited to a simple plate shape, and a fin portion (or an uneven portion) is provided on the surface opposite to the surface on which the heat conducting resin 102 is formed in order to increase heat dissipation, in order to increase the surface area. It may be formed. The linear expansion coefficient is set to 8 × 10 ⁻⁶ / ° C. to 20 × 10 ⁻⁶ / ° C. By bringing the coefficient of linear expansion close to that of the metal plate 108 and the light emitting element 104, warpage and distortion of the entire substrate can be reduced. In addition, when these components are surface-mounted, matching the thermal expansion coefficients with each other is also important in terms of reliability. Further, the metal plate 108 can be screwed to another heat radiating plate (not shown).

  As the lead frame 100, a metal plate mainly made of copper, at least a part of which is punched in advance, can be used. The thickness of the lead frame 100 is desirably 0.1 mm or greater and 1.0 mm or less (more desirably 0.3 mm or greater and 0.5 mm or less). This is because a large current (for example, 30 A to 150 A, which may further increase depending on the number of LEDs to be driven) is required to control the LEDs. Moreover, when the thickness of the lead frame 100 is less than 0.10 mm, pressing may be difficult. If the thickness of the lead frame 100 exceeds 1 mm, pattern miniaturization may be affected at the time of punching with a press. Here, it is not desirable to use a copper foil (for example, a thickness of 10 to 50 microns) instead of the lead frame 100. In the case of the present invention, heat generated in the light emitting element 104 such as an LED is diffused widely through the lead frame 100. Therefore, the greater the thickness of the lead frame 100, the more effective the thermal diffusion through the lead frame 100. On the other hand, when a copper foil is used instead of the lead frame 100, the thickness of the copper foil is thinner than that of the lead frame, which may make it difficult for heat diffusion.

  The thickness of the lead frame is preferably 0.10 mm or more and 1.0 mm or less, and the thickness difference between the thin portion of the lead frame and the other portion is preferably 0.05 mm or more and 0.7 mm or less. When the difference in thickness between the thin portion 120 and the other portion (or the thick portion 122) is less than 0.05 mm, there are cases where it is difficult to achieve both effects (punchability of fine portions and high terminal strength). If the thickness difference is greater than 0.7 mm, it may be difficult to process the lead frame.

  In this way, a plurality of lead frames 100, each of which is a thin portion 120, which are fixed by at least the reflecting portion 114 made of the light reflecting resin 106 and the wall portion 112 and further filled with the light reflecting resin 106 in the gap, and a metal plate 108, a heat conductive resin 102 that fixes the metal plate 108 and the lead frame 100, and a light emitting element 104 mounted on the plurality of lead frames 100 exposed while surrounded by the reflecting portion 114. A light emitting module is provided.

  Further, a plurality of lead frames 100, each of which is a thin portion 120, are fixed by at least a reflecting portion 114 made of a light reflecting resin 106 and a wall portion 112, and the gap is filled with the light reflecting resin 106, and a metal plate 108, a heat conducting resin 102 filled between the lead frame 100 and the metal plate 108, a spacer part 110 made of the light reflecting resin 106 surrounding the heat conducting resin 102, and the reflective part 114. Provided is a light emitting module including a plurality of light emitting elements 104 mounted on a plurality of exposed lead frames 100.

  A plurality of lead frames 100 each having a thin portion 120 and a metal plate 108, each of which is fixed by at least a reflecting portion 114 made of a light reflecting resin 102 and a wall portion 112 and further filled with the light reflecting resin 102 in the gap. And at least the heat conductive resin 102 that fixes the metal plate 108 and the lead frame 100, the light emitting element 104 mounted on the plurality of lead frames 100 in a frame surrounded by the reflecting portion 114, and A light emitting module including a transparent resin 126 covering the light emitting element 104 is provided.

  In addition, such a light emitting module is fixed at least partially by the reflecting portion 114 and the wall portion 112 made of, for example, the light reflecting resin 106, and a plurality of partially thin portions 120 in which the light reflecting resin 106 is filled in the gaps. After the heat conducting resin 102 is cured in a state where the heat conducting resin 102 is sandwiched between the lead frame 100 having the metal plate 108 and the metal plate 108, the metal plate 108 and the lead frame 100 are integrated, and then the reflecting portion It can be manufactured by mounting the light emitting element 104 on the lead frame 100 exposed in the area surrounded by 114.

  In addition, a plurality of lead frames 100 each having a thin portion 120, each of which is fixed by at least a reflecting portion 114 made of a light reflecting resin 106 and a wall portion 112 and further filled with the light reflecting resin 106 in the gap, and a metal plate The heat conductive resin 102 is cured with the heat conductive resin 102 interposed therebetween, and the metal plate 108 and the lead frame 100 are integrated, and then exposed in a portion surrounded by the reflective portion 114. After the light emitting element 104 is mounted on the lead frame 100, the light emitting module can be manufactured by covering with the transparent resin 126.

As the light reflecting resin 106, a white ceramic powder such as TiO ₂ or MgO or a light reflecting powder having a high light reflection such as glass powder or micro glass beads dispersed in a thermoplastic resin having a high heat resistance. Can be used. In addition, a refractive index can be made into a standard as light reflectivity of light reflection powder. Desirably, a member (or powder) having a higher refractive index than the refractive index of glass (nd = 1.44 to 1.70) is preferably used as the light reflecting powder. As an example, the refractive index of TiO ₂ (synthetic rutile titania) (nd = 2.62 to 2.90), the refractive index of SrTiO ₃ (strontium titanate) (nd = 2.41), GGG (Gd ₃ Ga _5). O ₁₂ ) (nd = 2.03), ZrSiO ₄ (high type zircon) refractive index (nd = 1.83), YAG (Y ₃ Al ₅ O ₁₂ ) refractive index (nd = 1. 83), refractive index of Al ₂ O ₃ (synthetic corundum) (nd = 1.73 to 1.77), refractive index of spinel of (MgO) _2. (Al ₂ O ₃ ) ₅ (nd = 1.73) , At least one selected from the group consisting of diamond (nd = 2.42) can be selected. The higher the refractive index, the easier it is to reflect the light entering the powder. At the same time, the transparency (or crystallinity, particle size, purity, etc.) of the powder (or material) itself and the refractive index of the thermoplastic resin are also increased. By taking this into consideration, the light reflectance can be increased. Further, as the light reflecting resin 106 obtained by dispersing light reflecting powder in a thermoplastic resin, it is also possible to use a surface mounting LED. Since the high refractive index powder has low thermal conductivity except for diamond, an inorganic filler added to the heat conductive resin may be added as necessary. By doing so, the heat conduction of the light reflecting resin 106 can be adjusted. In addition, as a method for molding such a commercially available light reflecting resin 106 with the lead frame 100, a material having high mass productivity such as injection molding can be selected. The light reflectance of the light reflecting resin 106 in the visible light region is desirably 90% or more and 99.9% or less. When the light reflectance is less than 90%, the reflection efficiency at the reflecting portion 114 is affected. If the light reflectance is to be higher than 99.9%, the light reflecting resin 106 may be expensive and special. The light reflecting resin 106 is desirably white. By making it white, color mixing of monochromatic light such as Red, Green, Blue, etc. is facilitated. As the reflective material added to the light reflecting resin 106 as described above, TiO ₂ , MgO, glass powder, micro glass beads, SrTiO ₃ , Gd ₃ Ga ₅ O ₁₂ , ZrSiO ₄ , YAG or (Y ₃ Al ₅ O ₁₂ ) , Al ₂ O ₃ , (MgO) _2. (Al ₂ O ₃ ) ₅ , or an inorganic filler containing at least one selected from the group consisting of diamonds is desirable, and the particle size is 10 microns or less and 0.01 microns or more. desirable. If it is larger than 10 microns, the moldability may be affected. On the other hand, when the particle size is less than 0.01 micron, the specific surface area of the powder becomes too large, which may affect the fluidity during injection molding.

  Further, the light emitting element 104 is mounted on the lead frame within an area surrounded by the light reflecting resin 106, and further covered with a transparent resin 126a or the like, so that the light emitting element 104 can be protected, and the plurality of light emitting elements 104 can be protected. Density bear mounting is possible. In addition, by mounting a plurality of light emitting elements 104 at a high density, it is easy to uniformize white color due to color mixing.

  Further, in this case, one or more of the plurality of light emitting elements 104 is colored white so that the effect of facilitating color mixing can be obtained.

  As the light reflecting resin 106, for example, a polycarbonate resin in which a white pigment is dispersed can be used for injection molding. In particular, in the case of polycarbonate resin, it is desirable that the resin is sufficiently dried before injection molding. This is because the polycarbonate resin is a hydrophilic resin and absorbs moisture in the air. Therefore, if injection molding is performed without drying, a hydrolysis reaction of the resin may occur during molding, and the molecular weight of the resin may decrease, affecting the quality of the molded body. Therefore, the drying is desirably performed at 100 ° C. or higher (desirably performed at 110 ° C. to 130 ° C. for 4 to 6 hours). The molding temperature is preferably in the range of 250 ° C to 300 ° C, and the mold temperature is preferably in the range of 50 ° C to 120 ° C. If the temperature is lower than this range, the moldability may be affected. When the molding temperature is higher than this range, the moldability and the physical properties of the resin of the molded body may be affected.

As the thermoplastic resin for the light reflecting resin 106, PPS and liquid crystal polymer can be selected. In the case of such a resin (for example, a liquid crystal polymer), the injection temperature is around 340 ° C. (desirably 270 ° C. or more and 380 ° C. or less. If the temperature range is lower than this temperature range, the injection moldability may be affected. May affect the resin). Similarly, the mold is heated to around 100 ° C. (preferably 50 ° C. or more and 130 ° C. or less, which may affect the moldability if it is lower than this temperature range. The same applies if it is higher than this temperature range). It is desirable to do. Examples of the white pigment to be added here may be used _{TiO 2, Al 2 O 3,} MgO or the like. The particle diameter of these pigments is preferably 10 microns or less and 0.01 microns or more (preferably 5 microns or less and 0.1 microns or more). If it is larger than 10 microns, the moldability may be affected. On the other hand, when the particle size is less than 0.01 micron, the specific surface area of the powder becomes too large, which may affect the fluidity during injection molding.

  As described above, since the light emitting module according to the present invention can be used to stably light a large number of light emitting elements, in addition to backlights such as liquid crystal TVs, projectors, projectors, etc. It can also be applied to color rendering applications.

Sectional drawing of the light emitting module in Embodiment 1 Sectional view showing how heat diffuses First top view of the light emitting module Second top view of light emitting module Sectional drawing which shows an example of the manufacturing method of the light emitting module in Embodiment 2. Sectional drawing which shows an example of the manufacturing method of the light emitting module in Embodiment 2. Sectional drawing which shows an example of the manufacturing method of the light emitting module in Embodiment 2. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. The perspective view which shows an example of the manufacturing method of the light emitting module in Embodiment 3. FIG. Sectional drawing which shows an example of the conventional light emitting module

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Lead frame 102 Thermal conductive resin 104 Light emitting element 106 Light reflection resin 108 Metal plate 110 Spacer part 112 Wall part 114 Reflection part 116 Arrow 118 Dotted line 120 Thin part 122 Thick part 124 Processing angle 126 Transparent resin 128 Lens 130 Gold wire

Claims (17)

A plurality of partially thin lead frames fixed at least by a reflecting portion and a wall portion made of a light reflecting resin, and further filled with the light reflecting resin in the gap;
A metal plate,
A heat conductive resin for fixing the metal plate and the lead frame;
A light emitting module comprising: a light emitting element mounted on a plurality of lead frames exposed inside the reflective portion. A plurality of partially thin lead frames fixed at least by a reflecting portion and a wall portion made of a light reflecting resin, and further filled with the light reflecting resin in the gap;
A metal plate,
A heat conductive resin filled between the lead frame and the metal plate;
A spacer portion made of the light reflecting resin surrounding the heat conducting resin;
A plurality of light emitting elements mounted on a plurality of lead frames exposed while surrounded by the reflecting portion; and
A light emitting module comprising: A plurality of partially thin lead frames fixed at least by a reflecting portion and a wall portion made of a light reflecting resin, and further filled with the light reflecting resin in the gap;
A metal plate,
A heat conducting resin for fixing at least the metal plate and the lead frame;
Among the frames surrounded by the reflective portion, light emitting elements mounted on the plurality of lead frames,
A transparent resin covering the light emitting element;
A light emitting module comprising: The light emitting module according to claim 1, wherein the heat conductive resin formed between the metal plate and the lead frame has a thickness of 50 microns or more and 500 microns or less. 4. The light emitting module according to claim 1, wherein a plurality of light emitting elements each having a different emission color are mounted within an area surrounded by the reflection portion. 4. The light emitting module according to claim 1, wherein at least one of the plurality of light emitting elements mounted in an area surrounded by the reflecting portion has a white light emission color. 5. . The thickness of the lead frame is 0.10 mm or more and 1.0 mm or less, and the thickness difference between the thin portion of the lead frame and the other portion is 0.05 mm or more and 0.7 mm or less. 4. The light emitting module according to any one of 3. The light emitting module according to claim 1, wherein the thermal conductivity of the heat conducting resin is 1 W / (m · K) or more and 20 W / (m · K) or less. The heat conductive resin is a resin in which an inorganic filler containing at least one selected from the group consisting of Al ₂ O ₃ , MgO, BN, SiO ₂ , SiC, Si ₃ N ₄ , and AlN is dispersed in a thermosetting resin. The light emitting module according to claim 1, claim 2, or claim 3. The thermal conductive resin is one in which an inorganic filler is dispersed in a thermosetting resin containing at least one selected from the group consisting of an epoxy resin, a phenol resin, and an isocyanate resin. 4. The light emitting module according to any one of 3. The light-emitting module according to claim 1, wherein the light-reflecting resin is a white one obtained by adding a light-reflecting material to a thermoplastic resin. The reflective material is TiO ₂ , MgO, glass powder, micro glass beads, SrTiO ₃ , Gd ₃ Ga ₅ O ₁₂ , ZrSiO ₄ , YAG or (Y ₃ Al ₅ O ₁₂ ), Al ₂ O ₃ , (MgO) _2. The inorganic filler containing (Al ₂ O ₃ ) ₅ or at least one selected from the group consisting of diamonds, the particle size of which is 10 microns or less and 0.01 microns or more. 4. The light emitting module according to any one of 3. Sn is 0.1 wt% to 0.15 wt%, Zr is 0.015 wt% to 0.15 wt%, Ni is 0.1 wt% to 5 wt%, Si is 0.01 wt% to 2 wt%, Zn is Lead frame mainly composed of copper containing at least one selected from the group of 0.1 wt% to 5 wt%, P is 0.005 wt% to 0.1 wt%, and Fe is 0.1 wt% to 5 wt%. The light emitting module according to claim 1, wherein the light emitting module is used. 4. A part of the light reflecting resin is also formed in a gap between the lead frames and a position between the lead frame and the heat conducting resin so as to avoid a position directly below the light emitting element. The light emitting module in any one of. 4. The light emitting module according to claim 1, wherein a part of the light reflecting resin forms a spacer that holds a gap between the lead frame and the metal plate. Heat conduction between a plurality of partially thin lead frames and a metal plate, at least part of which is fixed by a reflection part and a wall part made of light reflection resin, and the gap is filled with the light reflection resin. With the resin sandwiched, the heat conducting resin is cured,
After integrating the metal plate and the lead frame,
A method for manufacturing a light emitting module, wherein a light emitting element is mounted on the lead frame that is exposed while surrounded by the reflective portion. A heat conducting resin is sandwiched between a metal plate and a plurality of partially thin lead frames fixed at least by a reflecting portion and a wall portion made of a light reflecting resin, and further filled with the light reflecting resin in the gap. In this state, the heat conducting resin is cured,
After integrating the metal plate and the lead frame,
A method for manufacturing a light-emitting module, in which a light-emitting element is mounted on the lead frame exposed in a portion surrounded by the reflective portion and then covered with a transparent resin.

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