JP2007186663A5 - Method for producing polyimide resin - Google Patents

Method for producing polyimide resin Download PDF

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JP2007186663A5
JP2007186663A5 JP2006035215A JP2006035215A JP2007186663A5 JP 2007186663 A5 JP2007186663 A5 JP 2007186663A5 JP 2006035215 A JP2006035215 A JP 2006035215A JP 2006035215 A JP2006035215 A JP 2006035215A JP 2007186663 A5 JP2007186663 A5 JP 2007186663A5
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polyimide resin
producing
compound
resin according
acid anhydride
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JP2006035215A
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JP2007186663A (en
JP5158400B2 (en
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Publication of JP2007186663A5 publication Critical patent/JP2007186663A5/en
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すなわち、本発明は、２個以上のフェノール性水酸基を有するポリフェノール化合物（ａ１）とポリイソシアネート化合物（ａ２）と酸無水物（ａ３）とを反応させることを特徴とするポリイミド樹脂の製造方法を提供するものである。 That is, this invention provides the manufacturing method of the polyimide resin characterized by making the polyphenol compound (a1), polyisocyanate compound (a2), and acid anhydride (a3) which have a 2 or more phenolic hydroxyl group react. To do.

Claims (8)

２個以上のフェノール性水酸基を有するポリフェノール化合物（ａ１）とポリイソシアネート化合物（ａ２）と酸無水物（ａ３）とを反応させることを特徴とするポリイミド樹脂の製造方法。A method for producing a polyimide resin, comprising reacting a polyphenol compound (a1) having two or more phenolic hydroxyl groups, a polyisocyanate compound (a2), and an acid anhydride (a3). 前記ポリフェノール化合物（ａ１）が２個のフェノール性水酸基を含有するポリフェノール化合物である請求項１記載のポリイミド樹脂の製造方法。The method for producing a polyimide resin according to claim 1, wherein the polyphenol compound (a1) is a polyphenol compound containing two phenolic hydroxyl groups. 前記ポリフェノール化合物（ａ１）がビスフェノール系化合物である請求項２記載のポリイミド樹脂の製造方法。The method for producing a polyimide resin according to claim 2, wherein the polyphenol compound (a1) is a bisphenol compound. 前記ポリイソシアネート化合物（ａ２）がジイソシアネートとイソシアヌレート型ポリイソシアネートとの混合物である請求項１記載のポリイミド樹脂の製造方法。The method for producing a polyimide resin according to claim 1, wherein the polyisocyanate compound (a2) is a mixture of diisocyanate and isocyanurate type polyisocyanate. 前記混合物がジイソシアネートとして芳香族ジイソシアネートを、イソシアヌレート型ポリイソシアネートとして脂肪族ジイソシアネートのイソシヌレート型ポリイソシアネートおよび／または脂環式ジイソシアネートのイソシヌレート型ポリイソシアネートを含有する混合物である請求項４記載のポリイミド樹脂の製造方法。5. The polyimide resin according to claim 4, wherein the mixture is a mixture containing an aromatic diisocyanate as a diisocyanate and an isocyanurate type polyisocyanate of an aliphatic diisocyanate and / or an isocyanurate type polyisocyanate of an alicyclic diisocyanate as an isocyanurate type polyisocyanate. Production method. 前記酸無水物（ａ３）が芳香族系酸無水物である請求項１記載のポリイミド樹脂の製造方法。The method for producing a polyimide resin according to claim 1, wherein the acid anhydride (a3) is an aromatic acid anhydride. 前記芳香族系酸無水物がエチレングリコールビスアンヒドロトリメリテートである請求項６記載のポリイミド樹脂の製造方法。The method for producing a polyimide resin according to claim 6, wherein the aromatic acid anhydride is ethylene glycol bisanhydro trimellitate. 前記２個以上のフェノール性水酸基を有するポリフェノール化合物（ａ１）とポリイソシアネート化合物（ａ２）と酸無水物（ａ３）とを、（ａ１）、（ａ２）および（ａ３）の合計重量に対してそれぞれ５〜５０重量％、２０〜７０重量％、２０〜７０重量％となるように用いて反応させる請求項１記載のポリイミド樹脂の製造方法。The polyphenol compound (a1) having two or more phenolic hydroxyl groups, the polyisocyanate compound (a2), and the acid anhydride (a3), respectively, with respect to the total weight of (a1), (a2), and (a3) The manufacturing method of the polyimide resin of Claim 1 made to react by using so that it may become 5-50 weight%, 20-70 weight%, and 20-70 weight%.
JP2006035215A 2005-12-15 2006-02-13 Method for producing polyimide resin Expired - Fee Related JP5158400B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006035215A JP5158400B2 (en) 2005-12-15 2006-02-13 Method for producing polyimide resin

Applications Claiming Priority (3)

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JP2005361691 2005-12-15
JP2005361691 2005-12-15
JP2006035215A JP5158400B2 (en) 2005-12-15 2006-02-13 Method for producing polyimide resin

Related Child Applications (1)

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JP2011214479A Division JP4998642B2 (en) 2005-12-15 2011-09-29 Method for producing polyimide resin

Publications (3)

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JP2007186663A JP2007186663A (en) 2007-07-26
JP2007186663A5 true JP2007186663A5 (en) 2007-12-06
JP5158400B2 JP5158400B2 (en) 2013-03-06

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5092484B2 (en) * 2007-03-26 2012-12-05 Ｄｉｃ株式会社 Thermosetting polyimide resin composition
JP5223458B2 (en) * 2008-05-23 2013-06-26 東洋紡株式会社 Urethane-modified polyimide resin composition, paste comprising the composition, and electronic component obtained from the paste
CN102076732B (en) 2008-07-22 2013-03-13 株式会社钟化 Novel polyimide precursor composition and use thereof
JP6776589B2 (en) * 2015-04-10 2020-10-28 東洋紡株式会社 Polyimide resin-containing aqueous dispersion composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993003080A2 (en) * 1991-08-05 1993-02-18 Battelle Memorial Institute Thermally reversible isocyanate-based polymers
JPH11293223A (en) * 1998-04-09 1999-10-26 Toyobo Co Ltd Heat-resistant adhesive and flexible printed wiring board prepared by using the same
JP2001329243A (en) * 2000-05-22 2001-11-27 Hitachi Chem Co Ltd Adhesive, adhesive film, lead frame with adhesive film, and semiconductor unit therewith
JP4552109B2 (en) * 2003-12-22 2010-09-29 Ｄｉｃ株式会社 Thermosetting polyimide resin composition and cured product thereof
JP4103142B2 (en) * 2004-03-31 2008-06-18 荒川化学工業株式会社 Process for producing methoxysilyl group-containing silane-modified polyimidesiloxane resin, the resin, the resin composition, a cured film, and a metal foil laminate

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