JP2007184502A - Substrate carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the degree of substrate adhesion on a substrate carrier using a simple structure. <P>SOLUTION: The substrate carrier 10 includes: a carrier member 14 which loads and carries a substrate 1 to a reflow furnace with a punched hole 20 for suctioning the substrate 1 through vacuumization; and a carrier member adaptor 16 provided at the lower surface of the carrier member 14 and composed of bimetal which is deformed to a saucer shape due to a reflow heat in the reflow furnace. The carrier member adaptor 16 is deformed to a saucer shape due to heating at reflow to easily vacuumize the lower surface of the carrier member 14, so that the substrate 1 can be suctioned onto the carrier member 14 via the punched hole 20 of the carrier member 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate transport carrier, and more particularly to a substrate transport carrier that can stably hold a flexible printed circuit board or a thin substrate.

  Conventionally, there is a technique in which a substrate is vacuum-sucked in order to stably hold a substrate placed on a substrate transport carrier (Patent Document 1).

  In the substrate transport carrier described in Patent Document 1, the mounting portion on which the substrate is placed has a multilayer structure in which three plate members are stacked, and suction for vacuum suction of the substrate to the placing portion is performed. A hole, an opening connected to the vacuum suction mechanism, and an inner hole (suction path) connecting the suction hole and the opening are formed. Then, the opening formed in the substrate transport carrier is connected to the vacuum suction means so that the substrate is sucked and held through the inner hole and the suction hole.

Patent Documents 2 and 3 disclose a technique in which a resin layer having weak adhesiveness is bonded to a transport board and a flexible printed board is fixed with adhesive force.
JP 2003-142503 A JP 2005-72556 A JP 2004-71863 A

  However, when the substrate is adsorbed by the vacuum chuck described in Patent Document 1, not only the time for evacuation and the time for releasing it takes extra time, but the productivity does not increase, but the vacuum pressure changes due to heating during reflow. There is a problem that the O-ring for airtightness is thermally deteriorated and it is difficult to maintain a stable vacuum. Further, there is a problem that a vacuum suction means or the like is required, and the apparatus becomes large and troublesome.

  On the other hand, when the substrate is fixed with the adhesive force described in Patent Documents 2 and 3, the adhesive force decreases due to repeated use, and it becomes impossible to hold a stable flexible printed circuit board, or the electrons bonded at the time of peeling. There is a possibility that the parts are stressed and the solder joints are destroyed.

  The present invention has been made in view of the above circumstances, and can improve the adhesion of the substrate on the substrate transport carrier with a simple configuration, and can particularly stably hold the substrate in close contact during reflow. An object is to provide a transport carrier.

  In order to achieve the above object, a substrate transport carrier according to the present invention is a carrier member for placing a substrate and transporting the substrate to a reflow furnace, wherein the carrier member is formed with perforations for vacuum-adsorbing the substrate. And a carrier member adapter that is disposed on the lower surface side of the carrier member and deforms into a dish shape by heat during reflow in the reflow furnace, and with the deformation of the carrier member adapter, A vacuum space is formed between the lower surface and a substrate positioned on the perforation of the carrier member and the carrier member adapter, and the substrate is sucked onto the carrier member.

  That is, the carrier member adapter is deformed into a dish shape by heating at the time of reflow, and the lower surface side of the carrier member is simply evacuated, and the substrate is sucked onto the carrier member through the hole of the carrier member. Yes. Since the substrate is sucked using heat during reflow, the adhesion of the substrate can be increased with a simple configuration.

  The carrier member is perforated so as to avoid an opening formed in the substrate. The substrate has positioning holes and openings such as perforations between the discarded substrate and the single substrate, but the carrier member is perforated so as to avoid these openings.

  Moreover, the carrier member according to another aspect has a plurality of perforations formed on substantially the entire surface at predetermined intervals. In this case, the carrier member adapter is arranged corresponding to each of the perforations so that a plurality of perforations of the carrier member can be sucked independently.

  The carrier member has an airtight sheet having perforations corresponding to the perforations of the carrier member formed on an upper surface thereof, and maintains airtightness with a substrate placed on the airtight sheet. This is to maintain the airtightness between the substrate and the carrier member during vacuum suction. As the airtight sheet, a resin film having weak adhesiveness can be applied.

  The carrier member adapter is constituted by bimetal, shape memory material, or a combination of bimetal and shape memory material. As the shape memory material, in addition to the shape memory alloy, a shape memory resin, a shape memory ceramic and the like can be applied. Moreover, by combining the bimetal and the shape memory material to form the carrier member adapter, the time for the vacuum to be gradually vacuumed by the bimetal and the time for the vacuum to be vacuumed by the shape memory material and the time to be sucked are dispersed. be able to.

  Further, as still another aspect of the present invention, the carrier member adapter includes a telescopic sealant that is affixed to the lower surface of the carrier member between the carrier member and the carrier member adapter. When the dish is deformed, the sealing material is sucked in correspondence with each perforation of the carrier member, and a vacuum space is individually formed between the substrate located on the perforation of the carrier portion and the sealing material, and the substrate Is sucked onto the carrier member. Accordingly, even when the carrier member has perforations having different sizes, the substrate can be sucked evenly at each perforated portion.

  According to the present invention, the lower surface side of the carrier member is simply evacuated by the member (carrier member adapter) that deforms into a dish shape by heat during reflow, and the substrate is removed from the carrier member through the hole (adsorption hole) of the carrier member. Since the suction is performed upward, the adhesion of the substrate on the substrate transport carrier can be increased with a simple configuration.

  Hereinafter, preferred embodiments of a substrate transport carrier according to the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is an exploded perspective view showing a first embodiment of a substrate transport carrier according to the present invention, and FIG. 2 is a cross-sectional view of the substrate transport carrier.

  As shown in these drawings, the substrate transport carrier 10 includes a carrier member 14 having an airtight sheet 12 attached to the upper surface, a carrier member adapter 16 disposed on the lower surface side of the carrier member 14, and a carrier member adapter. The auxiliary adapter 18 is provided on the lower surface side of the auxiliary member 18.

  Positioning pins 13 for positioning a flexible printed circuit board (FPC) or a thin hard substrate (hereinafter simply referred to as “substrate”) 1 are implanted at the four corners of the carrier member 14 and protrude from the airtight sheet 12. ing.

  The airtight sheet 12 is provided in order to maintain airtightness with the substrate 1 placed on the upper surface thereof, and, for example, a resin rubber having weak adhesiveness is applied.

  3A and 3B are plan views of the substrate 1 and the airtight sheet 12, respectively. The carrier member 14 is formed in the same planar shape as the airtight sheet 12.

  As shown in FIG. 3A, this substrate 1 has two single substrates 2 and a discarded substrate 3, and a perforation 4 is formed between the single substrate 2 and the discarded substrate 3. Yes. Further, a positioning hole 5 is formed in the discarded substrate 3.

  On the other hand, as shown in FIG. 3B, the airtight sheet 12 and the carrier member 14 are formed with perforations 20 so as to avoid the openings (perforations 4 and positioning holes 5) formed in the substrate 1. . Instead of the perforations 20, round holes may be provided side by side in the same range as the perforations 20.

  FIG. 3C shows a state in which the substrate 1 is placed on the airtight sheet 12 (carrier member 14). As shown in the figure, the opening formed in the substrate 1 and the perforations 20 formed in the airtight sheet 12 do not overlap, and as a result, the airtightness between the substrate 1 and the airtight sheet 12 is maintained. The

  As shown in FIG. 2, the carrier member adapter 16 is composed of a bimetal in which a member 16a having a small linear expansion coefficient and a member 16b having a large linear expansion coefficient are bonded together. Only the outer peripheral portion of the carrier member adapter 16 is fixed to the lower surface of the carrier member 14 with airtightness.

  The auxiliary adapter 18 is disposed on the outer peripheral portion of the lower surface of the carrier member adapter 16, and a perforation 18 a that absorbs the amount of deformation of the carrier member adapter 16 is formed in the center portion thereof. A concave groove that absorbs the metamorphic amount of the carrier member adapter 16 may be used instead of the perforations 18a.

  Next, the operation of the substrate transport carrier 10 having the above configuration will be described.

  The substrate 1 is placed on the substrate transport carrier 10 as shown in FIG. Then, a solder paste is applied on a land (not shown) of the substrate 1, and an electronic component such as a semiconductor integrated circuit is placed thereon.

  Subsequently, the substrate transport carrier 10 is carried into a reflow furnace. In the reflow furnace, in order to solder the electronic component to the substrate 1, heating control is performed with a temperature profile as shown in FIG. As a result, the solder paste is melted and solidified, and the electronic component is soldered.

  4 (A) and 4 (B) show the change state of the carrier member adapter 16 at the temperatures of point A and point B of the temperature profile shown in FIG. 4 (C), respectively. In addition, B point shows the point from which the adhesiveness of the board | substrate 1 is requested | required more.

  The carrier member adapter 16 made of bimetal is deformed into a dish shape by heating during reflow in a reflow furnace. With the deformation of the carrier member adapter 16, a vacuum space is formed between the carrier member adapter 16 and the substrate 1 positioned on the lower surface of the carrier member 14, the airtight sheet 12 and the perforations 20 of the carrier member 14.

  Here, the space 16A that increases due to the deformation of the carrier member adapter 16 shown in FIG. 4B is a volume increase amount due to the thermal expansion of the gas sealed in the airtight sheet 12 and the perforations 20 of the carrier member 14 before heating. It has come to exceed. Thereby, the board | substrate 1 is attracted | sucked through the perforation 20, and is closely_contact | adhered and hold | maintained on the airtight sheet | seat 12, and the curvature of the board | substrate 1 at the time of soldering, a lift, etc. are prevented, and it can solder well.

[Second Embodiment]
FIG. 5 is a view showing a main part of a second embodiment of the substrate transport carrier according to the present invention.

  The substrate transport carrier of the second embodiment uses a carrier member adapter 22 made of a shape memory alloy instead of the carrier member adapter 16 made of the bimetal of the first embodiment. It is different in point.

  The carrier member adapter 22 made of a shape memory alloy has a flat shape as shown in FIG. 5A at a temperature below the point A of the temperature profile during reflow shown in FIG. When the temperature exceeds this temperature, the peripheral portion 22A of the carrier member adapter 22 is transformed as shown in FIG.

  As a result, the carrier member adapter 22 vacuums the lower surface side of the carrier member at a temperature exceeding the point A, sucks the substrate 1, and holds the substrate 1 in close contact with the airtight sheet 12.

  In addition, as a material of the carrier member adapter 22, other shape memory materials such as a heat-resistant shape memory resin and a shape memory ceramic may be used instead of the shape memory alloy.

[Third Embodiment]
FIG. 6 is a view showing a third embodiment of the substrate transport carrier according to the present invention, FIG. 6 (A) is a sectional view of the substrate transport carrier, and FIG. 6 (B) is a carrier member of the substrate transport carrier. A sectional view of the adapter is shown. In FIG. 6A, parts common to the substrate transport carrier 10 of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 6A, the substrate transport carrier 30 according to the third embodiment includes a bimetal, a shape memory alloy, and a carrier member adapter 16 that is composed of the bimetal according to the first embodiment. This is different in that a carrier member adapter 32 is used.

  As shown in FIG. 6B, the carrier member adapter 32 is configured by a bimetal in which a center part 32A of the carrier member adapter 32 is bonded to a member 34a having a small linear expansion coefficient and a member 34b having a large linear expansion coefficient. The peripheral portion 32B is made of a shape memory alloy.

  The carrier member adapter 32 has a shape in which the bimetal in the central portion 32A is slightly swelled in a dish shape as shown in FIG. 7A at the temperature of point A in the temperature profile during reflow shown in FIG. At point B, the shape memory alloy of the peripheral portion 32B of the carrier member adapter 32 is transformed as shown in FIG.

  Thus, in the carrier member adapter 34, only the central portion 34A made of bimetal is transformed below the temperature of the point B, and the peripheral portion made of a shape memory alloy becomes higher than the temperature of the point B (temperature at which adhesion is desired). 32B is also transformed.

  According to this carrier member adapter 32, it is possible to disperse the range in which the substrate 1 is gradually transformed by the temperature profile at the time of reflow and the substrate 1 is instantaneously transformed and the time at which the substrate 1 is instantly transformed.

[Fourth Embodiment]
FIG. 8 is a view showing a fourth embodiment of the substrate transport carrier according to the present invention, and FIGS. 8A and 8B are plan views of the substrate 1 and the airtight sheet 42, respectively. The carrier member 44 is formed in the same planar shape as the airtight sheet 42.

  As shown in FIG. 8B, the airtight sheet 42 and the carrier member 44 have a large number of perforations (adsorption holes) 46 regardless of the openings (perforations 4 and positioning holes 5) formed in the substrate 1. It is formed on the entire surface at a predetermined interval.

  FIG. 8C shows a state in which the substrate 1 is placed on the airtight sheet 42 (carrier member 44). As shown in the figure, a part of the perforation 4 formed in the substrate 1 overlaps with the perforation 46 formed in the airtight sheet 42.

  In addition, the substrate transport carrier of the fourth embodiment uses a substrate in which perforations having the same arrangement as the perforations 46 formed in the airtight sheet 42 and the carrier member 44 are formed as an auxiliary adapter, and as a carrier member adapter. Any one of the first to third embodiments is used.

  Thus, the perforations 46 can suck the substrate 1 independently. Therefore, the substrate 1 cannot be adsorbed at the portion of the perforation 46 that overlaps with the opening of the substrate 1, but the substrate 1 can be adsorbed at the portion of the perforation 46 that does not overlap with the opening of the substrate 1.

  Since the substrate transport carrier of the fourth embodiment can suck the substrate regardless of the position of the opening of the substrate, it can be commonly used for a plurality of types of substrates.

[Fifth Embodiment]
FIG. 9 is an exploded perspective view showing a fifth embodiment of the substrate transport carrier according to the present invention, and FIG. 10 is a sectional view of the substrate transport carrier. In addition, the same code | symbol is attached | subjected to the part which is common in FIG. 1, and the detailed description is abbreviate | omitted.

  In contrast to the substrate transport carrier 10 of the first embodiment shown in FIGS. 1 and 2, etc., the substrate transport carrier 50 of the fifth embodiment shown in FIGS. 9 and 10 includes a carrier member 14 and a carrier. The difference is that the seal material 52 and the seal auxiliary adapter 54 are provided between the member adapter 16 and the member adapter 16.

  The seal material 52 is a stretchable resin material seal material, and is attached to the lower surface of the carrier member 14. Therefore, the seal material 52 is configured such that the portion of the carrier member 14 facing each perforation 20 can expand and contract.

  The seal auxiliary adapter 54 is disposed between the seal material 52 and the carrier member adapter 16, and has a perforation 54 a that absorbs the amount of deformation of the seal material 52.

  Next, the operation of the substrate transport carrier 50 configured as described above will be described.

  FIG. 11 is a cross-sectional view of a main part of the substrate transport carrier 50 showing a change state during reflow. When this board | substrate conveyance carrier 50 is heated by a reflow furnace, the carrier member adapter 16 comprised from the bimetal will deform | transform into a dish shape.

  With the deformation of the carrier member adapter 16, the space of the hole 54 a of the seal auxiliary adapter 54 becomes negative pressure, and as a result, the seal material 52 is sucked. In the sucked sealing material 52, the portions of the carrier member 14 facing the perforations 20 extend, and the portions corresponding to the perforations 20 between the sealing material 52 and the substrate 1 are evacuated to suck the substrate 1.

  The portion of the hole 54a of the seal auxiliary adapter 54 has a smaller expansion coefficient than the gas sealed between the hole 20 of the carrier member 14 and the substrate 1, and is combined with the gas sealed between the hole 20 and the substrate 1. It is assumed that the amount of transformation of the carrier member adapter 16 is larger than the amount of expansion.

  Thereby, even if the holes 20 having different sizes are formed in the carrier member 14, each of the holes 20 can suck the substrate without being biased.

  Further, the seal member 52 and the seal auxiliary adapter 5 of the fifth embodiment can be applied as means for individually sucking the numerous perforations 46 of the fourth embodiment shown in FIG. .

FIG. 1 is an exploded perspective view showing a substrate transport carrier according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the substrate transport carrier shown in FIG. 3A is a plan view of the substrate, FIG. 3B is a plan view of the hermetic sheet (carrier member), and FIG. 3C is a plan view of a state where the substrate is placed on the hermetic sheet. FIG. 4 is a diagram used for explaining the operation of the substrate transport carrier according to the first embodiment. FIG. 5 is a diagram used for explaining the configuration and operation of the substrate transport carrier according to the second embodiment. FIG. 6 is a cross-sectional view used for explaining the configuration of the substrate transport carrier according to the third embodiment. FIG. 7 is a diagram used for explaining the operation of the substrate transport carrier according to the third embodiment. 8A is a plan view of the substrate, FIG. 8B is a plan view of the hermetic sheet (carrier member) of the fourth embodiment, and FIG. 8C is a state in which the substrate is placed on the hermetic sheet. FIG. FIG. 9 is an exploded perspective view showing a fifth embodiment of the substrate carrying carrier according to the present invention. 10 is a cross-sectional view of the substrate transport carrier shown in FIG. FIG. 11 is a cross-sectional view of the main part of the substrate transport carrier according to the fifth embodiment showing a change state during reflow.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Single substrate, 3 ... Discard substrate, 4 ... Perforation, 5 ... Positioning hole, 10, 30, 50 ... Substrate transport carrier, 12, 42 ... Airtight sheet, 13 ... Positioning pin, 14, 44 ... Carrier member 16, 22, 32 ... Carrier member adapter 18 ... Auxiliary adapter 20, 46, 54a ... Perforation 52 ... Sealing material 54 ... Seal auxiliary adapter

Claims (7)

A carrier member for placing a substrate and transporting it to a reflow furnace, wherein the carrier member is formed with perforations for vacuum-adsorbing the substrate;
A carrier member adapter disposed on the lower surface side of the carrier member and deformed into a dish shape by heat during reflow in the reflow furnace,
As the carrier member adapter is deformed, a vacuum space is formed between the carrier member adapter and a lower surface of the carrier member and a substrate located on the perforation of the carrier member, and the substrate is sucked onto the carrier member. A substrate carrying carrier.   The substrate transport carrier according to claim 1, wherein the carrier member is formed with perforations so as to avoid an opening formed in the substrate.   The substrate transport carrier according to claim 1, wherein the carrier member has a plurality of perforations formed on substantially the entire surface at a predetermined interval.   4. The substrate transport carrier according to claim 3, wherein the carrier member adapter is disposed corresponding to each of the perforations so that a plurality of perforations of the carrier member can be sucked independently.   The said carrier member has an airtight sheet | seat with which the perforation corresponding to the perforation | boring of the said carrier member was formed in the upper surface, and maintains airtightness with the board | substrate mounted on the said airtight sheet | seat. Item 5. The substrate transport carrier according to any one of Items 1 to 4.   The substrate carrier according to claim 1, wherein the carrier member adapter is configured by bimetal, shape memory material, or a combination of bimetal and shape memory material.   Between the carrier member and the carrier member adapter, and having a stretchable sealing material affixed to the lower surface of the carrier member, the carrier member adapter is formed in each perforation of the carrier member when deformed in a dish shape The sealing material is sucked correspondingly, a vacuum space is individually formed between the substrate located on the hole of the carrier part and the sealing material, and the substrate is sucked onto the carrier member. The substrate transport carrier according to claim 2 or 3.

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