JP2007184373A - Optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module conducting an optical-axis matching simpler than conventional devices. <P>SOLUTION: The optical module has a head carrying a conversion between an electric signal and a light signal, an optical communication element with metallic leads being extended from the head and carrying the transmission of the electric signal, and a socket having a recess fitting the head. The leads are formed partially in thick widths. The recess has a shape fitting the leads. The optical-axis matching is enabled only by arranging the socket with a high accuracy, by utilizing the positional relationship of the leads and the optical element hermetically sealed in the head controlled with the high accuracy. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical module comprising an optical communication element having a head for converting between an electrical signal and an optical signal, and a socket having a recess into which the head is fitted.

  In recent years, optical communication using an optical fiber and an optical communication element having a head responsible for conversion between an electrical signal and an optical signal, a metal lead extending from the head and responsible for electrical signal transmission, and an optical fiber has been used. Yes.

  By the way, the optical communication element used in the above-mentioned optical communication includes light such as a light emitting element and a light receiving element mounted with high accuracy on a lead frame composed of a large number of leads and a carrier that sequentially connects these leads. After the head is formed by sealing the element with transparent resin, it is manufactured by leaving the lead away from the carrier. For optical communication elements manufactured in such a manufacturing process, the head is inserted. The proposal which comprises an optical module with the socket which has a recessed part to make is made | formed (refer patent document 1).

By the way, in optical communication using a plurality of optical modules, it is conceivable to align the optical axes of the plurality of optical modules with a highly accurate head in which the optical element is sealed.
Japanese Patent Application Laid-Open No. 11-224752

  However, since the mounting position of the optical element in the head varies from head to head, there is a problem that even if the head is arranged with high accuracy, the optical axis cannot be aligned and adjustment is required.

  In view of the above circumstances, an object of the present invention is to provide an optical module in which optical axis alignment is simpler than before.

In order to achieve the above object, an optical module of the present invention comprises:
An optical communication element having a head for converting between an electric signal and an optical signal, a metal lead extending from the head and for transmitting an electric signal, and a socket having a recess for fitting the head. ,
The lead is formed partially thick,
The concave portion has a shape into which the lead is fitted.

  The positional relationship between the lead and the optical element sealed in the head is managed with high accuracy, and in the optical module of the present invention, the socket has a recess into which the lead is fitted. When the lead is fitted into the recess, the direction of the optical axis of the optical element with respect to the socket becomes constant. That is, in the optical module of the present invention, the optical axis can be aligned only by arranging the socket with high accuracy. Therefore, according to the optical module of the present invention, the optical axis can be aligned more easily than in the past. .

  Here, it is preferable that the lead is partially formed to have a large width by punching out a part of the carrier that sequentially connects the plurality of leads at the time of manufacture.

  In this way, an increase in cost can be suppressed by using a carrier portion that has been cut off.

  According to the optical module of the present invention, the optical axis can be easily adjusted.

  Hereinafter, embodiments of the present invention will be described.

  FIG. 1 is an external perspective view of an embodiment of the optical module of the present invention.

  FIG. 1A shows a state in which four optical modules 1 of the present embodiment are connected in series, and each of these four optical modules 1 is for R, G, B, and signals. It is used as.

  Here, the configuration of the optical module 1 will be described.

  The optical module 1 includes an optical communication element 11, a socket 12 having a recess 12a into which the optical communication element 11 is inserted, and a condensing cover 10 for condensing light. FIG. An exploded view of the optical module 1 is shown. The optical module 1 is assembled by fitting the optical communication element 11 into the recess 12 a of the socket 12 and then covering the light collecting cover 10.

  FIG. 2 is an external perspective view of the optical module shown in FIG. 1 from the back side.

  In FIG. 2, as will be described in detail later, two metallic leads 111 that extend from the head 112 that is responsible for conversion between the electrical signal and the optical signal of the optical communication element 11 and that are responsible for transmission of the electrical signal. An electrode 121 connected to one of them and an electrode 122 connected to the other are shown.

  The head 112 shown in FIG. 2 is obtained by sealing optical elements such as light emitting elements and light receiving elements, which are mounted on leads with high accuracy, with a transparent resin.

  FIG. 3 is a cross-sectional view of the optical module of the present embodiment.

  FIG. 3 shows a state in which the concave portion 12 a provided in the socket 12 and the square-shaped portion 1111 in the middle of the lead 111 of the optical communication element 11 are fitted.

  FIG. 3 shows a state in which the electrodes 121 and 122 attached to the socket 12 are in contact with the vicinity of the tip of the lead 111 inserted into the recess 12 a of the socket 12.

  FIG. 4 is a diagram showing a part of the manufacturing process of the optical communication element of the optical module of the present embodiment.

  FIG. 4A shows a head 112 formed by sealing a light emitting diode or the like mounted on a lead frame 110 including a carrier portion 1102 and a lead portion 1101 with a transparent resin or the like.

  4B shows two types of optical communication elements 11 manufactured as a result of punching the lead frame 110 shown in FIG. 4A. The optical communication elements shown on the left side of FIG. On the other hand, the optical communication device shown on the right side shows that an auxiliary member 1112 for preventing deformation of the lead 111 is further provided.

  The lead 111 of the optical communication element 11 of the optical module 1 of the present embodiment is punched into the shape shown in FIG. 4B when disconnected from the lead frame 110, and the socket 12 shown in FIG. The concave portion 12 a provided in is fitted to the quadrangular portion 1111 of the lead 111. Furthermore, since the positional relationship between the lead 111 and the optical element sealed in the head is managed with high accuracy, in the optical module 1 of the present embodiment, when the lead 111 is fitted into the recess 12a. The direction of the optical axis of the optical element with respect to the socket 12 is constant. That is, in the optical module 1 of the present embodiment, the optical axis can be aligned only by arranging the socket 12 with high accuracy. Therefore, according to the optical module 1 of the present embodiment, the optical axis alignment is simpler than before. Can be done. Moreover, in this optical module 1, since the square-shaped part 1111 of the lead 111 is formed using the carrier part that has been cut off conventionally, an increase in cost can be suppressed.

  In the embodiment described above, an example in which the carrier is used for the rectangular portion 1111 of the lead 111 has been described. However, this may not have the carrier and may have this shape. The shape is not limited to a quadrangular shape as long as it is partially thick.

It is an external appearance perspective view of one Embodiment of the optical module of this invention. It is an external appearance perspective view from the back side of the optical module shown in FIG. It is sectional drawing of the optical module of this embodiment. It is a figure which shows a part of manufacturing process of the optical communication element of the optical module of this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical module 10 Condensing cover 11 Optical communication element 110 Lead frame 1101 Lead part 1102 Carrier part 111 Lead 1111 part 1112 Auxiliary member 112 Head 12 Socket 12a Recessed part 121, 122 Electrode

Claims (2)

An optical communication element having a head for converting between an electric signal and an optical signal, a metal lead extending from the head and for transmitting an electric signal, and a socket having a recess into which the head is fitted. ,
The lead is partially formed with a large width,
An optical module, wherein the recess has a shape into which the lead is fitted.   2. The light according to claim 1, wherein the lead is partially formed to be thick by punching out a part of the carrier that sequentially connects a plurality of leads at the time of manufacture. module.

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