JP2007180267A5 - - Google Patents

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Publication number
JP2007180267A5
JP2007180267A5 JP2005377025A JP2005377025A JP2007180267A5 JP 2007180267 A5 JP2007180267 A5 JP 2007180267A5 JP 2005377025 A JP2005377025 A JP 2005377025A JP 2005377025 A JP2005377025 A JP 2005377025A JP 2007180267 A5 JP2007180267 A5 JP 2007180267A5
Authority
JP
Japan
Prior art keywords
resistor
metal substrate
wiring
circuit element
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005377025A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007180267A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005377025A priority Critical patent/JP2007180267A/ja
Priority claimed from JP2005377025A external-priority patent/JP2007180267A/ja
Publication of JP2007180267A publication Critical patent/JP2007180267A/ja
Publication of JP2007180267A5 publication Critical patent/JP2007180267A5/ja
Withdrawn legal-status Critical Current

Links

JP2005377025A 2005-12-28 2005-12-28 混成集積回路装置 Withdrawn JP2007180267A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005377025A JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005377025A JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Publications (2)

Publication Number Publication Date
JP2007180267A JP2007180267A (ja) 2007-07-12
JP2007180267A5 true JP2007180267A5 (cg-RX-API-DMAC7.html) 2009-02-19

Family

ID=38305159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005377025A Withdrawn JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Country Status (1)

Country Link
JP (1) JP2007180267A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5445329B2 (ja) * 2010-05-25 2014-03-19 株式会社デンソー 電力半導体装置
JP6315103B2 (ja) * 2014-11-13 2018-04-25 株式会社村田製作所 パワー半導体のパッケージ素子

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