JP2007178339A - Continuity testing method and testing device thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely detect bonding failure, when the bonding failure is present between an electronic component and a wiring substrate, in a continuity test method and a continuity test device, in which the bonding failure between the electronic component and the wiring substrate in a wiring substrate unit is detected, by energizing an electric circuit formed in the wiring substrate unit that has electronic components mounted therein. <P>SOLUTION: In both a state with the wiring substrate unit 10 at rest and a state with the wiring substrate 11 resonated that is to be equipped in the wiring substrate unit 10 and with an arbitrary electronic component 13 made to resonate, the bonding failure is detected by energizing a circuit consisting of the wiring substrate unit 10, detecting outputs from the circuit, and comparing and calculating these electrical signals. At least a plurality of measurements for conduction resistance are carried out, by changing the holding positions of holding members 22, 22, ... for holding the wiring substrate 11 and exciting them and then making the positions of the belly and the node of the wiring substrate unit 10 change. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for detecting a solder joint failure between a wiring board and an electronic component.

  Conventionally, a continuity test (electric characteristic test) has been performed to detect a bonding failure between a wiring board and an electronic component mounted on the wiring board. In the continuity test, for example, a probe pin is brought into contact with a wiring pattern constituting a circuit of a wiring board (hereinafter referred to as a wiring board unit) on which electronic components are mounted by solder bonding, and a circuit is operated by applying a current. In addition, the electrical signal output from the circuit is detected, and the electrical signal is compared with the electrical signal obtained from the non-defective product, thereby evaluating whether the wiring board and the electronic component are appropriately soldered. .

  However, if the wiring board and the electronic component are not properly soldered, but the electronic component and the wiring board are in contact with each other via solder, the conductive part is conductive at the joint between the wiring board and the electronic component. Therefore, it was not possible to detect a bonding failure.

Therefore, by applying vibration to the wiring board unit and causing the wiring board to resonate, instantaneously forcibly forming a non-conductive state at the junction between the wiring board and the electronic component, A continuity test method for detecting a bonding failure has been proposed.
For example, in the inspection apparatus described in Patent Document 1, an inspection jig for fixing a wiring board unit and a vibration device are connected by a connecting rod, and the prober unit including the probe pin and the wiring board unit are similarly vibrated. Thus, the structure is such that the inspection can be performed by applying current to the circuit of the wiring board at the same time while applying vibration to the wiring board unit.
JP-A-8-159953

  In the continuity test described in the above background art, the wiring board is vibrated to generate resonance, and the wiring board is instantaneously warped (or bent), and the non-conductive state is obtained. The continuity test is performed by forcibly forming, but depending on the shape and bonding position of the electronic component, contact between the electronic component and the solder may be maintained when the wiring board is warped even if there is a bonding failure. there were.

  Accordingly, the present invention proposes a continuity test method capable of reliably detecting a bonding failure when a bonding failure exists at the joint between the wiring board and the electronic component, and a continuity test apparatus provided for the same. .

  The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.

  That is, according to a first aspect of the present invention, there is provided a continuity test method for detecting a bonding failure between an electronic component and a wiring board in a wiring board unit in which an electronic component is mounted on the wiring board. In a state where both of the electronic components are resonated, the circuit configured in the wiring board unit is energized to inspect the connection state of the connecting portion between the wiring board and an arbitrary electronic component.

  According to a second aspect of the present invention, in the continuity test method for detecting a bonding failure between the electronic component and the wiring board in the wiring board unit in which the electronic component is mounted on the wiring board, the wiring board unit is stationary, and the wiring In both the state in which the wiring board included in the board unit and an arbitrary electronic component are resonated, the circuit configured in the wiring board unit is energized to conduct the connection portion between the wiring board and the arbitrary electronic component. A junction failure is detected by measuring the resistance and comparing and calculating these conduction resistances.

  In claim 3, by changing the positions of the vibration antinodes and nodes of the wiring board and any electronic component, measuring the conduction resistance at least a plurality of times, and comparing and calculating these conduction resistances, This is to detect a defect.

  According to a fourth aspect of the present invention, there is provided a continuity test apparatus for performing a continuity test for detecting a bonding failure between an electronic component and a wiring board in a wiring board unit in which the electronic component is mounted on the wiring board. A holding member, vibration means for vibrating the holding member at an oscillation frequency at which both of the wiring board provided in the wiring board unit and any electronic component resonate, and a circuit configured in the wiring board unit And an electric signal measuring means for detecting an electric signal output from the circuit and measuring a conduction resistance of a connection portion between the wiring board and an arbitrary electronic component.

  According to a fifth aspect of the present invention, the wiring board unit is configured in both the state where the wiring board unit is stationary and the state where the wiring board included in the wiring board unit and any electronic component are resonated. Further comprising determination means for determining whether the connection is good or bad by measuring the conduction resistance of the connection portion between the wiring board and any electronic component by energizing the circuit to be connected, and comparing and calculating these conduction resistances. It is.

  According to a sixth aspect of the present invention, a displacement measuring means for measuring the displacement of the wiring board or the electronic component, and a wiring board provided in the wiring board unit and an arbitrary electronic component resonate from the measurement result of the displacement displacement measuring means. And resonance confirmation means for determining whether or not it is.

  According to a seventh aspect of the present invention, the holding position of the holding member at the periphery of the wiring board is variable.

  As effects of the present invention, the following effects can be obtained.

  According to the first aspect, since not only the wiring board but also the electronic component is resonated, the distance between the solder and the electronic component can be further increased as compared with the case where only the wiring board is resonated. Therefore, when the wiring board is warped due to the shape and arrangement of the electronic component, it does not separate from the solder, or when the electronic component is incompletely joined with the solder, etc. The possibility of detecting a bonding failure that could not be detected when performing is increased.

According to the second aspect, since not only the wiring board but also the electronic component is resonated, the distance between the solder and the electronic component can be further increased as compared with the case where only the wiring board is resonated. Therefore, when the wiring board is warped due to the shape and arrangement of the electronic parts, the continuity test is performed by resonating only the wiring board, such as when the electronic parts are not joined with the solder, or when the electronic parts are incompletely joined with the solder. The possibility of detecting a bonding failure that could not be detected when performing is increased.
Furthermore, individual differences in wiring board units and accuracy differences in measurement equipment can be eliminated, and the connection state can be inspected more precisely.

  In claim 3, the electronic component arranged in the vicinity of the node in one measurement can be positioned in a location with a large displacement other than in the vicinity of the node in another measurement, and it is possible to detect a bonding failure more reliably. it can.

  According to the fourth aspect, since not only the wiring board but also the electronic component is resonated, the distance between the solder and the electronic component can be further increased as compared with the case where only the wiring board is resonated. Therefore, when the wiring board is warped due to the shape and arrangement of the electronic parts, the continuity test is performed by resonating only the wiring board, such as when the electronic parts are not joined with the solder, or when the electronic parts are incompletely joined with the solder. The possibility of detecting a bonding failure that could not be detected when performing is increased.

  According to the fifth aspect, it is possible to eliminate the individual difference of the wiring board unit and the accuracy difference of the measuring device, and to inspect the connection state more precisely.

  According to the sixth aspect of the present invention, resonance may not occur at a preset frequency due to individual differences between the wiring board and the electronic component. Therefore, the continuity test can be performed after confirming whether resonance has occurred reliably. .

  In claim 7, since the positions of the antinodes and nodes when the wiring board vibrates can be made variable, an electronic component arranged in the vicinity of the node in one measurement is replaced with a component other than the vicinity of the node in another measurement. It can be located at a location where the displacement is large, and a bonding failure can be detected more reliably.

Next, embodiments of the invention will be described.
FIG. 1 is a diagram showing a joint portion between a wiring board and an electronic component in which a solder joint failure has occurred, FIG. 2 is a diagram showing a state of displacement between the solder and the electronic component, and FIG. 3 is an overall configuration of a continuity test apparatus. FIG. 4 is a side view showing the configuration of the continuity test apparatus, FIG. 5 is a diagram showing the relationship between the movement of the holding member and the vibration of the wiring board, and FIG. 6 is a flowchart of processing by the arithmetic control unit in the continuity test. .

As shown in FIG. 1, the present invention is a continuity test method for detecting a joint failure between a wiring board 11 and an electronic component 13 joined to the wiring board 11 with a solder 12, and a continuity test for use therein. The apparatus 20 is concerned.
In the continuity test, a current is applied to a circuit configured on the wiring board 11 (hereinafter referred to as the wiring board unit 10) on which the electronic component 13 is mounted, and an electrical signal output from the circuit is detected. By evaluating the electric signal, it is evaluated whether the wiring board and the electronic component are appropriately soldered.
For example, an electrical signal representing a resistance value is used as the electrical signal to be evaluated.

As shown in FIG. 1 a, the electronic component 13 is not properly bonded to the wiring board 11, but when the electronic component 13 and the wiring board 11 are in contact via the solder 12, Conductivity is ensured at the joint with the electronic component 13.
In order to detect such a bonding failure as described above, in the continuity test method according to the present invention, the circuit board unit 10 is vibrated to resonate both the circuit board 11 and the electronic component 13, and the electrical circuit conductivity. Inspect.
By being vibrated, the wiring board 11 and the electronic component 13 having poor bonding behave independently of each other, and the solder 12 and the electronic component 13 are separated as shown in FIGS. There is a moment when it disappears. In the continuity test, a bonding failure between the wiring board 11 and the electronic component 13 is detected by detecting this phenomenon.

  In FIG. 2, when the wiring board 11 and the electronic component 13 are resonated, the displacement between the solder-side point 12A where the solder 12 and the electronic component 13 are in contact with the point 13A on the same electronic component side is shown. Show.

From the chart of FIG. 2, it can be seen that the point 12A and the point 13A are separated while the wiring board 11 and the electronic component 13 vibrate. Similarly, from the chart of FIG. 2, if not only the wiring substrate 11 but also the electronic component 13 is resonated, the distance between the solder 12 and the electronic component 13 is further increased as compared with the case where only the wiring substrate 11 is resonated. I understand that.
Therefore, only when the wiring board 11 is warped due to the shape or arrangement of the electronic component 13 and the wiring board 11 is not separated from the solder 12 or when the electronic component 13 is incompletely joined with the solder 12, The possibility of detecting a bonding failure that could not be detected when conducting a continuity test by resonating by resonating both the wiring board 11 and the electronic component 13 increases.

Here, the configuration of the continuity test apparatus 20 will be described.
As shown in FIGS. 3 and 4, the continuity test apparatus 20 generally applies a current to the vibration unit 7 that holds and vibrates the wiring board unit 10 and the electric circuit formed on the wiring board unit 10. And measuring unit 8 that measures the resistance value, and calculation control unit 9 that controls the operations of the excitation unit 7 and the measurement unit 8 and performs calculations based on the measurement results of the measurement unit 8. The

The vibration unit 7 includes a plurality of holding members 22, 22... That hold the peripheral portion of the wiring board 11 in the wiring board unit 10, a vibrator 23 that vibrates the holding member 22, and the vibrator And an oscillator 24 for adjusting the vibration.
The vibrator 23 and the oscillator 24 function as a vibration unit that vibrates the wiring board unit 10 via the holding member 22.

In the oscillator 24, it is possible to independently adjust the ON / OFF of the oscillation of each vibrator 23. As a result, all the holding members 22, 22... It is possible to vibrate the holding members 22.
The holding member 22 that vibrates as described above not only holds the wiring board 11 but also has a function of giving vibration to the wiring board 11.

In the oscillator 24, the oscillation frequency and amplitude of each vibrator 23 can be adjusted. The oscillation frequency is adjusted so that the frequency can resonate both the wiring board 11 and the arbitrary electronic component 13.
The wiring board 11 and the arbitrary electronic component 13 usually have different fundamental frequencies with respect to the natural frequency, but may overlap in some double vibrations, and the wiring board 11 and the arbitrary electronic component 13 may have a frequency corresponding to the double vibration. If both are vibrated, resonance occurs in both.

A plurality of electronic components 13 are mounted on one wiring board 11, and the natural frequency differs for each electronic component 13.
Therefore, the oscillator 24 can perform control to change the oscillation frequency of the vibrator 23 so that all the electronic components 13 mounted on the wiring board 11 and the wiring board 11 resonate in order.
Further, in the oscillator 24, it is possible to perform control to change the oscillation frequency of the vibrator 23 so that several electronic components that are likely to cause poor bonding empirically and the wiring board 11 resonate in order. .
Furthermore, the oscillator 24 can determine the oscillation frequency at which the vibrator 23 oscillates so that the specific electronic component that is to detect the bonding failure and the wiring board 11 resonate in order.

  The holding members 22, 22... Are supported by movable support means such as a linear slide so as to be movable in the front-rear and left-right directions, and can move relative to the wiring board 11. That is, the position held by the holding member 22 can be changed at the peripheral edge of the wiring board 11. In this embodiment, the holding members 22, 22... Are arranged on each side of the substantially rectangular wiring board 11 so that the wiring board 11 is not twisted by vibration. .

As described above, since the positions of the holding members 22, 22... Are variable, as shown in FIG. 5, the positions of the vibration antinodes and nodes of the wiring board 11 that vibrates can be freely changed.
As a result, for example, as shown in FIG. 5b, the electronic component 13 bonded at a position corresponding to the vicinity of the vibration node is separated from the solder 12 when the wiring board 11 warps even if there is a bonding failure. However, as shown in FIG. 5c, the position of the vibration node and the antinode is appropriately changed so that when the wiring board 11 is warped, the electronic component 13 with poor bonding is positioned away from the solder 12. can do.
As described above, since the positions of the holding members 22, 22... Are variable and the positions of the vibration antinodes and nodes of the wiring board 11 are variable, the vibration antinodes are moved by moving the positions of the vibration antinodes and nodes. If the position of the node is stationary, the possibility of detecting a bonding failure that could not be detected increases.

The measuring unit 8 includes a probe unit 25 including an inspection probe 25 a, a measuring instrument 26, and a displacement measuring unit 27.
An electrical signal measuring means for energizing a circuit configured in the wiring board unit with the probe unit 25 and the measuring instrument 26, detecting an electrical signal output from the circuit, and measuring an electrical signal such as a conduction resistance. Function as.

The inspection probe 25 a is in contact with a wiring pattern constituting a circuit of the wiring board unit 10 and electrically connects the circuit constituted in the wiring board unit 10 and the measuring instrument 26.
In the present embodiment, the wiring board 11 is provided with a connector 14 serving as an input / output part of an electric signal to a circuit configured in the wiring board unit 10, and an inspection probe 25 a is connected to the connector 14. .

  In the above embodiment, the connector 14 on the wiring board 11 and the inspection probe 25a are electrically connected. However, the inspection probe 25 is directly brought into contact with the wiring pattern on the wiring board 11 to be electrically connected. You can also

  The probe unit 25 provided with the inspection probe 25 a is fixed to one or a plurality of holding members 22, 22. As a result, the inspection probe 25a is vibrated in the same manner as the wiring board 11, and the inspection probe 25a and the wiring board 11 vibrate integrally, so that the relative displacement between the inspection probe 25a and the connector 14 becomes substantially constant. Generation of noise due to vibration of the probe 25a and the like is suppressed, which can contribute to improvement in measurement stability.

The measuring device 26 controls the value of the current flowing through the inspection probe 25a, or measures the resistance value of the circuit configured in the wiring board unit 10 based on the electrical signal detected through the inspection probe 25. is there.
In addition, the probe unit 25 and the measuring device 26 are not limited to the form of a present Example, The measuring device etc. which are generally used for a conductivity test are employable. For example, the measuring instrument 26 can be configured to measure the electrical conductivity, or the test probe 25a can be configured to pass a constant voltage and detect the current value.

  The displacement measuring means 27 is for detecting the displacement of the wiring board 11 and / or the electronic component 13, and in this embodiment, a camera device and an image processing device are employed. However, the displacement measuring means 27 may employ a non-contact displacement meter such as a laser displacement meter or an ultrasonic displacement meter, or various displacement meters such as a contact displacement meter.

  The arithmetic control section 9 adjusts the vibrator 23 to be operated, the excitation control means 41 for controlling the oscillator 24 to adjust the oscillation frequency of the vibrator 23, and the current value supplied from the inspection probe 25a. Therefore, the measuring instrument control means 42 for controlling the measuring instrument 26, the determination means 43 for determining the presence or absence of a bonding failure based on the resistance value measured by the measuring instrument 26, and the measurement result of the displacement measuring means 27 Resonance confirmation means 44 for confirming the resonance state based on the above.

  In this embodiment, the vibration control means 41, measuring instrument control means 42, determination means 43, and resonance confirmation means 44 are provided on a general-purpose computer 30 having a monitor 31 as display output means, a keyboard 32 as input means, and the like. Is functioning. However, any one or a plurality of the vibration control means 41, the measuring instrument control means 42, the determination means 43, and the resonance confirmation means 44 can be configured by an independent computer.

  Next, the flow of the continuity test using the continuity test apparatus 20 having the above configuration will be described with reference to the flowchart shown in FIG.

As a pretreatment for the continuity test, the end of the wiring board 11 is held by the holding members 22, 22.
First, the resistance value of a predetermined portion of a circuit formed by the wiring board 11 and the electronic component 13 is measured in a stationary state (S1).
The measuring instrument control means 42 of the arithmetic control unit 9 causes the inspection probe 25a to pass a predetermined current through a circuit configured in the wiring board unit 10 and to detect an electrical signal output from the circuit. The measuring instrument 26 is operated so that the measuring instrument 26 receives the resistance value.
The measured resistance value is transmitted from the measuring instrument 26 to the arithmetic control unit 9 and acquired as a stationary resistance value (S2).

Subsequently, the wiring board unit 10 is vibrated (S3).
The vibration control means 41 of the arithmetic control unit 9 operates the oscillator 24 so that the predetermined vibrator 23 is vibrated at a predetermined oscillation frequency.

Then, after the vibration of the wiring board unit 10 is stabilized, it is determined whether the vibration state of the wiring board unit 10 is good (S4).
The resonance frequency at which the wiring board 11 and the arbitrary electronic component 13 resonate is measured in advance and set as the oscillation frequency of the vibrator 23. The holding position of the holding members 22, 22. Due to the individual difference, a difference occurs in the resonance frequency. Therefore, there is a case where the resonance does not occur at the set oscillation frequency. Therefore, it is confirmed whether the resonance has occurred reliably.

  The resonance confirmation unit 44 of the arithmetic control unit 9 acquires the measurement result of the displacement measurement unit 27 and compares the displacement of the wiring board 11 and the electronic component 13 with a preset reference value to determine the presence or absence of resonance. Then, it is determined whether the vibration state of the wiring board 11 and the electronic component 13 is good. That is, if the wiring board 11 and the electronic component 13 are resonating, it is determined that the vibration state is good, and if not, it is determined that the vibration state is bad.

If the vibration state of the wiring board 11 is not good, the vibration control means is used to finely adjust the oscillation frequency of the vibrator 23 by a predetermined adjustment width by the oscillator 24 in order to resonate the wiring board 11 and the electronic component 13. 41 is operated (S21).
In addition to adjusting the oscillation frequency of the vibrator 23 by the oscillator 24 to resonate the wiring board 11 and the electronic component 13, the position of the holding members 22, 22. The position of the abdomen and the node can be moved and adjusted so that the displacement of the location where the bonding failure is to be detected becomes larger.

Then, the oscillation frequency of the vibrator 23 is finely adjusted, and after the vibration of the wiring board 11 is stabilized, it is determined again whether the vibration state of the wiring board 11 is good (S4).
Each processing step of determination of vibration state (S4) → adjustment of frequency fraction (S21) → determination of vibration state (S4) is repeated until it is determined that the vibration state of the wiring board 11 is good.

If the vibration state of the wiring substrate 11 is good, the resistance value of a predetermined portion (the same portion as that measured in a stationary state) of the circuit formed by the wiring substrate 11 and the electronic component in the vibration state is measured (S5). ).
The measuring instrument control means 42 of the arithmetic control unit 9 causes the inspection probe 25a to pass a predetermined current through a circuit formed by the wiring board 11 and the electronic component 13 and detect an electric signal output from the circuit. In response to the detection signal, the measuring instrument 26 is operated so that the resistance value is measured.
The measured resistance value is transmitted from the measuring instrument 26 to the arithmetic control unit 9, and is acquired as a resistance value during vibration (S6).

When the measurement is finished, the vibration of the wiring board 11 is stopped.
The vibration control means 41 of the arithmetic control unit 9 operates the oscillator 24 so as to stop the oscillation of the vibrator 23. However, it is also possible to shift to the process shown below with the vibration of the wiring board 11 being continued.

  The determination means 43 of the calculation control unit 9 compares the resistance value at rest and the resistance value at vibration (S7) and calculates whether these differences are within a predetermined allowable range. (S8) If it is within the allowable range, a good determination is made (S9), and if it is not within the allowable range, a failure is determined (S10), and the continuity test is terminated.

  In the above-described continuity test, the resistance value is measured for the same test object in both a stationary state and a vibration state. Therefore, the individual difference of the wiring board unit 10 and the accuracy difference of the measuring device can be eliminated, and the bonding failure can be detected more precisely.

In the above-described continuity test, it is more desirable to measure the resistance value by changing the oscillation frequency of the vibrator 23 in order to reliably detect a bonding failure.
By measuring the resistance value by changing the oscillation frequency of the vibrator 23, the electronic component 13 that is resonating among the electronic components 13 mounted on the wiring board 11 can be identified. It is possible to pursue whether or not a bonding failure has occurred. Furthermore, since the proportion of the electronic components 13 that can resonate can be increased, it is possible to more reliably detect a bonding failure.

Further, in the above-described continuity test, changing the holding position of the wiring board 11 by the holding members 22, 22... And measuring the resistance value a plurality of times can reliably detect a bonding failure. More desirable.
By changing the holding position of the wiring board 11 by the holding members 22, 22... And measuring the resistance value, the positions of the vibration antinodes and nodes of the wiring board 11 change. In other measurements, the electronic component placed in the position can be positioned at a location with a large displacement other than the vicinity of the node, and a bonding failure can be detected more reliably.
For example, in the first measurement, the electronic component 13 arranged near the node is arranged at a position near the belly where the displacement is large in the second measurement performed by changing the position of the holding members 22. In this case, it is possible to detect a bonding failure that cannot be detected in the first measurement in the second measurement.

The figure which shows the junction part of the wiring board and electronic component in which the solder joint defect has generate | occur | produced. The figure which shows the mode of a displacement with solder and an electronic component. The figure which shows the whole structure of a continuity test apparatus. The side view which shows the structure of a continuity test apparatus. The figure which shows the relationship between the movement of a holding member and the vibration of a wiring board. The flowchart of the process by the calculation control part in a continuity test.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Wiring board 12 Solder 13 Electronic component 14 Connector 20 Continuity test apparatus 22 Holding member 23 Vibrator 24 Oscillator 25 Probe unit 25a Inspection probe 26 Measuring instrument 27 Displacement measuring means 41 Excitation control means 42 Measuring instrument control means 43 Determination means 44 Resonance Confirmation means

Claims (7)

In a continuity test method for detecting a bonding failure between an electronic component and a wiring board in a wiring board unit formed by mounting electronic components on the wiring board,
In a state where both the wiring board provided in the wiring board unit and an arbitrary electronic component are resonated, the circuit configured in the wiring board unit is energized to connect the connection portion between the wiring board and the arbitrary electronic component. A continuity test method characterized by inspecting a state. In a continuity test method for detecting a bonding failure between an electronic component and a wiring board in a wiring board unit formed by mounting electronic components on the wiring board,
In both the state where the wiring board unit is stationary and the state where the wiring board included in the wiring board unit and any electronic component are resonated, the circuit configured in the wiring board unit is energized. Measure the conduction resistance of the connection part between the wiring board and any electronic component,
A continuity test method characterized in that a bonding failure is detected by comparing and calculating these conduction resistances. Detecting a bonding failure by changing the position of vibration antinodes and nodes of the wiring board and any electronic component, measuring the conduction resistance at least several times, and comparing these conduction resistances. Features
The continuity test method according to claim 1 or 2. In a continuity test apparatus for performing a continuity test for detecting a bonding failure between an electronic component and a wiring board in a wiring board unit formed by mounting electronic components on a wiring board,
A holding member for holding a peripheral edge of the wiring board;
Vibration means for vibrating the holding member at an oscillation frequency at which both the wiring board and any electronic component provided in the wiring board unit resonate;
An electric signal measuring means for energizing a circuit configured in the wiring board unit, detecting an electric signal output from the circuit, and measuring a conduction resistance of a connection portion between the wiring board and an arbitrary electronic component; A continuity test apparatus characterized by the above. In both the state where the wiring board unit is stationary and the state where the wiring board included in the wiring board unit is resonated with an arbitrary electronic component, the circuit configured in the wiring board unit is energized. Measuring means for the conduction resistance of the connection part between the wiring board and any electronic component, and by comparing these conduction resistances, a determination means for judging whether the bonding is good or bad,
Further comprising:
The continuity test apparatus according to claim 4. Displacement measuring means for measuring the displacement of the wiring board or electronic component;
From the measurement result of the displacement displacement measuring means, resonance confirmation means for determining whether the wiring board provided in the wiring board unit and any electronic component are resonating,
Further comprising:
The continuity test apparatus according to claim 4 or 5. The holding position of the holding member at the periphery of the wiring board is variable.
The continuity test apparatus according to any one of claims 4 to 6.

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