JP2007173635A - Lighting apparatus - Google Patents

Lighting apparatus Download PDF

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Publication number
JP2007173635A
JP2007173635A JP2005371050A JP2005371050A JP2007173635A JP 2007173635 A JP2007173635 A JP 2007173635A JP 2005371050 A JP2005371050 A JP 2005371050A JP 2005371050 A JP2005371050 A JP 2005371050A JP 2007173635 A JP2007173635 A JP 2007173635A
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JP
Japan
Prior art keywords
light
sealing material
emitting diode
emitting diodes
light emitting
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Pending
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JP2005371050A
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Japanese (ja)
Inventor
Hiroyuki Sekii
広行 関井
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2005371050A priority Critical patent/JP2007173635A/en
Publication of JP2007173635A publication Critical patent/JP2007173635A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting apparatus improving a light-extraction efficiency. <P>SOLUTION: The lighting apparatus has a plurality of light-emitting diodes 1, a printed-wiring board 2 with the mounted light-emitting diodes 1, and a sealing material 3 composed of a material having a light-transparency for sealing the light-emitting diodes 1. A plurality of fins 31 are projected at places where direct lights from the light-emitting diodes 1 are not incident at an angle lower than a critical angle, if the surface of the sealing material 3 is formed in a plane, respectively on the surface of the sealing material 3. If the fins 31 are not formed, part of the direct lights from the light-emitting diodes 1 in the direction of a total reflection is incident at an angle of incidence lower than the critical angle on a surface in the direction crossing the projecting direction of the fins 31. Accordingly, the light-extraction efficiency is improved because an incompletely totally reflected light is increased on the surface of the sealing material 3 in the direct lights from the light-emitting diodes 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、透光性を有する封止材で発光ダイオードを封止した照明装置に関するものである。   The present invention relates to a lighting device in which a light emitting diode is sealed with a light-transmitting sealing material.

従来から、発光ダイオードを光源として用いた照明装置が提供されている（例えば、特許文献１参照）。   Conventionally, an illumination device using a light emitting diode as a light source has been provided (see, for example, Patent Document 1).

この種の照明装置として、発光ダイオードをプリント配線板に実装するとともに、発光ダイオードを透光性を有する封止材で封止ししたものがある。
特開２００１−３６１５３号公報 As this type of lighting device, there is one in which a light emitting diode is mounted on a printed wiring board and the light emitting diode is sealed with a light-transmitting sealing material.
JP 2001-36153 A

しかし、封止材が外気と接する表面において、発光ダイオードの光が臨界角以上の角度で入射すると、発光ダイオードの光は封止材の内側へ全反射し、プリント配線板や封止材に吸収されたり封止材内で減衰したりしてしまう。このため、光取り出し効率が低下していた。   However, if the light from the light emitting diode is incident on the surface where the sealing material is in contact with the outside air at an angle greater than the critical angle, the light from the light emitting diode is totally reflected inside the sealing material and absorbed by the printed wiring board and the sealing material. Or attenuated in the encapsulant. For this reason, the light extraction efficiency has been reduced.

本発明は上記事由に鑑みて為されたものであり、その目的は、光取り出し効率が向上した照明装置を提供することにある。   The present invention has been made in view of the above-described reasons, and an object thereof is to provide an illumination device with improved light extraction efficiency.

本発明は、発光ダイオードと、発光ダイオードが実装されたプリント配線板と、透光性を有する材料からなり発光ダイオードを封止する封止材とを備え、封止材の表面において、仮に凹凸を設けなかった場合に発光ダイオードの直射光が臨界角以下の角度で入射しない位置のみに凹凸を設けたことを特徴とする。   The present invention includes a light emitting diode, a printed wiring board on which the light emitting diode is mounted, and a sealing material that is made of a light-transmitting material and seals the light emitting diode. When not provided, unevenness is provided only at a position where the direct light of the light emitting diode does not enter at an angle less than the critical angle.

本発明によれば、封止材に凹凸を設けない場合には封止材の表面で全反射される向きの発光ダイオードの直射光の少なくとも一部は、凹凸の表面に対して臨界角以下の入射角で入射する。従って、発光ダイオードの直射光のうち封止材の表面で全反射されない光が増加することにより、光取り出し効率が向上する。また、凹凸によって封止材の表面積が増加するから、放熱性が向上する。さらに、凹凸を設ける位置を、仮に凹凸を設けなかった場合に発光ダイオードの直射光が臨界角以下の角度で入射しない位置のみとしたことにより、封止材の表面全体に凹凸を設ける場合に比べて見栄えが良い。   According to the present invention, when the encapsulant is not provided with irregularities, at least a part of the direct light of the light emitting diode in the direction that is totally reflected on the surface of the encapsulant is less than the critical angle with respect to the irregular surface. Incident at an incident angle. Accordingly, light that is not totally reflected on the surface of the sealing material in the direct light of the light emitting diode is increased, thereby improving light extraction efficiency. Moreover, since the surface area of the sealing material increases due to the unevenness, heat dissipation is improved. Furthermore, the position where the unevenness is provided is only the position where the direct light of the light emitting diode does not enter at an angle less than the critical angle when the unevenness is not provided, so that the unevenness is provided on the entire surface of the sealing material. Good looking.

以下、本発明を実施するための最良の形態について、図面を参照しながら説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

本実施形態は、図１に示すように、複数個（図では２個）の発光ダイオード１と、発光ダイオード１が実装されたプリント配線板２と、透光性を有する材料からなり発光ダイオード１を封止する封止材３とを備える。発光ダイオード１は、発光部をプリント配線板２の反対側（図１の上側）へ向けてプリント配線板２に表面実装されており、発光ダイオード１の光は封止材３を通じて出射される。封止材３の材料としては、例えばアクリル樹脂やシリコーン樹脂などの透明な合成樹脂を用いることができる。   In the present embodiment, as shown in FIG. 1, a plurality (two in the figure) of light emitting diodes 1, a printed wiring board 2 on which the light emitting diodes 1 are mounted, and a light emitting diode 1 made of a light-transmitting material. And a sealing material 3 for sealing. The light emitting diode 1 is surface-mounted on the printed wiring board 2 with the light emitting portion facing the opposite side of the printed wiring board 2 (upper side in FIG. 1), and light from the light emitting diode 1 is emitted through the sealing material 3. As a material of the sealing material 3, for example, a transparent synthetic resin such as an acrylic resin or a silicone resin can be used.

また、封止材３の表面のうち、発光ダイオード１の光が主に出射する図１の上面において、仮に平面とした場合にどの発光ダイオード１の直射光も臨界角以下の角度で入射しない位置には、それぞれ複数個のフィン３１を図１の上方へ突設している。ここで、「直射光」とは、発光ダイオード１から出射した後に反射を経ずに図１に矢印で示すように直接表面に到達した光を指す。フィン３１の形状は、例えば図１の上方から見て最も近い発光ダイオード１を中心とする円環形状又は円弧形状とする。   In addition, on the upper surface of FIG. 1 where the light of the light emitting diode 1 mainly emits on the surface of the sealing material 3, a position where no direct light of the light emitting diode 1 is incident at an angle equal to or less than the critical angle if it is a flat surface. In FIG. 1, a plurality of fins 31 are provided so as to project upward in FIG. Here, “direct light” refers to light that has been emitted from the light emitting diode 1 and has directly reached the surface as indicated by an arrow in FIG. 1 without being reflected. The shape of the fin 31 is, for example, an annular shape or a circular arc shape with the light emitting diode 1 closest to the top as viewed from above in FIG.

上記構成によれば、フィン３１を設けない場合には全反射される向きの発光ダイオード１の直射光の一部は、フィン３１の突出方向に交差する向きの面（図１における左右の面）に対して臨界角以下の入射角で入射する。従って、発光ダイオード１の直射光のうち封止材３の表面で全反射されない光が増加することにより、光取り出し効率が向上する。   According to the above configuration, when the fin 31 is not provided, a part of the direct light of the light-emitting diode 1 in the direction of total reflection is a surface in the direction intersecting the protruding direction of the fin 31 (left and right surfaces in FIG. 1). The incident angle is less than the critical angle. Therefore, light that is not totally reflected on the surface of the sealing material 3 in the direct light of the light emitting diode 1 is increased, so that the light extraction efficiency is improved.

また、発光ダイオード１の直射光が臨界角以下の入射角で入射しない位置は、封止材３の外周部となることが多いから、上記の位置にフィン３１を設けることは放熱性の観点からも有効である。   Moreover, since the position where the direct light of the light emitting diode 1 does not enter at an incident angle less than the critical angle is often the outer peripheral portion of the sealing material 3, providing the fin 31 at the above position is from the viewpoint of heat dissipation. Is also effective.

さらに、フィン３１を設けなくとも発光ダイオード１の直射光が臨界角以下の入射角で入射するような位置にはフィン３１を設けていないことにより、封止材３の表面全体にフィン３１を設ける場合に比べて見栄えが良い。   Further, the fins 31 are provided on the entire surface of the sealing material 3 by not providing the fins 31 at positions where the direct light of the light emitting diode 1 is incident at an incident angle less than the critical angle without providing the fins 31. It looks better than the case.

なお、フィン３１を設ける代わりに、例えばブラスト加工によって、より微細な凹凸を設けた場合、放熱性が低下する代わりに光取り出し効率をより向上することができる。   Note that when finer irregularities are provided by, for example, blasting instead of providing the fins 31, the light extraction efficiency can be further improved instead of reducing the heat dissipation.

本発明の実施形態を示す断面図である。It is sectional drawing which shows embodiment of this invention.

符号の説明Explanation of symbols

１ 発光ダイオード
２ プリント配線板
３ 封止材
３１ フィン DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 Printed wiring board 3 Sealing material 31 Fin

Claims (1)

発光ダイオードと、発光ダイオードが実装されたプリント配線板と、透光性を有する材料からなり発光ダイオードを封止する封止材とを備え、封止材の表面において、仮に凹凸を設けなかった場合に発光ダイオードの直射光が臨界角以下の角度で入射しない位置のみに凹凸を設けたことを特徴とする照明装置。   When a light-emitting diode, a printed wiring board on which the light-emitting diode is mounted, and a sealing material that is made of a light-transmitting material and seals the light-emitting diode are provided. An illuminating device, wherein unevenness is provided only at a position where the direct light of the light emitting diode is not incident at an angle less than a critical angle.
JP2005371050A 2005-12-22 2005-12-22 Lighting apparatus Pending JP2007173635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005371050A JP2007173635A (en) 2005-12-22 2005-12-22 Lighting apparatus

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Application Number Priority Date Filing Date Title
JP2005371050A JP2007173635A (en) 2005-12-22 2005-12-22 Lighting apparatus

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Application Number Title Priority Date Filing Date
JP2005371050A Pending JP2007173635A (en) 2005-12-22 2005-12-22 Lighting apparatus

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016162932A (en) * 2015-03-03 2016-09-05 シチズン電子株式会社 Led light source device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204840A (en) * 1998-01-16 1999-07-30 Nichia Chem Ind Ltd Light emitting device
JP2003209293A (en) * 2002-01-17 2003-07-25 Stanley Electric Co Ltd Light emitting diode

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204840A (en) * 1998-01-16 1999-07-30 Nichia Chem Ind Ltd Light emitting device
JP2003209293A (en) * 2002-01-17 2003-07-25 Stanley Electric Co Ltd Light emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016162932A (en) * 2015-03-03 2016-09-05 シチズン電子株式会社 Led light source device

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