JP2007180288A - Light emitting device and illuminator - Google Patents

Light emitting device and illuminator Download PDF

Info

Publication number
JP2007180288A
JP2007180288A JP2005377386A JP2005377386A JP2007180288A JP 2007180288 A JP2007180288 A JP 2007180288A JP 2005377386 A JP2005377386 A JP 2005377386A JP 2005377386 A JP2005377386 A JP 2005377386A JP 2007180288 A JP2007180288 A JP 2007180288A
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting diode
diode chip
phosphor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005377386A
Other languages
Japanese (ja)
Inventor
Masahiro Toda
雅宏 戸田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP2005377386A priority Critical patent/JP2007180288A/en
Publication of JP2007180288A publication Critical patent/JP2007180288A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device ensuring stabilized luminescent color, and to provide an illuminator. <P>SOLUTION: The light emitting device comprises a substrate 11, a light emitting diode chip 12 arranged on the substrate, a phosphor layer 13 provided oppositely to the light emitting diode chip and containing phosphor which emits different light by the light from the light emitting diode chip, a lens body 15 passing the light radiated from the light emitting diode chip and the phosphor layer, and a light diffusion means 16 provided between the lens body and the phosphor layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光ダイオードを発光源とした発光装置及び照明装置に関する。   The present invention relates to a light emitting device and a lighting device using a light emitting diode as a light source.

近年、フィラメント電球や蛍光ランプなどに代わって、寿命が長く、また消費電力の少ない発光ダイオードを発光源とした発光装置が、各種照明装置の光源として採用されるようになってきている。   In recent years, light-emitting devices that use light-emitting diodes that have a long lifetime and low power consumption as light sources instead of filament bulbs and fluorescent lamps have been adopted as light sources for various lighting devices.

これら発光ダイオードを発光源とした発光装置により、白色の光源を得るために次の方式がとられている。   In order to obtain a white light source by a light emitting device using these light emitting diodes as a light source, the following method is adopted.

青色発光ダイオードと、その補色である黄色蛍光体を組み合わせて白色光を得る方式。   A system that obtains white light by combining a blue light-emitting diode and its complementary yellow phosphor.

光の3原色である、赤色発光ダイオード、緑色発光ダイオード及び青色発光ダイオードを組み合わせて白色光を得る方式。   A system that obtains white light by combining red, green, and blue light emitting diodes, which are the three primary colors of light.

さらに、紫または紫外発光ダイオードに赤・緑・青の蛍光体を組み合わせて白色光を得る方式。   In addition, a system that obtains white light by combining red, green, and blue phosphors with purple or ultraviolet light emitting diodes.

これらの方式で白色光を得る発光装置には、例えば、特許文献1に示すように、発光ダイオードの光を所望の方向に集束させるためにレンズを設けて構成している。
特開平11−163412号公報
In a light emitting device that obtains white light by these methods, for example, as shown in Patent Document 1, a lens is provided to focus light from a light emitting diode in a desired direction.
Japanese Patent Laid-Open No. 11-163212

白色の光源を得るための方法として、上記のような方式がとられているが、例えば、青色発光ダイオードとその補色である黄色蛍光体を組み合わせて白色光を得る方式においては、一般的に図7(a)に示すように、基体50の円形をなす凹部50aの中央部に青色発光ダイオードチップ51を配設し、チップの上面に対向して黄色蛍光体層52を設けて構成し、白色の光を1枚のレンズ53を通して放射するように構成している。   As a method for obtaining a white light source, the above-described method is adopted. For example, in a method of obtaining white light by combining a blue light emitting diode and a yellow phosphor that is a complementary color thereof, a general diagram is used. 7 (a), a blue light-emitting diode chip 51 is disposed at the center of the circular recess 50a of the base body 50, and a yellow phosphor layer 52 is provided opposite to the top surface of the chip. Is emitted through a single lens 53.

しかしながら、レンズを用いて光を取り出すと、照射面54に一部青色が存在して、完全な白色とならない問題が生じる。   However, when light is extracted using a lens, there is a problem that a part of blue is present on the irradiation surface 54 and the light is not completely white.

特に、上記に構成した青色発光ダイオードチップ51、黄色蛍光体層52及び1枚のレンズ53からなる発光装置によって、下方から照明すると、図7(d)に示すように、白色領域Wの上方に一部青色の領域Bが存在し、照射面に色むらが生じた照明となってしまう。   In particular, when illuminated from below by the light emitting device composed of the blue light emitting diode chip 51, the yellow phosphor layer 52 and the single lens 53 configured as described above, as shown in FIG. A part of the blue region B exists, and the illumination surface is unevenly colored.

これは、図7(b)に照射面54の投影図Xで示すように、基体の光源部分の構成、すなわち、黄色蛍光体層52の中心部に青色の発光ダイオードチップ51を設けた像形が、レンズ53を通して略そのままの形で照射面54に投影され、一部に青色が存在することが起因していることが分かった。   This is because the configuration of the light source portion of the substrate, that is, the image shape in which the blue light emitting diode chip 51 is provided at the center of the yellow phosphor layer 52, as shown in the projection view X of the irradiation surface 54 in FIG. However, it was found that the light is projected onto the irradiation surface 54 through the lens 53 as it is, and that blue is partially present.

特に、この現象は、図7(c)に基体50の平面視の図で示すように、青色発光ダイオードチップ51による青色領域のサイズと黄色蛍光体層52による黄色領域のサイズが異なる場合、換言すれば、青色発光ダイオードチップの発光面積Bと黄色蛍光体層による発光面積Yが異なる場合に、1枚のレンズまたは全反射形のレンズを使用すると色が分離し、より顕著に現れて色むらが生じ照射面が白色とならないことが判明した。   In particular, this phenomenon occurs when the size of the blue region by the blue light emitting diode chip 51 and the size of the yellow region by the yellow phosphor layer 52 are different as shown in the plan view of the substrate 50 in FIG. In this case, when the light emitting area B of the blue light emitting diode chip is different from the light emitting area Y of the yellow phosphor layer, if one lens or a total reflection type lens is used, the colors are separated and appear more noticeably and the color unevenness. It was found that the irradiated surface did not become white.

特許文献1などに示されるレンズは、専ら配光特性や光の取り出し効率を改良したもので、色むらを改善することには至っていない。   The lens disclosed in Japanese Patent Application Laid-Open No. H10-133707 has improved light distribution characteristics and light extraction efficiency, and has not improved color unevenness.

このため、この種発光ダイオードを発光源とした発光装置においては、色むらを生じない安定した白色光を如何に得るかが重要な課題となっている。   For this reason, in a light-emitting device using such a light-emitting diode as a light-emitting source, how to obtain stable white light that does not cause color unevenness is an important issue.

これは、白色を得るための他の方式、すなわち、赤色発光ダイオード、緑色発光ダイオード及び青色発光ダイオードを組み合わせて白色光を得る方式でも、さらに紫または紫外発光ダイオードに赤・緑・青の蛍光体を組み合わせて白色光を得る方式でも、程度の差こそあれ、同様の問題が生じており、さらには、白色に限らず、所望の補色関係にない可視光を得る場合にも同様の問題が生じる。   This is another method for obtaining white color, that is, a method of obtaining white light by combining a red light emitting diode, a green light emitting diode and a blue light emitting diode, and further, red, green and blue phosphors in a purple or ultraviolet light emitting diode. Even in the method of obtaining white light by combining the same, there are similar problems to some extent, and the same problem also occurs when obtaining visible light not limited to white but having a desired complementary color relationship. .

本発明は、上記の問題、課題に鑑みてなされたもので、安定した発光色が得られる発光装置及び照明装置を提供しようとするものである。   The present invention has been made in view of the above problems and problems, and an object of the present invention is to provide a light emitting device and a lighting device that can obtain a stable emission color.

本発明における第1の態様の発光装置は、基体と;基体に配設された発光ダイオードチップと;発光ダイオードチップに対向して設けられ、発光ダイオードチップの光により異なる光を発光する蛍光体を含んでなる蛍光体層と;発光ダイオードチップ及び蛍光体層から放射される光を通過させるレンズ体と;レンズ体と蛍光体層との間に設けられた光拡散手段と;を具備することを特徴とする。   The light-emitting device according to the first aspect of the present invention includes a base; a light-emitting diode chip disposed on the base; and a phosphor that is provided facing the light-emitting diode chip and emits different light depending on the light of the light-emitting diode chip. A phosphor layer comprising: a light emitting diode chip; a lens body that allows light emitted from the phosphor layer to pass through; and a light diffusion means provided between the lens body and the phosphor layer. Features.

本発明によれば、レンズ体と蛍光体層との間に設けられた光拡散手段により、発光ダイオードチップ及び蛍光体層の色の領域サイズが異なっていても照射面の色が分離することなく、色むらを抑制し安定した発光色を得ることが可能な発光装置が実現される。   According to the present invention, the light diffusing means provided between the lens body and the phosphor layer does not separate the color of the irradiated surface even if the light emitting diode chip and the phosphor layer have different color area sizes. Thus, a light emitting device capable of suppressing color unevenness and obtaining a stable emission color is realized.

本発明において、基体は、例えば、PBT(ポリブチレンテレフタレート)等の、耐熱性、耐光性、電気絶縁性を有する合成樹脂等からなり、発光ダイオードチップ及び蛍光体層を配設するための凹部を有する基体として構成されることが許容される。   In the present invention, the substrate is made of, for example, a synthetic resin having heat resistance, light resistance, and electrical insulation, such as PBT (polybutylene terephthalate), and has a recess for disposing the light emitting diode chip and the phosphor layer. It is allowed to be configured as a substrate having.

発光ダイオードチップは、所望の発光色を有するものが用いられ、例えば、青色発光形、紫または紫外発光形、さらには、赤色発光形や緑色発光形などの発光ダイオードチップを用いることができる。   As the light emitting diode chip, one having a desired light emitting color is used. For example, a blue light emitting type, a violet or ultraviolet light emitting type, or a light emitting diode chip such as a red light emitting type or a green light emitting type can be used.

蛍光体層は、発光ダイオードチップから放射される光によって励起され所望の発光色を得るための手段で、発光ダイオードチップの光により異なる光を発光する蛍光体を含んでなり、発光ダイオードチップから放射される光が通過するように、発光ダイオードチップに対向して設けられる。例えば、発光ダイオードチップを蛍光体層に埋設して対向させるようにしても、または、発光ダイオードチップの前面に位置して蛍光体層を重層的に形成して対向させるようにしてもよい。   The phosphor layer is a means for obtaining a desired emission color by being excited by light emitted from the light emitting diode chip, and includes a phosphor that emits different light depending on the light of the light emitting diode chip, and is emitted from the light emitting diode chip. It is provided to face the light emitting diode chip so that the light to be transmitted can pass through. For example, the light emitting diode chip may be embedded in the phosphor layer so as to be opposed to each other, or the phosphor layer may be formed in a multilayer so as to be opposed to the front surface of the light emitting diode chip.

発光ダイオードチップ及び蛍光体層は、例えば、白色の発光色を得るために、凹部の中心部に青色発光ダイオードチップを配置し、青色発光ダイオードチップの前面に黄色蛍光体層を重層的に配設して、蛍光体層が発光ダイオードチップより大なる発光面積を有するように構成した方式が、本発明による色むら抑制の効果をより一層発揮するが、これに限らず、光の3原色である、赤色発光ダイオードチップ、緑色発光ダイオードチップ及び青色発光ダイオードチップを凹部に配設して白色を得る方式、さらには紫または紫外発光ダイオードチップに赤・緑・青の蛍光体を凹部に配設して白色を得る方式等も本発明の対象として許容される。   For example, in order to obtain a white emission color, a blue light emitting diode chip is disposed in the center of the recess, and a yellow phosphor layer is disposed in front of the blue light emitting diode chip. The method in which the phosphor layer has a light emitting area larger than that of the light emitting diode chip further exhibits the effect of suppressing color unevenness according to the present invention. However, the present invention is not limited to this, and is the three primary colors of light. Red light emitting diode chip, green light emitting diode chip and blue light emitting diode chip are arranged in the recess to obtain white color, and further, red, green and blue phosphors are arranged in the recess in the purple or ultraviolet light emitting diode chip. Thus, a method for obtaining white is also acceptable as an object of the present invention.

発光ダイオードチップ及び蛍光体層は、白色光を得ることが主たる目的であるが、純粋な白色に限らず、例えば、演色性を高めるため構成された昼光色や電球色などを含めた、全ての白色系統の色が許容される。さらには、白色系統の色に限らず、所望により補色関係にない可視光を得ることも許容される。   The main purpose of the light-emitting diode chip and the phosphor layer is to obtain white light, but it is not limited to pure white, for example, all white light including daylight color and light bulb color configured to enhance color rendering. System colors are acceptable. Furthermore, it is allowed to obtain visible light that is not limited to a complementary color relationship as desired, not limited to white color.

レンズ体は、透明なアクリル樹脂等の合成樹脂または透明なガラスで構成した凸レンズが好ましいが、凹レンズまたは凸レンズを2枚等、複数枚を組み合わせ、各種の配光を得るようにしてもよい。   The lens body is preferably a convex lens made of a synthetic resin such as a transparent acrylic resin or transparent glass, but a plurality of concave lenses or two convex lenses may be combined to obtain various light distributions.

レンズ体は、発光ダイオードチップ及び蛍光体層を配設した基体の一部または全部を収納するための凹部及び反射部を一体に形成し、発光ダイオードチップ及び蛍光体層から放射される光線を凹部から取り込み、反射部で反射させて所望の方向に光を集束させるように構成してもよい。   The lens body is integrally formed with a concave portion and a reflecting portion for housing a part or the whole of the substrate on which the light emitting diode chip and the phosphor layer are disposed, and the light emitted from the light emitting diode chip and the phosphor layer is recessed. The light may be taken in from the light and reflected by the reflecting portion to focus the light in a desired direction.

光拡散手段は、レンズ体と別体の、例えば、光拡散処理を施したガラス体等の透明または半透明の透光体からなる光拡散手段を、レンズ体と蛍光体層との間に設けてもよい。さらにはレンズ体の蛍光体層側の面に直接光拡散処理を施して、レンズ体に一体に光拡散手段を形成する手段でもよい。   The light diffusing means is provided between the lens body and the phosphor layer with a light diffusing means made of a transparent or translucent translucent material such as a glass body subjected to light diffusing treatment, which is separate from the lens body. May be. Furthermore, the light diffusion unit may be directly formed on the surface of the lens body on the phosphor layer side to form a light diffusion unit integrally with the lens body.

光拡散手段は、透明なガラス体等、若しくはレンズ体の表面を切削して細かい凹凸部を形成しても、または細かいガラス粒子等を吹き付けて形成してもよく、処理の手段は特定のものには限定されない。さらに、スリガラス等の半透明の構成部材が光を拡散させる手段であってもよい。   The light diffusing means may be a transparent glass body or the like, or may be formed by cutting the surface of the lens body to form fine irregularities, or by spraying fine glass particles, etc. It is not limited to. Further, a translucent constituent member such as ground glass may be a means for diffusing light.

本発明における第2の態様の発光装置は、基体と;基体に配設された発光ダイオードチップと;発光ダイオードチップに対向して設けられ、発光ダイオードチップの光により異なる光を発光する蛍光体を含み、かつ発光ダイオードチップより大なる発光面積を有する蛍光体層と;発光ダイオードチップ及び蛍光体層から放射される光を通過させるレンズ体と;レンズ体と蛍光体層との間に設けられた光拡散手段と;を具備することを特徴とする。   A light emitting device according to a second aspect of the present invention comprises: a base; a light emitting diode chip disposed on the base; and a phosphor that is provided opposite to the light emitting diode chip and emits different light depending on the light of the light emitting diode chip. A phosphor layer having a light emitting area larger than that of the light emitting diode chip; a lens body that allows light emitted from the light emitting diode chip and the phosphor layer to pass; and provided between the lens body and the phosphor layer And a light diffusing means.

本発明の第2の態様は、本発明の第1の態様と比較して、発光ダイオードチップより大なる発光面積を有する蛍光体層を具備している点が異なり、他の構成は共通している。   The second aspect of the present invention is different from the first aspect of the present invention in that a phosphor layer having a light emitting area larger than that of the light emitting diode chip is provided, and other configurations are common. Yes.

本発明によれば、レンズ体と蛍光体層との間に設けられた光拡散手段により、発光ダイオードチップより大なる発光面積を有する蛍光体層を具備し、発光ダイオードチップ及び蛍光体層の色の領域サイズが異なっていても照射面の色が分離することなく、色むらを抑制し安定した発光色を得ることが可能な発光装置が実現される。   According to the present invention, the light diffusion means provided between the lens body and the phosphor layer includes the phosphor layer having a light emitting area larger than that of the light emitting diode chip, and the color of the light emitting diode chip and the phosphor layer is increased. Even if the region sizes are different, the light emitting device capable of suppressing the color unevenness and obtaining a stable emission color without separating the color of the irradiated surface is realized.

本発明における第3の態様の発光装置は、請求項1または2に記載の発光装置において、前記光拡散手段は、レンズ体に一体に形成したことを特徴とする。   A light emitting device according to a third aspect of the present invention is the light emitting device according to claim 1 or 2, wherein the light diffusing means is formed integrally with a lens body.

本発明における第4の態様の発光装置は、請求項1ないし3いずれか一に記載の発光装置において、前記発光ダイオードチップは、青色発光ダイオードチップで構成し、蛍光体層は黄色蛍光体を有して構成したことを特徴とする。   A light emitting device according to a fourth aspect of the present invention is the light emitting device according to any one of claims 1 to 3, wherein the light emitting diode chip is a blue light emitting diode chip, and the phosphor layer has a yellow phosphor. It is characterized by being configured.

本発明において、青色発光ダイオードチップ及び黄色蛍光体は、厳密な青色または黄色を発光するものに限らず、青色付近または黄色付近の波長で発光するものも許容される。   In the present invention, the blue light-emitting diode chip and the yellow phosphor are not limited to those that emit strictly blue or yellow, and those that emit light at a wavelength near blue or near yellow are also acceptable.

本発明によれば、レンズ体と蛍光体層との間に設けられた光拡散手段により、青色発光ダイオードチップ及び黄色蛍光体を有する蛍光体層の色の領域サイズが異なっていても照射面の色が分離することなく、色むらを抑制し安定した白色、若しくは白色系統の色を得ることが可能な発光装置が実現される。   According to the present invention, the light diffusing means provided between the lens body and the phosphor layer allows the irradiation surface of the phosphor layer having the blue light emitting diode chip and the yellow phosphor to have different color area sizes. A light-emitting device capable of suppressing color unevenness and obtaining a stable white color or a white color without realizing color separation is realized.

本発明の照明装置は、照明装置本体と;照明装置本体に配設された請求項1ないし4いずれか一に記載の発光装置と;を具備することを特徴とする。   The illuminating device of this invention is equipped with an illuminating device main body; and the light-emitting device as described in any one of Claims 1 thru | or 4 arrange | positioned at the illuminating device main body.

本発明において、照明装置は、上述の発光装置を単一のもので構成しても、多数の発光装置を直線状またはマトリックス状等に多数配列し、線または面モジュール式等の照明装置を構成したものであってもよい。   In the present invention, even if the lighting device is composed of a single light-emitting device as described above, a large number of light-emitting devices are arranged in a straight line or a matrix to form a line or surface module type lighting device. It may be what you did.

さらに、その用途は照明装置全てに適用するもので、例えば、一般照明用のダウンライト、天井直付け灯などの各種の照明器具や、道路用、トンネル用照明器具、投光器などの屋外用の照明器具、さらには各種の表示装置等に用いることができる。   Furthermore, the application is applied to all lighting devices, for example, various lighting fixtures such as downlights for general lighting, direct ceiling lights, outdoor lighting such as road lighting, tunnel lighting fixtures, floodlights, etc. It can be used for instruments, and various display devices.

請求項1の発明によれば、レンズ体と蛍光体層との間に設けられた光拡散手段により、発光ダイオードチップ及び蛍光体層の色の領域サイズが異なっていても照射面の色が分離することなく、色むらを抑制し安定した発光色を得ることが可能な発光装置を提供することができる。   According to the invention of claim 1, the light diffusing means provided between the lens body and the phosphor layer separates the color of the irradiated surface even if the light emitting diode chip and the phosphor layer have different color area sizes. Thus, it is possible to provide a light emitting device capable of suppressing color unevenness and obtaining a stable emission color.

請求項2の発明によれば、レンズ体と蛍光体層との間に設けられた光拡散手段により、発光ダイオードチップより大なる発光面積を有する蛍光体層を具備し、発光ダイオードチップ及び蛍光体層の色の領域サイズが異なっていても照射面の色が分離することなく、色むらを抑制し安定した発光色を得ることが可能な発光装置を提供することができる。   According to the invention of claim 2, the light diffusing means provided between the lens body and the phosphor layer includes the phosphor layer having a light emitting area larger than that of the light emitting diode chip, and the light emitting diode chip and the phosphor It is possible to provide a light-emitting device capable of suppressing color unevenness and obtaining a stable emission color without separation of the color of the irradiated surface even when the color region sizes of the layers are different.

請求項3の発明によれば、光拡散手段は、レンズ体に一体に形成したことにより、簡易な構成で発光ダイオードチップ及び蛍光体層の色の領域サイズが異なっていても照射面の色が分離することなく、色むらを抑制し安定した発光色を得ることが可能な発光装置を提供することができる。   According to the invention of claim 3, since the light diffusing means is formed integrally with the lens body, the color of the irradiation surface can be changed even if the color region sizes of the light emitting diode chip and the phosphor layer are different with a simple configuration. It is possible to provide a light-emitting device that can suppress color unevenness and obtain a stable emission color without separation.

請求項4の発明によれば、レンズ体と蛍光体層との間に設けられた光拡散手段により、青色発光ダイオードチップ及び黄色蛍光体を有する蛍光体層の色の領域サイズが異なっていても照射面の色が分離することなく、色むらを抑制し安定した白色、若しくは白色系統の発光色を得ることが可能な発光装置を提供することができる。   According to invention of Claim 4, even if the color area size of the fluorescent substance layer which has a blue light emitting diode chip and a yellow fluorescent substance differs by the light-diffusion means provided between the lens body and the fluorescent substance layer It is possible to provide a light-emitting device capable of obtaining a stable white color or a white-colored emission color by suppressing color unevenness without separating colors of an irradiation surface.

請求項5の発明によれば、色むらを抑制し安定した発光色を得ることが可能な照明装置を提供することができる。   According to invention of Claim 5, the illuminating device which can suppress color unevenness and can obtain the stable luminescent color can be provided.

以下、図を参照して本発明に係る発光装置及び照明装置の実施形態について説明する。   Hereinafter, embodiments of a light emitting device and a lighting device according to the present invention will be described with reference to the drawings.

図1〜図6は、本発明の第1の実施形態である発光装置及び照明装置を示し、図1は発光装置の構成概要を示し、(a)は側面視の説明図、(b)は(a)の照射面における投影図、図2は発光装置の基体を示し、(a)は平面図、(b)は一部を切り欠いて示す縦断面図、図3は発光装置のレンズ体を示し、(a)は平面図、(b)は縦断面図、(c)は底面図、(d)は変形例の縦断面図、図4は発光装置の縦断面図、図5は照明装置を示し、(a)は線モジュール式の照明装置を示す平面図、(b)は面モジュール式の照明装置を示す平面図、図6は発光装置の変形例を示す側面視の構成概要の説明図である。   1 to 6 show a light emitting device and a lighting device according to a first embodiment of the present invention, FIG. 1 shows a schematic configuration of the light emitting device, (a) is an explanatory view in side view, and (b) is FIG. 2A is a projection view on the irradiation surface, FIG. 2 shows a substrate of the light emitting device, FIG. 2A is a plan view, FIG. 3B is a longitudinal sectional view partially cut away, and FIG. 3 is a lens body of the light emitting device. (A) is a plan view, (b) is a longitudinal sectional view, (c) is a bottom view, (d) is a longitudinal sectional view of a modification, FIG. 4 is a longitudinal sectional view of a light emitting device, and FIG. 5 is an illumination. FIG. 6A is a plan view showing a line module type lighting device, FIG. 6B is a plan view showing a surface module type lighting device, and FIG. 6 is a schematic side view showing a modification of the light emitting device. It is explanatory drawing.

本実施例は、屋内等の照明を行う線モジュール式の照明装置に適用される発光ダイオードを用いた発光装置として構成されたものである。   The present embodiment is configured as a light emitting device using a light emitting diode which is applied to a line module type lighting device that performs indoor lighting or the like.

図1に示すように、発光装置10は、基体11、発光ダイオードチップ(以下「LEDチップ」と称する)12、蛍光体層13、基体に設けられた透光部14、レンズ体15、光拡散手段16で構成する。   As shown in FIG. 1, a light emitting device 10 includes a base body 11, a light emitting diode chip (hereinafter referred to as “LED chip”) 12, a phosphor layer 13, a translucent portion 14 provided on the base body, a lens body 15, and light diffusion. Consists of means 16.

基体11は、図2に示すように、例えば、PBT(ポリブチレンテレフタレート)、PPA(ポリフタルアミド)やPC(ポリカーボネート)等の、耐熱性、耐光性、電気絶縁性を有する合成樹脂からなり、外方に向けて順次広がる逆円錐形状の凹部11a及び凹部の周囲に一体に形成した段部からなるレンズ支持部11bを形成する。   As shown in FIG. 2, the base 11 is made of a synthetic resin having heat resistance, light resistance, and electrical insulation, such as PBT (polybutylene terephthalate), PPA (polyphthalamide), and PC (polycarbonate). An inverted conical concave portion 11a that gradually spreads outward is formed, and a lens support portion 11b that is formed integrally with the periphery of the concave portion is formed.

凹部11aは、内周面に逆テーパー状の反射壁を形成し、開口端に本発明の透光部14を構成する開口部11cを形成する。   The recess 11a forms a reverse-tapered reflecting wall on the inner peripheral surface, and forms an opening 11c that constitutes the translucent part 14 of the present invention at the opening end.

基体11は、電気絶縁層11d及びリードフレーム11eを介して基板11f上に配設される。   The base 11 is disposed on the substrate 11f via the electrical insulating layer 11d and the lead frame 11e.

LEDチップ12は、青色光を発生する例えば窒化ガリウム(GaN)系の半導体からなり、基体の凹部11aの底面に位置するリードフレーム11e上に実装され、所定の電気配線が施される。   The LED chip 12 is made of, for example, a gallium nitride (GaN) -based semiconductor that generates blue light, and is mounted on a lead frame 11e positioned on the bottom surface of the recess 11a of the base, and is provided with predetermined electrical wiring.

LEDチップ12は、凹部11a内に充填された封止樹脂20に埋設される。   The LED chip 12 is embedded in the sealing resin 20 filled in the recess 11a.

すなわち、封止樹脂20は、透光性を有するシリコーン樹脂やエポキシ樹脂などの熱硬化性樹脂からなり、凹部11a内に充填されて、拡散層20aと蛍光体層13の2層に構成される。   That is, the sealing resin 20 is made of a thermosetting resin such as a translucent silicone resin or an epoxy resin, and is filled in the concave portion 11a to be composed of two layers of the diffusion layer 20a and the phosphor layer 13. .

拡散層20aは、アルミナ、チタニア、カルシア、シリカ、イットリアなどの金属酸化物や、これらの金属単体の微粒子からなる拡散剤を、例えば、3〜5質量%添加した封止樹脂を、LEDチップ12が内部に埋設されるように凹部11aに充填し熱硬化させて構成する。拡散層20aの表面は、中央が例えば、1〜5μm程度窪むように形成する。   The diffusion layer 20a includes, for example, a sealing resin in which 3 to 5% by mass of a diffusing agent composed of metal oxides such as alumina, titania, calcia, silica, and yttria and fine particles of these simple metals are added. Is filled in the recess 11a so as to be embedded therein and thermally cured. The surface of the diffusion layer 20a is formed so that the center is recessed by about 1 to 5 μm, for example.

なお、上記の拡散層20aは設けずに構成してもよい。   In addition, you may comprise without providing said diffusion layer 20a.

蛍光体層13は、拡散層20aを熱硬化して形成した後に、黄色発光蛍光体を所要量添加した封止樹脂を凹部11a内に充填し、熱硬化させて形成する。   The phosphor layer 13 is formed by thermally curing the diffusion layer 20a, filling the recess 11a with a sealing resin to which a required amount of a yellow light-emitting phosphor is added, and thermosetting the resin.

これにより蛍光体層13は、LEDチップ12に対向して設けられ、LEDチップから放射される青色光により励起されて黄色光を発生する。   Thereby, the phosphor layer 13 is provided to face the LED chip 12 and is excited by blue light emitted from the LED chip to generate yellow light.

上記に構成した、基体の光源部分は、平面から見ると図2(a)に示すように、黄色蛍光体層13の中心部に青色LEDチップ12が設けられた形状をなし、青色LEDチップ12による青色領域のサイズと黄色蛍光体層13による黄色領域のサイズ、換言すれば、青色LEDチップ12の発光面積Bと黄色蛍光体層13による発光面積Yが異なり、蛍光体層13がLEDチップ12より大なる発光面積を有して構成される。   The light source portion of the base configured as described above has a shape in which the blue LED chip 12 is provided at the center of the yellow phosphor layer 13 as shown in FIG. The size of the blue region due to the yellow phosphor layer 13 is different from the size of the yellow region due to the yellow phosphor layer 13, in other words, the light emission area B of the blue LED chip 12 and the light emission area Y of the yellow phosphor layer 13 are different. It has a larger light emitting area.

レンズ体15は、基体11の透光部14、換言すれば、蛍光体層13に面して設けられ、詳細には図3(a)〜(c)に示すように、例えば、透明なアクリル樹脂製で、凸レンズ部15a、凹部15b及び反射部15cを有して構成され、基体11のレンズ支持部11bに嵌合させることにより、レンズ体15が透光部14、すなわち蛍光体層13に面し、かつLEDチップ12及び蛍光体層13に接近して支持される(図4)。   The lens body 15 is provided so as to face the light transmitting portion 14 of the base body 11, in other words, the phosphor layer 13, and in detail, for example, as shown in FIGS. The lens body 15 is made of resin and has a convex lens portion 15a, a concave portion 15b, and a reflective portion 15c, and is fitted to the lens support portion 11b of the base 11, so that the lens body 15 is attached to the light transmitting portion 14, that is, the phosphor layer 13. Facing and supported close to the LED chip 12 and the phosphor layer 13 (FIG. 4).

凸レンズ部15aは、レンズ体15の中心に位置し、LEDチップ12からの光軸方向の比較的狭い出射角の光が入射する。   The convex lens portion 15 a is located at the center of the lens body 15, and light with a relatively narrow emission angle in the optical axis direction from the LED chip 12 enters.

凹部15bは、その内面が回転近似放物面状の円柱状をなし、上端が凸レンズ部15aの周縁部に連続し、凸レンズ部15aに入射する光より出射角の大きな光が入射する。   The concave portion 15b has a cylindrical shape whose inner surface is a rotation approximate paraboloid, the upper end is continuous with the peripheral portion of the convex lens portion 15a, and light having a larger emission angle than the light incident on the convex lens portion 15a is incident thereon.

反射部15cは、凹部15bからレンズ体15内に入射した光が反射するように形成され、凸レンズ部15aの周辺周囲に配置されている。反射部15cは、全反射形であり反射光が前方へ放射される。さらにレンズ体15の上面は平坦に形成されている。   The reflection part 15c is formed so that the light which entered into the lens body 15 from the recessed part 15b may be reflected, and is arrange | positioned around the periphery of the convex lens part 15a. The reflection part 15c is a total reflection type, and reflected light is radiated | emitted ahead. Furthermore, the upper surface of the lens body 15 is formed flat.

16は光拡散手段で、レンズ体15とは別体に構成した光拡散処理を施したガラス体からなり、レンズ体15と基体11の蛍光体層13との間に設ける。光拡散手段16は、出来るだけ基体11に近づけて設けることがよい。   Reference numeral 16 denotes a light diffusing means, which is made of a glass body that has been subjected to a light diffusing process and is provided separately from the lens body 15, and is provided between the lens body 15 and the phosphor layer 13 of the substrate 11. The light diffusing means 16 is preferably provided as close to the substrate 11 as possible.

より具体的には、図3(a)〜(c)に示すように、光拡散手段16を構成するガラス体を、レンズ体15の円柱状をなす凹部15b内に、凸レンズ部15aに対向し、かつ凹部15bの開口端部に出来るだけ近接させて嵌合し支持する。  More specifically, as shown in FIGS. 3A to 3C, the glass body constituting the light diffusing means 16 is opposed to the convex lens portion 15 a in the concave portion 15 b forming the cylindrical shape of the lens body 15. And it fits and supports as close as possible to the opening end of the recess 15b.

光拡散手段16を構成するガラス体は、その片面若しくは両面を切削して細かい凹凸部を形成し、光拡散処理を施して構成する。   The glass body constituting the light diffusing means 16 is formed by cutting one surface or both surfaces thereof to form fine irregularities and performing a light diffusion treatment.

上記に構成したレンズ体15を、図4に示すように基体11のレンズ支持部11bに嵌合して支持し、発光装置10を構成する。   As shown in FIG. 4, the lens body 15 configured as described above is fitted into and supported by the lens support portion 11 b of the base body 11 to constitute the light emitting device 10.

これにより、光拡散手段16が基体11の蛍光体層13に近接して配設される。   As a result, the light diffusing means 16 is disposed close to the phosphor layer 13 of the base 11.

次に、上記に構成した発光装置の作用につき説明する。   Next, the operation of the light emitting device configured as described above will be described.

まず、発光装置10に所定の直流電流を供給する。これによりLEDチップ12が青色光を発光し、この青色光は拡散層20aで適度に拡散されて、蛍光体層13に入射して黄色蛍光体を励起し、黄色光を放射する。   First, a predetermined direct current is supplied to the light emitting device 10. As a result, the LED chip 12 emits blue light, and this blue light is appropriately diffused by the diffusion layer 20a, enters the phosphor layer 13, excites the yellow phosphor, and emits yellow light.

これらの青色光及び黄色光は、図1に示すように、基体11の透光部14から放射され、透光部に面して設けられた光拡散手段16を構成するガラス体に入射する。   As shown in FIG. 1, these blue light and yellow light are emitted from the light transmitting portion 14 of the base 11 and are incident on the glass body constituting the light diffusing means 16 provided facing the light transmitting portion.

光拡散手段16を構成するガラス体には、蛍光体層13に面して凹凸の拡散処理が施されており、青色光及び黄色光はそれぞれ拡散して混合され、青色光及び黄色光が分離することなく白色の光が放射される。   The glass body constituting the light diffusing means 16 is subjected to uneven diffusion treatment facing the phosphor layer 13, and blue light and yellow light are respectively diffused and mixed to separate blue light and yellow light. White light is radiated without.

この際、光拡散手段16を構成するガラス体は、透光部14から放射される青色光及び黄色光をロスなく十分に取り込む大きさに構成してあるので光出力を殆んど低下させることがない。   At this time, the glass body constituting the light diffusing means 16 is configured to sufficiently capture the blue light and yellow light emitted from the light transmitting portion 14 without loss, so that the light output is substantially reduced. There is no.

拡散手段16を構成するガラス体を通過した光は、レンズ体15に入射して所定の方向に配光制御されて所望の照明を行う。   The light that has passed through the glass body constituting the diffusing unit 16 enters the lens body 15 and is subjected to light distribution control in a predetermined direction to perform desired illumination.

この際、図1(b)に示すように、照射面Cにはレンズ体15により光源部分の像形Xが投影される。   At this time, as shown in FIG. 1B, the image form X of the light source portion is projected onto the irradiation surface C by the lens body 15.

しかし、本実施例において、レンズ体15が像として投影する対象は、レンズ体の手前に存在する光拡散手段16としてのガラス体である。   However, in this embodiment, the object that the lens body 15 projects as an image is a glass body as the light diffusing means 16 existing in front of the lens body.

このガラス体は、上述のように凹凸の光拡散処理が施されており、青色光及び黄色光はそれぞれ拡散して混合され、色が分離することなく白色の光を放射している。   This glass body has been subjected to uneven light diffusion treatment as described above, and blue light and yellow light are each diffused and mixed to emit white light without color separation.

この白色の光が照射面に投影されるため、従来のように、青色光と黄色光が分離して色むらが生じ照射面が白色とならないようなことがなく、確実かつ安定した白色光による照明を行うことができる。   Since this white light is projected onto the irradiation surface, the blue light and the yellow light are separated from each other as in the conventional case, and color unevenness does not occur and the irradiation surface does not become white. Lighting can be performed.

上記に構成した発光装置10は、単独で使用して点モジュールの照明装置を構成してもよいが、本実施例では、図5(a)に示すように発光装置10を照明装置本体30に直線状に多数配列して、線モジュール式の照明装置31を構成した。   Although the light emitting device 10 configured as described above may be used alone to form a point module lighting device, in this embodiment, the light emitting device 10 is mounted on the lighting device main body 30 as shown in FIG. A line module type lighting device 31 was configured by arranging a large number in a straight line.

これら照明装置は、別途の電源ユニットを有し、また接続用延長ケーブルによって、所定数の線モジュール式の照明装置31が連結されて、例えば、列車の窓に沿った直線的な室内照明やシステムキッチンの手元照明等に使用される。   These lighting devices have a separate power supply unit, and a predetermined number of line module type lighting devices 31 are connected by an extension cable for connection, for example, linear indoor lighting or system along a train window. Used for kitchen lighting, etc.

以上、本実施例において、光拡散手段16を構成するガラス体は、その片面若しくは両面を切削して細かい凹凸部を形成し、光拡散処理を施して構成したが、半透明のスリガラスで構成してもよい。さらに、材質は、例えば、透明なアクリル樹脂等の合成樹脂で構成してもよい。   As described above, in this embodiment, the glass body constituting the light diffusing means 16 is formed by cutting one side or both sides to form fine irregularities and performing the light diffusing treatment, but it is made of translucent ground glass. May be. Further, the material may be made of a synthetic resin such as a transparent acrylic resin.

ガラス体からなる光拡散手段16を、レンズ体15と基体11の蛍光体層13との間、より詳細には、レンズ体15の円柱状をなす凹部15b内に嵌合させて支持したが、図3(d)に示すように、凸レンズ部15aの蛍光体層13側に面する面に、直接光拡散処理を施し、レンズ体15に一体に光拡散手段16を形成してもよい。   The light diffusing means 16 made of a glass body is supported by being fitted between the lens body 15 and the phosphor layer 13 of the base body 11, more specifically, in a cylindrical recess 15 b of the lens body 15. As shown in FIG. 3D, the surface of the convex lens portion 15a facing the phosphor layer 13 may be directly subjected to light diffusion processing to form the light diffusion means 16 integrally with the lens body 15.

これにより、別体構成の光拡散手段16を構成するガラス体を省略し、より簡易な構成の発光装置を提供することができる。   Thereby, the glass body which comprises the light-diffusion means 16 of another structure is abbreviate | omitted, and the light-emitting device of a simpler structure can be provided.

さらには、凸レンズ部15aの光拡散処理を施した面に連続して、円柱状をなす凹部15bの内周面にも光拡散処理を施すように構成してもよい。   Furthermore, it may be configured such that the light diffusion process is also performed on the inner peripheral surface of the concave part 15b having a cylindrical shape, in succession to the surface subjected to the light diffusion process of the convex lens part 15a.

これにより、入射角の大きな光も拡散することができ、より一層色むらを抑制することができる。   Thereby, light having a large incident angle can also be diffused, and color unevenness can be further suppressed.

レンズ体15を、凸レンズで構成したが、図6に示すように、透光部14側に光拡散処理を施して光拡散手段16を一体に形成した凹レンズ15dで構成してもよい。   Although the lens body 15 is formed of a convex lens, as shown in FIG. 6, it may be formed of a concave lens 15d in which the light diffusing unit 16 is integrally formed by performing light diffusion processing on the light transmitting portion 14 side.

発光装置10を直線状に多数配列して、線モジュール式の照明装置31を構成したが、図5(b)に示すようにマトリックス状に多数配列して、面モジュール式の照明装置を構成してもよい。   A large number of light emitting devices 10 are arranged in a straight line to form a line module type lighting device 31. However, as shown in FIG. 5B, a large number of light emitting devices 10 are arranged in a matrix to form a surface module type lighting device. May be.

以上、本実施例によれば、照射面Cには、青色光及び黄色光がそれぞれ拡散して混合され、それぞれの色が分離することなく白色の光を放射している光拡散手段としてのガラス体16の像が投影される。   As described above, according to the present embodiment, blue light and yellow light are each diffused and mixed on the irradiation surface C, and glass as light diffusing means that emits white light without separating each color. An image of the body 16 is projected.

このため、色が分離することなく、色むらが抑制されて確実かつ安定した白色を呈する照明を行うことができ、同時に輝度むらが少なくなり、グレアを伴わない照明を行うことができる。   For this reason, it is possible to perform illumination that suppresses color unevenness and exhibits a reliable and stable white color without separation of colors, and at the same time, luminance unevenness is reduced and illumination without glare can be performed.

特に、発光ダイオードチップ12よりも大なる発光面積を有する蛍光体層13を具備していても、照射面の色が分離することなく、色むらが抑制されて確実かつ安定した白色を呈する照明を行うことができ、同時にグレアを伴わない照明を行うことができる。   In particular, even if the phosphor layer 13 having a light emitting area larger than that of the light emitting diode chip 12 is provided, the illumination surface is not separated, and the color unevenness is suppressed and illumination that exhibits a reliable and stable white color is achieved. It is possible to perform illumination at the same time without glare.

また、ガラス体で構成した光拡散手段16及びレンズ体15を、黄色領域Y及び青色領域Bの両方の領域を十分にカバーできるように構成したので、透光部14から放射される、LEDチップ12からの青色光と蛍光体層13から放射される黄色光を、ロスなく十分に取り込んで、光出力を低下させることなく、かつ色むらを抑制することができる。   Further, since the light diffusing means 16 and the lens body 15 made of a glass body are configured so as to sufficiently cover both the yellow region Y and the blue region B, the LED chip emitted from the translucent part 14 The blue light from 12 and the yellow light emitted from the phosphor layer 13 can be taken in sufficiently without loss, and color unevenness can be suppressed without reducing the light output.

また、光拡散手段16を構成するガラス体を、レンズ体15の円柱状をなす凹部15b内に、凸レンズ部15aに対向し、かつ凹部15bの開口端部に出来るだけ近接させて嵌合し支持するようにしたので、光拡散手段を簡易な構成で所定の位置に確実に支持することができ、色むらを抑制できると共に、所望の光学性能を確実に発揮させることができる。   Further, the glass body constituting the light diffusing means 16 is fitted and supported in the cylindrical concave portion 15b of the lens body 15 so as to face the convex lens portion 15a and as close as possible to the opening end portion of the concave portion 15b. Thus, the light diffusing means can be reliably supported at a predetermined position with a simple configuration, color unevenness can be suppressed, and desired optical performance can be reliably exhibited.

さらに、凸レンズ部15aの蛍光体層13側に面する面に、直接光拡散処理を施せば、より一層簡易な構成で、色むらを抑制できると共に、所望の光学性能を確実に発揮させることができる。   Furthermore, if a direct light diffusion process is performed on the surface of the convex lens portion 15a facing the phosphor layer 13, the color unevenness can be suppressed with a simpler configuration and the desired optical performance can be reliably exhibited. it can.

発光装置10を直線状に多数配列して、照明装置を構成したので、色むらを抑制し安定した発光色を得ることが可能な照明装置を提供することができると共に、線モジュールや面モジュール等の照明装置を簡単に構成することができ、各種の照明用途に適用可能な照明装置を提供することができる。   Since the lighting device is configured by arranging a large number of light emitting devices 10 in a straight line, it is possible to provide a lighting device capable of suppressing color unevenness and obtaining a stable light emitting color, as well as a line module, a surface module, and the like. Thus, it is possible to provide a lighting device applicable to various lighting applications.

以上、本発明の好適な実施形態を説明したが、本発明は上述の実施例に限定されることなく、本発明の要旨を逸脱しない範囲内において、種々の設計変更を行うことができる。   Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various design changes can be made without departing from the scope of the present invention.

本発明の第1の実施形態である発光装置の構成概要を示し、(a)は側面視の説明図、(b)は(a)の照射面における投影図。BRIEF DESCRIPTION OF THE DRAWINGS The structure outline | summary of the light-emitting device which is the 1st Embodiment of this invention is shown, (a) is explanatory drawing of a side view, (b) is the projection figure in the irradiation surface of (a). 同じく発光装置の基体を示し、(a)は平面図、(b)は一部を切り欠いて示す縦断面図。The base material of a light-emitting device is shown similarly, (a) is a top view, (b) is a longitudinal cross-sectional view shown with a part cut away. 同じく発光装置のレンズ体を示し、(a)は平面図、(b)は縦断面図、(c)は底面図、(d)は変形例の縦断面図。The lens body of a light-emitting device is similarly shown, (a) is a plan view, (b) is a longitudinal sectional view, (c) is a bottom view, and (d) is a longitudinal sectional view of a modification. 同じく発光装置の縦断面図。Similarly, the longitudinal cross-sectional view of a light-emitting device. 同じく第1の実施形態である照明装置を示し、(a)は線モジュール式の照明装置を示す平面図、(b)は面モジュール式の照明装置を示す平面図。Similarly, the illuminating device which is 1st Embodiment is shown, (a) is a top view which shows a line module type illuminating device, (b) is a top view which shows a surface module type illuminating device. 同じく発光装置の変形例を示す側面視の説明図。Explanatory drawing of the side view which similarly shows the modification of a light-emitting device. 従来の発光装置の構成概要を示し、(a)は側面視の説明図、(b)は(a)の照射面における投影図、(c)は基体の平面視の説明図、(d)は下方から照明した場合の照射面における投影図。The outline of the structure of a conventional light emitting device is shown, (a) is an explanatory view in side view, (b) is a projection view on the irradiation surface of (a), (c) is an explanatory view in plan view of the base, and (d) The projection figure in the irradiation surface at the time of illuminating from the downward direction.

符号の説明Explanation of symbols

10 発光装置
11 基体
12 発光ダイオードチップ
13 蛍光体層
15 レンズ体
16 光拡散手段
DESCRIPTION OF SYMBOLS 10 Light-emitting device 11 Base | substrate 12 Light emitting diode chip 13 Phosphor layer 15 Lens body 16 Light diffusion means

Claims (5)

基体と;
基体に配設された発光ダイオードチップと;
発光ダイオードチップに対向して設けられ、発光ダイオードチップの光により異なる光を発光する蛍光体を含んでなる蛍光体層と;
発光ダイオードチップ及び蛍光体層から放射される光を通過させるレンズ体と;
レンズ体と蛍光体層との間に設けられた光拡散手段と;
を具備することを特徴とする発光装置。
A substrate;
A light emitting diode chip disposed on the substrate;
A phosphor layer provided opposite to the light emitting diode chip and including a phosphor that emits different light depending on the light of the light emitting diode chip;
A lens body that allows light emitted from the light emitting diode chip and the phosphor layer to pass;
A light diffusing means provided between the lens body and the phosphor layer;
A light-emitting device comprising:
基体と;
基体に配設された発光ダイオードチップと;
発光ダイオードチップに対向して設けられ、発光ダイオードチップの光により異なる光を発光する蛍光体を含み、かつ発光ダイオードチップより大なる発光面積を有する蛍光体層と;
発光ダイオードチップ及び蛍光体層から放射される光を通過させるレンズ体と;
レンズ体と蛍光体層との間に設けられた光拡散手段と;
を具備することを特徴とする発光装置。
A substrate;
A light emitting diode chip disposed on the substrate;
A phosphor layer provided opposite to the light emitting diode chip, including a phosphor that emits different light depending on the light of the light emitting diode chip, and having a light emitting area larger than that of the light emitting diode chip;
A lens body that allows light emitted from the light emitting diode chip and the phosphor layer to pass;
A light diffusing means provided between the lens body and the phosphor layer;
A light-emitting device comprising:
前記光拡散手段は、レンズ体に一体に形成したことを特徴とする請求項1または2に記載の発光装置。 The light-emitting device according to claim 1, wherein the light diffusing unit is formed integrally with a lens body. 前記発光ダイオードチップは、青色発光ダイオードチップで構成し、蛍光体層は黄色蛍光体を有して構成したことを特徴とする請求項1ないし3いずれか一に記載の発光装置。 The light emitting device according to any one of claims 1 to 3, wherein the light emitting diode chip is configured by a blue light emitting diode chip, and the phosphor layer is configured by including a yellow phosphor. 照明装置本体と;
照明装置本体に配設された請求項1ないし4いずれか一に記載の発光装置と;
を具備することを特徴とする照明装置。
A lighting device body;
A light emitting device according to any one of claims 1 to 4 disposed in a lighting device body;
An illumination device comprising:
JP2005377386A 2005-12-28 2005-12-28 Light emitting device and illuminator Pending JP2007180288A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005377386A JP2007180288A (en) 2005-12-28 2005-12-28 Light emitting device and illuminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005377386A JP2007180288A (en) 2005-12-28 2005-12-28 Light emitting device and illuminator

Publications (1)

Publication Number Publication Date
JP2007180288A true JP2007180288A (en) 2007-07-12

Family

ID=38305180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005377386A Pending JP2007180288A (en) 2005-12-28 2005-12-28 Light emitting device and illuminator

Country Status (1)

Country Link
JP (1) JP2007180288A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113504A1 (en) * 2009-03-31 2010-10-07 シャープ株式会社 Light source module and electronic device provided with module
JP2012049367A (en) * 2010-08-27 2012-03-08 Kyocera Elco Corp Semiconductor light-emitting device attachment module, semiconductor light-emitting device module, semiconductor light-emitting device lighting apparatus, and manufacturing method of semiconductor light-emitting device attachment module
JP2013030598A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device
JP2015146325A (en) * 2015-03-27 2015-08-13 北明電気工業株式会社 Light source unit, lighting device for tunnel, and lighting device for street light

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113504A1 (en) * 2009-03-31 2010-10-07 シャープ株式会社 Light source module and electronic device provided with module
JP2010238837A (en) * 2009-03-31 2010-10-21 Sharp Corp Light source module and electronic device provided with module
JP4604123B2 (en) * 2009-03-31 2010-12-22 シャープ株式会社 LIGHT SOURCE MODULE AND ELECTRONIC DEVICE PROVIDED WITH THE MODULE
JP2012049367A (en) * 2010-08-27 2012-03-08 Kyocera Elco Corp Semiconductor light-emitting device attachment module, semiconductor light-emitting device module, semiconductor light-emitting device lighting apparatus, and manufacturing method of semiconductor light-emitting device attachment module
JP2013030598A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device
JP2015146325A (en) * 2015-03-27 2015-08-13 北明電気工業株式会社 Light source unit, lighting device for tunnel, and lighting device for street light

Similar Documents

Publication Publication Date Title
JP5266605B2 (en) Vehicle lighting
JP2010086946A (en) Light source for illumination and luminaire with reflector using the same
JP2007059864A (en) Lighting device and light emitting diode device
JP2008159453A (en) Light source device, and lamp having same
JP4179176B2 (en) LED lamp device
US9746145B2 (en) Light-emitting device with non-successive placement of light-emitting elements of one color, illumination light source having the same, and illumination device having the same
WO2009082011A1 (en) Light-emitting device and illuminating device
US9297500B2 (en) Light emitting module, lighting device, and lighting apparatus
JP2007035426A (en) Luminaire
JP2006278309A (en) Lighting system
JP6311856B2 (en) lighting equipment
JP4924337B2 (en) Lighting device
JP2016170912A (en) Luminaire
JP2012221634A (en) Lighting system and headlamp
JP2016167518A (en) Light emission device and luminaire
JP2010140674A (en) Lighting system
JP2008016303A (en) Light-emitting device
JP2011054340A (en) Lighting device
JP2010219163A (en) Light emitting module and lamp fitting unit
JP2011238497A (en) Lamp fitting using led light source unit
JP6583671B2 (en) Lighting device
JP2007180288A (en) Light emitting device and illuminator
US11519563B2 (en) Light-emitting device
JP2016162693A (en) Lighting device
JP2014110301A (en) Light-emitting device and illumination light source