JP2007241113A - Optical component and illumination device using same - Google Patents

Optical component and illumination device using same Download PDF

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JP2007241113A
JP2007241113A JP2006066405A JP2006066405A JP2007241113A JP 2007241113 A JP2007241113 A JP 2007241113A JP 2006066405 A JP2006066405 A JP 2006066405A JP 2006066405 A JP2006066405 A JP 2006066405A JP 2007241113 A JP2007241113 A JP 2007241113A
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light emitting
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JP5060059B2 (en
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Yutaka Sugaya
豊 菅谷
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical component capable of enhancing the efficiency of taking light out of a light source and an illumination device using the same. <P>SOLUTION: The illumination device comprises an LED chip 2 being a light source, a sealing resin 3 for sealing the LED chip 2, the optical component 1 provided atop the sealing resin 3 and opposed to a light emission surface of the LED chip 2, and a lighting device for supplying electric power to the LED chip 2. The optical component 1 has an approximately plane-shaped light incident surface 10 on which the light from the LED chip 2 is made incident, and an approximately plane-shaped light exit surface 11 from which the light incident from the light incident surface 10 is taken outside. The light incident surface 10 and the light exit surface 11 respectively have rough surfaces 12, 13 provided with a number of irregularities within a range where the incident angle of the light incident on each surface is above the critical angle α. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、光源からの光を取り出す光学部品及びそれを用いた照明装置に関する。   The present invention relates to an optical component that extracts light from a light source and an illumination device using the same.

近年、ディスプレイ等の照明装置として表面実装型の発光ダイオードが広く用いられている。従来の表面実装型の発光ダイオードには、セラミック等から成り正負の外部接続電極が形成されたパッケージ内にＬＥＤチップが設けられ、ＬＥＤチップの発光面側に透光性の封止樹脂が充填されて、該封止樹脂を介してＬＥＤチップが発光した光を外部に出射するものがある。このような表面実装型の発光ダイオードには、光の取り出し効率を高めるために、封止樹脂の表面において、ＬＥＤチップと対向する部位を平滑面とし且つ平滑面を除く周辺部分を粗面としたものがある。具体的には、封止樹脂の表面において、ＬＥＤチップの発光面の中心部から出力された光の入射角が臨界角以下となる範囲を平滑面とし、臨界角以上となる範囲を粗面とすることで全反射が生じるのを防ぎ、粗面とした部分から効果的に光を取り出すことができるものである（特許文献１参照）。
特開平１１−２０４８４０号公報 In recent years, surface-mounted light-emitting diodes have been widely used as illumination devices such as displays. In a conventional surface-mount type light emitting diode, an LED chip is provided in a package made of ceramic or the like and formed with positive and negative external connection electrodes, and a light-transmitting sealing resin is filled on the light emitting surface side of the LED chip. In some cases, light emitted from the LED chip is emitted to the outside through the sealing resin. In such a surface-mount type light emitting diode, in order to increase the light extraction efficiency, a portion facing the LED chip on the surface of the sealing resin is a smooth surface and a peripheral portion excluding the smooth surface is a rough surface. There is something. Specifically, on the surface of the sealing resin, a range in which the incident angle of light output from the center of the light emitting surface of the LED chip is a critical angle or less is defined as a smooth surface, and a range in which the incident angle is equal to or greater than a critical angle is defined as a rough surface. By doing so, it is possible to prevent total reflection and to effectively extract light from the roughened portion (see Patent Document 1).
JP-A-11-204840

ところで、上記特許文献１に記載されているような発光ダイオードでは、封止樹脂が柔らかいので、封止樹脂を保護するために封止樹脂の表面にアクリル等の耐候性の高い樹脂から成る光学部品を積層する必要がある。しかしながら、このような光学部品を積層すると、該光学部品の表面で光が全反射してしまい、光源からの光の取り出し効率が低下するという問題があった。   By the way, in the light emitting diode described in Patent Document 1, since the sealing resin is soft, an optical component made of a highly weather-resistant resin such as acrylic on the surface of the sealing resin in order to protect the sealing resin. Need to be laminated. However, when such optical components are stacked, there is a problem that light is totally reflected on the surface of the optical component, and the light extraction efficiency from the light source is lowered.

本発明は、上記の点に鑑みて為されたもので、光源からの光の取り出し効率を高めることのできる光学部品及びそれを用いた照明装置を提供することを目的とする。   The present invention has been made in view of the above points, and an object of the present invention is to provide an optical component capable of increasing the light extraction efficiency from a light source and an illumination device using the same.

請求項１の発明は、上記目的を達成するために、光源の発光面に対向して設けられて、光源からの光が入射する略平面状の光入射面と、光入射面から入射した光を外部に取り出す略平面状の光出射面とを有する光学部品であって、光入射面及び光出射面は、各々の面に入射する光の入射角が臨界角以上となる範囲において多数の凹凸が設けられた粗面をそれぞれ備えたことを特徴とする。   In order to achieve the above object, the invention according to claim 1 is provided so as to face the light emitting surface of the light source, and has a substantially planar light incident surface on which light from the light source enters, and light incident from the light incident surface. An optical component having a substantially planar light exit surface for taking out the light, and the light incident surface and the light exit surface have a large number of irregularities within a range in which the incident angle of light incident on each surface is equal to or greater than a critical angle. Each is provided with a rough surface provided.

請求項２の発明は、請求項１の発明において、粗面は、その凹凸が各々フレネルレンズ状に形成されたことを特徴とする。   The invention of claim 2 is characterized in that, in the invention of claim 1, the rough surface has irregularities formed in a Fresnel lens shape.

請求項３の発明は、請求項１の発明において、粗面は、その凹凸が各々プリズム状に形成されたことを特徴とする。   According to a third aspect of the present invention, in the first aspect of the present invention, the rough surface has irregularities formed in a prism shape.

請求項４の発明は、請求項１乃至３の何れかの光学部品と、光源と、光源に電力を供給する点灯装置とを備えたことを特徴とする。   According to a fourth aspect of the invention, there is provided an optical component according to any one of the first to third aspects, a light source, and a lighting device that supplies electric power to the light source.

請求項１の発明によれば、光源の発光面に対向して設けられて、光源からの光が入射する略平面状の光入射面と、光入射面から入射した光を外部に取り出す略平面状の光出射面とを有する光学部品であって、光入射面及び光出射面は、各々の面に入射する光の入射角が臨界角以上となる範囲において多数の凹凸が設けられた粗面をそれぞれ備えたので、光入射面及び光出射面の臨界角以上の範囲で全反射が生じることなく光を外部に取り出すことができ、したがって光源からの光の取り出し効率を高めることができる。   According to the first aspect of the present invention, the light incident surface of the light source is provided so as to face the light emitting surface, and the light incident surface on which the light from the light source is incident, and the substantially flat surface for taking out the light incident from the light incident surface to the outside. An optical component having a light emitting surface in the form of a light, and the light incident surface and the light emitting surface are rough surfaces provided with a large number of irregularities in a range where the incident angle of light incident on each surface is equal to or greater than a critical angle. Thus, light can be extracted to the outside without causing total reflection in a range equal to or greater than the critical angle of the light incident surface and the light output surface, and thus the light extraction efficiency from the light source can be increased.

請求項２の発明によれば、粗面は、その凹凸が各々フレネルレンズ状に形成されたので、単なる凹凸の場合と比べて全反射をほぼ無くすことができ、光の取り出し効率を更に高めることができる。また、粗面の凹凸が入射する光に対して略垂直となるため、光源からの光の配光特性を損なうことなく光を外部に取り出すことができる。   According to the second aspect of the present invention, since the unevenness of the rough surface is formed in a Fresnel lens shape, total reflection can be almost eliminated as compared with a simple unevenness, and the light extraction efficiency is further increased. Can do. Further, since the rough surface is substantially perpendicular to the incident light, the light can be extracted outside without impairing the light distribution characteristics of the light from the light source.

請求項３の発明によれば、粗面は、その凹凸が各々プリズム状に形成されたので、請求項１と同様に光の取り出し効率を高めることができる。   According to the invention of claim 3, since the irregularities of the rough surface are each formed in a prism shape, the light extraction efficiency can be increased as in the case of claim 1.

請求項４の発明によれば、請求項１乃至３の何れかの効果を奏する照明装置を実現することができる。   According to invention of Claim 4, the illuminating device which has an effect in any one of Claims 1 thru | or 3 is realizable.

以下、本発明の実施形態について図面を用いて説明する。尚、以下の説明における上下左右方向は、図１における上下左右を基準と定める。本実施形態の照明装置は、図１に示すように、光源となるＬＥＤチップ２と、ＬＥＤチップ２を封止する封止樹脂３と、封止樹脂３の上面に設けられてＬＥＤチップ２の発光面と対向する光学部品１と、ＬＥＤチップ２に電力を供給する点灯装置（図示せず）とから構成される。光学部品１は、ＬＥＤチップ２からの光が入射する略平面状の光入射面１０と、光入射面１０から入射した光を外部に取り出す略平面状の光出射面１１とを有し、光入射面１０及び光出射面１１は、各々の面に入射する光の入射角が臨界角α以上となる範囲において多数の凹凸が設けられた粗面１２、１３をそれぞれ備えている。
ＬＥＤチップ２は、例えば基板４にダイボンド固着され、図示しないが外部の正負の電極とそれぞれワイヤボンディングで接続される。光学部品１とＬＥＤチップ２との間には、ＬＥＤチップ２を覆うように、例えばシリコーン等の透光性の封止樹脂３が充填されている。ＬＥＤチップ２は、点灯装置から電力を供給されることで発光し、その光は封止樹脂２及び光学部品１を介して外部に取り出される。尚、ＬＥＤチップ２の発光面の面積は、光学部品１の光入射面１０及び光出射面１１の面積に比べて十分に小さいものであるので、以下ではＬＥＤチップ２の発光面中心２ａから出射される光について説明する。
光学部品１は、例えばアクリル樹脂等の透光性の樹脂材料で形成され、封止樹脂３の表面に積層することで封止樹脂３を保護する。光学部品１の光入射面１０及び光出射面１１は、ＬＥＤチップ２の発光面中心２ａから出射される光に対して、入射角が臨界角α以下となる範囲では各々平滑な平面となっており、入射角が臨界角α以上となる範囲では多数の凹凸を設けた粗面１２、１３がそれぞれ形成されている。
光入射面１０における粗面１２は、図２（ａ）に示すように、ＬＥＤチップ２の発光面中心２ａから出射される光の入射角が臨界角α以上となる範囲において、上方へと傾斜する立ち上がり面５ａと、立ち上がり面５ａと交差して下方へと傾斜する有効面５ｂとから成る谷部５が多数形成されている。また、光出射面１１における粗面１３にも、光入射面１０における粗面１２と同様に、ＬＥＤチップ２の発光面中心２ａから出射される光に対して入射角が臨界角α以上となる範囲において、上方へと傾斜する立ち上がり面６ａと、立ち上がり面６ａと交差して下方へと傾斜する有効面６ｂとから成る谷部６が多数形成されている。尚、図２（ａ）ではＬＥＤチップ２の右側断面図のみを図示しているが、断面左側においても同様の粗面１２、１３が形成されているのは言うまでもない。
谷部５は、光学部品１の光入射面１０において、各々上下方向における一定の幅ｔの長さ分切り欠いて形成されるもので、立ち上がり面５ａは、ＬＥＤチップ２の発光面中心２ａからの光の出射方向に沿って形成されており、有効面５ｂは、発光面中心２ａを中心とし且つ谷部５の上側の頂点と発光面中心２ａとを結ぶ線分を半径とした円弧状に形成されている。
例えば、図２（ｃ）に示すように、最もＬＥＤチップ２に近い谷部５０では、発光面中心２ａから光入射面１０に対して入射角αで出射される光Ｌ１に沿って立ち上がり面５ａが形成されており、有効面５ｂは、発光面中心２ａを中心とし且つ発光面中心２ａと谷部５０の上側の頂点５０ａとを結ぶ線分ｒ１を半径として円弧状に形成されている。また、ＬＥＤチップ２から２番目に近い谷部５１では、発光面中心２ａから谷部５０の下側の頂点５０ｂを通るように出射される光Ｌ２に沿って立ち上がり面５ａが形成されており、有効面５ｂは、発光面中心２ａを中心とし且つ発光面中心２ａと谷部５１の上側の頂点５１ａとを結ぶ線分ｒ２を半径として円弧状に形成されている。以下、同様に谷部５が粗面１２に多数形成されている。このように、谷部５はＬＥＤチップ２の発光面中心２ａを中心とした同心円状、所謂フレネルレンズ状に切り欠いて形成されている。
谷部６は、光学部品１の光出射面１１において、各々上下方向における一定の幅Ｔの長さ分切り欠いて形成されるもので、谷部５と同様にフレネルレンズ状に形成されている。例えば、図２（ｂ）に示すように、最もＬＥＤチップ２に近い谷部６０では、光Ｌ１の軌道と光出射面１１との交点６０ａと発光面中心２ａとを結ぶ線分Ｒ１を半径として発光面中心２ａを中心とした円弧状に有効面６ｂが形成され、立ち上がり面６ａは、光Ｌ２の軌道に沿って形成されている。また、ＬＥＤチップから２番目に近い谷部６１では、光Ｌ２の軌道と光出射面１１との交点６１ａと発光面中心２ａとを結ぶ線分Ｒ２を半径として発光面中心２ａを中心とした円弧状に有効面６ｂが形成され、立ち上がり面６ａは、発光面中心２ａから谷部６１の下側の頂点６１ｂを通るように出射される光Ｌ３に沿って形成されている。以下、同様に谷部６が粗面１３に多数形成されている。
上述のように、入射角が臨界角α以上の範囲においてフレネルレンズ状に形成された谷部５、６を多数設けた粗面１２、１３を光入射面１０及び光出射面１１それぞれに備えたので、光入射面１０に臨界角α以上で入射する光に対して各谷部５の有効面５ｂが略垂直となるために、入射光がほぼ全反射することなく光入射面１０を通過し、さらに光出射面１１に臨界角α以上で入射する光に対して各谷部６の有効面６ｂが略垂直となるために、ほぼ全反射することなく光が外部に取り出される。したがって、封止樹脂３の上面に光学部品１を積層した場合にも、ほぼ全反射を生じることなく外部に光を取り出すことができ、光の取り出し効率を高めることができる。また、有効面５ｂ、６ｂが入射光に対して略垂直であるために、ほぼ屈折させることなく光を外部に取り出すことができるため、ＬＥＤチップ２の配光特性を活かすことができる。
ところで、光入射面１０及び光出射面１１の粗面１２、１３の凹凸の形状は、本実施形態のようなフレネルレンズ状に限定されるものではなく、例えばプリズム状や、シボ加工等による単なる凹凸形状であってもよい。この場合にも粗面１２、１３によってある程度全反射を抑えることができ、ＬＥＤチップ２からの光の取り出し効率を高める効果が得られる。
また、封止樹脂３には、光学部品１の屈折率とほぼ等しい屈折率を有する透光性の樹脂材料を用いてもよい。この場合、封止樹脂３の上面と光学部品１の光入射面１０との界面では全反射が生じないので、図３に示すように、光出射面１１のみに粗面１３を設けることで、ＬＥＤチップ２からの光の取り出し効率を高める効果が得られる。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the vertical and horizontal directions in the following description are defined based on the vertical and horizontal directions in FIG. As shown in FIG. 1, the illumination device of the present embodiment is provided on the LED chip 2 serving as a light source, a sealing resin 3 that seals the LED chip 2, and an upper surface of the sealing resin 3. The optical component 1 is configured to face the light emitting surface, and a lighting device (not shown) that supplies power to the LED chip 2. The optical component 1 includes a substantially planar light incident surface 10 on which light from the LED chip 2 is incident, and a substantially planar light emitting surface 11 that extracts light incident from the light incident surface 10 to the outside. The incident surface 10 and the light emitting surface 11 are respectively provided with rough surfaces 12 and 13 provided with a large number of irregularities in a range where the incident angle of light incident on each surface is equal to or larger than the critical angle α.
For example, the LED chip 2 is die-bonded to the substrate 4 and connected to external positive and negative electrodes (not shown) by wire bonding. Between the optical component 1 and the LED chip 2, a light-transmitting sealing resin 3 such as silicone is filled so as to cover the LED chip 2. The LED chip 2 emits light when power is supplied from the lighting device, and the light is extracted to the outside through the sealing resin 2 and the optical component 1. In addition, since the area of the light emitting surface of the LED chip 2 is sufficiently smaller than the areas of the light incident surface 10 and the light emitting surface 11 of the optical component 1, the light is emitted from the light emitting surface center 2a of the LED chip 2 below. The light to be described will be described.
The optical component 1 is formed of a translucent resin material such as acrylic resin, for example, and protects the sealing resin 3 by being laminated on the surface of the sealing resin 3. The light incident surface 10 and the light emitting surface 11 of the optical component 1 are each a smooth plane in the range where the incident angle is equal to or less than the critical angle α with respect to the light emitted from the light emitting surface center 2a of the LED chip 2. In the range where the incident angle is greater than or equal to the critical angle α, rough surfaces 12 and 13 having a large number of irregularities are formed.
As shown in FIG. 2A, the rough surface 12 of the light incident surface 10 is inclined upward in a range where the incident angle of light emitted from the light emitting surface center 2a of the LED chip 2 is not less than the critical angle α. A large number of troughs 5 are formed, each of which includes a rising surface 5a and an effective surface 5b that crosses the rising surface 5a and is inclined downward. Similarly to the rough surface 12 of the light incident surface 10, the incident angle of the rough surface 13 on the light emitting surface 11 is greater than or equal to the critical angle α with respect to the light emitted from the light emitting surface center 2 a of the LED chip 2. In the range, a large number of troughs 6 are formed which are composed of a rising surface 6a inclined upward and an effective surface 6b which intersects the rising surface 6a and is inclined downward. 2A shows only the right sectional view of the LED chip 2, it goes without saying that the same rough surfaces 12, 13 are formed on the left side of the cross section.
The troughs 5 are formed by notching the light incident surface 10 of the optical component 1 by a certain length t in the vertical direction, and the rising surface 5a is from the light emitting surface center 2a of the LED chip 2. The effective surface 5b is formed in an arc shape having a radius that is a line segment that connects the light emitting surface center 2a and the upper vertex of the valley portion 5 to the light emitting surface center 2a. Is formed.
For example, as shown in FIG. 2C, in the valley portion 50 closest to the LED chip 2, the rising surface 5a along the light L1 emitted from the light emitting surface center 2a with respect to the light incident surface 10 at the incident angle α. The effective surface 5b is formed in an arc shape with the radius r1 being the line segment r1 that is centered on the light emitting surface center 2a and connects the light emitting surface center 2a and the upper vertex 50a of the valley 50. Further, in the valley portion 51 closest to the LED chip 2, the rising surface 5a is formed along the light L2 emitted from the light emitting surface center 2a so as to pass through the lower vertex 50b of the valley portion 50, The effective surface 5b is formed in an arc shape with the radius r2 being the line segment r2 centering on the light emitting surface center 2a and connecting the light emitting surface center 2a and the apex 51a on the upper side of the valley portion 51. Similarly, a large number of valleys 5 are formed on the rough surface 12. As described above, the valley portion 5 is formed by concentrically cutting the light emitting surface center 2a of the LED chip 2 into a so-called Fresnel lens shape.
The troughs 6 are formed by notching the light emitting surface 11 of the optical component 1 by a certain length T in the vertical direction, and are formed in a Fresnel lens shape like the troughs 5. . For example, as shown in FIG. 2B, in the valley 60 closest to the LED chip 2, the line segment R1 connecting the intersection 60a between the light L1 trajectory and the light emitting surface 11 and the light emitting surface center 2a is used as the radius. The effective surface 6b is formed in an arc shape centered on the light emitting surface center 2a, and the rising surface 6a is formed along the trajectory of the light L2. Further, in the valley portion 61 closest to the LED chip, a circle centering on the light emitting surface center 2a is set with a radius of a line segment R2 connecting the intersection 61a between the light L2 trajectory and the light emitting surface 11 and the light emitting surface center 2a. The effective surface 6b is formed in an arc shape, and the rising surface 6a is formed along the light L3 emitted from the light emitting surface center 2a so as to pass through the apex 61b below the valley portion 61. Similarly, a large number of valleys 6 are formed on the rough surface 13 in the same manner.
As described above, each of the light incident surface 10 and the light emitting surface 11 is provided with rough surfaces 12 and 13 provided with a number of valleys 5 and 6 formed in a Fresnel lens shape in an incident angle range of the critical angle α or more. Therefore, since the effective surface 5b of each valley portion 5 is substantially perpendicular to the light incident on the light incident surface 10 at a critical angle α or more, the incident light passes through the light incident surface 10 without almost total reflection. Furthermore, since the effective surface 6b of each valley 6 is substantially perpendicular to the light incident on the light emitting surface 11 at a critical angle α or more, the light is extracted outside without being substantially totally reflected. Therefore, even when the optical component 1 is laminated on the upper surface of the sealing resin 3, light can be extracted to the outside with almost no total reflection, and the light extraction efficiency can be increased. In addition, since the effective surfaces 5b and 6b are substantially perpendicular to the incident light, the light can be extracted outside without being refracted, so that the light distribution characteristics of the LED chip 2 can be utilized.
By the way, the uneven shape of the rough surfaces 12 and 13 of the light incident surface 10 and the light emitting surface 11 is not limited to the Fresnel lens shape as in the present embodiment, but is merely a prism shape, a crumbly processing or the like. An uneven shape may be used. In this case as well, the total reflection can be suppressed to some extent by the rough surfaces 12 and 13, and the effect of increasing the light extraction efficiency from the LED chip 2 can be obtained.
The sealing resin 3 may be a translucent resin material having a refractive index substantially equal to the refractive index of the optical component 1. In this case, since total reflection does not occur at the interface between the upper surface of the sealing resin 3 and the light incident surface 10 of the optical component 1, by providing the rough surface 13 only on the light emitting surface 11, as shown in FIG. The effect of increasing the light extraction efficiency from the LED chip 2 is obtained.

本発明の実施形態の照明装置を示す断面図である。It is sectional drawing which shows the illuminating device of embodiment of this invention. 同上の粗面の形状を示す断面図で、（ａ）はＬＥＤチップを含む右側の断面図で、（ｂ）は光出射面の一部拡大図で、（ｃ）は光入射面の一部拡大図である。It is sectional drawing which shows the shape of the rough surface same as the above, (a) is sectional drawing of the right side containing a LED chip, (b) is a partial enlarged view of a light-projection surface, (c) is a part of light-incidence surface. It is an enlarged view. 同上の光学部品の屈折率とほぼ等しい屈折率を有する封止樹脂を用いた場合を示す断面図の一部である。It is a part of sectional drawing which shows the case where sealing resin which has a refractive index substantially equal to the refractive index of an optical component same as the above is used.

符号の説明Explanation of symbols

１ 光学部品
１０ 光入射面
１１ 光出射面
１２、１３ 粗面
２ ＬＥＤチップ
２ａ 発光面中心 DESCRIPTION OF SYMBOLS 1 Optical component 10 Light incident surface 11 Light output surface 12, 13 Rough surface 2 LED chip 2a Light emission surface center

Claims (4)

光源の発光面に対向して設けられて、光源からの光が入射する略平面状の光入射面と、光入射面から入射した光を外部に取り出す略平面状の光出射面とを有する光学部品であって、光入射面及び光出射面は、各々の面に入射する光の入射角が臨界角以上となる範囲において多数の凹凸が設けられた粗面をそれぞれ備えたことを特徴とする光学部品。   An optical device that is provided opposite to the light emitting surface of the light source and has a substantially planar light incident surface on which light from the light source is incident and a substantially planar light emitting surface that extracts light incident from the light incident surface to the outside. The light incident surface and the light exit surface are components each having a rough surface provided with a large number of irregularities in a range where the incident angle of light incident on each surface is equal to or greater than a critical angle. Optical component. 前記粗面は、その凹凸が各々フレネルレンズ状に形成されたことを特徴とする請求項１記載の光学部品。   The optical component according to claim 1, wherein the rough surface has irregularities formed in a Fresnel lens shape. 前記粗面は、その凹凸が各々プリズム状に形成されたことを特徴とする請求項１記載の光学部品。   The optical component according to claim 1, wherein the rough surface has irregularities formed in a prism shape. 請求項１乃至３の何れかの光学部品と、光源と、光源に電力を供給する点灯装置とを備えたことを特徴とする照明装置。
An illumination device comprising: the optical component according to claim 1; a light source; and a lighting device that supplies power to the light source.
JP2006066405A 2006-03-10 2006-03-10 Optical component and illumination device using the same Active JP5060059B2 (en)

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JP2009117207A (en) * 2007-11-07 2009-05-28 Enplas Corp Light emission device, planar light source, and display
JP2011113798A (en) * 2009-11-26 2011-06-09 Koizumi Lighting Technology Corp Lighting system
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JP2005191197A (en) * 2003-12-25 2005-07-14 Kyocera Corp Light emitting device

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JP2005191197A (en) * 2003-12-25 2005-07-14 Kyocera Corp Light emitting device

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JP2009117207A (en) * 2007-11-07 2009-05-28 Enplas Corp Light emission device, planar light source, and display
JP2011113798A (en) * 2009-11-26 2011-06-09 Koizumi Lighting Technology Corp Lighting system
WO2012032757A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Led lighting device
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JP2016162932A (en) * 2015-03-03 2016-09-05 シチズン電子株式会社 Led light source device

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