JP2007169502A - Removable water dispersion type acrylic adhesive composition and adhesive sheet - Google Patents
Removable water dispersion type acrylic adhesive composition and adhesive sheet Download PDFInfo
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本発明は、半導体、回路、各種プリント基板、各種マスク、リードフレームなどの微細加工部品の製造の際に、表面保護や破損防止のために使用される低汚染性の再剥離用水分散型アクリル系粘着剤組成物及び粘着シート類に関する。特に半導体ウエハの裏面研削時やダイシング時に使用される半導体ウエハ加工用粘着シートに好適に用いられる再剥離用水分散型アクリル系粘着剤組成物及び粘着シート類に関する。 The present invention is a low-dispersion, water-removable acrylic resin used for surface protection and damage prevention in the manufacture of microfabricated parts such as semiconductors, circuits, various printed boards, various masks, and lead frames. The present invention relates to an adhesive composition and an adhesive sheet. In particular, the present invention relates to a re-peeling water-dispersed acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets which are preferably used for a semiconductor wafer processing pressure-sensitive adhesive sheet used during back grinding or dicing of a semiconductor wafer.
従来、半導体、回路、各種プリント基板、各種マスク、リードフレームなどの微細加工部品の製造の際に、表面保護や破損防止のために再剥離用粘着シート類が使用されている。これに使用される再剥離用粘着シート類には、被着体が粘着剤組成物に起因する有機物やパーティクル等で汚染されない非汚染タイプであることが要求される。従来このような用途には、溶剤型のアクリル系粘着剤が用いられてきたが、これら溶剤型アクリル系粘着剤は有機溶媒中で合成されるため、塗工時の溶剤の揮発が環境的に問題があり、水分散型アクリル系粘着剤への転換が図られている。しかしながら水分散型アクリル系粘着剤は、溶剤型のアクリル系粘着剤に比べ、乳化剤を使用するため低汚染性を達成することは困難であった。 Conventionally, when a microfabricated part such as a semiconductor, a circuit, various printed boards, various masks, and a lead frame is manufactured, a re-peeling pressure-sensitive adhesive sheet is used for protecting the surface and preventing damage. The re-peeling pressure-sensitive adhesive sheet used for this is required to be a non-contamination type in which the adherend is not contaminated with organic substances, particles or the like resulting from the pressure-sensitive adhesive composition. Conventionally, solvent-type acrylic pressure-sensitive adhesives have been used for such applications, but since these solvent-type acrylic pressure-sensitive adhesives are synthesized in an organic solvent, the volatilization of the solvent during coating is environmentally friendly. There is a problem, and conversion to water-dispersed acrylic pressure-sensitive adhesive is being attempted. However, the water-dispersed acrylic pressure-sensitive adhesive uses an emulsifier as compared with the solvent-type acrylic pressure-sensitive adhesive, so that it is difficult to achieve low contamination.
また、特に半導体集積回路の加工用途において用いられる半導体ウエハ加工用粘着シートにおいては、この非汚染性の特性は重要である。通常、半導体集積回路は、高純度シリコン単結晶などをスライスしてウエハとした後、ウエハ表面にＩＣなどの所定の回路パターンをエッチング形成して集積回路を組み込み、次いでウエハ裏面を研削機により研削して、ウエハの厚さを１００〜６００μｍまで薄くし、最後にダイシングしてチップ化することにより製造されている。ここで、上記研削時には、ウエハ表面に粘着シートを貼り付けて、ウエハの破損を防止したり、研削加工を容易にしている。また、上記ダイシング時には、ウエハ裏面側に粘着シート類を貼り付けて、ウエハを接着固定した状態でダイシングし、形成されるチップをフィルム基材側よりニードルで突き上げてピックアップし、ダイパッド上に固定させている。 Further, this non-contaminating property is important particularly in a semiconductor wafer processing pressure-sensitive adhesive sheet used for processing a semiconductor integrated circuit. Normally, a semiconductor integrated circuit is made by slicing a high-purity silicon single crystal or the like into a wafer, etching a predetermined circuit pattern such as an IC on the wafer surface, incorporating the integrated circuit, and then grinding the back surface of the wafer with a grinding machine. The wafer is manufactured by reducing the thickness of the wafer to 100 to 600 μm and finally dicing into chips. Here, at the time of grinding, an adhesive sheet is attached to the wafer surface to prevent the wafer from being damaged or to facilitate grinding. At the time of dicing, an adhesive sheet is attached to the back side of the wafer, the wafer is bonded and fixed, and the formed chip is picked up by a needle from the film substrate side and picked up and fixed on the die pad. ing.
このような目的で用いられる半導体ウエハ加工用粘着シートは、研削加工やダイシング加工中に剥離しない程度の粘着力が必要である一方、研削加工後やダイシング後のピックアップ時には容易に剥離でき、また半導体ウエハを破損しない程度の低い粘着力であることが要求され、さらにウエハ表面やウエハ裏面に糊残りを生じず、これらの面を汚染しないものであることが必要である。特に近年、半導体集積回路の高密度化及び高性能化に伴い、半導体ウエハ及びそれから得られる半導体チップの回路面に対する汚染の管理が厳しくなってきている。そのため、ウエハ加工用粘着フィルムには従来に増してより低汚染性が求められるようになっている。 The pressure-sensitive adhesive sheet for semiconductor wafer processing used for such a purpose requires an adhesive force that does not peel during grinding or dicing, but can be easily peeled off after grinding or picking up after dicing. It is required that the adhesive strength is low enough not to damage the wafer, and that no adhesive residue is generated on the wafer surface or the back surface of the wafer, so that these surfaces are not contaminated. Particularly in recent years, with the increase in density and performance of semiconductor integrated circuits, the management of contamination on the circuit surfaces of semiconductor wafers and semiconductor chips obtained therefrom has become stricter. Therefore, an adhesive film for wafer processing is required to have lower contamination than ever before.
さらにウエハ表面の汚染物は、ワイヤーボンディングのシェア強度へ影響を与えることが知られている。すなわち半導体チップを製造する際に行われるワイヤーボンディングにおいては、ボールとパッド間の接着強度が高いことが要求されるが、ウエハ上のアルミ表面に付着した有機物やパーティクルは、金ワイヤーのアルミ表面への接着を阻害する要因となり、アルミ表面に多量の汚染物質が付着すると、ワイヤーボンディングシェア強度が低下するという問題が発生する。 Furthermore, it is known that contaminants on the wafer surface affect the shear strength of wire bonding. In other words, wire bonding performed when manufacturing a semiconductor chip requires high adhesion strength between the ball and the pad, but organic substances and particles adhering to the aluminum surface on the wafer are transferred to the aluminum surface of the gold wire. When a large amount of contaminants adhere to the aluminum surface, the wire bonding shear strength is reduced.
一方、研削するウエハにはパターンやダイシングラインなどの凹凸が存在している。粘着シートはその凹凸のあるウエハパターン表面に貼り付けられる。粘着シートがウエハ表面の凹凸を埋めず空へきが存在していたり、ウエハ表面への接着性が低い場合において、研削時に水が浸入し、ウエハパターン表面を汚染してしまう問題が発生する。なお、水分散型の粘着剤で形成された粘着剤層を有し、特に半導体ウエハ加工用粘着シートとして用いることのできる被着体表面への汚染が少ない再剥離用水分散型アクリル系粘着シートはすでに提案されているが（例えば特許文献１）、さらに高い耐水浸入性と低汚染性との両立が求められている。 On the other hand, the wafer to be ground has irregularities such as patterns and dicing lines. The adhesive sheet is affixed to the uneven wafer pattern surface. When the adhesive sheet does not fill the irregularities on the wafer surface and there are voids or the adhesiveness to the wafer surface is low, there is a problem that water enters during grinding and contaminates the wafer pattern surface. The water-dispersible acrylic pressure-sensitive adhesive sheet for re-peeling has a pressure-sensitive adhesive layer formed of a water-dispersed pressure-sensitive adhesive, and can be used as a pressure-sensitive adhesive sheet for processing semiconductor wafers. Although already proposed (for example, Patent Document 1), there is a demand for both higher water penetration resistance and low contamination.
本発明は上記問題に鑑み、水系で塗工できる水分散型アクリル系粘着剤組成物であって、該組成物を用いて粘着シートを製造した際には、適宜な接着力と良好な再剥離性を発現し、被着体表面への汚染が少ない粘着シートとすることができる粘着剤組成物を提供することを目的とする。 In view of the above problems, the present invention is a water-dispersed acrylic pressure-sensitive adhesive composition that can be applied in an aqueous system. When a pressure-sensitive adhesive sheet is produced using the composition, an appropriate adhesive force and good re-peeling An object of the present invention is to provide a pressure-sensitive adhesive composition that can exhibit an adhesive property and can be a pressure-sensitive adhesive sheet with little contamination on the adherend surface.
本発明は又、被着体表面の凹凸への追従性及び耐水浸入性に優れ、且つ再剥離時は被着体に糊残りを生じることなく良好に剥離可能であり、被着体表面への汚染が少ない、特に半導体ウエハ加工用粘着シートとして好適に用いることのできる水分散型アクリル系粘着シートを提供することを目的とする。 The present invention is also excellent in conformity to the unevenness of the adherend surface and water penetration resistance, and can be peeled well without causing adhesive residue on the adherend during re-peeling. An object of the present invention is to provide a water-dispersed acrylic pressure-sensitive adhesive sheet that is less contaminated and can be suitably used particularly as a pressure-sensitive adhesive sheet for processing semiconductor wafers.
本発明者らは、上記の目的を達成するために鋭意検討した結果、アクリルエマルション系重合体を主成分とし、ヒドラジン架橋剤を含む粘着剤組成物であって、該アクリルエマルション系重合体が一定の条件を満たすことにより粘着シート等とした際には、ウエハなどの被着体表面への汚染が少なく、かつウエハ研削時に耐水浸入性が高い水分散型アクリル系粘着剤組成物が得られることを見出し、本発明を完成するに至った。 As a result of intensive studies to achieve the above object, the present inventors have found that the pressure-sensitive adhesive composition contains an acrylic emulsion polymer as a main component and contains a hydrazine crosslinking agent, and the acrylic emulsion polymer is constant. When a pressure-sensitive adhesive sheet or the like is satisfied by satisfying the above conditions, a water-dispersed acrylic pressure-sensitive adhesive composition having little contamination on the surface of an adherend such as a wafer and having high water penetration resistance during wafer grinding should be obtained. As a result, the present invention has been completed.
すなわち本発明は、（メタ）アクリル酸アルキルエステルを主成分とするモノマー混合物をエマルション重合して得られるアクリルエマルション系重合体を主成分とし、ヒドラジン架橋剤を含む粘着剤組成物であって、上記モノマー混合物が、カルボニル基含有モノマーを全モノマー１００重量部に対して０．５〜１０重量部含み、アクリルエマルション系重合体のガラス転移温度が−８０〜−２０℃である水分散型アクリル系粘着剤組成物を提供する。 That is, the present invention is a pressure-sensitive adhesive composition comprising, as a main component, an acrylic emulsion polymer obtained by emulsion polymerization of a monomer mixture containing (meth) acrylic acid alkyl ester as a main component, and comprising a hydrazine crosslinking agent, A water-dispersed acrylic adhesive in which the monomer mixture contains 0.5 to 10 parts by weight of a carbonyl group-containing monomer with respect to 100 parts by weight of all monomers, and the glass transition temperature of the acrylic emulsion polymer is -80 to -20 ° C. An agent composition is provided.
上記モノマー混合物は、水酸基含有モノマーを全モノマー１００重量部に対して１〜１５重量部含んでいることが好ましい。 It is preferable that the monomer mixture contains 1 to 15 parts by weight of a hydroxyl group-containing monomer with respect to 100 parts by weight of all monomers.
上記水分散型アクリル系粘着剤組成物は、該組成物を層状に成形して粘着剤層を作製した際の該粘着剤層の引張試験における初期弾性率が０．２０〜１．５０ＭＰａ、最大強度が１．０〜８．０MＰａ、破断伸びが１８０〜９００％、ゲル分率が９０％以上であることが望ましい。 The water-dispersed acrylic pressure-sensitive adhesive composition has an initial elastic modulus of 0.20 to 1.50 MPa in the tensile test of the pressure-sensitive adhesive layer when the pressure-sensitive adhesive layer is produced by forming the composition into a layer, It is desirable that the strength is 1.0 to 8.0 MPa, the elongation at break is 180 to 900%, and the gel fraction is 90% or more.
アクリルエマルション系重合体は、レドックス系重合開始剤によるエマルション重合により得られたものであることが望ましい。 The acrylic emulsion-based polymer is desirably obtained by emulsion polymerization using a redox polymerization initiator.
本発明は又、上記水分散型アクリル系粘着剤組成物よりなる粘着剤層を支持体上に設けてなり、被着体に貼付後再剥離可能な水分散型アクリル系粘着シートを提供する。該粘着シートは半導体ウエハ加工用水分散型アクリル系粘着シートとして、半導体ウエハ加工用途に好適に使用することができる。 The present invention also provides a water-dispersed acrylic pressure-sensitive adhesive sheet which is provided with a pressure-sensitive adhesive layer made of the above-mentioned water-dispersed acrylic pressure-sensitive adhesive composition on a support and can be peeled off after being attached to an adherend. The pressure-sensitive adhesive sheet can be suitably used for semiconductor wafer processing as a water-dispersed acrylic pressure-sensitive adhesive sheet for semiconductor wafer processing.
本発明の水分散型アクリル系粘着剤組成物は、有機溶剤等を使用せず水系で製造、塗工作業等ができるため環境衛生上優れている。本発明の粘着剤組成物を使用して、被着体表面の凹凸への追従性、耐水浸入性に優れ、被着体に貼付後再剥離した際には、被着体表面に糊残りを生じず、有機物汚染をほとんど生じることなく再剥離可能な粘着剤を製造することができる。 The water-dispersed acrylic pressure-sensitive adhesive composition of the present invention is excellent in environmental hygiene because it can be manufactured and applied in an aqueous system without using an organic solvent or the like. Using the pressure-sensitive adhesive composition of the present invention, it has excellent followability to unevenness on the surface of the adherend and water penetration resistance, and when it is peeled off after being attached to the adherend, the adhesive residue remains on the adherend surface. A pressure-sensitive adhesive that does not occur and can be peeled off with little organic contamination is produced.
本発明の水分散型アクリル系粘着シートは、水系で塗工でき、有機溶媒を使用しなくても製造することができるため、環境衛生上優れている。さらに、被着体へ貼付時は被着体表面の凹凸によく追従し、適度な接着力を発現するため、耐水浸入性に優れている。貼付目的達成後再剥離する際には、糊残り等を生ずること無く良好に再剥離可能であり、剥離後の被着体表面への汚染は極めて少ない。従って、本発明の水分散型アクリル系粘着シートは、特に半導体ウエハの裏面研削時やダイシング時に使用される半導体ウエハ加工用粘着シートとして好適に用いることができ、半導体チップの製造時に行われるワイヤーボンディングにおいて本発明の半導体ウエハ加工用水分散型アクリル系粘着シートを使用して加工作業を行うと、アルミ表面と金ワイヤー間で界面破壊を生じることなく、高いシェア強度を維持することができる。さらに又、低汚染性であるという特長を生かし、使用時又は使用終了時に粘着シートの剥離を伴うような各種用途、例えば各種工業部材、特に半導体、回路、各種プリント基板、各種マスク、リードフレームなどの微細加工部品の製造の際に表面保護や破損防止のために使用する再剥離用水分散型アクリル系粘着シートとして幅広く利用することができる。 Since the water-dispersed acrylic pressure-sensitive adhesive sheet of the present invention can be applied in an aqueous system and can be produced without using an organic solvent, it is excellent in environmental hygiene. Furthermore, when sticking to an adherend, it follows the unevenness of the adherend surface well and develops an appropriate adhesive force, so it has excellent water penetration resistance. When re-peeling after the purpose of sticking is achieved, it is possible to re-peel well without causing adhesive residue and the like, and there is very little contamination on the adherend surface after peeling. Therefore, the water-dispersed acrylic pressure-sensitive adhesive sheet of the present invention can be suitably used as a pressure-sensitive adhesive sheet for processing semiconductor wafers used particularly when grinding or dicing a semiconductor wafer, and wire bonding performed when manufacturing semiconductor chips. When the processing operation is performed using the water-dispersed acrylic pressure-sensitive adhesive sheet for processing semiconductor wafers of the present invention, high shear strength can be maintained without causing interface fracture between the aluminum surface and the gold wire. Furthermore, taking advantage of the low pollution property, various uses such as peeling of the adhesive sheet at the time of use or termination of use, such as various industrial members, especially semiconductors, circuits, various printed boards, various masks, lead frames, etc. It can be widely used as a re-peeling water-dispersed acrylic pressure-sensitive adhesive sheet that is used for surface protection and damage prevention in the production of microfabricated parts.
本発明の再剥離用水分散型アクリル系粘着剤組成物の主成分であるアクリルエマルション系重合体は、（メタ）アクリル酸アルキルエステルを主成分とし、カルボニル基含有モノマーをモノマー混合物１００重量部に対して０．５〜１０重量部含むモノマー混合物をエマルション重合することにより得られ、かつ該アクリルエマルション系重合体のガラス転移温度は−８０〜−２０℃である。 The acrylic emulsion polymer that is the main component of the water-dispersible acrylic pressure-sensitive adhesive composition for re-peeling of the present invention comprises (meth) acrylic acid alkyl ester as a main component, and a carbonyl group-containing monomer with respect to 100 parts by weight of the monomer mixture. Is obtained by emulsion polymerization of a monomer mixture containing 0.5 to 10 parts by weight, and the glass transition temperature of the acrylic emulsion polymer is -80 to -20 ° C.
上記（メタ）アクリル酸アルキルエステルの具体例としては例えば、（メタ）アクリル酸メチル、（メタ）アクリル酸エチル、（メタ）アクリル酸プロピル、（メタ）アクリル酸ブチル、（メタ）アクリル酸イソブチル、（メタ）アクリル酸イソアミル、（メタ）アクリル酸ヘキシル、（メタ）アクリル酸２−エチルヘキシル、（メタ）アクリル酸イソオクチル、（メタ）アクリル酸イソノニル、（メタ）アクリル酸イソデシルなどがあげられる。 Specific examples of the (meth) acrylic acid alkyl ester include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, Examples thereof include isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, isodecyl (meth) acrylate, and the like.
モノマー混合物は、上記（メタ）アクリル酸アルキルエステルに加えて、カルボニル基含有モノマーをモノマー混合物１００重量部に対して０．５〜１０重量部、好ましくは０．５〜７重量部、さらに好ましくは０．７〜４重量部含有する。カルボニル基含有モノマーが０．５重量部より少ないと、後述するヒドラジン架橋剤との反応点が少なくなり、該組成物からなる粘着剤層を有する粘着シートを被着体から剥離した後の被着体への汚染物が多くなる。また、１０重量部より多いと、アクリルエマルション系重合体の溶液粘度が高くなり、支持体や剥離ライナーへ粘着剤を塗布するなどして粘着剤層を形成するときに、塗工筋などの問題が発生する。 In the monomer mixture, in addition to the above (meth) acrylic acid alkyl ester, the carbonyl group-containing monomer is 0.5 to 10 parts by weight, preferably 0.5 to 7 parts by weight, more preferably 100 parts by weight of the monomer mixture. Contains 0.7 to 4 parts by weight. When the amount of the carbonyl group-containing monomer is less than 0.5 parts by weight, the number of reactive sites with the hydrazine crosslinking agent described later decreases, and the adhesion after peeling the pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer made of the composition from the adherend. More pollutants to the body. On the other hand, when the amount is more than 10 parts by weight, the solution viscosity of the acrylic emulsion polymer becomes high, and when the pressure-sensitive adhesive layer is formed by applying the pressure-sensitive adhesive to the support or the release liner, problems such as coating stripes Will occur.
カルボニル基含有モノマーとしては例えば、（メタ）アクリル酸アクリルエステルと重合可能であり、ケト基及び／又はアルデヒド基を含むものであれば特に制限されないが、例えばダイアセトンアクリルアミド、ダイアセトンメタクリルアミド、アクロレイン、ホルミルスチロール、ビニルメチルケトン、ビニルエチルケトン、ビニルイソブチルケトン、ジアセトンアクリレート、ジアセトンメタクリレート、アセトニトリルアクリレート、２−ヒドロキシプロピルアクリレートアセトアセテート、ブタンジオールアクリレートアセトアセテート等が挙げられる。これらの中で、特にダイアセトンアクリルアミドを好適に使用することができる。 The carbonyl group-containing monomer is not particularly limited as long as it can be polymerized with (meth) acrylic acid acrylic ester and contains a keto group and / or an aldehyde group. For example, diacetone acrylamide, diacetone methacrylamide, acrolein , Formylstyrene, vinyl methyl ketone, vinyl ethyl ketone, vinyl isobutyl ketone, diacetone acrylate, diacetone methacrylate, acetonitrile acrylate, 2-hydroxypropyl acrylate acetoacetate, butanediol acrylate acetoacetate and the like. Of these, diacetone acrylamide can be particularly preferably used.
アクリルエマルション系重合体を得るためのモノマー混合物には、上述の（メタ）アクリル酸アクリルエステル及びカルボニル基含有モノマーに加えて、必要に応じてエマルション粒子の安定化、粘着剤層の基材への密着性の向上、又被着体への初期接着性の向上などを目的として、主モノマーと共重合可能なモノマーが含まれていてもよい。なお、このようなモノマーを本明細書中でその他のモノマーと称する場合がある。その他のモノマーは、全モノマー混合物中６０重量％以下、好ましくは２５重量％以下の範囲で、各モノマーの種類に応じて適宜その使用量を選択できる。 In addition to the above-mentioned (meth) acrylic acid acrylic ester and carbonyl group-containing monomer, the monomer mixture for obtaining the acrylic emulsion-based polymer may be used to stabilize emulsion particles and to apply the adhesive layer to the base material as necessary. A monomer copolymerizable with the main monomer may be included for the purpose of improving adhesion and improving initial adhesion to the adherend. Such a monomer may be referred to as other monomer in this specification. The amount of other monomers can be appropriately selected according to the kind of each monomer within the range of 60% by weight or less, preferably 25% by weight or less in the total monomer mixture.
上記その他のモノマーとしては、例えば、アクリル酸、メタクリル酸、マレイン酸、クロトン酸、アクリル酸ダイマー、ω−カルボキシ−ポリカプロラクトンモノアクリレート、フタル酸モノヒドロキシエチルアクリレートなどのカルボキシル基含有モノマー；酢酸ビニル等のビニルエステル系モノマー；スチレン等のスチレン系モノマー；アクリル酸グリシジル、メタクリル酸グリシジル等のエポキシ基含有モノマー；（メタ）アクリル酸２−ヒドロキシエチル、（メタ）アクリル酸２−ヒドロキシプロピル等のヒドロキシル基含有モノマー；Ｎ，Ｎ−ジメチルアクリルアミド、Ｎ，Ｎ−ジエチルアクリルアミド、Ｎ−イソプロピルアクリルアミド等のアミド基含有モノマー；アクリロイルモルホリンなどのアミノ基含有モノマーが挙げられる。 Examples of the other monomers include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, maleic acid, crotonic acid, acrylic acid dimer, ω-carboxy-polycaprolactone monoacrylate, and monohydroxyethyl acrylate phthalate; vinyl acetate and the like Vinyl ester monomers; styrene monomers such as styrene; epoxy group-containing monomers such as glycidyl acrylate and glycidyl methacrylate; hydroxyl groups such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate Containing monomers; Amide group-containing monomers such as N, N-dimethylacrylamide, N, N-diethylacrylamide, and N-isopropylacrylamide; Amino group-containing monomers such as acryloylmorpholine That.
本発明においては、その他のモノマーとして、（メタ）アクリル酸２−ヒドロキシエチル、（メタ）アクリル酸２−ヒドロキシプロピルなどの水酸基含有モノマーを使用することが望ましい。水酸基含有モノマーを使用することにより、シリコンウエハとの相互作用が増し、ウエハ研削時に研削水がウエハと粘着テープ界面に浸入する不具合が発生しにくくなる。水酸基含有モノマーはモノマー混合物１００重量部に対して、例えば１〜１５重量部、好ましくは１〜１０重量部、特に好ましくは１〜５重量部の範囲で使用することができる。水酸基含有モノマーが１５重量部より多いと、アクリルエマルション系重合体の溶液粘度が高くなり、粘着剤組成物として基材や剥離ライナー上に塗布する際に、塗工筋などの問題が発生しやすくなる。 In the present invention, it is desirable to use a hydroxyl group-containing monomer such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate as the other monomer. By using the hydroxyl group-containing monomer, the interaction with the silicon wafer is increased, and it becomes difficult to cause a problem that the grinding water enters the interface between the wafer and the adhesive tape during wafer grinding. The hydroxyl group-containing monomer can be used in the range of, for example, 1 to 15 parts by weight, preferably 1 to 10 parts by weight, and particularly preferably 1 to 5 parts by weight with respect to 100 parts by weight of the monomer mixture. When the amount of the hydroxyl group-containing monomer is more than 15 parts by weight, the solution viscosity of the acrylic emulsion polymer becomes high, and problems such as coating streaks are likely to occur when the adhesive composition is applied onto a substrate or a release liner. Become.
アクリルエマルション系重合体を調製する際には、後述する粘着剤のゲル分率を調整するために、多官能モノマー（架橋剤）を共重合することができる。多官能モノマーとしては、例えば、ジエチレングリコールジアクリレート、ジエチレングリコールジメタクリレート、エチレングリコールジアクリレート、エチレングリコールジメタクリレート、テトラエチレングリコールジアクリレート、テトラエチレングリコールジメタクリレート、ネオペンチルグリコールジアクリレート、ネオペンチルグリコールジメタクリレート、１，６−ヘキサンジオールジアクリレート、１，６−ヘキサンジオールジメタクリレート、トリメチロールプロパントリアクリレート、トリメチロールプロパントリメタクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールトリメタクリレート、ジペンタエリスリトールヘキサアクリレート、ジペンタエリスリトールヘキサメタクリレート等の多官能（メタ）アクリレート類、ジビニルベンゼン等の多官能芳香族ビニル化合物などがあげられる。 In preparing the acrylic emulsion polymer, a polyfunctional monomer (crosslinking agent) can be copolymerized in order to adjust the gel fraction of the pressure-sensitive adhesive described later. Examples of the polyfunctional monomer include diethylene glycol diacrylate, diethylene glycol dimethacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexa Such as methacrylate Functional (meth) acrylates, polyfunctional aromatic vinyl compounds such as divinylbenzene and the like.
主モノマーである（メタ）アクリル酸アルキルエステル、カルボニル基含有モノマー、及びその他のモノマー等の種類及びその組み合わせ、配合の割合は、得られるアクリルエマルション系重合体のガラス転移温度が−８０〜−２０℃、好ましくは−７５〜−２２℃、さらに好ましくは−７０〜−３０℃となるように調節して選択される。ガラス転移温度が−２０℃より高くなるとパターンウエハ表面の段差への粘着剤の追従性が悪くなり、ウエハ研削時に研削水がウエハと粘着テープ界面に浸入する不具合が発生してしまう。なお、ガラス転移温度は、分子全体の運動が分子構造の部分−部分間の相互作用よりも強くなり、物性の大きな変化が起きる温度のことをいう。本発明においてガラス転移温度は、レオメトリック社製動的粘弾性測定装置：商品名「ＡＲＥＳ」を用いて、サンプル厚さ１．５ｍｍで、Φ７．９ｍｍのパラレルプレートの治具を用い、周波数１Ｈｚ、昇温速度５℃／分で測定し、得られた損失弾性率のピーク点の温度をガラス転移温度とした。 The kind of the main monomer (meth) acrylic acid alkyl ester, carbonyl group-containing monomer, and other monomers and combinations thereof, and the blending ratio are such that the glass transition temperature of the resulting acrylic emulsion polymer is -80 to -20. It is selected by adjusting so that it is in the range of ° C, preferably -75 to -22 ° C, more preferably -70 to -30 ° C. When the glass transition temperature is higher than −20 ° C., the followability of the adhesive to the step on the surface of the patterned wafer is deteriorated, and a problem that the grinding water enters the interface between the wafer and the adhesive tape during wafer grinding occurs. The glass transition temperature refers to a temperature at which the movement of the whole molecule becomes stronger than the part-to-part interaction of the molecular structure and a large change in physical properties occurs. In the present invention, the glass transition temperature is a rheometric dynamic viscoelasticity measuring device: trade name “ARES”, a sample thickness of 1.5 mm, a φ 7.9 mm parallel plate jig, and a frequency of 1 Hz. The temperature at a rate of temperature rise of 5 ° C./min was measured, and the temperature at the peak point of the obtained loss modulus was taken as the glass transition temperature.
アクリルエマルション系重合体は、上述のモノマー混合物に重合開始剤及び乳化剤などを加え、通常のエマルション重合方法を用いて調製する。エマルション重合は、一般的な一括重合、連続滴下重合、分割滴下重合など任意の方法を用いることができ、その方法は特に限定されるものではない。また、重合温度は、用いる開始剤の種類等に応じて、例えば５〜１００℃程度の範囲内から選択することができる。 The acrylic emulsion polymer is prepared by adding a polymerization initiator, an emulsifier and the like to the above monomer mixture and using a normal emulsion polymerization method. For emulsion polymerization, any method such as general batch polymerization, continuous dropping polymerization, and divided dropping polymerization can be used, and the method is not particularly limited. The polymerization temperature can be selected from the range of, for example, about 5 to 100 ° C. according to the type of initiator used.
本発明においては、アクリルエマルション系重合体は、ウエハ等の被着体への有機物汚染量の減少に特に効果があることから、一括重合でかつ低温（例えば５０℃以下、好ましくは３０℃以下）で重合することが望ましい。このような条件で重合を行うと、高分子量体が得られやすく、低分子量体が少なくなるため、ウエハへの有機物汚染が減少するものと推定される。 In the present invention, since the acrylic emulsion polymer is particularly effective in reducing the amount of organic matter contamination on the adherend such as a wafer, it is a batch polymerization and a low temperature (for example, 50 ° C. or less, preferably 30 ° C. or less). It is desirable to polymerize with. When polymerization is carried out under such conditions, it is presumed that high molecular weight products are easily obtained and low molecular weight products are reduced, so that organic contamination on the wafer is reduced.
アクリルエマルション系重合体の調製のために使用する乳化剤は、公知の乳化剤から適宜選択して使用することができ特に制限されないが、例えばビニル基、プロペニル基、イソプロペニル基、ビニルエーテル基（ビニルオキシ基）、アリルエーテル基（アリルオキシ基）などのラジカル重合性官能基を有する反応性乳化剤を使用するとウエハへの汚染を大きく低減することができる。このような反応性官能基の市販の例として、旭電化工業（株）製：商品名「アデカソープＳＥ−１０Ｎ」、第一工業製薬（株）製：商品名「アクアロンＨＳ−２０」、「アクアロンＨＳ−１０」、「アクアロンＨＳ−５０」などが挙げられる。又は、カルボキシル基又はその塩を含有する乳化剤を使用し、架橋剤としてヒドラジン架橋剤に加えて後述するカルボキシル基と反応し得る官能基を有する架橋剤を併用することもウエハへの汚染低減に効果的である。カルボキシル基又はその塩を含有する乳化剤としては、例えばマレイン酸、イタコン酸、フマル酸、スルホコハク酸などのジカルボン酸のハーフエステルやハーフアミド又はこれらの塩などが挙げられる。特に、例えばスルホコハク酸モノプロペニルエステルや、スルホコハク酸モノアリルエステルなどの分子内にプロペニル基やアリルオキシ基などの重合性官能基を有し、且つカルボキシル基を含有する反応性乳化剤を使用し、さらにカルボキシル基と反応し得る官能基を有する架橋剤を併用することはウエハへの有機汚染低減の点から好ましい。このような乳化剤の市販の例として具体的には、日本乳化剤（株）製、商品名「ニューコール２９３」、「ＲＡ５４１１」、「ＲＡ５４４」などを例示できる。 The emulsifier used for the preparation of the acrylic emulsion polymer can be appropriately selected from known emulsifiers and is not particularly limited. For example, a vinyl group, a propenyl group, an isopropenyl group, a vinyl ether group (vinyloxy group) If a reactive emulsifier having a radical polymerizable functional group such as an allyl ether group (allyloxy group) is used, contamination of the wafer can be greatly reduced. Commercially available examples of such reactive functional groups include: Asahi Denka Kogyo Co., Ltd .: trade name “Adeka Soap SE-10N”, Daiichi Kogyo Seiyaku Co., Ltd .: trade names “AQUALON HS-20”, “AQUALON” HS-10 "," Aqualon HS-50 "and the like. Alternatively, using an emulsifier containing a carboxyl group or a salt thereof, and using a crosslinking agent having a functional group capable of reacting with a carboxyl group described later in addition to a hydrazine crosslinking agent as a crosslinking agent is also effective in reducing contamination on the wafer. Is. Examples of the emulsifier containing a carboxyl group or a salt thereof include half esters or half amides of dicarboxylic acids such as maleic acid, itaconic acid, fumaric acid, and sulfosuccinic acid, or salts thereof. In particular, for example, a reactive emulsifier having a polymerizable functional group such as a propenyl group or an allyloxy group in a molecule such as sulfosuccinic acid monopropenyl ester or sulfosuccinic acid monoallyl ester, and containing a carboxyl group is further used. Use of a crosslinking agent having a functional group capable of reacting with a group is preferable from the viewpoint of reducing organic contamination on the wafer. Specific examples of such commercially available emulsifiers include trade names “New Coal 293”, “RA5411”, and “RA544” manufactured by Nippon Emulsifier Co., Ltd.
乳化剤としては、粘着剤組成物の諸特性向上のために、例えばラウリル硫酸ナトリウム、ラウリル硫酸アンモニウム、ドデシルベンゼンスルホン酸ナトリウム、ポリオキシエチレンアルキルエーテル硫酸ナトリウム、ポリオキシエチレンアルキルフェニルエーテル硫酸ナトリウムなどのアニオン系乳化剤；ポリオキシエチレンアルキルエーテル、ポリオキシエチレンアルキルフェニルエーテルなどのノニオン系乳化剤等、一般的な乳化剤を上記反応性乳化剤と併用してもよい。なお、乳化剤は１種又は２種以上を選択して使用することができる。 As an emulsifier, anionic systems such as sodium lauryl sulfate, ammonium lauryl sulfate, sodium dodecylbenzene sulfonate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkyl phenyl ether sulfate are used to improve various properties of the pressure-sensitive adhesive composition. Emulsifiers: General emulsifiers such as nonionic emulsifiers such as polyoxyethylene alkyl ether and polyoxyethylene alkyl phenyl ether may be used in combination with the reactive emulsifier. In addition, 1 type (s) or 2 or more types can be selected and used for an emulsifier.
半導体ウエハ加工用粘着シートでは、特に不純物イオンが問題となる場合があるため、不純物イオンを取り除き、ＳＯ4 2-イオン濃度が１００μｇ／ｇ以下である乳化剤を使用することが望ましい。不純物イオンを取り除く方法としては、イオン交換樹脂法、膜分離法、アルコールを用いた不純物の沈殿ろ過法など適宜な方法を用いることができる。なお、乳化剤としてアニオン系乳化剤を使用する場合であれば、アンモニウム塩乳化剤を用いることが望ましい。 In the adhesive sheet for semiconductor wafer processing, since impurity ions may be a problem, it is desirable to remove the impurity ions and use an emulsifier having an SO 4 2− ion concentration of 100 μg / g or less. As a method for removing the impurity ions, an appropriate method such as an ion exchange resin method, a membrane separation method, or an impurity precipitation filtration method using alcohol can be used. In addition, when using an anionic emulsifier as an emulsifier, it is desirable to use an ammonium salt emulsifier.
乳化剤の使用量は、モノマー混合物１００重量部に対して、例えば０．１〜５重量部、好ましくは０．５〜３重量部程度の範囲から選択することができる。乳化剤の配合量が５重量部を超えると粘着剤の凝集力が低下して被着体への汚染量が増加し、また乳化剤自身による汚染も起こる場合がある。乳化剤の配合量が０．１重量部未満では安定した乳化が維持できない場合があり何れも好ましくない。 The usage-amount of an emulsifier can be selected from the range of about 0.1-5 weight part with respect to 100 weight part of monomer mixtures, Preferably about 0.5-3 weight part. When the blending amount of the emulsifier exceeds 5 parts by weight, the cohesive force of the pressure-sensitive adhesive is decreased, the amount of contamination on the adherend is increased, and contamination by the emulsifier itself may occur. If the blending amount of the emulsifier is less than 0.1 parts by weight, stable emulsification may not be maintained, which is not preferable.
重合開始剤としては、たとえば、２，２′−アゾビスイソブチロニトリル、２，２′−アゾビス（２−アミジノプロパン）ジヒドロクロライド、２，２′−アゾビス（Ｎ，Ｎ′−ジメチレンイソブチルアミジン）などのアゾ系、過硫酸カリウム、過硫酸アンモニウムなどの過硫酸塩、ベンゾイルパーオキサイド、ｔ−ブチルハイドロパーオキサイドなどの過酸化物系や、過酸化水素水とアスコルビン酸、過酸化水素水と鉄（ＩＩ）塩、過硫酸塩と亜硫酸水素ナトリウムなどのレドックス系重合開始剤などがあげられる。これらの中で、ウエハ等被着体への有機物汚染量の減少に特に効果があることから、レドックス系重合開始剤を用いることが望ましい。 Examples of the polymerization initiator include 2,2′-azobisisobutyronitrile, 2,2′-azobis (2-amidinopropane) dihydrochloride, 2,2′-azobis (N, N′-dimethyleneisobutyl). Azo compounds such as amidine), persulfates such as potassium persulfate and ammonium persulfate, peroxide systems such as benzoyl peroxide and t-butyl hydroperoxide, hydrogen peroxide water and ascorbic acid, hydrogen peroxide water Examples thereof include redox polymerization initiators such as iron (II) salts, persulfates and sodium bisulfite. Among these, it is desirable to use a redox polymerization initiator because it is particularly effective in reducing the amount of organic matter contamination on the adherend such as a wafer.
この理由については明確でないが、レドックス系重合開始剤を用いることで高分子量体が得られやすく低分子量成分が少ないことに起因しているものと推定される。また粘着シートにて不純物イオンが問題となる場合には、イオン成分を含まない開始剤を用いることが要求され、たとえば過酸化水素水とアスコルビン酸などの組み合わせが好適に使用される。また、レドックス系重合開始剤を用いる場合は、重合温度は５０℃以下、好ましくは３０℃以下にすることが望ましい。 Although the reason for this is not clear, it is presumed that the use of a redox polymerization initiator is likely due to the fact that a high molecular weight product is easily obtained and that there are few low molecular weight components. Further, when impurity ions become a problem in the pressure-sensitive adhesive sheet, it is required to use an initiator that does not contain an ionic component. For example, a combination of hydrogen peroxide and ascorbic acid is preferably used. When a redox polymerization initiator is used, the polymerization temperature is 50 ° C. or lower, preferably 30 ° C. or lower.
これらの重合開始剤は、その種類やアクリルモノマーの種類に応じて、その使用量が決定されるが、通常は、全モノマー混合物１００重量部あたり、０．００１〜０．１重量部の範囲で使用するのが望ましい。 The amount of these polymerization initiators to be used is determined according to the type and the type of acrylic monomer, but is usually in the range of 0.001 to 0.1 parts by weight per 100 parts by weight of the total monomer mixture. It is desirable to use it.
アクリルエマルション系重合体の調製において、分子量を調整するために連鎖移動剤を使用してもよい。連鎖移動剤としては、特に限定されるものではないが、たとえばラウリルメルカプタン、メルカプト酢酸、２−メルカプトエタノール、チオグリコール酸２−エチルヘキシル、２，３−ジメルカプト−１−プロパノールなどが挙げられ、その目的、用途に応じて１種又は２種以上が用いられる。 In the preparation of the acrylic emulsion polymer, a chain transfer agent may be used to adjust the molecular weight. The chain transfer agent is not particularly limited, and examples thereof include lauryl mercaptan, mercaptoacetic acid, 2-mercaptoethanol, 2-ethylhexyl thioglycolate, and 2,3-dimercapto-1-propanol. Depending on the application, one or more may be used.
本発明の水分散型アクリル系粘着剤組成物は、上述のアクリルエマルション系重合体にヒドラジン架橋剤を配合して得られる。ヒドラジン架橋剤としては、多官能性ヒドラジン系化合物を使用できる。具体的には、例えばシュウ酸ジヒドラジド、マロン酸ジヒドラジド、コハク酸ジヒドラジド、グルタル酸ジヒドラジド、アジピン酸ジヒドラジド、セバシン酸ジヒドラジド、マレイン酸ジヒドラジド、フマル酸ジヒドラジド、イタコン酸ジヒドラジドなどの炭素数２〜１６程度（特に炭素数３〜１０程度）の飽和又は不飽和ジカルボン酸ジヒドラジドなどが挙げられる。これらの市販の例としては、例えば味の素ファインテクノ（株）製、商品名「アミキュアＶＤＨ」、「アミキュアＵＤＨ」などが挙げられる。 The water-dispersed acrylic pressure-sensitive adhesive composition of the present invention is obtained by blending a hydrazine crosslinking agent with the above-mentioned acrylic emulsion polymer. As the hydrazine crosslinking agent, a polyfunctional hydrazine-based compound can be used. Specifically, for example, about 2 to 16 carbon atoms such as oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, glutaric acid dihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, maleic acid dihydrazide, fumaric acid dihydrazide, itaconic acid dihydrazide ( In particular, a saturated or unsaturated dicarboxylic acid dihydrazide having about 3 to 10 carbon atoms may be used. Examples of these commercially available products include those manufactured by Ajinomoto Fine Techno Co., Ltd., trade names “Amicure VDH”, “Amicure UDH”, and the like.
ヒドラジン架橋剤の配合量は、アクリルエマルション系重合体１００重量部に対して、例えば０．１〜５重量部、好ましくは０．３〜３重量部程度の範囲から選択できる。 The compounding quantity of a hydrazine crosslinking agent can be selected from the range of about 0.1-5 weight part with respect to 100 weight part of acrylic emulsion type polymers, Preferably about 0.3-3 weight part.
ヒドラジン架橋剤を使用すると、被着体表面への汚染が少なく、且つウエハ研削時に耐水浸入性が高い再剥離用水分散型アクリル系粘着シートを得ることができる。この理由について詳細は明らかではないが、被着体汚染に影響を及ぼす成分や不純物が少なく、且つ架橋の効率が良いため、低汚染性と、耐水浸入性の両方を同時に実現できるものであると推察できる。 When a hydrazine crosslinking agent is used, a re-peeling water-dispersed acrylic pressure-sensitive adhesive sheet with little contamination on the adherend surface and high water penetration resistance during wafer grinding can be obtained. Although details are not clear about this reason, since there are few components and impurities affecting the adherend contamination and the crosslinking efficiency is good, both low contamination and water penetration resistance can be realized at the same time. I can guess.
アクリルエマルション系重合体の調製においてカルボキシル基含有乳化剤を使用した場合や、アクリルエマルション系重合体がカルボキシル基を有する場合には、上記ヒドラジン架橋剤に加えて、カルボキシル基と反応し得る官能基を含む架橋剤を併用すると、ウエハへの有機汚染低減に特に効果的である。このような架橋剤としては、例えば多官能のエポキシ系架橋剤、イソシアネート系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、カルボジイミド架橋剤などが挙げられる。なお、多官能とは２官能以上であることを意味する。具体的には、Ｎ，Ｎ，Ｎ′，Ｎ′−テトラグリシジル−ｍ−キシレンジアミン、１，３−ビス（Ｎ，Ｎ−グリシジルアミノメチル）シクロヘキサン、１，６−ヘキサンジオールグリシジルエーテル、ポリエチレングリコールジグリシジルエーテル、ポリグリセロールポリグリシジルエーテルなどのエポキシ系架橋剤、商品名「エポクロスＷＳ−５００」（（株）日本触媒製）などのオキサゾリン系架橋剤、商品名「ケミタイトＰＺ−３３」（（株）日本触媒製）などのアジリジン系架橋剤、トリレンジイソシアネート（ブロック）、商品名「エラストロンＢＮ−６９」（第一工業製薬（株）製）などのブロックイソシアネート系架橋剤、商品名「カルボジライトＶ−０２」、「カルボジライトＶ−０２−Ｌ２」、「カルボジライトＶ−０４」、「カルボジライトＥ−０１」、「カルボジライトＥ−０２」（日清紡（株）製ポリカルボジイミド樹脂）などのカルボジイミド系架橋剤が挙げられる。 When a carboxyl group-containing emulsifier is used in the preparation of the acrylic emulsion polymer, or when the acrylic emulsion polymer has a carboxyl group, it contains a functional group capable of reacting with the carboxyl group in addition to the hydrazine crosslinking agent. The combined use of a crosslinking agent is particularly effective in reducing organic contamination on the wafer. Examples of such crosslinking agents include polyfunctional epoxy crosslinking agents, isocyanate crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, carbodiimide crosslinking agents, and the like. In addition, polyfunctional means that it is bifunctional or more. Specifically, N, N, N ′, N′-tetraglycidyl-m-xylenediamine, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, 1,6-hexanediol glycidyl ether, polyethylene glycol Epoxy crosslinking agents such as diglycidyl ether and polyglycerol polyglycidyl ether, oxazoline crosslinking agents such as trade name “Epocross WS-500” (manufactured by Nippon Shokubai Co., Ltd.), trade name “Chemite PZ-33” ((stock) Aziridine-based cross-linking agent such as Tolylene diisocyanate (Block), trade name “Elastolon BN-69” (Daiichi Kogyo Seiyaku Co., Ltd.), trade name “Carbodilite V” -02 "," Carbodilite V-02-L2 "," Carbodilite V-04 " "Carbodilite E-01", a carbodiimide-based crosslinking agent such as "Carbodilite E-02" (Nisshinbo Co. polycarbodiimide resin) and the like.
これらの架橋剤は、粘着剤層を作製した際の諸特性、特にゲル分率が後述するような好ましい範囲となるような使用量で、１種又は２種以上を選択して使用することができる。また、ゲル分率の調整のために、上記以外の架橋剤（例えば過酸化物系架橋剤など）を適宜使用してもよい。 These cross-linking agents may be used by selecting one or more kinds thereof in such an amount that the various properties when the pressure-sensitive adhesive layer is produced, particularly the gel fraction, is within a preferable range as described later. it can. Further, in order to adjust the gel fraction, a crosslinking agent other than the above (for example, a peroxide-based crosslinking agent) may be used as appropriate.
上述のようにして得られる本発明の粘着剤組成物は、該組成物を層状に成形して粘着剤層を作製した際の該粘着剤層の引張試験における初期弾性率が０．２０〜１．５０MＰａ、最大強度が１．０〜８．０MＰａ、破断伸びが１８０〜９００％、ゲル分率が９０％以上であるのが好ましい。 The pressure-sensitive adhesive composition of the present invention obtained as described above has an initial elastic modulus of 0.20 to 1 in a tensile test of the pressure-sensitive adhesive layer when the pressure-sensitive adhesive layer is produced by forming the composition into a layer. .50 MPa, maximum strength is 1.0 to 8.0 MPa, elongation at break is 180 to 900%, and gel fraction is preferably 90% or more.
ここで引張試験は、粘着剤層を、断面積０．７５ｍｍ、長さ３０ｍｍの円柱状に形成し、この形成体に対して、２３℃×５０％ＲＨ雰囲気下、引張試験機により、チャック間距離１０ｍｍ、引張速度５０ｍｍ／ｍｉｎにて引張試験を行う。初期弾性率は、伸び−応力曲線の初期接線を引き、その接線と試験片が１００％すなわち２０ｍｍまで伸びた所の交点（伸び＝２０ｍｍの直線との交点）の応力を求め、単位初期断面積当たりのその応力値を表す。最大強度は、単位初期断面積当たりの伸び−応力曲線における最大応力値をとして表される。破断伸びは、引張試験で、試験片が破断したときの伸びを表し、「破断伸び」％＝（「破断時の試験片の長さ」−「初期長さ（１０ｍｍ）」）÷「初期長さ（１０ｍｍ）」×１００で計算される。 Here, in the tensile test, the pressure-sensitive adhesive layer is formed in a cylindrical shape having a cross-sectional area of 0.75 mm and a length of 30 mm, and this formed body is measured between chucks with a tensile tester in a 23 ° C. × 50% RH atmosphere. A tensile test is performed at a distance of 10 mm and a tensile speed of 50 mm / min. The initial elastic modulus is obtained by drawing the initial tangent line of the elongation-stress curve, and obtaining the stress at the intersection of the tangent line and the test piece extending to 100 mm, that is, 20 mm (intersection point with the elongation = 20 mm straight line). The stress value per hit. The maximum strength is expressed as the maximum stress value in the elongation-stress curve per unit initial cross-sectional area. The elongation at break represents the elongation when the test piece broke in the tensile test, and “breaking elongation”% = (“length of the test piece at break” − “initial length (10 mm)”) ÷ “initial length (10 mm) "x 100.
粘着剤層の初期弾性率は０．２０〜１．５０ＭＰａ、好ましくは０．３０〜１．０ＭＰａである。初期弾性率が０．２０ＭＰａ未満であると粘着シートを被着体に貼付後再剥離した際に、粘着シートの粘着剤層の粘着剤が被着体表面に残ってしまう場合がある。初期弾性率が１．５ＭＰａより大きいと、例えば粘着シートを半導体ウエハ加工用粘着シートとして用いた場合、パターンウエハ表面の段差への粘着剤の追従性が悪くなりウエハ研削時に研削水がウエハと粘着シート界面に浸入する不具合が発生してしまう場合がある。最大強度は１．０〜８．０ＭＰａ、好ましくは２．０〜５．０ＭＰａである。最大強度が１．０ＭＰａ未満であると、粘着シートをウエハ等被着体から剥離した後、粘着剤がウエハ等被着体表面に残ってしまう場合がある。最大強度が８．０ＭＰａより大きいと、パターンウエハ表面の段差への粘着剤の追従性が悪くなり、ウエハ研削時に研削水がウエハと粘着シート界面に浸入する不具合が発生してしまう場合がある。破断伸びは１８０〜９００％、好ましくは１８０〜８００％、さらに好ましくは１８０〜５００％で、破断伸びが９００％を超えると、粘着シートを被着体に貼付後再剥離した際に粘着シートの粘着剤層の粘着剤が被着体表面に残ってしまう場合があり、破断伸びが１８０％未満であると被着体表面への有機物汚染が増大する場合が多くなる。 The initial elastic modulus of the pressure-sensitive adhesive layer is 0.20 to 1.50 MPa, preferably 0.30 to 1.0 MPa. When the initial elastic modulus is less than 0.20 MPa, the pressure-sensitive adhesive in the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet may remain on the surface of the adherend when the pressure-sensitive adhesive sheet is attached to the adherend and then peeled again. If the initial elastic modulus is greater than 1.5 MPa, for example, when an adhesive sheet is used as an adhesive sheet for processing a semiconductor wafer, the followability of the adhesive to the level difference on the surface of the patterned wafer becomes poor, and the grinding water adheres to the wafer during wafer grinding. There is a case where a problem of entering the sheet interface occurs. The maximum strength is 1.0 to 8.0 MPa, preferably 2.0 to 5.0 MPa. If the maximum strength is less than 1.0 MPa, the pressure-sensitive adhesive may remain on the surface of the adherend such as a wafer after the pressure-sensitive adhesive sheet is peeled off from the adherend such as a wafer. When the maximum strength is greater than 8.0 MPa, the followability of the adhesive to the level difference on the surface of the patterned wafer deteriorates, and there may be a problem that the grinding water enters the interface between the wafer and the adhesive sheet during wafer grinding. The elongation at break is 180 to 900%, preferably 180 to 800%, more preferably 180 to 500%. When the elongation at break exceeds 900%, the adhesive sheet is peeled off after being adhered to the adherend and then peeled off. The pressure-sensitive adhesive in the pressure-sensitive adhesive layer may remain on the surface of the adherend, and when the elongation at break is less than 180%, organic contamination on the surface of the adherend increases in many cases.
粘着剤のゲル分率は好ましくは９０％以上（例えば９０〜９９％）、特に好ましくは９５％以上（例えば９５〜９９％）である。ゲル分率が９０％未満では、被着体への汚染物の転写が増加する場合がある。ゲル分率とは、粘着剤の架橋度合いを表しており、９０％未満であると架橋度が小さいため、低分子量成分などが被着体表面に転写するなどの不具合を生じる場合があり、好ましくない。なお、ゲル分率は試料約０．１ｇをサンプリングして秤量し、これを約５０ｍｌの酢酸エチル中に室温で１週間浸漬した後、溶剤不溶分を取り出し、１３０度で約１時間乾燥して秤量することにより、上記ゲル分率（重量％）＝［（浸漬・乾燥後の重量）／試料の重量］×１００として算出されるものである。 The gel fraction of the pressure-sensitive adhesive is preferably 90% or more (for example, 90 to 99%), particularly preferably 95% or more (for example, 95 to 99%). If the gel fraction is less than 90%, transfer of contaminants to the adherend may increase. The gel fraction represents the degree of cross-linking of the pressure-sensitive adhesive, and if it is less than 90%, the degree of cross-linking is small, which may cause problems such as transfer of low molecular weight components to the adherend surface. Absent. As for the gel fraction, about 0.1 g of a sample was sampled and weighed, and this was immersed in about 50 ml of ethyl acetate at room temperature for 1 week, and then the solvent-insoluble matter was taken out and dried at 130 degrees for about 1 hour. By weighing, the gel fraction (% by weight) = [(weight after immersion / drying) / weight of sample] × 100 is calculated.
粘着剤層の初期弾性率、最大強度、破断伸び、ゲル分率等の諸特性は、例えば粘着剤組成物の主成分であるアクリルエマルション系重合体の調製において、モノマーの種類やその割合、その他の添加剤の種類や添加量を調節することや、粘着剤組成物の調整において配合する架橋剤の種類や量、放射線処理の有無やその処理条件などを選択することにより調整できる。 Various properties such as initial elastic modulus, maximum strength, elongation at break and gel fraction of the pressure-sensitive adhesive layer are, for example, in the preparation of an acrylic emulsion polymer that is the main component of the pressure-sensitive adhesive composition, the type of monomer and its ratio, etc. It can be adjusted by adjusting the type and amount of the additive, the type and amount of the crosslinking agent to be blended in the adjustment of the pressure-sensitive adhesive composition, the presence or absence of radiation treatment, and the treatment conditions.
上記放射線処理は、粘着剤組成物を調製する際に該組成物に対して行ってもよいが、支持体上に粘着剤組成物を塗布するなどして粘着剤層を形成した後、該粘着剤層に対して行うこともできる。放射線には、活性エネルギー線として、α線、β線、γ線、中性子線、電子線などの電離性放射線や、紫外線などが用いられる。放射線の照射量は、ゲル分率が上述のように９０％以上となるように調整すればよいが、電離性放射線であれば通常２−Ｍｒａｄ以下、好ましくは１０Ｍｒａｄ以下、紫外線であれば通常３０００ｍｊ／ｃｍ2以下とするのがよい。照射量が多すぎると、例えば支持体上に粘着剤層を設けた状態で該粘着剤層に対して放射線処理を行った場合であれば、支持体が劣化するなどの問題が生じやすい。なお、紫外線を照射する場合、使用する紫外線は１８０〜４６０ｎｍの波長範囲であることが好ましく、その発生源としては、水銀ランプ、メタハライドランプなどを好適に使用できる。また、紫外線を照射する処理を行う場合には、あらかじめ粘着剤組成物中に光反応開始剤（光増感剤）を含ませておくのがよい。光反応開始剤としては、例えばベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ジベンジル、ベンジルジメチルケタールなどを挙げることができる。 The radiation treatment may be performed on the composition when preparing the pressure-sensitive adhesive composition. However, after the pressure-sensitive adhesive layer is formed on the support by forming the pressure-sensitive adhesive layer, the pressure-sensitive adhesive composition is applied. It can also be performed on the agent layer. As the active energy rays, ionizing radiation such as α rays, β rays, γ rays, neutron rays, electron rays, ultraviolet rays, and the like are used for the radiation. The irradiation amount of radiation may be adjusted so that the gel fraction is 90% or more as described above. However, it is usually 2-Mrad or less, preferably 10 Mrad or less for ionizing radiation, and usually 3000 mj for ultraviolet rays. / Cm 2 or less is preferable. If the amount of irradiation is too large, for example, when radiation treatment is performed on the pressure-sensitive adhesive layer with the pressure-sensitive adhesive layer provided on the support, problems such as deterioration of the support are likely to occur. In addition, when irradiating an ultraviolet-ray, it is preferable that the ultraviolet-ray to be used is a wavelength range of 180-460 nm, and as a generation source, a mercury lamp, a metahalide lamp, etc. can be used conveniently. Moreover, when performing the process which irradiates with an ultraviolet-ray, it is good to contain a photoreaction initiator (photosensitizer) beforehand in an adhesive composition. Examples of the photoreaction initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, dibenzyl, and benzyldimethyl ketal.
本発明の粘着剤組成物からなる粘着剤層を支持体上に設けてシート状やテープ状等の形状とし、必要に応じて乾燥や放射線処理などを行うことにより、被着体に貼付後再剥離可能な本発明の粘着シートを製造することができる。粘着剤層の厚さは特に制限されないが、例えば５〜１００μｍ、好ましくは１０〜４０μｍ程度である。支持体上に粘着剤層を設ける方法は特に制限されず、公知適宜な方法により粘着シートを製造すればよい。例えば、支持体上に粘着剤組成物を直接塗布してもよく、適宜な剥離ライナー等に塗布し、成形した粘着剤層を支持体上に転写してもよい。 A pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition of the present invention is provided on a support so as to have a sheet-like or tape-like shape. The peelable pressure-sensitive adhesive sheet of the present invention can be produced. Although the thickness in particular of an adhesive layer is not restrict | limited, For example, 5-100 micrometers, Preferably it is about 10-40 micrometers. The method for providing the pressure-sensitive adhesive layer on the support is not particularly limited, and the pressure-sensitive adhesive sheet may be produced by a known appropriate method. For example, the pressure-sensitive adhesive composition may be directly applied on the support, or may be applied to an appropriate release liner or the like, and the molded pressure-sensitive adhesive layer may be transferred onto the support.
支持体としては適宜な薄葉体を何れも使用することができ特に制限されないが、例えばポリオレフィン系樹脂、ポリエステル系樹脂、塩化ビニル系樹脂、酢酸ビニル系樹脂、ポリイミド系樹脂などのブラスチックフィルムや、金属箔、又はこれらの積層体などが用いられる。支持体の厚みは特に制限されないが、例えば５０〜３００μｍ、好ましくは７０〜２００μｍ程度の範囲から選択することができる。支持体は、片面又は両面に粘着剤層との密着力向上を目的として、コロナ処理やプラズマ処理等の物理的処理、下塗り剤等の化学的処理など適宜な表面処理を施したものであってもよい。また、支持体と粘着剤層との間には、被着体（半導体ウエハなど）への接着面積の増大や、表面への追従性を向上させること、応力の緩和などを目的とする適宜な中間層を設けてもよい。 Any suitable thin leaf can be used as the support, and is not particularly limited.For example, polyolefin films, polyester resins, vinyl chloride resins, vinyl acetate resins, polyimide resins and other plastic films, A metal foil or a laminate of these is used. Although the thickness in particular of a support body is not restrict | limited, For example, it can select from the range of about 50-300 micrometers, Preferably it is about 70-200 micrometers. The support has been subjected to appropriate surface treatment such as physical treatment such as corona treatment or plasma treatment, chemical treatment such as primer for the purpose of improving the adhesion with the adhesive layer on one or both sides. Also good. In addition, between the support and the pressure-sensitive adhesive layer, an appropriate amount for the purpose of increasing the adhesion area to the adherend (semiconductor wafer or the like), improving the followability to the surface, and relaxing the stress. An intermediate layer may be provided.
また、本発明の再剥離用水分散型アクリル系粘着シートは巻回体とすることができ、剥離フィルムで粘着剤層を保護した状態でロール状に巻き取ることができる。また剥離フィルムを用いない場合、粘着シートの背面にはシリコーン系剥離剤や長鎖アルキル系剥離剤などの剥離処理剤により背面処理を施してもかまわない。 Moreover, the water-dispersed acrylic pressure-sensitive adhesive sheet for re-peeling of the present invention can be a wound body, and can be wound up in a roll shape with the pressure-sensitive adhesive layer protected by a release film. When the release film is not used, the back surface of the pressure-sensitive adhesive sheet may be subjected to a back treatment with a release treatment agent such as a silicone release agent or a long-chain alkyl release agent.
上述のようにして得られる本発明のアクリル系水分散型粘着シートは、これまでにない低汚染性の再剥離型粘着シートであって、特に半導体ウエハ加工用粘着シートとして好適に用いることができるが、その用途は何ら限定されるものではなく、半導体、回路、各種プリント基板、各種マスク、リードフレームなどの微細加工部品の際の表面保護や破損防止、あるいは異物等の除去、マスキング等幅広い用途に使用することができる。 The acrylic water-dispersed pressure-sensitive adhesive sheet of the present invention obtained as described above is an unprecedented low-contamination re-peelable pressure-sensitive adhesive sheet and can be suitably used particularly as a pressure-sensitive adhesive sheet for processing semiconductor wafers. However, its application is not limited in any way, and it has a wide range of applications such as surface protection and damage prevention for semiconductors, circuits, various printed boards, various masks, lead frames, etc., removal of foreign substances, masking, etc. Can be used for
本発明の粘着剤組成物は、層状に形成し、必要に応じて乾燥その他の処理を行い粘着剤層としたとき、被着体の凹凸によく追従し、優れた耐水浸入性を発現する。さらに、良好な再剥離性を有し、被着体に糊残りを生ずることなく再剥離可能なばかりでなく、被着体上に微細な有機物汚染をもほとんど残すことなく再剥離することができる。従って、本発明の粘着剤組成物を使用して製造した本発明の粘着シートは、低汚染性が求められる用途、例えば半導体ウエハの裏面研削時やダイシング時に使用される半導体ウエハ加工用粘着シートとして特に好適に使用することができる。本発明の半導体ウエハ加工用水分散型アクリル系粘着シートを使用して加工作業等を行うことにより、半導体チップの製造時に行われるワイヤーボンディングにおいてアルミ表面と金ワイヤー間で界面破壊することを防止でき、高いシェア強度を維持することができる。さらに、低汚染性であるという特長を生かし、使用時又は使用終了時に粘着時の剥離を伴うような用途であって、低汚染性が求められる各種用途、例えば、各種工業部材、特に半導体、回路、各種プリント基板、各種マスク、リードフレームなどの微細加工部品の製造の際に表面保護や破損防止のために使用する再剥離用水分散型アクリル系粘着シートとして幅広く利用することができる。 When the pressure-sensitive adhesive composition of the present invention is formed into a layer and dried to give a pressure-sensitive adhesive layer as necessary, the pressure-sensitive adhesive composition closely follows the unevenness of the adherend and exhibits excellent water penetration resistance. Furthermore, it has good removability and can be re-removed without leaving any adhesive residue on the adherend, and can be re-removed with almost no fine organic contamination remaining on the adherend. . Therefore, the pressure-sensitive adhesive sheet of the present invention manufactured using the pressure-sensitive adhesive composition of the present invention is used as a pressure-sensitive adhesive sheet for processing semiconductor wafers used in applications where low contamination is required, for example, when grinding or dicing a semiconductor wafer. It can be particularly preferably used. By using the water-dispersed acrylic pressure-sensitive adhesive sheet for semiconductor wafer processing of the present invention to perform processing operations, it is possible to prevent interfacial breakage between the aluminum surface and the gold wire in wire bonding performed at the time of manufacturing the semiconductor chip, High share strength can be maintained. Furthermore, taking advantage of its low contamination property, it is used in applications that involve peeling during adhesion at the time of use or at the end of use, and various applications that require low contamination properties, such as various industrial members, especially semiconductors, circuits, etc. It can be widely used as a re-peeling water-dispersed acrylic pressure-sensitive adhesive sheet used for surface protection and damage prevention in the manufacture of microfabricated parts such as various printed boards, various masks, and lead frames.
以下に実施例を挙げて本発明をより詳細に説明するが、本発明はこれら実施例により何ら限定されるものではない。 EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.
〈試験評価〉
実施例比較例で得た粘着シートについて、以下の試験を行った。結果を表３に示す。
（ガラス転移温度）
レオメトリック社製の動的粘弾性測定装置［商品名『ＡＲＥＳ』］を用いて、サンプル厚さ約１．５ｍｍで、φ７．９ｍｍパラレルプレートの治具を用い、周波数１Ｈｚ、昇温速度５℃／分にて測定し、得られた損失弾性率のピーク点の温度をガラス転移温度とした。
<Test evaluation>
The following test was done about the adhesive sheet obtained by the Example comparative example. The results are shown in Table 3.
(Glass-transition temperature)
Using a dynamic viscoelasticity measuring device [trade name “ARES”] manufactured by Rheometric Co., Ltd., using a jig having a sample thickness of about 1.5 mm, a φ7.9 mm parallel plate, a frequency of 1 Hz, and a heating rate of 5 ° C. The temperature at the peak point of the obtained loss modulus was taken as the glass transition temperature.
（初期弾性率・最大強度・破断伸び）
断面積０．７５ｍｍ、長さ３０ｍｍの円柱状の粘着剤を作成し、２３℃×５０％ＲＨ雰囲気下、引張試験機により、チャック間距離１０ｍｍ、引張速度５０ｍｍ／ｍｉｎにて引張試験を行う。初期弾性率は、伸び−応力曲線の初期接線を引き、その接線と試験片が１００％すなわち２０ｍｍまで伸びた所の交点（伸び＝２０ｍｍの直線との交点）の応力を求め、単位初期断面積当たりのその応力値として表される。最大強度は、単位初期断面積当たりの伸び−応力曲線における最大応力値を表す。破断伸びは、引張試験で、試験片が破断したときの伸びを表し、「破断伸び」％＝（「破断時の試験片の長さ」−「初期長さ（１０ｍｍ）」）÷「初期長さ（１０ｍｍ）」×１００で計算される。
(Initial elastic modulus, maximum strength, elongation at break)
A cylindrical pressure-sensitive adhesive having a cross-sectional area of 0.75 mm and a length of 30 mm is prepared, and a tensile test is performed at a distance between chucks of 10 mm and a tensile speed of 50 mm / min with a tensile tester in an atmosphere of 23 ° C. × 50% RH. The initial elastic modulus is obtained by drawing the initial tangent line of the elongation-stress curve, and obtaining the stress at the intersection of the tangent line and the test piece extending to 100 mm, that is, 20 mm (intersection point with the elongation = 20 mm straight line). It is expressed as its stress value per hit. The maximum strength represents the maximum stress value in the elongation-stress curve per unit initial cross-sectional area. The elongation at break represents the elongation when the test piece broke in the tensile test, and “breaking elongation”% = (“length of the test piece at break” − “initial length (10 mm)”) ÷ “initial length (10 mm) "x 100.
（ゲル分率）
粘着剤のゲル分率は、試料０．１ｇをサンプリングして精秤し、これを約５０ｍｌの酢酸エチル中に室温で一週間浸漬したのち、溶剤不溶分を取り出し、１３０℃で約１時間乾燥して、秤量することにより、「上記ゲル分率（重量％）」＝［（浸漬・乾燥後の重量）÷試料の重量］×１００として算出される。
（対ウエハ有機物汚染）
粘着シート片をアルミ蒸着ウエハ（１２〜１３atomic％）に、テープ貼り合わせ機［商品名『ＤＲ８５００−II』（日東精機（株）製）］にて貼り付け（貼り付け圧力：０．２５ＭＰａ、貼り付け速度２．４ｍ／ｍｉｎ）、４０℃中に１日放置後、シート片をテープ剥離機［商品名『ＨＲ８５００−II』（日東精機（株）製）］にて剥離し（剥離速度８ｍ／ｍｉｎ、剥離角度１８０度）、ウエハ上に転写した有機物をＥＳＣＡ［商品名『ｍｏｄｅ１５４００』（アルバックファイ社製）］を用いて測定した。全く粘着シートを貼り付けていないウエハも同様に分析し、検出された炭素原子のatomic％の増加量により有機物の転写量を評価した。対ウエハ有機物汚染増加量は１０atomic％以下が望ましい。
(Gel fraction)
As for the gel fraction of the pressure-sensitive adhesive, 0.1 g of a sample was sampled and weighed accurately. After immersing the sample in about 50 ml of ethyl acetate at room temperature for one week, the solvent-insoluble matter was taken out and dried at 130 ° C. for about 1 hour. Then, by weighing, “the gel fraction (% by weight)” = [(weight after immersion / drying) ÷ weight of sample] × 100.
(Vs. wafer organic contamination)
Adhesive sheet pieces are attached to an aluminum vapor-deposited wafer (12 to 13 atomic%) with a tape bonding machine [trade name “DR8500-II” (manufactured by Nitto Seiki Co., Ltd.)] (adhesion pressure: 0.25 MPa, adhesion) (Attachment speed 2.4 m / min) After leaving at 40 ° C. for 1 day, the sheet piece is peeled off with a tape peeling machine [trade name “HR8500-II” (manufactured by Nitto Seiki Co., Ltd.)] (peeling speed 8 m / min). min, peeling angle 180 degrees), and the organic substance transferred onto the wafer was measured using ESCA [trade name “mode15400” (manufactured by ULVAC-PHI)]. Wafers without any adhesive sheet were analyzed in the same manner, and the amount of organic matter transferred was evaluated based on the increase in atomic% of detected carbon atoms. The increase in the amount of organic contamination with respect to the wafer is desirably 10 atomic% or less.
（糊残り性）
ＰＩウエハ上に、厚み２０μｍ、幅２ｍｍのテープを貼り付け、高さ２０μｍの段差を作る。段差と垂直方向に、幅２０ｍｍの粘着シート片を２ｋｇの圧着荷重で貼り付ける。そのサンプルを６０℃で１日保存後、２３℃雰囲気下で２時間保存し冷却をする。その後粘着シート片を剥離角度１８０度、引張速度３００ｍｍ／ｍｉｎにて剥離する。剥離後、ＰＩウエハ表面の状態を、光学顕微鏡を用いて観察し、糊残りが見られたものを『×』、見られなかったものを『○』とし評価を行った。
(Adhesive residue)
A tape having a thickness of 20 μm and a width of 2 mm is pasted on the PI wafer to form a step having a height of 20 μm. In the direction perpendicular to the step, an adhesive sheet piece having a width of 20 mm is attached with a pressure load of 2 kg. The sample is stored at 60 ° C. for 1 day and then stored in a 23 ° C. atmosphere for 2 hours to cool. Thereafter, the pressure-sensitive adhesive sheet piece is peeled at a peeling angle of 180 degrees and a tensile speed of 300 mm / min. After peeling, the state of the PI wafer surface was observed using an optical microscope, and the evaluation was made with “X” when the adhesive residue was observed and “◯” when the adhesive was not observed.
（パーティクル数）
クリーンルーム内でセパレーターを剥離してその粘着剤層を介して粘着シート片を４インチミラーウエハーに接着して２３℃で１時間放置した後、粘着シート片を剥離速度１２ｍ／ｍｉｎ、剥離角度１８０度で剥離し、ミラーウエハ面における０．２８μｍ以上のパーティクル数をレーザー表面検査装置［商品名『ＬＳ−５０００』（日立電子エンジニアリング（株）製）］にて評価した。パーティクル数は１００個／４インチウエハ以下であることが望ましい。
(Number of particles)
The separator was peeled off in a clean room, and the adhesive sheet piece was adhered to a 4-inch mirror wafer through the adhesive layer and allowed to stand at 23 ° C. for 1 hour, and then the adhesive sheet piece was peeled at a peeling speed of 12 m / min and a peeling angle of 180 degrees. And the number of particles of 0.28 μm or more on the mirror wafer surface was evaluated with a laser surface inspection apparatus [trade name “LS-5000” (manufactured by Hitachi Electronics Engineering)]. The number of particles is desirably 100 or less than 4 inches wafer.
（耐水浸入性）
高さ７μｍ、エッジリンス幅３．５ｍｍにポリイミドでコーティングされた８インチウエハを、幅９０μｍ、高さ７μｍのストリートを１０ｍｍ間隔でＸＹ方向に作成し、碁盤目上にストリートラインがあるサンプルウエハを作製した。このウエハをＪＥＯＬ社製：商品名「ＪＥＨ−０１ＴＳ」により下表１の条件にて酸素プラズマ処理を行い、エッジリンス上のＰＩ残渣を除去した。このウエハに、テープ貼り合わせ機［商品名『ＤＲ８５００−II』（日東精機（株）製）］にて粘着シート片を貼り付け（貼り付け圧力：０．２５ＭＰａ、貼り付け速度２．４ｍ／ｍｉｎ）、２３℃中に１時間放置後、ウエハ裏面研削機［商品名『８４６０』（ＤＩＳＣＯ社製）］にてウエハ裏面を表２記載の条件で、厚み７３０μｍから２５０μｍまで研削後、粘着シート片をテープ剥離機［商品名『ＨＲ８５００−II』（日東精機 （株）製）］にて剥離する（剥離速度８ｍ／ｍｉｎ、剥離角度１８０度）。ウエハストリートおよびその周辺に水浸入した跡を光学顕微鏡で観察し、水浸入した面積比率を出す。水浸入が見られたものを『×』、見られなかったものを『○』とし評価を行った。
(Water penetration resistance)
An 8-inch wafer coated with polyimide with a height of 7 μm and an edge rinse width of 3.5 mm is created in 90 mm width and 7 μm high streets in the XY direction at intervals of 10 mm, and a sample wafer with street lines on the grid Produced. This wafer was subjected to oxygen plasma treatment under the conditions shown in Table 1 below under the trade name “JEH-01TS” manufactured by JEOL Co. to remove PI residue on the edge rinse. Adhesive sheet pieces were pasted on this wafer with a tape laminating machine [trade name “DR8500-II” (manufactured by Nitto Seiki Co., Ltd.)] (pasting pressure: 0.25 MPa, pasting speed 2.4 m / min) ), Left at 23 ° C. for 1 hour, and after grinding the wafer back surface with a wafer back grinding machine [trade name “8460” (manufactured by DISCO)] from the thickness of 730 μm to 250 μm under the conditions shown in Table 2, a piece of adhesive sheet Is peeled off with a tape peeling machine [trade name “HR8500-II” (manufactured by Nitto Seiki Co., Ltd.)] (peeling speed 8 m / min, peeling angle 180 degrees). The trace of water intrusion into the wafer street and its periphery is observed with an optical microscope, and the area ratio of water intrusion is obtained. Evaluations were made with “×” indicating that water intrusion was observed and “○” indicating that water infiltration was not observed.
（実施例１）
冷却管、窒素導入管、温度計、撹拌装置を備えた反応容器に、水１８０重量部、アクリル酸２−エチルヘキシル５５重量部、メタクリル酸ｎ−ブチル４０重量部、メタクリル酸２−ヒドロキシエチル２重量部、アクリル酸２重量部、ダイアセトンアクリルアミド１重量部及びエーテルサルフェート型の反応性ノニオンアニオン系界面活性剤（旭電化工業（株）製：商品名「アデカソープＳＥ−１０Ｎ」）をアルコール沈殿ろ過により精製し、不純物ＳＯ4 2-イオン濃度を５６０μｇ／ｇから７０μｇ／ｇ以下とした乳化剤２重量部部を乳化機で乳化して得られたエマルジョン溶液を仕込み、撹拌下１時間窒素置換した。以後、重合中の内浴温度は２５℃に制御した。ここに過酸化水素水（３０重量％）０．１重量部を加えた後、アスコルビン酸０．０５重量部及び水１０重量部からなるアスコルビン酸水溶液１ｍｌ添加し重合を開始させた。重合開始から５時間後から残りのアスコルビン酸水溶液を２時間かけて滴下し、さらに２時間反応を熟成し完了した。その後、１０重量％のアンモニア水で中和してアクリルエマルション系重合体Ａを作製した。
アクリルエマルション系重合体Ａ１００重量部にヒドラジン架橋剤としてアジピン酸ジヒドラジドを粘着剤組成物の全固形分１００重量部に対して０．５重量部添加してアクリル系粘着剤組成物とした。この粘着剤組成物を厚さ６０μｍのポリオレフィンフィルムの片面に塗工し、１００℃で３分間乾燥して、厚さ１５μｍの粘着剤層を形成し、該粘着剤層の粘着面にコロナ放電式で表面酸化処理をしたエチレン−酢酸ビニル共重合体フィルム（厚さ１３５μｍ）を貼り合わせ、粘着剤層を転写し粘着シートを得た。
粘着剤層のガラス転移温度は−４０℃、初期弾性率は０．３４MＰａ、最大強度は１．２MＰａ、破断伸びは２９０％、ゲル分率は９８％であった。
Example 1
In a reaction vessel equipped with a cooling pipe, a nitrogen introduction pipe, a thermometer, and a stirring device, 180 parts by weight of water, 55 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of n-butyl methacrylate, 2 parts by weight of 2-hydroxyethyl methacrylate Part by weight, 2 parts by weight of acrylic acid, 1 part by weight of diacetone acrylamide and ether sulfate type reactive nonionic anionic surfactant (manufactured by Asahi Denka Kogyo Co., Ltd .: trade name “Adekasoap SE-10N”) by alcohol precipitation filtration An emulsion solution obtained by purifying and emulsifying 2 parts by weight of an emulsifier with an impurity SO 4 2− ion concentration of 560 μg / g to 70 μg / g or less was prepared using an emulsifier, and the atmosphere was purged with nitrogen for 1 hour with stirring. Thereafter, the inner bath temperature during the polymerization was controlled at 25 ° C. After 0.1 parts by weight of hydrogen peroxide (30% by weight) was added thereto, 1 ml of an ascorbic acid aqueous solution consisting of 0.05 parts by weight of ascorbic acid and 10 parts by weight of water was added to initiate polymerization. The remaining ascorbic acid aqueous solution was dropped over 2 hours after 5 hours from the start of polymerization, and the reaction was further aged for 2 hours to complete the reaction. Thereafter, the emulsion was neutralized with 10% by weight of ammonia water to prepare an acrylic emulsion polymer A.
0.5 parts by weight of adipic acid dihydrazide as a hydrazine crosslinking agent was added to 100 parts by weight of the acrylic emulsion polymer A to 100 parts by weight of the total solid content of the pressure-sensitive adhesive composition to prepare an acrylic pressure-sensitive adhesive composition. This pressure-sensitive adhesive composition is applied to one side of a polyolefin film having a thickness of 60 μm and dried at 100 ° C. for 3 minutes to form a pressure-sensitive adhesive layer having a thickness of 15 μm. Then, an ethylene-vinyl acetate copolymer film (thickness 135 μm) subjected to surface oxidation treatment was bonded together, and the adhesive layer was transferred to obtain an adhesive sheet.
The pressure-sensitive adhesive layer had a glass transition temperature of −40 ° C., an initial elastic modulus of 0.34 MPa, a maximum strength of 1.2 MPa, an elongation at break of 290%, and a gel fraction of 98%.
（実施例２）
モノマーをアクリル酸ｎ−ブチル７８重量部、メタクリル酸ｎ−ブチル１７重量部、メタクリル酸２−ヒドロキシエチル２重量部、アクリル酸２重量部、ダイアセトンアクリルアミド１重量部とした以外は、実施例１と同様の操作を行いアクリルエマルション系重合体Ｂを作製した。
続いて、アクリルエマルション系重合体Ａのかわりにアクリルエマルション系重合体Ｂを使用した以外は実施例１と同様の操作により粘着シートを作製した。
粘着剤層のガラス転移温度は−４２℃、初期弾性率は０．３８MＰａ、最大強度は１．６MＰａ、破断伸びは２６０％、ゲル分率は９８％であった。
(Example 2)
Example 1 except that the monomer was 78 parts by weight of n-butyl acrylate, 17 parts by weight of n-butyl methacrylate, 2 parts by weight of 2-hydroxyethyl methacrylate, 2 parts by weight of acrylic acid, and 1 part by weight of diacetone acrylamide. An acrylic emulsion polymer B was prepared in the same manner as described above.
Subsequently, a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the acrylic emulsion polymer B was used instead of the acrylic emulsion polymer A.
The pressure-sensitive adhesive layer had a glass transition temperature of −42 ° C., an initial elastic modulus of 0.38 MPa, a maximum strength of 1.6 MPa, an elongation at break of 260%, and a gel fraction of 98%.
（比較例１）
ヒドラジン架橋剤（アジピン酸ジヒドラジド）を使用しなかった以外は、実施例１と同様の操作を行い粘着シートを作製した。
粘着剤層のガラス転移温度は−４０℃、初期弾性率は０．１９MＰａ、最大強度は１．１MＰａ、破断伸びは５７０％、ゲル分率は９２％であった。
(Comparative Example 1)
A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the hydrazine crosslinking agent (adipic acid dihydrazide) was not used.
The pressure-sensitive adhesive layer had a glass transition temperature of −40 ° C., an initial elastic modulus of 0.19 MPa, a maximum strength of 1.1 MPa, an elongation at break of 570%, and a gel fraction of 92%.
（比較例２）
モノマーとしてアクリル酸ｎ−ブチル３７重量部、メタクリル酸ｎ−ブチル５８重量部、メタクリル酸２−ヒドロキシエチル２重量部、アクリル酸２重量部、ダイアセトンアクリルアミド１重量部を使用した以外は実施例１と同様の操作を行いアクリルエマルション系重合体Ｃを作製した。
アクリルエマルション系重合体Ａのかわりにアクリルエマルション系重合体Ｃを使用した以外は実施例１と同様の操作をおこない粘着シートを作製した。
粘着剤層のガラス転移温度は−１５℃、初期弾性率は２．０２MＰａ、最大強度は６．７MＰａ、破断伸びは１８５％、ゲル分率は９９％であった。
(Comparative Example 2)
Example 1 except that 37 parts by weight of n-butyl acrylate, 58 parts by weight of n-butyl methacrylate, 2 parts by weight of 2-hydroxyethyl methacrylate, 2 parts by weight of acrylic acid and 1 part by weight of diacetone acrylamide were used as monomers. An acrylic emulsion polymer C was prepared in the same manner as described above.
An adhesive sheet was prepared in the same manner as in Example 1 except that the acrylic emulsion polymer C was used instead of the acrylic emulsion polymer A.
The pressure-sensitive adhesive layer had a glass transition temperature of −15 ° C., an initial elastic modulus of 2.02 MPa, a maximum strength of 6.7 MPa, an elongation at break of 185%, and a gel fraction of 99%.
（比較例３）
ヒドラジン架橋剤（アジピン酸ジヒドラジド）のかわりに１，３−ビス（Ｎ，Ｎ−グリシジルアミノメチル）シクロヘキサン（三菱瓦斯化学（株）製：商品名「テトラッドＣ」）を２重量部、（株）日本触媒製：商品名「エポクロスＷＳ−５００」を０．５重量部使用した以外は実施例１と同様の操作を行い粘着テープを作製した。
粘着剤層のガラス転移温度は−４０℃、初期弾性率は１．５３MＰａ、最大強度は２．０MＰａ、破断伸びは１５０％、ゲル分率は９８％であった。
(Comparative Example 3)
2 parts by weight of 1,3-bis (N, N-glycidylaminomethyl) cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd .: trade name “Tetrad C”) instead of hydrazine crosslinking agent (adipic acid dihydrazide), Nippon Shokubai Co., Ltd .: An adhesive tape was prepared in the same manner as in Example 1 except that 0.5 parts by weight of trade name “Epocross WS-500” was used.
The glass transition temperature of the pressure-sensitive adhesive layer was −40 ° C., the initial elastic modulus was 1.53 MPa, the maximum strength was 2.0 MPa, the elongation at break was 150%, and the gel fraction was 98%.
（比較例４）
ヒドラジン架橋剤（アジピン酸ジヒドラジド）のかわりに１，３−ビス（Ｎ，Ｎ−グリシジルアミノメチル）シクロヘキサン（三菱瓦斯化学（株）製：商品名「テトラッドＣ」）０．５重量部を使用した以外は実施例１と同様の操作を行い粘着テープを作製した。
粘着剤層のガラス転移温度は−４０℃、初期弾性率は０．４８MＰａ、最大強度は２．３MＰａ、破断伸びは２８５％、ゲル分率は９８％であった。
(Comparative Example 4)
Instead of the hydrazine crosslinking agent (adipic acid dihydrazide), 0.5 parts by weight of 1,3-bis (N, N-glycidylaminomethyl) cyclohexane (trade name “Tetrad C” manufactured by Mitsubishi Gas Chemical Co., Inc.) was used. Except for the above, the same operation as in Example 1 was performed to produce an adhesive tape.
The pressure-sensitive adhesive layer had a glass transition temperature of −40 ° C., an initial elastic modulus of 0.48 MPa, a maximum strength of 2.3 MPa, an elongation at break of 285%, and a gel fraction of 98%.
表３の結果から明らかなように、実施例の粘着シートは対ウエハ有機物汚染増加量が５ａｔｏｍｉｃ％以下、パーティクル数も２５個／４インチウエハ以下であり、被着体表面への汚染が少なく、又糊残り性や耐水浸入性が良好である水分散型アクリル系粘着シートであることがわかる。これに対し、ヒドラジン架橋剤を配合しない比較例１では被着体への汚染物、パーティクル数が多く、かつ糊残り性が悪い。また粘着剤のガラス転移温度が高く、初期弾性率が高い比較例２では耐水浸入性が低く、又ヒドラジン架橋剤のかわりにエポキシ系架橋剤とオキサゾリン系架橋剤を使用した比較例３では、初期弾性率が高く耐水浸入性が悪い。ヒドラジン架橋剤の代わりに、エポキシ系架橋剤を使用し、さらにその配合量を比較例３における配合量よりも少なくした比較例４は、初期弾性率は問題なく、耐水浸入性は良好であるが、被着体への汚染物、パーティクル数が多い。 As is clear from the results in Table 3, the adhesive sheet of the example has an increase in organic contamination of the wafer of 5 atomic% or less, and the number of particles is 25/4 inches or less, and the adherend surface is less contaminated. It can also be seen that this is a water-dispersed acrylic pressure-sensitive adhesive sheet having good adhesive residue and water penetration resistance. On the other hand, in Comparative Example 1 in which no hydrazine crosslinking agent is blended, there are many contaminants and particles on the adherend, and the adhesive residue is poor. In Comparative Example 2 where the adhesive has a high glass transition temperature and a high initial elastic modulus, the water penetration resistance is low, and in Comparative Example 3 where an epoxy crosslinking agent and an oxazoline crosslinking agent are used in place of the hydrazine crosslinking agent, High elastic modulus and poor water penetration. In Comparative Example 4 in which an epoxy-based crosslinking agent was used instead of the hydrazine crosslinking agent and the blending amount thereof was smaller than the blending amount in Comparative Example 3, the initial elastic modulus was satisfactory and the water penetration resistance was good. There are many contaminants and particles on the adherend.
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| KR1020060131785A KR20070066929A (en) | 2005-12-22 | 2006-12-21 | Removable water-dispersible acrylic adhesive composition and adhesive sheet |
| US11/643,764 US7491772B2 (en) | 2005-12-22 | 2006-12-22 | Removable water-dispersible acrylic adhesive composition and adhesive sheet |
| CN 200610170782 CN1986716A (en) | 2005-12-22 | 2006-12-22 | Removable water-dispersible acrylic adhesive composition and adhesive sheet |
| TW095148629A TW200732445A (en) | 2005-12-22 | 2006-12-22 | Removable water-dispersible acrylic adhesive composition and adhesive sheet |
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| JP2010235710A (en) * | 2009-03-30 | 2010-10-21 | Lintec Corp | Water-dispersed pressure-sensitive acrylic adhesive composition, pressure-sensitive adhesive sheet and method for using the same |
| JP2010248465A (en) * | 2009-03-26 | 2010-11-04 | Dic Corp | Water dispersion type acrylic adhesive composition and adhesive tape |
| GB2482531A (en) * | 2010-08-05 | 2012-02-08 | Loctite R & D Ltd | Adhesive composition with enhanced cure through volume |
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| CN1986716A (en) | 2007-06-27 |
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