CN111154449B - Preparation method of photosensitive adhesive for building bonding - Google Patents
Preparation method of photosensitive adhesive for building bonding Download PDFInfo
- Publication number
- CN111154449B CN111154449B CN202010024844.5A CN202010024844A CN111154449B CN 111154449 B CN111154449 B CN 111154449B CN 202010024844 A CN202010024844 A CN 202010024844A CN 111154449 B CN111154449 B CN 111154449B
- Authority
- CN
- China
- Prior art keywords
- mixture
- parts
- stirring
- mixing
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to the technical field of building auxiliaries, and particularly relates to a preparation method of a photosensitive adhesive for building adhesion. The polyimide is synthesized by taking pyromellitic dianhydride as a basic monomer, dimethyl terephthalate is added to modify the polyimide in the synthesis process to increase the bonding property of the polyimide, meanwhile, a modifier is used for modifying to increase the active groups in the polyimide to improve the photosensitive property, then the polyimide is mixed with a mixed monomer, the mixed monomer is polymerized under the action of a catalyst and an initiator to form an oxygen anion polymer, and the oxygen anion polymer is combined and compounded with the polymer to further improve the photosensitive property and enhance the bonding property under the action of oxygen anion release of the polymer.
Description
Technical Field
The invention belongs to the technical field of building auxiliaries, and particularly relates to a preparation method of a photosensitive adhesive for building adhesion.
Background
The adhesive bonding refers to a technology for bonding surfaces of homogeneous or heterogeneous objects together by using an adhesive, and has the characteristics of continuous stress distribution, light weight, sealing, low temperature of most processes and the like. The glue joint is particularly suitable for connecting different materials, different thicknesses, ultrathin specifications and complex components. The adhesive joint is the fastest in recent development and has wide application industry. The adhesives are classified into thermosetting type, hot melt type, room temperature curing type, pressure sensitive type and the like according to application methods; according to the application object, the glue is divided into structural type, non-structural type or special glue; the bonding form can be divided into water-soluble type, water-emulsion type, solvent type, and various solid type. Synthetic chemists often prefer to classify adhesives by the chemical composition of the binder.
The interfacial adhesion between the polymer base material and different materials exists among polymers, between polymers and nonmetal or metal, between metal and nonmetal, and the like. Bonding is the result of post-contact interaction between interfaces of dissimilar materials. Therefore, the role of the interface layer is a fundamental problem studied in the science of gluing. Such as interfacial tension, surface free energy, nature of functional groups, interfacial reactions between the adherend and the binder, all affect the adhesion. The existing cementing theory explains the principle from a certain aspect, so that the comprehensive and unique theory does not exist so far.
Disclosure of Invention
The invention aims to solve the technical problem that the existing building adhesive is poor in adhesive effect, and provides a photosensitive adhesive for building adhesion.
In order to solve the technical problems, the invention adopts the following technical scheme:
a preparation method of photosensitive adhesive for building bonding comprises the following steps:
(1) Putting the mixed solvent and the mixture into a reaction kettle according to the mass ratio of 16-7, preheating at 35-40 ℃ under the protection of nitrogen, adding phthalic anhydride accounting for 15-20% of the mass of the mixture, heating to 45-48 ℃, and stirring;
(2) After stirring, adding a modifier accounting for 3-6% of the mass of the mixture, cooling to 3-5 ℃, adding dichloro oxygen sulfur accounting for 2-5% of the mass of the mixture, stirring, adding diaminodiphenyl ether accounting for 1-3% of the mass of the mixture, stirring for reaction, and collecting a reaction mixture;
(3) Taking 160-180 parts of tetrahydrofuran, 50-60 parts of reaction mixture, 20-30 parts of mixed monomer, 5-8 parts of initiator and 1-3 parts of catalyst according to parts by weight, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and carrying out nitrogen protection and preheating;
(4) After preheating is finished, raising the temperature and the pressure, adding an initiator, stirring and reacting for 9-13 h at the speed of 900r/min, cooling to room temperature, discharging, placing at 3-6 ℃, standing, removing the solvent by rotary evaporation, collecting the remainder, and mixing the remainder with the styrene-acrylic emulsion according to the mass ratio of 16-9 to obtain the photosensitive adhesive for building bonding.
The mixed solvent in the step (1) is formed by mixing acetone and N-methyl pyrrolidone according to a volume ratio of 5.
The mixture in the step (1) is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12.
The modifier in the step (2) is formed by mixing cinnamyl alcohol and triethylamine according to the mass ratio of 6.
The mixed monomer is formed by mixing hydroxyethyl methacrylate and glycidyl methacrylate according to the mass ratio of 6-8.
The initiator is any one of potassium tert-butoxide and potassium methoxide.
The catalyst is a palladium carbon catalyst.
Compared with other methods, the method has the beneficial technical effects that:
the polyimide is synthesized by taking pyromellitic dianhydride as a basic monomer, dimethyl terephthalate is added to modify the polyimide in the synthesis process to increase the bonding property of the polyimide, meanwhile, a modifier is used for modifying to increase the active groups in the polyimide to improve the photosensitive property, then the polyimide is mixed with a mixed monomer, the mixed monomer is polymerized under the action of a catalyst and an initiator to form an oxygen anion polymer, and the oxygen anion polymer is combined and compounded with the polymer to further improve the photosensitive property and enhance the bonding property under the action of oxygen anion release of the polymer.
Detailed Description
The mixed solvent is formed by mixing acetone and N-methyl pyrrolidone according to the volume ratio of 5.
The mixture is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12.
The modifier is formed by mixing cinnamyl alcohol and triethylamine according to a mass ratio of 6.
The mixed monomer is formed by mixing hydroxyethyl methacrylate and glycidyl methacrylate according to the mass ratio of 6-8.
The initiator is any one of potassium tert-butoxide and potassium methoxide.
The catalyst is a palladium carbon catalyst.
A preparation method of photosensitive adhesive for building bonding comprises the following steps:
(1) Putting the mixed solvent and the mixture into a reaction kettle according to the mass ratio of 16-7, preheating for 20min at 35-40 ℃ under the protection of nitrogen, adding phthalic anhydride accounting for 15-20% of the mass of the mixture, heating to 45-48 ℃, and stirring for 7-9 h;
(2) After stirring, adding a modifier accounting for 3-6% of the mass of the mixture, cooling to 3-5 ℃, adding dichloro oxygen sulfur accounting for 2-5% of the mass of the mixture, stirring for 8 hours at 600r/min, adding diaminodiphenyl ether accounting for 1-3% of the mass of the mixture, stirring for 5 hours, and collecting a reaction mixture;
(3) Taking 160-180 parts by weight of tetrahydrofuran, 50-60 parts by weight of reaction mixture, 20-30 parts by weight of mixed monomer, 5-8 parts by weight of initiator and 1-3 parts by weight of catalyst, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and preheating for 50min at 60 ℃ under the protection of nitrogen;
(4) After preheating, heating to 110-120 ℃, boosting to 0.6MPa, adding an initiator, stirring at 900r/min for reaction for 9-13 h, cooling to room temperature, discharging, placing at 3-6 ℃, standing for 5h, removing a solvent by rotary evaporation, collecting residues, and mixing the residues with a styrene-acrylic emulsion according to a mass ratio of 16-9 to obtain the photosensitive adhesive for building bonding.
Example 1
The mixed solvent is formed by mixing acetone and N-methyl pyrrolidone according to the volume ratio of 5.
The mixture is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12.
The modifier is formed by mixing cinnamyl alcohol and triethylamine according to a mass ratio of 6.
The mixed monomer is prepared by mixing hydroxyethyl methacrylate and glycidyl methacrylate according to the mass ratio of 6.
The initiator is any one of potassium tert-butoxide and potassium methoxide.
The catalyst is palladium carbon catalyst.
A preparation method of photosensitive adhesive for building bonding comprises the following steps:
(1) Placing the mixed solvent and the mixture into a reaction kettle according to a mass ratio of 16;
(2) After stirring, adding a modifier accounting for 6% of the mass of the mixture, cooling to 5 ℃, adding dichlorooxysulfide accounting for 5% of the mass of the mixture, stirring at 600r/min for 8 hours, adding diaminodiphenyl ether accounting for 3% of the mass of the mixture, stirring for reacting for 5 hours, and collecting a reaction mixture;
(3) Taking 180 parts of tetrahydrofuran, 60 parts of reaction mixture, 30 parts of mixed monomer, 8 parts of initiator and 3 parts of catalyst according to parts by weight, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and preheating for 50min at 60 ℃ under the protection of nitrogen;
(4) After preheating is finished, heating to 120 ℃, boosting the pressure to 0.6MPa, adding an initiator, stirring at 900r/min for reaction for 13h, cooling to room temperature, discharging, placing at 6 ℃, standing for 5h, removing the solvent by rotary evaporation, collecting the residues, and mixing the residues with the styrene-acrylic emulsion according to a mass ratio of 16.
Example 2
The mixed solvent is formed by mixing acetone and N-methyl pyrrolidone according to the volume ratio of 5.
The mixture is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12.
The modifier is formed by mixing cinnamyl alcohol and triethylamine according to a mass ratio of 6.
The mixed monomer is prepared by mixing hydroxyethyl methacrylate and glycidyl methacrylate according to the mass ratio of 6. The initiator is any one of potassium tert-butoxide and potassium methoxide.
The catalyst is a palladium carbon catalyst.
A preparation method of photosensitive adhesive for building bonding comprises the following steps:
(1) Placing the mixed solvent and the mixture into a reaction kettle according to a mass ratio of 16;
(2) After stirring, adding a modifier accounting for 5% of the mass of the mixture, cooling to 4 ℃, adding dichlorooxysulfide accounting for 4% of the mass of the mixture, stirring at 600r/min for 8 hours, adding diaminodiphenyl ether accounting for 2% of the mass of the mixture, stirring for reacting for 5 hours, and collecting a reaction mixture;
(3) Taking 170 parts of tetrahydrofuran, 55 parts of reaction mixture, 25 parts of mixed monomer, 6 parts of initiator and 2 parts of catalyst according to parts by weight, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and preheating for 50min at 60 ℃ under the protection of nitrogen;
(4) After preheating is finished, heating to 115 ℃, boosting to 0.6MPa, adding an initiator, stirring at 900r/min for reaction for 11h, cooling to room temperature, discharging, placing at 5 ℃, standing for 5h, removing the solvent by rotary evaporation, collecting the residues, and mixing the residues with the styrene-acrylic emulsion according to a mass ratio of 16.
Example 3
The mixed solvent is formed by mixing acetone and N-methyl pyrrolidone according to the volume ratio of 5.
The mixture is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12.
The modifier is formed by mixing cinnamyl alcohol and triethylamine according to a mass ratio of 6.
The mixed monomer is prepared by mixing hydroxyethyl methacrylate and glycidyl methacrylate according to a mass ratio of 6.
The initiator is any one of potassium tert-butoxide and potassium methoxide.
The catalyst is a palladium carbon catalyst.
A preparation method of photosensitive adhesive for building bonding comprises the following steps:
(1) Placing the mixed solvent and the mixture into a reaction kettle according to a mass ratio of 16;
(2) After stirring, adding a modifier accounting for 3-6% of the mass of the mixture, cooling to 3 ℃, adding dichloro oxygen sulfur accounting for 2% of the mass of the mixture, stirring at 600r/min for 8 hours, adding diaminodiphenyl ether accounting for 1% of the mass of the mixture, stirring for reaction for 5 hours, and collecting a reaction mixture;
(3) Taking 160 parts of tetrahydrofuran, 50 parts of reaction mixture, 20 parts of mixed monomer, 5 parts of initiator and 1 part of catalyst according to parts by weight, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and preheating for 50min at 60 ℃ under the protection of nitrogen;
(4) After preheating is finished, raising the temperature to 110 ℃, boosting the pressure to 0.6MPa, adding an initiator, stirring at 900r/min for reaction for 9 hours, cooling to room temperature, discharging, placing at 3 ℃, standing for 5 hours, removing the solvent by rotary evaporation, collecting the residues, and mixing the residues with the styrene-acrylic emulsion according to the mass ratio of 16.
Comparative example 1
The mixed solvent is formed by mixing acetone and N-methyl pyrrolidone according to the volume ratio of 5.
The mixture is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12.
The mixed monomer is prepared by mixing hydroxyethyl methacrylate and glycidyl methacrylate according to a mass ratio of 6.
The initiator is any one of potassium tert-butoxide and potassium methoxide.
The catalyst is a palladium carbon catalyst.
A preparation method of photosensitive adhesive for building bonding comprises the following steps:
(1) Placing the mixed solvent and the mixture into a reaction kettle according to a mass ratio of 16;
(2) After stirring, cooling to 4 ℃, adding dichlorooxysulfide accounting for 4% of the mass of the mixture, stirring at 600r/min for 8 hours, adding diaminodiphenyl ether accounting for 2% of the mass of the mixture, stirring for reaction for 5 hours, and collecting a reaction mixture;
(3) Taking 170 parts of tetrahydrofuran, 55 parts of reaction mixture, 25 parts of mixed monomer, 6 parts of initiator and 2 parts of catalyst according to parts by weight, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and preheating for 50min at 60 ℃ under the protection of nitrogen;
(4) After preheating is finished, raising the temperature to 115 ℃, boosting the pressure to 0.6MPa, adding an initiator, stirring at 900r/min for reaction for 11 hours, cooling to room temperature, discharging, placing at 5 ℃, standing for 5 hours, removing the solvent by rotary evaporation, collecting the residues, and mixing the residues with the styrene-acrylic emulsion according to the mass ratio of 16.
Comparative example 2
The mixed solvent is formed by mixing acetone and N-methyl pyrrolidone according to the volume ratio of 5.
The mixture is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12.
The modifier is formed by mixing cinnamyl alcohol and triethylamine according to a mass ratio of 6.
The initiator is any one of potassium tert-butoxide and potassium methoxide.
The catalyst is palladium carbon catalyst.
A preparation method of photosensitive adhesive for building bonding comprises the following steps:
(1) Placing the mixed solvent and the mixture into a reaction kettle according to a mass ratio of 16;
(2) After stirring, adding a modifier accounting for 5% of the mass of the mixture, cooling to 4 ℃, adding dichlorooxysulfide accounting for 4% of the mass of the mixture, stirring at 600r/min for 8 hours, adding diaminodiphenyl ether accounting for 2% of the mass of the mixture, stirring for reacting for 5 hours, and collecting a reaction mixture;
(3) Taking 170 parts of tetrahydrofuran, 55 parts of reaction mixture, 6 parts of initiator and 2 parts of catalyst according to parts by weight, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and preheating for 50min at 60 ℃ under the protection of nitrogen;
(4) After preheating is finished, heating to 115 ℃, boosting to 0.6MPa, adding an initiator, stirring at 900r/min for reaction for 11h, cooling to room temperature, discharging, placing at 5 ℃, standing for 5h, removing the solvent by rotary evaporation, collecting the residues, and mixing the residues with the styrene-acrylic emulsion according to a mass ratio of 16.
The construction adhesive photosensitive adhesives prepared in the examples and the comparative examples were tested as follows:
| tensile strength/MPa of adhesive film | Tensile shear strength/MPa | Bonding strength/MPa | |
| Example 1 | 29.6 | 2.89 | 10.23 |
| Example 2 | 30.2 | 2.92 | 11.12 |
| Example 3 | 29.8 | 2.82 | 10.65 |
| Comparative example 1 | 19.8 | 1.36 | 6.23 |
| Comparative example 2 | 20.3 | 1.68 | 6.58 |
In conclusion, the photosensitive adhesive for building bonding prepared by the invention has better performance.
Claims (1)
1. A preparation method of photosensitive adhesive for building bonding is characterized by comprising the following steps:
(1) Putting the mixed solvent and the mixture into a reaction kettle according to the mass ratio of 16-7, preheating at 35-40 ℃ under the protection of nitrogen, adding phthalic anhydride accounting for 15-20% of the mass of the mixture, heating to 45-48 ℃, and stirring;
(2) After stirring, adding a modifier accounting for 3-6% of the mass of the mixture, cooling to 3-5 ℃, adding dichloro oxygen sulfur accounting for 2-5% of the mass of the mixture, stirring, adding diaminodiphenyl ether accounting for 1-3% of the mass of the mixture, stirring for reaction, and collecting a reaction mixture;
(3) Taking 160-180 parts of tetrahydrofuran, 50-60 parts of reaction mixture, 20-30 parts of mixed monomer, 5-8 parts of initiator and 1-3 parts of catalyst according to parts by weight, firstly putting the tetrahydrofuran, the reaction mixture, the mixed monomer and the catalyst into a reactor, and carrying out nitrogen protection and preheating;
(4) After preheating is finished, raising the temperature and the pressure, adding an initiator, stirring and reacting for 9-13 h at 900r/min, cooling to room temperature, discharging, placing at 3-6 ℃, standing, removing the solvent by rotary evaporation, collecting the remainder, and mixing the remainder with the styrene-acrylic emulsion according to the mass ratio of 16-9 to obtain the photosensitive adhesive for building bonding;
the mixed solvent in the step (1) is formed by mixing acetone and N-methyl pyrrolidone according to a volume ratio of 5;
the mixture in the step (1) is prepared by mixing pyromellitic dianhydride and dimethyl terephthalate according to the mass ratio of 12;
the modifier in the step (2) is formed by mixing cinnamyl alcohol and triethylamine according to the mass ratio of 6;
the mixed monomer is formed by mixing 5-8 parts of hydroxyethyl methacrylate and glycidyl methacrylate according to a mass ratio of 6;
the initiator is any one of potassium tert-butoxide and potassium methoxide;
the catalyst is a palladium carbon catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010024844.5A CN111154449B (en) | 2020-01-10 | 2020-01-10 | Preparation method of photosensitive adhesive for building bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010024844.5A CN111154449B (en) | 2020-01-10 | 2020-01-10 | Preparation method of photosensitive adhesive for building bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111154449A CN111154449A (en) | 2020-05-15 |
| CN111154449B true CN111154449B (en) | 2022-12-23 |
Family
ID=70562201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010024844.5A Active CN111154449B (en) | 2020-01-10 | 2020-01-10 | Preparation method of photosensitive adhesive for building bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111154449B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5495697A (en) * | 1978-01-13 | 1979-07-28 | Hitachi Ltd | Photosensitive resin composition |
| CN101017324A (en) * | 2003-03-12 | 2007-08-15 | 三菱化学株式会社 | Photosensitive composition, photosensitive colored composition, color filter, and liquid crystal display |
| JP5235271B2 (en) * | 2005-12-22 | 2013-07-10 | 日東電工株式会社 | Water-dispersible acrylic pressure-sensitive adhesive composition for re-peeling and pressure-sensitive adhesive sheet |
| CN101807001B (en) * | 2010-03-17 | 2013-04-10 | 长兴化学工业股份有限公司 | Photosensitive resin composition and application thereof |
| CN101921482B (en) * | 2010-08-18 | 2012-07-04 | 东华大学 | Thermosetting polyimide resin and preparation method thereof |
| CN102199290B (en) * | 2011-04-12 | 2013-06-12 | 中国科学院化学研究所 | Thermoplastic polyimide adhesive film as well as preparation method and application thereof |
-
2020
- 2020-01-10 CN CN202010024844.5A patent/CN111154449B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111154449A (en) | 2020-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2786794A (en) | Polyglycidyl ether of a polyhydric phenol hot setting adhesive and method of unitingarticles therewith | |
| EP1730210A2 (en) | Polycarboxy-functionalized prepolymers | |
| WO2001094492A1 (en) | Impact-resistant epoxy resin compositions | |
| EP1123348A2 (en) | Impact-resistant epoxide resin compositions | |
| CN101906278A (en) | Single-component polyvinylacetate binding agent and preparation method thereof | |
| CN108559433B (en) | Formula and preparation method of high-temperature-resistant polyester hot melt adhesive | |
| CN114316854B (en) | Acrylic acid adhesive with high solid content and low viscosity and preparation method thereof | |
| CN106749936A (en) | Vinyl acetate binder and preparation method thereof | |
| CN111154449B (en) | Preparation method of photosensitive adhesive for building bonding | |
| Gouri et al. | Studies on the adhesive properties of solid elastomer-modified novolac epoxy resin | |
| CN105647389A (en) | Method for preparing esters with rosin acrylic acid and GMA (glycidyl methacrylate) | |
| JPS60108416A (en) | Thermosettable composition | |
| CA1184339A (en) | Thermosetting adhesive composition including epoxy resin and half ester product of saponified ethylene/ vinyl acetate copolymer with a dicarboxylic acid | |
| CN109503520B (en) | 5-aldehyde resorcinol diglycidyl ether and preparation method thereof | |
| CN109942742A (en) | A kind of water dispersion glass coated polymeric and preparation method thereof | |
| DE10017783A1 (en) | Thermosetting resin composition, especially useful as structural adhesive with high impact strength at low temperature, containing epoxy resin, reactive copolymer, acid anhydride reaction product and latent hardener | |
| EP1174481A2 (en) | One-part, heat-cured epoxy adhesive | |
| CN112521637B (en) | Rosin-based reactive tackifying emulsion, one-pot preparation method and application thereof | |
| JPH01113476A (en) | Epoxy adhesive composition | |
| CN107880710B (en) | High-temperature-resistant water-based adhesive | |
| CN109627991A (en) | A kind of molten type two-component composite adhesive of water-resistance ester and preparation method thereof | |
| WO1993021274A1 (en) | Multilayer core-shell polymer compositions as toughener for thermosets and thermoplastics | |
| CN118085666B (en) | High-adhesion water-based ultraviolet light curing coating and preparation method thereof | |
| CN115260962B (en) | Epoxy resin adhesive fast in room temperature curing and preparation method thereof | |
| CN114573790B (en) | Bio-based degradable epoxy resin, preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20221207 Address after: 430058 iFLYTEK AI Industry Acceleration Center, Building 1, Phase II, Innovation Valley, South Taizi Lake, Wuhan Economic and Technological Development Zone, Hubei Province (Ji-KDXF-B010) Applicant after: Songta Technology Consulting Wuhan Co.,Ltd. Address before: 362200 Heping Middle Road, Jinjiang City, Quanzhou City, Fujian Province Applicant before: Lin Peishuang Effective date of registration: 20221207 Address after: 443700 Pingyikou Industrial Park, Xiakou Town, Xingshan County, Yichang City, Hubei Province Applicant after: HUBEI JUNBANG NEW MATERIAL TECHNOLOGY CO.,LTD. Address before: 430058 iFLYTEK AI Industry Acceleration Center, Building 1, Phase II, Innovation Valley, South Taizi Lake, Wuhan Economic and Technological Development Zone, Hubei Province (Ji-KDXF-B010) Applicant before: Songta Technology Consulting Wuhan Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A preparation method of photosensitive adhesive for building bonding Effective date of registration: 20230613 Granted publication date: 20221223 Pledgee: Xingshan County Sub branch of Agricultural Bank of China Co.,Ltd. Pledgor: HUBEI JUNBANG NEW MATERIAL TECHNOLOGY CO.,LTD. Registration number: Y2023420000228 |