JP2007163608A - Droplet discharge device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a droplet discharge device in which alignment accuracy between a striking position of a droplet and an irradiation position of a laser beam is improved and a shape controlling property of a pattern is improved. <P>SOLUTION: The droplet discharge device has an alignment mechanism 40 provided with: a light conversion film 43 laminated on the upper surface of a transmission substrate 42; and a light receiving part 45 arranged on the lower side of the transmission substrate 42. Therein, both of the droplet Fb from a discharge head 33 and the laser beam B of an infrared region are received on the surface (detection surface) of the light conversion film 43. Further, an intensity distribution of composite light of external light via the droplet Fb struck on the detection surface and conversion light of the the laser beam B with which the detection surface is irradiated is detected from the side facing the discharge head 33. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a droplet discharge device.

  Conventionally, a display device such as a liquid crystal display device or an electroluminescence display device is provided with a substrate for displaying an image. On this type of substrate, an identification code (for example, a two-dimensional code) in which manufacturing information such as the manufacturer and product number is encoded is formed for the purpose of quality control and manufacturing control.

  Such an identification code manufacturing method includes a laser sputtering method in which a metal foil is irradiated with laser light to form a code pattern by sputtering, or a water jet that injects water containing an abrasive material onto a substrate or the like to imprint the code pattern. A method has been proposed (Patent Documents 1 and 2).

  However, in the above laser sputtering method, the gap between the metal foil and the substrate must be adjusted to several to several tens of micrometers in order to obtain a code pattern having a desired size. Therefore, very high flatness is required for the surface of the substrate and the metal foil, and the gap between them must be adjusted with an accuracy of the order of μm. As a result, there is a problem in that the target substrate for manufacturing the identification code is limited, and the versatility is impaired. Further, the water jet method has a problem of contaminating the target substrate because water, dust, abrasives, and the like are scattered when the substrate is engraved.

Therefore, in recent years, an inkjet method has attracted attention as a method for manufacturing an identification code that solves these problems. In the ink jet method, a code pattern is manufactured by discharging a droplet containing metal fine particles from a droplet discharge head and drying the droplet. Therefore, the range of the target substrate for manufacturing the identification code can be easily expanded, and the identification code can be manufactured without contaminating the target substrate.
Japanese Patent Laid-Open No. 11-77340 JP 2003-127537 A

  By the way, in the inkjet method, the shape of the pattern is defined by the shape of the droplet. For this reason, if the surface state of the target substrate is different, there is a problem that the wettability of the droplets varies and the shape controllability of the pattern is impaired.

  Therefore, in recent years, in order to solve such problems, proposals have been made to control the shape of the droplet by irradiating the region of the droplet with laser light. For example, a proposal to convert the light energy of laser light into thermal energy of the droplet to dry the droplet instantaneously or to convert the light energy of laser light into kinetic energy of the droplet to wet and spread the droplet Has been made.

  However, in general, a droplet discharge device used in the ink jet method has a distance between the droplet discharge head and the substrate close to several millimeters or less in order to ensure the positional accuracy of the landing droplet. . As a result, it becomes difficult to detect the landing position of the droplet immediately after landing or the irradiation position of the laser beam on the droplet from above the substrate, and the alignment accuracy between the landing position and the irradiation position is impaired, and the laser to the droplet There was a risk of poor light irradiation.

In addition, when the wavelength region of the laser beam is set to a region other than the visible region (for example, infrared or ultraviolet region), or the laser light cross section is reduced below the droplet size, the detection position of the laser beam is detected. However, there is a problem that the alignment accuracy between the irradiation position and the landing position is further lowered.

  The present invention has been made to solve the above-described problems, and its object is to improve the alignment accuracy of the landing position of the droplet and the irradiation position of the laser beam and improve the pattern shape controllability. It is to provide a droplet discharge device.

  A liquid droplet ejection apparatus according to the present invention includes a liquid droplet ejection head that ejects liquid droplets on an object, and a laser irradiation unit that irradiates laser light onto the liquid droplets that have landed on the object. In the above, a laser beam from the laser irradiation means is incident on the front surface, and a light conversion member that emits visible light corresponding to the laser beam incident on the front surface to the back surface side, and on the back surface side of the light conversion member And a light detection means that detects at least one of an intensity distribution, a wavelength distribution, and a direction distribution of visible light on the back surface side.

  According to the droplet discharge device of the present invention, the laser light incident on the front surface can be converted into visible light on the side (back surface side) opposite to the laser irradiation means. Then, at least one of the intensity distribution, the wavelength distribution, and the direction distribution of the converted visible light can be detected. Therefore, regardless of the wavelength region of the laser beam, the detection accuracy of the irradiation position of the laser beam on the surface can be improved by converting the incident laser beam into visible light on the side opposite to the laser irradiation means. As a result, the alignment accuracy between the landing position of the droplet and the irradiation position of the laser beam can be improved, and the pattern shape controllability can be improved.

  In this droplet discharge device, the light conversion member receives droplets from the droplet discharge head on the front surface, and transmits light on the front surface side through the droplets received on the front surface to the back surface side. You may make it permeate | transmit.

  According to this droplet discharge device, both the light via the droplet landed on the surface and the laser light irradiated on the surface are converted into visible light on the side (back side) opposite to the droplet discharge head. Can do. Therefore, both the landing position of the droplet and the irradiation position of the laser beam can be detected on the side facing the droplet discharge head. As a result, the alignment accuracy between the landing position of the droplet and the irradiation position of the laser beam can be further improved.

In this droplet discharge device, the light conversion member may be made of at least one of an infrared-visible conversion material and an ultraviolet-visible conversion material.
According to this droplet discharge device, it is possible to detect an irradiation position with respect to at least one of the infrared region and the ultraviolet region.

  In this droplet discharge device, a position changing unit that changes a relative position of the laser irradiation unit with respect to the droplet discharge head, and a droplet that has landed on the surface based on a detection signal detected by the light detection unit. Control means for detecting both the landing position and the irradiation position of the laser beam irradiated on the surface, and for driving and controlling the position changing means based on the landing position and the irradiation position. Also good.

  According to this droplet discharge device, the relative position of the laser irradiation means with respect to the droplet discharge head can be changed based on the detected landing position and irradiation position. Therefore, the alignment accuracy between the landing position of the droplet and the irradiation position of the laser beam can be improved more reliably.

A liquid droplet ejection apparatus according to the present invention includes a liquid droplet ejection head that ejects liquid droplets on an object, and a laser irradiation unit that irradiates laser light onto the liquid droplets that have landed on the object. The laser beam from the laser irradiation means is incident on the surface, and the light conversion member that emits the scattered light corresponding to the laser beam incident on the surface to the back surface side, and the back surface side of the light conversion member And a light detection means arranged to detect at least one of the intensity distribution, the wavelength distribution, and the direction distribution of the scattered light converted by the light conversion member.

  According to the droplet discharge device of the present invention, laser light incident on the front surface can be converted into scattered light on the side (back side) opposite to the droplet discharge head. Then, at least one of the intensity distribution, wavelength distribution, and direction distribution of the converted scattered light can be detected. Accordingly, it is possible to improve the detection accuracy of the light section of the laser beam on the surface, that is, the irradiation position of the laser beam, by the amount that the incident laser beam is converted into scattered light on the side opposite to the laser irradiation means. As a result, the alignment accuracy between the landing position of the droplet and the irradiation position of the laser beam can be improved, and the pattern shape controllability can be improved.

  In this droplet discharge device, the light conversion member receives droplets from the droplet discharge head on the front surface, and transmits light on the front surface side through the droplets received on the front surface to the back surface side. You may make it permeate | transmit.

  According to this droplet discharge device, both the light via the droplet landed on the surface and the laser light irradiated on the surface are converted into scattered light on the side (back side) opposite to the droplet discharge head. Can do. Then, at least one of the intensity distribution, wavelength distribution, and direction distribution of the converted scattered light can be detected. Therefore, both the landing position of the droplet and the irradiation position of the laser beam can be detected on the side facing the droplet discharge head. As a result, the alignment accuracy between the landing position of the droplet and the irradiation position of the laser beam can be improved, and the pattern shape controllability can be improved.

In this droplet discharge device, the light conversion member may be a light diffusion plate.
According to this droplet discharge device, the irradiation position of the laser beam can be detected based on the light diffused by the light diffusion plate. As a result, the space in which the laser beam can be detected can be expanded, and the detection range of the irradiation position can be expanded. As a result, the alignment accuracy between the landing position of the droplet and the irradiation position of the laser beam can be further improved.

In this droplet discharge device, the light conversion member may be made of at least one of ground glass and translucent plastic.
According to this droplet discharge device, both the landing position and the irradiation position can be detected by at least one of ground glass and translucent plastic.

  In this droplet discharge device, a position changing unit that changes a relative position of the laser irradiation unit with respect to the droplet discharge head, and a droplet that has landed on the surface based on a detection signal detected by the light detection unit. Control means for detecting both the landing position and the irradiation position of the laser beam irradiated on the surface, and for driving and controlling the position changing means based on the landing position and the irradiation position. Also good.

  According to this droplet discharge device, the relative position of the laser irradiation means with respect to the droplet discharge head can be changed based on the detected landing position and irradiation position. Therefore, the alignment accuracy between the landing position of the droplet and the irradiation position of the laser beam can be improved more reliably.

In this droplet discharge apparatus, the surface may be arranged at an arrangement position in the irradiation direction of the laser beam substantially equal to an arrangement position of the object in the irradiation direction.
According to this droplet discharge device, the irradiation state of the laser beam to the surface and the irradiation state of the laser beam to the object can be made substantially equal. Therefore, the landing position and the irradiation position can be matched in an environment substantially equal to the irradiation state of the laser beam on the object. As a result, the alignment accuracy between the droplet landing position and the laser beam irradiation position can be improved more reliably.

  Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. First, a liquid crystal display device 1 having an identification code formed using the droplet discharge device of the present invention will be described with reference to FIG.

  In FIG. 1, a rectangular display unit 3 in which liquid crystal molecules are sealed is formed at a substantially central position on one side surface (surface 2 a) of a substrate 2, and a scanning line driving circuit is provided outside the display unit 3. 4 and a data line driving circuit 5 are formed. The liquid crystal display device 1 controls the alignment state of the liquid crystal molecules in the display unit 3 based on the scanning signal supplied from the scanning line driving circuit 4 and the data signal supplied from the data line driving circuit 5. ing. The liquid crystal display device 1 is configured to display a desired image in the area of the display unit 3 by modulating the plane light from the illumination device (not shown) according to the alignment state of the liquid crystal molecules.

  In the lower left corner of the surface 2a, a code area S made up of a square having a side of about 1 mm is defined, and in the code area S, 16 rows × 16 columns of data cells C are virtually divided. A pattern (dot D) is formed in each of the selected data cells C in the code area S, and the plurality of dots D constitute the identification code 10 of the liquid crystal display device 1. In this embodiment, the center position of the data cell C in which the dot D is formed is set as the target discharge position P, and the length of one side of each data cell C is referred to as “cell width W”.

  Each dot D is a hemispherical pattern whose outer diameter is formed by the length of one side of the data cell C (the “cell width W”). The dots D are formed by discharging a droplet Fb of the drawing liquid F1 (see FIG. 5) to the data cell C, and drying and firing the droplet Fb landed on the data cell C. The drawing liquid F1 of this embodiment is a liquid containing metal fine particles (for example, nickel fine particles and manganese fine particles) dispersed in a solvent with a dispersion medium.

  The identification code 10 reproduces the product number, lot number, and the like of the liquid crystal display device 1 depending on the presence or absence of the dot D in each data cell C. In the present embodiment, the longitudinal direction of the substrate 2 is referred to as the X arrow direction, and the direction orthogonal to the X arrow direction is referred to as the Y arrow direction.

  Next, a droplet discharge device 20 for forming the identification code 10 will be described with reference to FIGS. In the present embodiment, a case will be described in which a plurality of identification codes 10 corresponding to each substrate 2 are formed on a mother substrate 2M as an object in which a plurality of the substrates 2 can be cut out.

  In FIG. 2, the droplet discharge device 20 includes a base 21 formed in a substantially rectangular parallelepiped shape, and a plurality of mother substrates 2 </ b> M are provided on one side (X arrow direction side) of the base 21. A substrate stocker 22 that can be accommodated is provided. The substrate stocker 22 moves in the vertical direction (Z arrow direction and anti-Z arrow direction) in FIG. 2 to carry out the respective mother substrates 2M to be accommodated onto the base 21 and the mother substrate 2M on the base 21. Are loaded into the corresponding slots.

On the upper surface 21a of the base 21 and on the substrate stocker 22 side (X arrow direction side), a traveling device 23 extending in the Y arrow direction is disposed. The traveling device 23 has a traveling motor MS (see FIG. 10) inside, and causes the transport device 24 that is drivingly connected to the output shaft of the traveling motor MS to travel in the Y arrow direction and the anti-Y arrow direction. ing. The transfer device 24 is a horizontal articulated robot having a transfer arm 24a that can suck and hold the back surface 2Mb of the mother board 2M. The transport device 24 rotates the transport arm 24a, which is driven and connected to the output shaft of the transport motor MT (see FIG. 10) disposed therein, so that the transport arm 24a can expand and contract on the XY plane and move in the vertical direction. It is like that.

  On the upper surface 21a of the base 21 and on both sides in the Y arrow direction of the traveling device 23, a pair of mounting tables 25R and 25L for mounting the mother substrate 2M with the surface 2Ma of the mother substrate 2M on the upper side are provided. ing. Each of the pair of mounting tables 25R and 25L has a space (recessed portion 25a) that allows the transfer arm 24a to be extracted on the back surface 2Mb side of the mother substrate 2M to be mounted, and the transfer arm 24a is placed in the recessed portion 25a. By moving up and down, the mother substrate 2M can be transported and placed.

  When a signal for transporting the mother substrate 2M is supplied to the travel motor MS and the transport motor MT, the travel device 23 and the transport device 24 unload each mother substrate 2M in the substrate stocker 22 and unload it. The mother substrate 2M thus mounted is placed on the placement table 25R (or the placement number 25L). Further, the traveling device 23 and the transport device 24 are configured to carry the mother substrate 2M placed on the placement tables 25R and 25L into a predetermined slot in the substrate stocker 22 and collect it.

  In the present embodiment, as shown in FIG. 3, the code region S of the mother board 2M placed on the placement tables 25R and 25L, and the first row code region S1 in order from the X arrow direction side. The second line code area S2,..., The fifth line code area S5.

  In FIG. 2, an articulated robot (hereinafter simply referred to as a SCARA robot) 26 as a relative movement means is disposed on the upper surface 21a of the base 21 between the pair of mounting bases 25R and 25L. The SCARA robot 26 includes a main shaft 27 that is fixed to the upper surface 21a of the base 21 and extends upward (in the Z arrow direction).

  A first arm 28a that is drivingly connected to an output shaft of a first motor M1 (see FIG. 10) installed on the main shaft 27 is connected to an upper end of the main shaft 27 so as to be rotatable in a horizontal direction (XY plane direction). Yes. A second arm 28b that is drivingly connected to an output shaft of a second motor M2 (see FIG. 10) installed on the first arm 28a is connected to the tip of the first arm 28a so as to be rotatable in the horizontal direction. . At the tip of the second arm 28b, a columnar third arm 28c that is drivingly connected to the output shaft of a third motor M3 (see FIG. 10) installed on the second arm 28b is an axis along the Z arrow direction. It is connected so as to be rotatable about the center of rotation. A head unit 30 is disposed at the tip (lower end) of the third arm 28c.

  When the signals for causing the head unit 30 to scan are supplied to the first, second, and third motors M1, M2, and M3, the SCARA robot 26 corresponds to the corresponding first, second, and third arms 28a, The head unit 30 is scanned within a predetermined area on the upper surface 21a by rotating the wheels 28b and 28c.

  More specifically, as shown in FIG. 3, the SCARA robot 26 is a smooth ninety-fold target trajectory R generated based on the position coordinates of each target discharge position P (teaching coordinates Tp: see FIG. 10). The head unit 30 is scanned along the line. That is, the SCARA robot 26 first rotates the first, second, and third arms 28a, 28b, and 28c as indicated by the arrows on the mounting table 25L, and the head unit 30 (the tip of the third arm 28c). Is made to be opposed to a position on the side opposite to the Y arrow in the first line code area S1 (hereinafter simply referred to as a starting point SP). When the head unit 30 is placed at the start point SP, the SCARA robot 26 scans the head unit 30 located at the start point SP along the Y arrow direction.

  When the head unit 30 is scanned along the Y arrow direction, the SCARA robot 26 rotates the first, second, and third arms 28a, 28b, and 28c to move the head on the outer side of the mother substrate 2M in the Y arrow direction. The unit 30 is rotated counterclockwise by 180 degrees and rotated to the Y arrow direction side of the second line code area S2. When the head unit 30 is arranged on the second line code area S2, the SCARA robot 26 scans the head unit 30 along the anti-Y arrow direction.

  Thereafter, in the same manner, the SCARA robot 26 moves the head unit 30 in the order of the third row, fourth row, and fifth row code areas S3, S4, and S5, with the arrangement direction of the head unit 30 corresponding to the scanning direction. The fifth line code area S5 is made to be opposed to the position (end point EP) on the Y arrow direction side.

Next, the head unit 30 will be described below.
4 and 5 are side views for explaining the head unit 30, respectively. FIGS. 6 and 7 are explanatory views for explaining the alignment mechanism 40, respectively. 8 and 9 are plan views of the head unit 30 as viewed from the lower side (on the side opposite to the Z arrow).

  In FIG. 4, a drawing liquid tank 32 a that stores the drawing liquid F <b> 1 so as to be able to be led out is disposed inside a case 31 provided in the head unit 30. Further, in the case 31, the alignment liquid that accommodates the alignment liquid F2 having substantially the same viscosity as the drawing liquid F1 and having a higher vapor pressure than the drawing liquid F1 in a releasable manner. A body tank 32b is provided. A droplet discharge head (hereinafter simply referred to as a discharge head) 33 is disposed below the case 31 and below the drawing liquid tank 32a and the alignment liquid tank 32b.

  The drawing liquid tank 32a and the alignment liquid tank 32b are drawn by appropriately adjusting the water head difference between the drawing liquid F1 and the alignment liquid F2 accommodated by a self-sealing valve or the like. The liquid material F1 and the alignment liquid material F2 are supplied to the discharge head 33 disposed below the liquid material F1 and the alignment liquid material F2. Note that a switching valve (not shown) is connected between the drawing liquid tank 32a and the discharge head 33, and between the alignment liquid tank 32b and the discharge head 33, so that the drawing liquid F1 and the alignment head are aligned. Any one of the liquids F <b> 2 is supplied to the ejection head 33.

  In FIG. 5, a nozzle plate 34 is provided below the ejection head 33, and the lower surface (nozzle formation surface 34a) of the nozzle plate 34 is in the normal direction (Z arrow direction) of the mother substrate 2M. A plurality of (i in the present embodiment) circular holes (nozzles N) are formed through. The nozzles N are arrayed along a direction (direction perpendicular to the paper surface in FIG. 5) orthogonal to the scanning direction of the ejection head 33 (Y arrow direction in FIG. 5), and the formation pitch in the array direction is the data. It is formed at the same pitch as the formation pitch (cell width W) of the cells C. In the present embodiment, each position on the plane along the surface 2Ma and facing each nozzle N is referred to as a landing position PF.

  In this embodiment, in FIG. 8 and FIG. 9, the nozzles are referred to as a first nozzle N1, a second nozzle N2,. Of these nozzles N, the nozzle N located at the approximate center in the X arrow direction is referred to as a reference nozzle Nm. Furthermore, among the landing positions PF, the landing positions PF corresponding to the reference nozzle Nm and the i-th nozzle Ni are referred to as a reference landing position PFm and an i-th landing position PFi, respectively.

  In FIG. 5, a cavity 35 communicating with the drawing liquid tank 32a and the alignment liquid tank 32b is formed above each nozzle N. In the cavity 35, either the drawing liquid F1 derived from the drawing liquid tank 32a or the alignment liquid F2 derived from the alignment liquid tank 32b is supplied into the corresponding nozzle N. It has come to be. A vibration plate 36 that can vibrate in the vertical direction is attached to the upper side of each cavity 35 so that the volume in the cavity 35 is enlarged or reduced. A plurality of piezoelectric elements PZ corresponding to the respective nozzles N are disposed on the upper side of the diaphragm 36, and a signal (piezoelectric element driving voltage COM1: see FIG. 10) for discharging the droplet Fb is received. It is designed to contract and expand in the vertical direction.

  When each landing position PF (each nozzle N) is opposed to the corresponding target ejection position P (center position of the data cell C), the piezoelectric element driving voltage COM1 is supplied to the corresponding piezoelectric element PZ. Then, the corresponding piezoelectric element PZ contracts and expands, and the interface of the drawing liquid F1 in the nozzle N corresponding to the piezoelectric element PZ vibrates in the vertical direction. As a result, a droplet Fb having a size corresponding to the piezoelectric element driving voltage COM1 is ejected from the corresponding nozzle N. The discharged droplet Fb flies along the direction of the anti-Z arrow and lands on the opposite target discharge position P. The droplet Fb that has landed on the target discharge position P wets and spreads along the surface 2Ma, and eventually becomes a size that is dried and fired (the outer diameter becomes the cell width W). In the present embodiment, the time from the start of the discharge operation of the droplet Fb to the time when the outer diameter of the discharged droplet Fb reaches the cell width W is referred to as irradiation standby time. The head unit 30 of this embodiment is scanned for a predetermined distance (irradiation standby distance Lw: see FIG. 5) during this irradiation standby time. The irradiation standby distance Lw is set to a distance equal to the cell width W.

In this embodiment, in FIGS. 8 and 9, the droplets Fb corresponding to the reference nozzle Nm and the i-th nozzle Ni are referred to as a reference droplet Fbm and an i-th droplet Fbi, respectively.
In FIG. 4, a laser unit 37 is disposed in the head unit 30 in the anti-scanning direction of the case 31 (the anti-Y arrow direction in FIG. 4). And a laser head 39 constituting laser irradiation means.

  The laser stage 38 is a multi-axis stage (XYZθ stage) disposed in a direction opposite to the arrow Y of the case 31, and moves a laser head 39 mounted on the lower side with respect to the ejection head 33. ing. More specifically, the laser stage 38 receives a predetermined drive signal and translates the laser head 39 in the X and anti-X arrow directions, the Y and anti-Y arrow directions, and the Z and anti-Z arrow directions. Yes. Further, upon receiving a predetermined drive signal, the laser stage 38 rotates and moves the laser head 39 within the XY plane with the axis along the Z arrow direction including the reference landing position PFm as a rotation axis. ing.

  Inside the laser head 39, a plurality of semiconductor lasers LD corresponding to the respective nozzles N are arranged along the arrangement direction of the nozzles N. Each semiconductor laser LD receives a signal (laser driving voltage COM2: see FIG. 10) for driving and controlling the semiconductor laser LD, and receives a wavelength region corresponding to the absorption wavelength of the droplet Fb (in this embodiment, an infrared region). ) Laser beam B is emitted. Further, each semiconductor laser LD guides the emitted laser beam B to a position (irradiation position PT: see FIG. 5) in the anti-scanning direction (anti-Y arrow direction) of the corresponding landing position PF.

  Each irradiation position PT has a distance from the corresponding landing position PF to the irradiation standby distance Lw as shown in FIG. 5 due to position alignment (alignment operation) of the laser head 39 with respect to the ejection head 33. The layout is set to be

  Then, the laser beam B in the infrared region is emitted from the semiconductor laser LD at the timing when the irradiation standby time has elapsed from the start of the ejection operation. Then, the irradiation position PT is moved by the irradiation standby distance Lw by scanning of the irradiation standby time, and is opposed to the corresponding target discharge position P. When the irradiation position PT is relative to the corresponding target discharge position P, the laser light B from the semiconductor laser LD is a droplet Fb at the target discharge position P relative to the irradiation position PT, that is, a liquid having an outer diameter of the cell width W. The region of the droplet Fb is irradiated. The droplet Fb irradiated with the laser beam B evaporates the solvent and the dispersion medium, and calcinates the metal fine particles, and comes into close contact with the corresponding target discharge position P (data cell C). As a result, a dot D whose outer shape has a cell width W is formed in the data cell C.

  In this embodiment, in FIG. 8 and FIG. 9, the semiconductor laser LD closest to the X arrow direction is referred to as a first laser LD1, a second laser LD2,. Further, among the semiconductor lasers LD, the semiconductor laser LD positioned substantially at the center position of the laser head 39 is referred to as a reference laser LDm. Furthermore, in the present embodiment, the irradiation positions PT corresponding to the reference laser LDm and the i-th laser LDi are referred to as a reference irradiation position PTm and an i-th irradiation position PTi, respectively.

2 and 3, an alignment mechanism 40 is disposed on the upper surface 21 a of the base 21 on the side opposite to the X-arrow direction of the SCARA robot 26.
In FIG. 6, the alignment mechanism 40 is provided with a case 41 that is formed in a box shape that opens upward (in the direction of the arrow Z), and external light and the laser light B are placed on the upper side of the case 41. A colorless and transparent glass substrate (transmission substrate 42) that is transmitted through 41 is disposed.

  In FIG. 7, a light conversion film 43 as a light conversion member is laminated on the upper surface of the transmission substrate 42. The light conversion film 43 is made of an infrared-visible conversion material that transmits the external light B0 (visible light) and converts the laser light B in the infrared region to light in the visible region (converted light Bt). .

  When external light B0 from the ejection head 33 side (upper side in FIG. 7) is incident on the surface (detection surface 43a) of the light conversion film 43, the light conversion film 43 converts the external light B0 incident on the detection surface 43a to The light is transmitted through the back surface side (the transmission substrate 42 side: the lower side in FIG. 7) and emitted to the inside of the case 41. When the laser beam B in the infrared region enters the detection surface 43a of the light conversion film 43, the light conversion film 43 converts the incident laser light B into converted light Bt corresponding to the energy of the laser light B. At the same time, the converted light Bt is diffused (emitted) into the case 41 through the transmission substrate 42.

  Further, the light conversion film 43 is disposed such that the height position of the detection surface 43a is the same height position as the surface 2Ma of the mother substrate 2M mounted on the mounting tables 25R and 25L. Yes. Thus, the light conversion film 43 has the same distance between the detection surface 43a and the nozzle formation surface 34a as the distance between the surface 2Ma of the mother substrate 2M and the nozzle formation surface 34a. That is, the light conversion film 43 is configured so that the flight state (landing accuracy) of the droplet Fb ejected from the ejection head 33 is the same as the flight state (landing accuracy) with respect to the mother substrate 2M.

  Further, in the direction in which the light conversion film 43 is irradiated with the laser beam B, the distance between the detection surface 43a and the laser head 39 is the same as the distance between the surface 2Ma of the mother substrate 2M and the laser head 39. Thus, the irradiation state (irradiation accuracy) of the laser beam B irradiated from the laser head 39 is made the same as the irradiation state (irradiation accuracy) with respect to the mother substrate 2M.

  Further, the light conversion film 43 is coated with a fluorine resin or the like on the detection surface 43a to impart liquid repellency to make the alignment liquid F2 repellent. For example, a monomolecular film of FAS (perfluoroalkylsilane) is formed on the detection surface 43 a of the light conversion film 43. As a result, the light conversion film 43 suppresses the wetting and spreading of the droplet Fb that has landed on the detection surface 43a, maintains the position of the droplet Fb, and ensures its light transmission.

  Then, the ejection head 33 supplied with the alignment liquid F2 is disposed and moved immediately above the alignment mechanism 40, and the piezoelectric element driving voltage COM1 is supplied to the piezoelectric elements PZ corresponding to the reference nozzle Nm and the i-th nozzle Ni, respectively. To do. Then, as shown in FIG. 8, the reference droplet Fbm and the i-th droplet Fbi made of the alignment liquid F2 are ejected from the corresponding reference nozzle Nm and i-th nozzle Ni, respectively, and the light conversion film 43 is detected. Land on the surface 43a.

  The reference droplet Fbm and the i-th droplet Fbi that land on the detection surface 43a have the same landing accuracy (flight state) as the landing accuracy (flight state) on the mother substrate 2M, respectively. Lands at the landing position PFi. In addition, the reference droplet Fbm and the i-th droplet Fbi that have landed at the reference landing position PFm and the i-th landing position PFi suppress the spread of wetting from the corresponding landing position PF by the liquid repellency of the detection surface 43a. The stagnation occurs in the region of the reference landing position PFm and the i-th landing position PFi.

  Subsequently, the laser drive voltage COM2 is supplied to both the reference laser LDm and the i-th laser LDi. Then, as shown in FIG. 8, the corresponding laser beams B are emitted from both the reference laser LDm and the i-th laser LDi, and the emitted laser beams B from the reference laser LDm and the i-th laser LDi are emitted. Irradiate different positions of the detection surface 43a.

  The laser beam B that irradiates the detection surface 43a irradiates the reference irradiation position PTm and the i-th irradiation position PTi on the detection surface 43a with the same irradiation accuracy (irradiation state) as the irradiation accuracy (irradiation state) for the mother substrate 2M. When the laser beam B is irradiated to the reference irradiation position PTm and the i-th irradiation position PTi, it corresponds to the energy of the laser beam B from the light conversion film 43 corresponding to the regions of the reference irradiation position PTm and the i-th irradiation position PTi, respectively. The converted light Bt is emitted inward of the case 41.

  That is, below the light conversion film 43 (transmission substrate 42), external light B0 on the ejection head 33 side via the reference droplet Fbm and the i-th droplet Fbi, and converted light Bt converted by the light conversion film 43, The synthesized light is irradiated.

  More specifically, below the transmissive substrate 42, the external light is absorbed and scattered by the reference droplet Fbm and the i-th droplet Fbi, and the intensity of the region corresponding to the reference landing position PFm and the i-th landing position PFi is reduced. B0 is irradiated. Further, the converted light Bt having intensity peaks at the reference irradiation position PTm and the i-th irradiation position PTi is irradiated below the transmission substrate 42.

  In FIG. 6, in the case 41 of the alignment mechanism 40, a light receiving stage 44 and a light receiving portion 45 constituting a light detecting means are arranged. The light receiving stage 44 is an XY stage that moves the light receiving unit 45 to be mounted in the case 41. When the ejection head 33 is disposed immediately above the alignment mechanism 40, the light receiving stage 44 receives a predetermined drive control signal and moves the mounted light receiving section 45 directly below the ejection head 33. Yes.

The light receiving unit 45 includes a large number of light receiving elements (for example, a CCD or the like) that can detect the intensity of light in the visible region from the detection surface 43a, and based on the light intensity detected by each light receiving element, Information on the light intensity distribution from the detection surface 43a (light reception information PI: see the lower right in FIG. 10) is generated.

  That is, the light receiving unit 45 detects the light intensity distribution on the side opposite to the ejection head 33, and the position of the droplet Fb (the reference landing position PFm and the i-th landing position PFi) and the irradiation position of the laser beam B ( The reference irradiation position PTm and the i-th irradiation position PTi) can be detected. In addition, the light receiving unit 45 can detect the focal position of the laser beam B irradiated to the reference irradiation position PTm and the i-th irradiation position PTi based on the detected light spread and light peak intensity.

  Then, the light receiving stage 44 and the light receiving unit 45 are driven and controlled so that the light receiving unit 45 receives light from the detection surface 43a. Then, the light receiving unit 45 receives the combined light of the external light B0 via the reference droplet Fbm and the i-th droplet Fbi and the converted light Bt converted by the light conversion film 43, and receives the reference landing position PFm, i-th Light reception information PI that enables detection of the position coordinates of the landing position PFi, the reference irradiation position PTm, the i-th irradiation position PTi, and the focal position of each laser beam B is generated.

  Now, based on the light reception information PI generated by the light receiving unit 45, the detected light spread and light peak intensity are set to a predetermined value, that is, the focal position of the laser beam B is set to a predetermined height. It is assumed that it is at a position (on the detection surface 43a in this embodiment).

  Then, as shown in FIG. 8, based on the light reception information PI generated by the light receiving unit 45, the translational movement amount (X movement amount Wm and Y movement amount Hm) for making the reference irradiation position PTm relative to the reference landing position PFm. Only the laser stage 38 (laser head 39) is moved in the X arrow direction and the anti-Y arrow direction. Then, the laser beam B from the reference laser LDm is opposed to the region of the reference droplet Fbm ejected from the reference nozzle Nm, and the reference irradiation position PTm is opposed to the reference landing position PFm.

  From this state, the translational movement amount (X movement amount Wm and Y movement amount Hm) in which the reference irradiation position PTm is made to be relative to the reference landing position PFm, and the translation for making the i-th irradiation position PTi relative to the i-th landing position PFi. The laser stage 38 is rotationally moved based on the movement amount (X movement amount Wi and Y movement amount Hi). That is, when viewed from the transmissive substrate 42 side, the rotational movement amount (rotational movement amount θa) for making the i-th irradiation position PTi relative to the i-th landing position PFi with the reference landing position PFm (reference irradiation position PTm) as the rotation center. ), The laser head 39 is rotated. Then, as shown in FIG. 9, the laser beam B from the i-th laser LDi is opposed to the region of the i-th droplet Fbi ejected from the i-th nozzle Ni, and the i-th irradiation position PTi is the i-th landing. It comes to be relative to the position PFi.

  Thereby, the irradiation positions PT corresponding to all the semiconductor lasers LD can be aligned with the landing positions PF of the corresponding nozzles N (alignment operation can be executed).

  When the focal position of the laser beam B is not at a preset height position (for example, the detection surface 43a), first, based on the light reception information PI generated by the light receiving unit 45, first, The laser stage 38 (laser head 39) is moved in the Z or anti-Z arrow direction so that the peak intensity of light becomes a predetermined value set in advance. Then, after the focal position of the laser beam B is arranged and moved on the detection surface 43a, the alignment operation described above is executed.

Thereby, the focal positions corresponding to all the semiconductor lasers LD can be arranged on the detection surface 43a, and all the irradiation positions PT can be aligned with the landing positions PF of the corresponding nozzles N, respectively. . That is, the laser beam B having a predetermined energy density
Can be irradiated to a predetermined droplet Fb.

Next, the electrical configuration of the droplet discharge device 20 configured as described above will be described with reference to FIG.
In FIG. 10, the droplet discharge device 20 is provided with a control device 51 having a CPU, a RAM, a ROM and the like and constituting a control means. The control device 51 drives and controls the travel device 23, the transport device 24, and the SCARA robot 26 based on the current position of the tip of the third arm 28c (discharge head 33) and various control programs, and also discharge head 33, laser unit. 37 and the alignment mechanism 40 are driven and controlled.

  The control device 51 is provided with a storage unit 51 </ b> A and stores various data and various programs for manufacturing the identification code 10. For example, the storage unit 51A stores various data such as bitmap data BMD, teaching coordinates Tp, light receiving coordinates Kp, correction information AI, and the like.

  The bitmap data BMD is data indicating whether or not the droplet Fb is ejected to each position obtained by virtually dividing the drawing plane (the surface 2Ma of the mother substrate 2M), and depends on the value (0 or 1) of each bit. Thus, it is data for defining whether to drive each piezoelectric element PZ. That is, the bitmap data BMD is data for defining whether or not the droplets Fb are ejected from the nozzles N when the ejection head 33 is scanned over the row code areas S1 to S5.

The teaching coordinate Tp is a position coordinate of the polar coordinate system for creating the target locus R, and is a position coordinate of each target discharge position P in the present embodiment.
The light receiving coordinate Kp is a position coordinate on the detection surface 43 a, and the ejection head 33 is disposed immediately above the detection surface 43 a corresponding to the light reception coordinate Kp, and the light receiving unit 45 is disposed on the ejection head 33. Used to place directly underneath. Note that the control device 51 of the present embodiment is configured to sequentially update the light receiving coordinates Kp by a predetermined amount every time the alignment operation described above is executed. That is, the control device 51 of the present embodiment is configured to discharge the alignment liquid material F2 to different positions on the detection surface 43a every time the alignment operation is executed.

  The correction information AI is information related to the X movement amount Wm, the Y movement amount Hm, and the rotational movement amount θa for driving and controlling the laser stage 38, and corresponds to the irradiation positions PT corresponding to all the semiconductor lasers LD. This is information for aligning with the landing position PF of the nozzle N. The control device 51 updates the correction information AI every time the alignment operation is executed.

  The control device 51 is provided with an interpolation calculation unit 51B, and performs an interpolation process at a predetermined interpolation cycle on the space between the light receiving coordinates Kp and the start point SP. The interpolation calculation unit 51B then moves the head unit 30 from directly above the light conversion film 43 (light receiving coordinates Kp) to directly above the mother substrate 2M (position coordinates of a plurality of interpolation points: interpolation coordinates). Are calculated sequentially. Further, the interpolation calculation unit 51B performs an interpolation process at a predetermined interpolation cycle on the space between the start point SP (or the preceding teaching coordinate Tp) and the subsequent teaching coordinate Tp. The interpolation calculation unit 51B sequentially calculates the interpolation coordinates of a plurality of interpolation points corresponding to the target locus R up to the end point EP. Then, the interpolation calculation unit 51B generates information (trajectory information TaI) including the light receiving coordinates Kp, the start point SP, each teaching coordinate Tp, the end point EP, and each interpolation coordinate, and sends the trajectory information TaI to the inverse conversion unit 51C. It is designed to output.

  Based on the trajectory information TaI from the interpolation calculation unit 51B, the inverse conversion unit 51C makes the posture of the SCARA robot 26 for making the discharge head 33 relative to each of the start point SP, the teaching coordinate Tp, the end point EP, and each of the interpolation coordinates ( The rotation angles of the motors M1, M2, M3, etc.) are calculated. In other words, the inverse conversion unit 51C arranges the head unit 30 immediately above the light conversion film 43 and information on the posture of the SCARA robot 26 for scanning along the target locus R from directly above the light conversion film 43 ( Arm rotation information θI) is generated. The inverse conversion unit 51C outputs the generated arm rotation information θI to the SCARA robot drive circuit 55.

  An input unit 52, a travel device drive circuit 53, a transport device drive circuit 54, a SCARA robot drive circuit 55, an ejection head drive circuit 56, a laser head drive circuit 57, and an alignment mechanism drive circuit 58 are connected to the control device 51. .

  The input unit 52 has operation switches such as a start switch and a stop switch, and inputs information related to the identification code 10 to the control device 51 as “drawing data Ia” in a predetermined format. Then, the control device 51 performs a predetermined development process on the drawing data Ia from the input unit 52 to generate the bitmap data BMD, and the position coordinates of each target discharge position P corresponding to the bitmap data BMD (the above-mentioned) Teaching coordinates Tp) are generated. Further, the control device 51 performs a development process different from the bitmap data BMD on the drawing data Ia to generate the piezoelectric element driving voltage COM1 and the laser driving voltage COM2.

  A travel motor MS and a travel motor rotation detector MSE are connected to the travel device drive circuit 53, and the travel motor MS is rotated forward or reverse in response to a drive control signal from the control device 51, and the travel motor rotation is detected. Based on the detection signal from the container MSE, the moving direction and the moving amount of the transport device 24 are calculated.

  A transport motor MT and a transport motor rotation detector MTE are connected to the transport device drive circuit 54, and the transport motor MT is rotated forward or reverse in response to a drive control signal from the control device 51, and the transport motor rotation is detected. Based on the detection signal from the device MTE, the moving direction and the moving amount of the transfer arm 24a are calculated.

  A first motor M1, a second motor M2, and a third motor M3 are connected to the SCARA robot drive circuit 55, and in response to arm rotation information θI from the control device 51, the first, second, and third motors. The motors M1, M2 and M3 are rotated forward or reverse. The SCARA robot drive circuit 55 is connected to a first motor rotation detector M1E, a second motor rotation detector M2E, and a third motor rotation detector M3E, and the first, second, and third motor rotation detectors. Based on the detection signals from M1E, M2E, and M3E, the moving direction and the moving amount of the tip (ejection head 33) of the third arm 28c are calculated.

  Then, the control device 51 arranges the head unit 30 directly above the light conversion film 43 via the SCARA robot drive circuit 55, and the mother substrate along the target locus R from directly above the light conversion film 43. It is designed to scan directly above 2M. During this time, the control device 51 outputs various control signals based on the calculation result (current position of the discharge head 33) from the SCARA robot drive circuit 55.

  More specifically, the control device 51 supplies the piezoelectric element drive voltage COM1 and the laser drive voltage COM2 to the discharge head drive circuit 56 before the discharge head 33 is positioned immediately above the light receiving coordinate Kp (light conversion film 43). And output to the laser head drive circuit 57.

  Further, the control device 51 generates a signal (alignment timing signal AP) for executing the alignment operation at a timing when the ejection head 33 is positioned immediately above the light receiving coordinate Kp (light conversion film 43). Yes. The control device 51 outputs the generated alignment timing signal AP to the ejection head drive circuit 56, the laser head drive circuit 57, and the alignment mechanism drive circuit 58.

  Further, the control device 51 synchronizes the bitmap data BMD corresponding to each nozzle N with a predetermined clock signal before each nozzle N (landing position PF) is opposed to each target discharge position P on the mother substrate 2M. The ejection control signal SI is generated and serially transferred to the ejection head drive circuit 56 in sequence.

  Further, the control device 51 generates a signal (discharge timing signal LP) for discharging the droplet Fb at a timing when each nozzle N (landing position PF) is opposed to each target discharge position P on the mother substrate 2M. At the same time, the generated ejection timing signal LP is output to the ejection head drive circuit 56.

  The ejection head drive circuit 56 is connected to the plurality of piezoelectric elements PZ. In response to the alignment timing signal AP from the control device 51, the ejection head drive circuit 56 supplies the piezoelectric element drive voltage COM1 to the piezoelectric elements PZ corresponding to the reference nozzle Nm and the i-th nozzle Ni, respectively. .

  The ejection head drive circuit 56 receives the ejection control signal SI from the control device 51, and sequentially converts the ejection control signal SI into serial / parallel corresponding to each piezoelectric element PZ. When the ejection head drive circuit 56 receives the ejection timing signal LP from the control device 51, the ejection head drive circuit 56 supplies the piezoelectric element drive voltage COM1 to the piezoelectric element PZ selected based on the serial / parallel converted ejection control signal SI. It is supposed to be.

  Further, the ejection head driving circuit 56 receives the ejection timing signal LP from the control device 51 and outputs a serial / parallel converted ejection control signal SI to the laser head driving circuit 57.

  The plurality of semiconductor lasers LD and the laser stage 38 are connected to the laser head drive circuit 57. The laser head drive circuit 57 receives the alignment timing signal AP from the control device 51 and waits for a predetermined time (the flight time of the droplet Fb). Then, after waiting for the flight time of the droplet Fb, when the reference droplet Fbm and the i-th droplet Fbi land on the detection surface 43a, the laser head driving circuit 57 applies both to the reference laser LDm and the i-th laser LDi. The laser drive voltage COM2 is supplied for a predetermined time (alignment period).

  Further, the laser head driving circuit 57 receives the correction information AI from the control device 51, and translates the laser stage with the translational movement amount and the rotational movement amount relative to the X movement amount Wm, the Y movement amount Hm, and the rotational movement amount θa. 38 is driven and controlled. That is, the laser head drive circuit 57 receives the correction information AI from the control device 51, drives and controls the laser stage 38, and irradiates the irradiation positions PT corresponding to all the semiconductor lasers LD to the corresponding nozzles N. The position is aligned with the position PF.

Further, the laser head driving circuit 57 receives the ejection control signal SI from the ejection head driving circuit 56 and waits for the irradiation waiting time. Then, after waiting for the irradiation waiting time, when each irradiation position PT is opposed to the droplet Fb at the corresponding target discharge position P, the laser head drive circuit 57 selects the semiconductor laser selected based on the discharge control signal SI. A laser drive voltage COM2 is supplied to each LD.

  The alignment mechanism drive circuit 58 is connected to the light receiving stage 44 and the light receiving unit 45. The alignment mechanism driving circuit 58 receives the light receiving coordinates Kp from the control device 51 and drives and controls the light receiving stage 44. When receiving the light receiving coordinate Kp from the control device 51, the alignment mechanism driving circuit 58 arranges and moves the light receiving unit 45 directly below the light receiving coordinate Kp (ejection head 33).

  The alignment mechanism drive circuit 58 receives the alignment timing signal AP from the control device 51 and causes the light receiving unit 45 to receive light in the visible region from the detection surface 43a during the alignment period. . That is, the alignment mechanism driving circuit 58 causes the reference droplet Fbm and the i-th droplet Fbi to land on the detection surface 43a, and the laser light B from the reference laser LDm and the i-th laser LDi is applied to the detection surface 43a. When incident, light in the visible region from the detection surface 43a is received by the light receiving unit 45 and light reception information PI is generated.

  Further, the alignment mechanism drive circuit 58 detects the position coordinates of the reference landing position PFm, the i-th landing position PFi, the reference irradiation position PTm, and the i-th irradiation position PTi based on the light reception information PI generated by the light receiving unit 45. The focal position of the laser beam B corresponding to the reference irradiation position PTm and the i-th irradiation position PTi is detected. In addition, the alignment mechanism drive circuit 58 generates information (coordinate information ZI) related to each position coordinate of the detected reference landing position PFm, i-th landing position PFi, reference irradiation position PTm, i-th irradiation position PTi, and focal position. The generated coordinate information ZI is output to the control device 51. The control device 51 receives the coordinate information ZI from the alignment mechanism drive circuit 58 and generates the correction information AI.

Next, a method for forming the identification code 10 using the droplet discharge device 20 will be described.
First, the input unit 52 is operated to input the drawing data Ia to the control device 51. Then, the control device 51 performs predetermined development processing on the drawing data Ia from the input unit 52 to generate the bitmap data BMD, the teaching coordinates Tp, the piezoelectric element driving voltage COM1, and the laser driving voltage COM2. The generated bitmap data BMD and teaching coordinates Tp are stored in the storage unit 51A.

  Subsequently, the control device 51 drives and controls the travel device 23 and the transport device 24 via the travel device drive circuit 53 and the transport device drive circuit 54, respectively, and unloads the mother substrate 2M of the substrate stocker 22 to place the mounting table 25R. (Or on the mounting table 25L). During this time, the control device 51 supplies the alignment liquid F <b> 2 to the ejection head 33.

  When the alignment liquid F2 is supplied to the ejection head 33, the control device 51 drives and controls the SCARA robot 26 and the light receiving stage 44 based on the light receiving coordinates Kp stored in advance, and the ejection head 33 and the light receiving unit 45. Are moved toward and immediately below the light receiving coordinates Kp, that is, the alignment operation is started.

During this time, the control device 51 outputs the piezoelectric element drive voltage COM1 and the laser drive voltage COM2 to the ejection head drive circuit 56 and the laser head drive circuit 57, respectively. Further, the control device 51 generates the trajectory information TaI including the light receiving coordinates Kp, the start point SP, each teaching coordinate Tp, the end point EP, and each interpolation coordinate via the interpolation calculation unit 51B, and the generated trajectory information TaI. And output to the inverse conversion unit 51C. When the trajectory information TaI is output to the inverse conversion unit 51C, the control device 51 passes through the inverse conversion unit 51C to start point SP, each teaching coordinate Tp, and end point E.
The arm rotation information θI corresponding to each of P and each interpolation coordinate is generated, and the generated arm rotation information θI is output to the SCARA robot drive circuit 55.

  When the ejection head 33 and the light receiving unit 45 are respectively disposed immediately above and immediately below the light receiving coordinate Kp, the control device 51 generates the alignment timing signal AP and the generated alignment timing signal AP. The data is output to the drive circuit 56, the laser head drive circuit 57, and the alignment mechanism drive circuit 58.

  When the control device 51 outputs the alignment timing signal AP, the laser head driving circuit 57 supplies the piezoelectric element driving voltage COM1 to the piezoelectric elements PZ corresponding to the reference nozzle Nm and the i-th nozzle Ni, respectively. Then, the reference droplet Fbm and the i-th droplet Fbi made of the alignment liquid F2 are discharged from the corresponding reference nozzle Nm and i-th nozzle Ni, respectively. The discharged reference droplet Fbm and i-th droplet Fbi land on the reference landing position PFm and i-th landing position PFi of the corresponding light conversion film 43 (detection surface 43a), respectively, and the liquid repellency of the detection surface 43a. Thus, the stagnation occurs in the area of the landed reference landing position PFm and the i-th landing position PFi.

  When the control device 51 outputs the alignment timing signal AP, the laser head driving circuit 57 waits for the flight time of the droplet Fb, and both the reference laser LDm and the i-th laser LDi are in the alignment period. A laser drive voltage COM2 is supplied to each. Then, the laser beam B from the reference laser LDm and the i-th laser LDi irradiates the reference irradiation position PTm and the i-th irradiation position PTi of the corresponding light conversion film 43 (detection surface 43a) only during the alignment period. The light conversion film 43 at the reference irradiation position PTm and the i-th irradiation position PTi that has received the laser beam B in the infrared region receives the converted light Bt having intensity peaks at the reference irradiation position PTm and the i-th irradiation position PTi. Exit toward

  When the control device 51 outputs the alignment timing signal AP, the alignment mechanism drive circuit 58 drives and controls the light receiving unit 45 during the alignment period to receive light from the detection surface 43a. Then, the light receiving unit 45 receives the combined light of the external light B0 via the reference droplet Fbm and the i-th droplet Fbi and the converted light Bt converted by the light conversion film 43, and generates the light reception information PI. .

  When the light receiving unit 45 generates the light receiving information PI, the alignment mechanism driving circuit 58 receives the light receiving information PI from the light receiving unit 45 and receives the reference landing position PFm, the i th landing position PFi, the reference irradiation position PTm, and the i th irradiation position. While detecting the position coordinates of PTi, the position coordinates of the focal position of the laser beam B corresponding to the reference irradiation position PTm and the i-th irradiation position PTi are detected. When the position coordinate of each position is detected, the alignment mechanism drive circuit 58 generates coordinate information ZI based on the position coordinate of each position and outputs the generated coordinate information ZI to the control device 51.

  Upon receiving the coordinate information ZI from the alignment mechanism drive circuit 58, the control device 51 arranges the focal position of the semiconductor laser LD on the detection surface 43a based on the coordinate information ZI, and sets all irradiation positions PT to Correction information AI for aligning with the landing position PF of the corresponding nozzle N is generated.

  When the correction information AI is generated, the control device 51 stores the generated correction information AI in the storage unit 51A. Further, the control device 51 displaces the used light receiving coordinate Kp by a predetermined amount and stores (updates) it in the storage unit 51A, and replaces the alignment liquid F2 in the ejection head 33 with the drawing liquid F1. To finish the alignment operation.

  When the alignment operation is finished, the control device 51 drives and controls the SCARA robot 26 based on the arm rotation information θI, and moves the head unit 30 toward the starting point SP.

  During this time, the control device 51 outputs the correction information AI to the laser head drive circuit 57 and drives and controls the laser stage 38 based on the correction information AI to set the laser head 39. That is, the control device 51 arranges the focal position of the semiconductor laser LD on the detection surface 43a based on the correction information AI, and aligns all the irradiation positions PT with the landing positions PF of the corresponding nozzles N, respectively. Like that. When all the irradiation positions PT are aligned with the landing positions PF of the corresponding nozzles N, the control device 51 displaces the laser head 39 by the irradiation standby distance Lw in the counter-scanning direction side. That is, the control device 51 sets the laser head 39 so as to displace all the irradiation positions PT (focal positions) by the irradiation standby distance Lw on the side opposite to the landing position PF in the scanning direction.

  During this time, the control device 51 generates bitmap data BMD corresponding to each nozzle N as an ejection control signal SI synchronized with a predetermined clock signal, and sequentially supplies the ejection control signal SI to the ejection head drive circuit 56. Serial transfer.

  When the head unit 30 eventually reaches the start point SP, the control device 51 starts scanning along the target locus R of the head unit 30 via the SCARA robot drive circuit 55. When the scanning of the head unit 30 along the target locus R is started, the control device 51 determines that the landing position PF is the most anti-Y arrow direction side of the first line code area S1 based on the calculation result from the SCARA robot drive circuit 55. It is determined whether or not the target discharge position P located at is reached.

  When the landing position PF reaches the target discharge position P located on the most anti-Y arrow side of the first line code area S1, the control device 51 outputs a discharge timing signal LP to the discharge head drive circuit 56, and discharges. A piezoelectric element drive voltage COM1 is supplied to each piezoelectric element PZ selected based on the control signal SI. Then, the droplets Fb are simultaneously discharged from the selected nozzles N, and each discharged droplet Fb is landed on the corresponding landing position PF (target discharge position P). The droplet Fb that has landed on the target discharge position P wets and spreads in the region of the corresponding target discharge position P (in the data cell C), and when the irradiation waiting time has elapsed from the start of the discharge operation, the outer diameter is changed to the cell width W. To.

  At this time, when the ejection timing signal LP is output to the ejection head drive circuit 56, the control device 51 outputs the ejection control signal SI converted to serial / parallel to the laser head drive circuit 57 via the ejection head drive circuit 56. To do. When the ejection control signal SI is output to the laser head driving circuit 57, the control device 51 causes the laser head driving circuit 57 to wait for the irradiation standby time. Further, the control device 51 scans the head unit 30 for the irradiation waiting time via the SCARA robot driving circuit 55 and makes each irradiation position PT relative to the corresponding target discharge position P.

  When each irradiation position PT is made to be relative to the corresponding target discharge position P, the control device 51 applies a laser drive voltage to each semiconductor laser LD selected based on the discharge control signal SI via the laser head drive circuit 57. COM2 is supplied. Then, the laser beam B from the selected semiconductor laser LD is emitted all at once, and the emitted laser beam B is irradiated to the droplet Fb at the corresponding irradiation position PT, that is, the outer diameter of the cell width W. The region of the droplet Fb having the is irradiated.

At this time, the laser beam B irradiated to the region of the droplet Fb can be caused to make the irradiation position PT (focal position) more accurately relative to the corresponding landing position PF as much as the alignment operation is performed. it can.

  As a result, each droplet Fb irradiated with the laser beam B receives the laser beam B having the same energy density at the center position of the droplet Fb, and uniformly evaporates the solvent and the dispersion medium. The fine particles are uniformly fired and are brought into close contact with the target discharge position P (data cell C). Thereby, uniform dots D whose outer shape is the cell width W can be formed in the data cell C.

  Thereafter, similarly, every time each landing position PF reaches the target discharge position P, the control device 51 discharges the droplet Fb from the selected nozzle N, and at the timing when the landed droplet Fb reaches the cell width W. The laser beam B is irradiated to the region of the droplet Fb. As a result, it is possible to form dots D whose outer shape is the cell width W in all selected data cells C.

  When all the dots D are formed and the head unit 30 is scanned to the end point EP, the control device 51 drives and controls the travel device 23 and the transport device 24 to form the mother substrate 2M on which the dots D are formed. It is carried into the stocker 22 and the forming operation of the identification code 10 is finished.

Next, effects of the present embodiment configured as described above will be described below.
(1) According to the above embodiment, the droplet discharge device 20 includes the light conversion film 43 stacked on the upper surface of the transmissive substrate 42 and the light receiving unit 45 disposed below the transmissive substrate 42. An alignment mechanism 40 is provided. Then, both the droplet Fb from the ejection head 33 and the laser beam B in the infrared region are received by the surface (detection surface 43a) of the light conversion film 43. Further, the intensity distribution of the combined light composed of the external light B0 via the droplet Fb landed on the detection surface 43a and the converted light Bt of the laser light B irradiated to the detection surface 43a is expressed as an ejection head 33 (nozzle formation surface 34a). ) To be detected from the opposite side.

Therefore, it is possible to detect both the landing position PF of the droplet Fb and the irradiation position PT of the laser beam B that cannot be visually recognized from the side facing the ejection head 33 (nozzle formation surface 34a). As a result, the alignment accuracy between the landing position PF and the irradiation position PT can be improved. Therefore, the shape controllability of the dot D can be improved.
(2) According to the above embodiment, based on the light intensity distribution detected by the light receiving unit 45, the position coordinates of the reference landing position PFm, the i-th landing position PFi, the reference irradiation position PTm, and the i-th irradiation position PTi are detected. I tried to make it. Based on the detected position coordinates of each position, the laser stage 38 is driven and controlled so that all the irradiation positions PT are aligned with the landing positions PF of the corresponding nozzles N, respectively.

Accordingly, both the landing position PF of the droplet Fb and the irradiation position PT of the laser beam B can be more accurately aligned.
(3) According to the above embodiment, the position coordinates of the focal position of the laser beam B corresponding to the reference irradiation position PTm and the i-th irradiation position PTi are detected based on the light intensity distribution detected by the light receiving unit 45. I made it. Based on the position coordinates of the detected focal position, the laser stage 38 is driven and controlled so that the focal position of the semiconductor laser LD is arranged at a predetermined height position (on the detection surface 43a).

Therefore, it is possible to irradiate the region of the landing position PF with the laser beam B having a predetermined energy density. As a result, the shape controllability of the dots D can be further improved.
(4) According to the above embodiment, the height position of the detection surface 43a of the light conversion film 43 is set to be the same as the height position of the surface 2Ma of the mother substrate 2M.

Therefore, the flight state (landing accuracy) of the droplet Fb ejected toward the detection surface 43a is the same as the flight state (landing accuracy) of the droplet Fb ejected toward the surface 2Ma of the mother substrate 2M. Can be made. Further, the irradiation state (irradiation accuracy) of the laser beam B irradiated toward the detection surface 43a is the same as the irradiation state (irradiation accuracy) of the laser beam B irradiated toward the surface 2Ma of the mother substrate 2M. Can be made.

As a result, the landing position PF and the irradiation position PT aligned on the detection surface 43a can be reliably reproduced on the surface 2Ma of the mother substrate 2M.
In addition, you may change the said embodiment as follows.
In the above embodiment, the light conversion film 43 is formed of an infrared-visible conversion material. Not limited to this, the light conversion film 43 may be configured by an ultraviolet-visible conversion material (for example, a fluorescent material) that converts laser light in the ultraviolet region as light in the visible region. According to this, the irradiation position PT of the laser beam in the ultraviolet region can be detected.

  Further, the light conversion film 43 is formed by a coating film of a material (for example, ink in which carbon black or metal fine particles are dispersed) that is fired by laser light irradiation and emits detectable light. Also good. Further, the light conversion film 43 may be formed of a light-shielding film that blocks external light, and may be configured to form a through-hole that allows external light to pass through by baking with laser light.

That is, the light conversion film 43 may be a member that emits light in the visible region corresponding to the laser light incident on the detection surface 43a to the back surface side.
In the above embodiment, the light conversion member is embodied in the light conversion film 43. For example, the light conversion member may be embodied as a light diffusing plate (for example, ground glass or translucent plastic) that diffuses the irradiated laser beam B. According to this, the laser beam B irradiated on the upper surface of the transmission substrate 42 can be diffused, and the region of light that can be detected in the case 41 can be expanded.
In the above embodiment, the reference landing position PFm, i-th landing position PFi, reference irradiation position PTm, i-th irradiation position PTi, and position coordinates of the focal position are detected based on the intensity distribution of light received by the light receiving unit 45. Made the configuration. However, the present invention is not limited to this, and the position coordinates of each position may be detected based on the wavelength distribution and direction distribution of light received by the light receiving unit 45. According to this, the position coordinates of each position can be detected more accurately. In addition, the range of the laser beam B that can be irradiated onto the region of the droplet Fb can be expanded.
In the above embodiment, the light conversion film 43 is configured to eject the droplet Fb. For example, the alignment mechanism 40 for detecting the landing position PF of the droplet Fb may be separately provided on the base 21. Accordingly, the constituent material of the light conversion film 43 can be selected regardless of the type or size of the droplet Fb, and the degree of design freedom for the light conversion film 43 can be expanded.
In the above embodiment, each irradiation position PT is aligned with the corresponding landing position PF by changing the arrangement of the laser head 39 by the laser stage 38. For example, the landing positions PF may be aligned with the corresponding irradiation positions PT by changing the arrangement of the ejection head 33, or the arrangement positions of both the laser head 39 and the ejection head 33 may be changed. It may be changed and each landing position PF may be configured to be aligned with the corresponding irradiation position PT.
In the above embodiment, based on the reference irradiation position PTm, the reference landing position PFm, the i-th irradiation position PTi, and the i-th landing position PFi, the correction information AI regarding the X movement amount Wm, the Y movement amount Hm, and the rotational movement amount θa is obtained. Generated. Then, the irradiation positions PT corresponding to all the semiconductor lasers LD are respectively set to the corresponding nozzles by the positional alignment of the combination of the reference irradiation position PTm and the reference landing position PFm and the combination of the i-th irradiation position PTi and the i-th landing position PFi. The position is aligned with the N landing position PF.

For example, the alignment operation may be executed only by a combination of the reference irradiation position PTm and the reference landing position PFm, or only by a combination of the i-th irradiation position PTi and the i-th landing position PFi. The configuration may be such that the alignment operation is executed. Furthermore, the configuration may be such that all the irradiation positions PT are aligned with the corresponding landing positions PF based on the laser beams B from all the semiconductor lasers LD and the droplets Fb from all the nozzles N. . That is, it is only necessary to align the predetermined irradiation position PT with the corresponding landing position PF based on the laser beam B from the semiconductor laser LD and the droplet Fb from the corresponding nozzle N.
In the above embodiment, the droplet Fb is ejected from the reference nozzle Nm and the i-th nozzle Ni only by one droplet.

However, the configuration is not limited thereto, and a plurality of droplets Fb may be ejected from the same nozzle N. According to this, the size of the alignment liquid F2 located at the landing position PF can be increased. As a result, the landing position PF can be detected more accurately even when the size of the ejected droplet Fb is small.
In the above embodiment, the head unit 30 is stationary on the detection surface 43a when performing the alignment operation. For example, the head unit 30 may be configured to execute the alignment operation by a combination of the nozzle N and the semiconductor laser LD while scanning the head unit 30 in the arrangement direction of the nozzles N (semiconductor lasers LD). . In other words, a plurality of different landing positions PF and irradiation positions PT may be detected by a combination of a predetermined nozzle N and a corresponding semiconductor laser LD.

According to this, the irradiation positions PT corresponding to all the semiconductor lasers LD are aligned with the landing positions PF of the corresponding nozzles N by a combination of a predetermined nozzle N and a corresponding semiconductor laser LD. Can do.
In the above embodiment, the light conversion film 43 is disposed so that the height position of the detection surface 43a is the same as the height position of the surface 2Ma of the mother substrate 2M. For example, the laser stage 38 is driven and controlled in the vertical direction so that the distance between the laser head 39 and the detection surface 43a is made to be relative to the distance between the laser head 39 and the surface 2Ma. Also good.

Alternatively, a stage for displacing the head unit 30 in the vertical direction is provided between the third arm 28c and the head unit 30, and the stage is driven and controlled so that the ejection head 33 (laser head 39) and the detection surface 43a are connected. The distance between them may be made to be relative to the distance between the ejection head 33 (laser head 39) and the surface 2Ma.
In the embodiment described above, the alignment liquid material tank 32b is disposed in the head unit 30, and the alignment liquid material F2 is discharged when performing the alignment operation. However, the present invention is not limited to this. For example, the drawing liquid F1 may be discharged when the alignment operation is performed without disposing the alignment liquid tank 32b. According to this, the alignment operation can be executed with a simpler configuration. In the above embodiment, each time the alignment operation is performed, the light receiving coordinate Kp is updated, and the alignment liquid F2 is ejected to different positions on the detection surface 43a. For example, a moving unit that moves the transmissive substrate 42 along the XY plane direction is provided, and each time the alignment operation is performed, the moving unit is driven and controlled to move the transmissive substrate 42 to a predetermined distance. You may comprise so that only displacement may be carried out.
In the above embodiment, the light from the detection surface 43 a is directly received by the light receiving unit 45. For example, a reflection mirror that reflects light from the detection surface 43a may be provided below the detection surface 43a, and light that passes through the reflection mirror may be received by the light receiving unit 45. According to this, the freedom degree of the arrangement position of the light-receiving part 45 or the light-receiving stage 44 can be expanded.
In the above embodiment, the head unit 30 is mounted on the SCARA robot 26 and the mother board 2
It was configured to move in a two-dimensional direction on M. For example, the head unit 30 may be fixed and the mounting board of the mother substrate 2M may be moved, or the head unit 30 may be mounted on a carriage and moved in a one-dimensional direction on the mother substrate 2M. You may make it the structure to make.
In the above embodiment, the droplet Fb is dried and fired by the laser beam B that irradiates the irradiation position PT. For example, the configuration may be such that the droplet Fb flows in a desired direction by the energy of the laser beam B to be irradiated. Alternatively, the configuration may be such that only the outer edge of the droplet Fb is irradiated with the laser beam B and the droplet Fb is pinned. In other words, any configuration may be used as long as the pattern formed of the droplets Fb is formed by the laser beam B applied to the region of the droplets Fb.
In the above embodiment, the hemispherical dots D are formed by the droplets Fb. However, the present invention is not limited to this. For example, an oval dot or a linear pattern may be formed.
In the above embodiment, the pattern is embodied as the dot D. For example, the pattern may be embodied in various thin films, metal wirings, color filters, and the like provided in the liquid crystal display device 1, and further an electric field including a planar electron-emitting device that emits a fluorescent material. The present invention may be embodied in various thin films and metal wirings provided in various display devices such as effect type devices (FED, SED, etc.). That is, any pattern may be used as long as it is composed of the droplet Fb irradiated with the laser beam B.
In the above embodiment, the object is embodied in the mother substrate 2M, but is not limited thereto, and may be a silicon substrate, a flexible substrate, a metal substrate, or the like, and the pattern is formed by the landed droplets Fb. Any object can be used.

The top view which shows the liquid crystal display device in this embodiment. Similarly, the schematic perspective view which shows a droplet discharge device. Similarly, the schematic plan view which shows a liquid suitable discharge apparatus. Similarly, the schematic side view explaining a head unit. Similarly, the schematic side view explaining a droplet discharge head. Similarly, the schematic side view explaining an alignment mechanism. Similarly, the schematic side view explaining an alignment mechanism. Similarly, explanatory drawing explaining alignment operation. Similarly, explanatory drawing explaining alignment operation. Similarly, the electric block circuit diagram which shows the electric constitution of a droplet discharge apparatus.

Explanation of symbols

2M ... Mother board as object, 20 ... Droplet ejection device, 33 ... Droplet ejection head, 38 ... Laser stage constituting position changing means, 39 ... Laser head constituting laser irradiation means, 40 ... Alignment mechanism, DESCRIPTION OF SYMBOLS 43 ... Light conversion film as a light conversion member, 43a ... Detection surface, 45 ... Light-receiving part which comprises light-receiving means, 51 ... Control apparatus which comprises control means, B ... Laser beam, Fb ... Droplet, F1 ... For drawing Liquid, F2 ... Alignment liquid, PF ... landing position, PT ... irradiation position.

Claims (10)

In a droplet ejection apparatus comprising: a droplet ejection head that ejects droplets onto an object; and a laser irradiation unit that irradiates laser light onto the droplets that have landed on the object.
A light conversion member that makes the laser light from the laser irradiation means incident on the surface and emits visible light corresponding to the laser light incident on the surface to the back surface side;
A light detecting means disposed on the back side of the light conversion member for detecting at least one of intensity distribution, wavelength distribution, and direction distribution of visible light on the back side;
A droplet discharge apparatus comprising: The droplet discharge device according to claim 1,
The light conversion member receives a droplet from the droplet discharge head on the surface, and transmits the light on the surface side through the droplet received on the surface to the back surface side. Droplet discharge device. The liquid droplet ejection apparatus according to claim 1 or 2,
The droplet conversion device, wherein the light conversion member is made of at least one of an infrared-visible conversion material and an ultraviolet-visible conversion material. In the liquid droplet ejection apparatus according to any one of claims 1 to 3,
Position changing means for changing the relative position of the laser irradiation means with respect to the droplet discharge head;
Based on the detection signal detected by the light detection means, both the landing position of the droplet landed on the surface and the irradiation position of the laser light irradiated on the surface are detected, and the landing position and the irradiation are detected. Control means for driving and controlling the position changing means based on the position;
A droplet discharge apparatus comprising: In a droplet ejection apparatus comprising: a droplet ejection head that ejects droplets onto an object; and a laser irradiation unit that irradiates laser light onto the droplets that have landed on the object.
A light conversion member that makes the laser light from the laser irradiation means incident on the surface and emits scattered light corresponding to the laser light incident on the surface to the back surface side;
A light detection means disposed on the back side of the light conversion member for detecting at least one of intensity distribution, wavelength distribution, and direction distribution of the scattered light converted by the light conversion member;
A droplet discharge apparatus comprising: In the droplet discharge device according to claim 5,
The light conversion member receives a droplet from the droplet discharge head on the surface, and transmits the light on the surface side through the droplet received on the surface to the back surface side. Droplet discharge device. In the droplet discharge device according to claim 5 or 6,
The droplet conversion device, wherein the light conversion member is a light diffusion plate. In the droplet discharge device according to claim 7,
The light diffusing plate is made of any one of frosted glass and translucent plastic. In the droplet discharge device according to any one of claims 5 to 8,
Position changing means for changing the relative position of the laser irradiation means with respect to the droplet discharge head;
Based on the detection signal detected by the light detection means, both the landing position of the droplet landed on the surface and the irradiation position of the laser light irradiated on the surface are detected, and the landing position and the irradiation are detected. Control means for driving and controlling the position changing means based on the position;
A droplet discharge apparatus comprising: In the liquid droplet ejection device according to any one of claims 1 to 9,
The liquid droplet ejection apparatus according to claim 1, wherein an arrangement position of the surface in the irradiation direction of the laser light is substantially equal to an arrangement position of the object in the irradiation direction.

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