JP2007160834A - Inkjet recording head, and manufacturing equipment and method of inkjet recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve recording quality, ensure high-speed recording and reduce manufacturing costs by reducing density irregularities caused by differences in discharge quantities due to manufacturing processes among recording element boards. <P>SOLUTION: The inkjet recording head has a plurality of recording element boards H1100, in which a plurality of nozzles H1105 discharging ink and a plurality of electro-thermal conversion elements generating discharge energy are arranged, are arranged along the nozzle arrangement direction, The recording element boards H1100 are arranged in order of the average discharge quantity of each of the recording element boards H1100. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inkjet recording head that performs a recording operation by ejecting ink onto a recording medium such as recording paper, and an inkjet recording head manufacturing apparatus and manufacturing method.

  Conventional inkjet recording apparatuses have a relatively low running cost, can be reduced in size, and can easily support color image recording using a plurality of colors of ink. Widely used in equipment and commercialized.

  On the other hand, as an energy generating element that generates energy for ejecting ink from the ejection port of the recording head, an element that uses an electromechanical transducer such as a piezo element, or an electromagnetic wave such as a laser emits heat to generate heat. And the like that eject ink droplets by the action of. As an energy generating element, an element that heats a liquid by an electrothermal conversion element having a heating resistor is known.

  Among them, a recording head of an ink jet recording method that discharges ink droplets using thermal energy can arrange the discharge ports at high density, so that high-resolution recording is possible. Furthermore, among them, a recording head using an electrothermal transducer as an energy generating element can be easily downsized. Furthermore, recording heads using electrothermal transducers can make full use of the advantages of IC technology and micromachining technology, which have made remarkable progress in technology and reliability in recent semiconductor fields, and facilitate high-density mounting. This is advantageous because the manufacturing cost is low.

Recently, in order to perform higher-definition recording, a method for producing a nozzle for ejecting ink with high accuracy using a photolithography technique has been used.
Japanese Patent Laid-Open No. 5-24192 Japanese Patent Laid-Open No. 7-224004

  In recent years, in order to realize high-definition image recording at a higher speed, it is desired to realize a recording head having a longer recording width. Specifically, a recording head having a length of 4 inches to 12 inches or the like has been required.

  There are various problems in realizing such a recording head having a long recording width.

  For example, a recording element substrate having a so-called side shooter type recording element in which the ink ejection direction is orthogonal to the heater surface includes a large number of recording elements corresponding to the number of nozzles. For this reason, when these many recording elements are configured on a single recording element substrate, the recording element substrate becomes very long, and problems such as cracking and warping of the recording element substrate occur.

  Further, since the recording element substrate is very long, there is a problem that the yield of the recording element substrate itself in the manufacturing process is lowered.

  Therefore, in Patent Document 1 or the like, by having an appropriate number of nozzles, a plurality of recording element substrates having appropriate lengths are arranged on a plate to realize a recording head having a long recording width as a whole. A configuration is proposed.

  However, the recording head having such a configuration has the following problems.

  Since a dimensional variation caused by the manufacturing process occurs between a plurality of recording element substrates, each recording element substrate has a slight discharge amount. When such recording element substrates are randomly arranged, the relationship between the recording element substrate and each discharge amount, that is, the density, is uneven when the density changes as shown in FIG. There is. As a result of recording with the recording head in which each recording element substrate is arranged in this way, as shown in the schematic diagram of FIG. 17B, density unevenness is caused even by a slight difference in ejection amount between the recording element substrates. It is difficult to perform high-quality recording. In particular, when there is a large discharge amount difference between adjacent recording element substrates, density unevenness becomes very noticeable. Note that FIG. 17B shows a state in which recording is performed with a density difference that is more extreme than actual, for easy understanding.

  Various methods for correcting such density unevenness between recording element substrates in software have been proposed, as disclosed in Patent Document 2 and the like. May increase the number of man-hours during inspections.

  In such a correction method, correction is generally performed using a correction table or the like obtained in advance by experiments. However, there is not always a good correlation between the actually manufactured recording head and the correction table, and there are cases where density unevenness cannot be reliably corrected.

  Accordingly, the present invention provides an inkjet recording head, an inkjet recording head manufacturing apparatus, and a manufacturing method that enable high-speed recording by improving density and reducing manufacturing costs by suppressing density unevenness between the recording element substrates. The purpose is to do.

  In order to achieve the above-described object, an inkjet recording head according to the present invention includes a plurality of recording element substrates in which a plurality of nozzles that eject ink and a plurality of recording elements that generate ejection energy are arranged in the nozzle arrangement direction. In the inkjet recording heads disposed along the plurality of recording element substrates, the plurality of recording element substrates are disposed in the order of the average discharge amount of each recording element substrate.

  As described above, according to the present invention, it is possible to reduce the density unevenness between the recording element substrates arranged in the nozzle arrangement direction, improve the recording quality, and perform high-speed recording. In addition, according to the present invention, the manufacturing cost can be reduced by reducing density unevenness relatively simply.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
6 to 16 are explanatory diagrams for explaining the recording head, the drive circuit, the ink jet recording apparatus, and the respective relationships according to the present embodiment. Hereinafter, the entire apparatus will be described with reference to these drawings while explaining the configuration of each part.

(1) Description of Recording Head As shown in FIG. 6, the recording head H1000 performs recording by using an electrothermal transducer that generates thermal energy for causing film boiling to the ink in accordance with an electrical signal. This is a recording head of a bubble jet type side shooter type.

  As shown in FIG. 7, the recording head H1000 includes a recording element unit H1001 and an ink supply member H1500 of the ink supply unit H1002. Further, as shown in FIG. 8, the recording element unit H1001 includes a recording element substrate H1100, a first plate H1200, an electric wiring substrate H1300, a second plate H1400, and a filter member H1600. As shown in FIG. 9, the ink supply unit H1002 includes an ink supply member H1500, a joint rubber H1700, a tube H1802, and an ink tank H1800.

(1-1) Recording Element Unit FIG. 10A is a diagram illustrating the configuration of the recording element substrate H1100, and FIG. 10B is a cross-sectional view taken along the line AA in FIG. The recording element substrate H1100 has a thin film formed of, for example, a Si substrate H1108 having a thickness of 0.5 mm to 1 mm. In addition, the recording element substrate H1100 is formed with an ink supply port H1101 having a long groove-like through-hole as an ink flow path, and the electrothermal conversion elements H1102 are alternately arranged on each side of the ink supply port H1101. Yes. The electrothermal transducer H1102 and electric wiring such as Al are formed by a film forming technique. The recording element substrate H1100 is provided with an electrode H1103 for supplying electric power to the electrical wiring. The ink supply port H1101 is formed by anisotropic etching using the crystal orientation of the Si substrate H1108. When the wafer surface has a crystal orientation of <100> and a thickness direction of <111>, etching proceeds at an angle of about 54.7 degrees by anisotropic etching (KOH, TMAH, humanradine, etc.). . Etching is performed to a desired depth using this method.

  Further, a nozzle plate H1110 is provided on the Si substrate H1108, and an ink flow path H1104, a nozzle H1105, and a foaming chamber H1107 corresponding to the electrothermal conversion element H1102 are formed by a photolithography technique. The nozzle H1105 is provided so as to face the electrothermal conversion element H1102, and causes the ink supplied from the ink supply port H1101 to generate bubbles by the electrothermal conversion element H1102 to discharge the ink.

The first plate H1200 is made of, for example, an alumina (Al2O3) material having a thickness of 0.5 mm to 10 mm. The material of the first plate H1200 is not limited to alumina, and has a linear expansion coefficient equivalent to that of the material of the recording element substrate H1100, and the thermal conductivity of the recording element substrate H1100 material. It may be made of a material having a thermal conductivity equal to or greater than. Examples of the material of the first plate H1200 include silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), and tungsten (W). Either may be sufficient.

  In the first plate H1200, an ink supply port H1201 for supplying ink to the recording element substrate H1100 is formed. In the first plate H1200, the ink supply port H1101 of the recording element substrate H1100 corresponds to the ink supply port H1201 of the first plate H1200, and the recording element substrate H1100 is bonded and fixed to the first plate H1200 with high positional accuracy. The The first adhesive H1202 is desirably, for example, a material having a low viscosity, a thin adhesive layer formed on the contact surface, a relatively high hardness after curing, and ink resistance. The first adhesive H1202 is, for example, a thermosetting adhesive mainly composed of an epoxy resin or an ultraviolet curing combined thermosetting adhesive, and the thickness of the adhesive layer is desirably 50 μm or less. The first plate H1200 has an X-direction reference H1204, a Y-direction reference H1205, and a Z-direction reference H1206, which are positioning references.

  As shown in FIG. 6, the recording element substrate H1100 is alternately arranged in two rows on the first plate H1200 to enable wide recording with the same color. For example, four recording element substrates H1100a, H1100b, H1100c, and H1100d having a nozzle group length of 1 inch + α are alternately arranged in two rows, thereby enabling recording of a width of 4 inches.

  Further, at the end of the ejection port group of each recording element substrate, there is provided an overlapping region L with respect to the end of the nozzle group of the recording element substrate adjacent across the row and the nozzle row direction, It is possible to prevent a gap from being generated in recording by each recording element substrate. For example, the nozzle groups H1106a and H1106b are provided with overlapping regions H1109a and H1109b.

  The electrical wiring substrate H1300 applies an electrical signal for ejecting ink to the recording element substrate H1100. The electric wiring substrate H1300 has an opening for incorporating the recording element substrate H1100, and is bonded and fixed to the main surface of the first plate H1200 with a second adhesive H1203. The electric wiring board H1300 has an electrode terminal H1302 corresponding to the electrode H1103 of the recording element board H1100 and an external signal input terminal H1301 which is located at the end of the wiring and receives an electric signal from the recording apparatus main body. is doing.

  The electrical wiring board H1300 and the recording element board H1100 are electrically connected. As this connection method, for example, the electrode H1103 of the recording element substrate H1100 and the electrode terminal H1302 of the electric wiring substrate H1300 are electrically connected by a wire bonding technique using a gold wire (not shown). As a material of the electrical wiring board H1300, for example, a flexible wiring board having a two-layer structure is used, and a surface layer is covered with a polyimide film.

  The second plate H1400 is formed of a SUS plate having a thickness of 0.5 mm to 1 mm, for example. Note that the material of the second plate H1400 is not limited to SUS, and may be made of a material having ink resistance and good flatness. The second plate H1400 has a recording element substrate H1100 bonded and fixed to the first plate H1200, and an opening for taking in an electric mounting region of the recording element substrate H1100 and the electric wiring substrate H1300. Then, the second plate H1400 is bonded and fixed on the electric wiring board H1300 by the third adhesive H1401.

  A groove formed by the opening H1402 of the second plate H1400 and the side surface of the recording element substrate H1100 is filled with the first sealant H1304, and the electrical mounting portion of the electrical wiring substrate H1300 is sealed. Further, the electrode H1103 of the recording element substrate is sealed with a second sealant H1305 to protect the electrical connection portion from corrosion by ink and external impact.

  A filter member H1600 for removing foreign matter mixed in the ink is bonded and fixed to the back surface side ink supply port H1201 of the first plate H1100.

(1-2) Ink Supply Unit The ink supply member H1500 is formed by, for example, injection molding using a resin material, and includes a common liquid chamber H1501 and a Z-direction reference surface H1502. The Z reference plane H1502 positions and fixes the recording element unit and serves as the Z reference for the recording head H1000.

  In addition, a joint rubber H1700 is provided at an ink supply port H1504 that supplies ink from the ink tank H1800, thereby preventing evaporation of ink from the joint portion.

  The ink supply tube H1802 extending from the ink tank H1800 and the ink supply unit H1500 are connected by a needle H1801 provided at the tip of the tube passing through the joint rubber H1700. Ink used at the time of ejection passes through the ink supply tube H1802 by the ink tank H1800, is supplied to the common liquid chamber H1501 of the ink supply unit H1500, and is supplied to the recording element unit H1001 through the filter member H1600.

(1-3) Coupling of Recording Element Unit and Ink Supply Unit As shown in FIG. 7 described above, the recording head H1000 is completed by coupling the recording element unit H1001 to the ink supply member H1500.

  The recording element unit H1001 and the ink supply member H1500 are coupled as follows.

  The opening of the ink supply member H1500 and the recording element unit H1001 are sealed with a third sealant H1503, and the common liquid chamber H1501 is sealed. Then, the Z reference H1502 of the recording element unit H1001 is positioned and fixed to the Z reference H1502 of the ink supply member H1500 using, for example, a screw H1900. The third sealant H1503 is desirably a sealant that has ink resistance, is cured at room temperature, and has flexibility to withstand a difference in linear expansion between different materials.

  Further, the external signal input terminal H1301 portion of the recording element unit H1001 is positioned and fixed on the back surface of the ink supply member H1500, for example.

(2) Description of Drive Circuit As shown in FIG. 6, in the print head H1000 of this embodiment, four print element substrates H1100 are accurately arranged on a chip plate H1200, and further four print element substrates H1100 are electrically connected. Wiring is performed on the wiring board H1300. FIG. 14 is a circuit diagram showing signal wiring between the four recording element substrates H1100. In FIG. 14, each of the four recording element substrates H1100a to H1100d is composed of two odd-numbered and even-numbered nozzle row drive circuits as shown in FIGS.

  HEATO, HEATE, IDATAO, and IDATAE are taken out separately for each element evenly and oddly, and are indicated by signal names of HEAT1 to HEAT8 and IDATA1 to IDATA8 for each recording element substrate H1100. Other signals are wired in common between the recording element substrates H1100. LTCLK, DCLK, HEAT1 to HEAT8, IDATA1 to IDATA8 are connected to an external signal input terminal H1301, and VH, GNDH, VDD, and GND which are power supply systems are connected to a power supply terminal H1302.

  FIG. 10 is a diagram showing the configuration of the recording element substrate H1100, in which odd and even two nozzle rows are arranged on both sides of the ink supply port H1101 while being shifted by half the nozzle pitch. These two drive circuits are formed on the recording element substrate by a semiconductor process. Each drive circuit has HEATO, HEATE, IDATAO, and IDATAE signals independently wired, but other signals (DCLK, LTCLK) and power supplies (VDD, GND, VH, HGND) are printing elements. Common wiring is also used in the substrate. In both the odd and even nozzle rows, 640 nozzles are arranged at a pitch of 600 dpi and are shifted by a half pitch as described above, so that a nozzle row of 1200 dpi and 1280 dpi is formed as a printing element substrate. .

  Since the drive circuit of each nozzle row is exactly the same, an outline of the drive circuit will be described with reference to FIG. Each of the 640 nozzles is provided with discharge heaters H1102-1 to H1102-1279, and by driving each of the discharge heaters H1102-1 to H1102-1279, the ink in the nozzles is foamed and ink droplets are discharged. Each of the discharge heaters is divided into 20 drive blocks and 32 drive blocks, and is driven in a time division manner. The drive block is selected by signals BE0 to BE31, and the 20 discharge heaters belonging to the drive block determine whether or not to discharge by turning on / off the transistors E1006-1 to E1006-20.

  The drive of the recording head H1000 will be described with reference to the drive timing chart shown in FIG. 15 and FIG. The PRINT signal is a pulse signal that gives the timing for starting ejection of one column, and the operation of the drive circuit starts at the rise timing of the pulse. When the drive circuit starts operation, LTCLK is first generated, and several hundreds ps after that, the transfer clock DCLK is output for the transfer data, that is, 25 clocks. Transfer data is output to each signal of IDATA1 to IDATA8 in synchronization with DCLK and serially transferred to the 25-bit shift register E1001.

  The data stored in the shift register E1001 is stored in the 25-bit latch E1002 at the timing of LTCLK output at the beginning of the next drive block. Therefore, the actual driving is performed based on the first transfer data at the timing when the next block is transferred. The data content transferred here is a total of 25 bits including 5 bits for the number of blocks to be driven BENB0 to BENB4 and 20 bits for the drive data of the electrothermal transducer H1102 driven in that block. The drive blocks BENB0 to BENB4 are decoded into BE0 to BE31 by the 5 → 3 decoder E1003 and connected to the base electrodes of the transistors E1005-1 to E1005-32.

  For this reason, only one of the 32 transistors E1005-1 to E1005-32 is always driven, and the drive power supply (VH) is supplied only to one end of the electrothermal conversion element belonging to the designated block. It will be. On the other hand, the other ends of the electrothermal transducers H1102-1 to H1102-1279 are connected in parallel by 32 for each segment, and are connected to collector electrodes of 20 transistors E1006-1 to E1006-20, respectively. The driving of these transistors is controlled by outputs of AND gates E1004-1 to E1004-20 connected to the base electrode. A 20-bit drive data signal is connected to one input of the AND gate, and pulse signals HEAT1 to HEAT8 are connected to the other to give timing for actually driving the electrothermal transducer.

  Therefore, the transistors E1006-1 to E1006-20 are controlled by AND of the above-mentioned two signals, and as a result, the segment designated by the 20-bit drive data is driven at the pulse timing of HEAT1 to HEAT8. Will be. As described above, when the PRINT signal is activated, the drive circuit starts operation, the 0th block is driven first, the first block, the second block,..., And finally 31 blocks. The eye completes driving, and the ejection operation of all the nozzles of all the printing element substrates is controlled.

(3) Inkjet recording apparatus As shown in FIG. 11, the inkjet recording apparatus M4000 of the present embodiment includes, for example, recording heads for six colors corresponding to photographic image quality recording. The recording head H1000Bk is a recording head for black ink, the recording head H1000C is for cyan ink, the recording head H1000M is for magenta ink, and the recording head H1000Y is for yellow ink. The recording head H1000LC is for light cyan ink, and the recording head H1000LM is for light magenta ink. These recording heads H1000 are fixed and supported by positioning means and electric contacts M4002 of a carriage M4001 mounted on the ink jet recording apparatus main body M4000.

  These recording heads H1000 are controlled by the drive circuit described above to perform recording on the recording medium. In the recording apparatus shown in FIG. 11, the recording head is a full line type recording head having nozzles corresponding to the width of the recording medium, the recording head is fixed, and the recording medium scans in the direction of the arrow. This is a recording method.

  In contrast, the recording apparatus shown in FIG. 16 is a serial drive type recording apparatus in which the recording head performs recording while reciprocating in the main scanning direction (carriage movement direction).

  Next, the first embodiment will be described in more detail.

  FIG. 1 is an external perspective view showing the recording head of this embodiment, but shows a recording head in which eight recording element substrates are arranged as an example for easy understanding. The basic configuration other than the number of recording element substrates is the same as that of the recording head shown in FIG. Each recording element substrate has No. 1 in order from one end side. 1-No. Recording element substrate numbers up to 8 are assigned.

  FIG. 2A is a diagram showing the density of each recording element substrate of the recording head shown in FIG. 1, that is, the ejection amount. As shown in FIG. 2A, the recording element substrates are arranged in the order of the discharge amount. Therefore, in the conventional example, the density difference between the adjacent recording element substrates is relatively large, and the density unevenness between the recording element substrates in the entire recorded matter is very large, which deteriorates the recording quality.

  Compared to this, as shown in FIG. 2B, the recorded matter recorded by the recording head of the present embodiment has a smooth transition in density, so density unevenness is reduced and high quality is achieved. It has become a record. Note that FIG. 2B shows a state where recording is performed with a density difference that is more extreme than actual, for easy understanding.

  Thus, good recording can be obtained by measuring the discharge amount (density) of each recording element substrate and arranging them in the order of the discharge amount. However, in the case of actually manufacturing a recording head, it is difficult in terms of its configuration to bond and fix the recording element substrate on the plate after measuring the ejection amount.

  Therefore, in the present invention, instead of measuring the ejection amount of each recording element substrate, for example, a configuration is proposed in which the ejection orifice diameter of the nozzle is measured and each recording element substrate is arranged based on the measurement data of the ejection orifice diameter. Yes. This is because, in general, if the size of the discharge heater of the recording element substrate is the same, the discharge amount depends on the volume of the foaming chamber H1107 as shown in FIG. Therefore, the discharge port diameter φD (FIG. 3A), which is one of the parameters for determining the volume of the foaming chamber H1107, is one factor for determining the discharge amount. In particular, in a printing element substrate manufactured in the same wafer, the height h of the foaming chamber H1107 is often substantially constant. In such a case, each printing element is based on the measurement data of the discharge port diameter. A substrate may be disposed.

  Further, for example, when the variation in the discharge port diameter is relatively small, the foaming chamber height h may be measured, and the foaming chamber height h may be used as a parameter instead of the discharge amount. Alternatively, both the discharge port diameter and the foaming chamber height may be measured, and the arrangement of the recording element substrates may be determined based on the value of the foaming chamber volume calculated from these measured values. Which of the above-described parameters is used may be selected as appropriate depending on the manufacturing variation of the nozzle. Thus, instead of measuring the discharge amount of the nozzle, it is not necessary to actually perform the discharge by the nozzle by measuring an arbitrary parameter such as the discharge port diameter of the nozzle. Manufacturing cost can be reduced.

  In particular, the present invention relates to a so-called side shooter type recording head in which the ejection energy generating element is an electrothermal conversion element, and the ejection direction is a direction perpendicular to the electrothermal conversion element surface, and bubbles generated during foaming Is suitable for a system in which discharge is completed by communicating with outside air. That is, the present invention is preferably applied to a recording head in which all ink ahead of the foamed bubbles is ejected.

  This is because, in this side shooter type recording head, the discharge amount is stable, and the discharge amount is determined by the size of the nozzle, so the correlation between the measurement parameters such as the discharge port diameter and the actual discharge amount is relatively high. Because. Therefore, the side shooter type recording head enables high-quality recording with reduced density unevenness.

  In addition, when the nozzle is formed by a photolithography technique, it is possible to form a highly accurate nozzle, and thus it is more preferable to apply the present invention.

  By the way, there is a case where the shape of the nozzle does not have a sharp edge, for example, in a cross-sectional shape, and the edge is formed in an arc shape due to a design factor or the like. In such a case, depending on the measurement method, it may be difficult to perform measurement with high accuracy, resulting in a relatively large variation in measurement. In such a case, a dummy pattern for measurement is prepared in advance in addition to the nozzle in a manufacturing process using a photolithography technique similar to that for the nozzle. The dummy pattern is formed in a size and shape suitable for measurement, for example, by forming a sharp edge in a cross-sectional shape. Then, instead of measuring the actual nozzle, by measuring the shape dimension of this dummy pattern, it is possible to substitute the parameter of the nozzle, and the measurement can be performed with high accuracy.

  Although the above-described measurement of the discharge port diameter and the like is performed, since there are a large number of nozzles even in one recording element substrate, the measurement time becomes very long when all the nozzles are measured. If nozzles are formed using photolithography technology, etc., they are basically manufactured with high accuracy. Therefore, by measuring several nozzles in one recording element substrate, all the nozzles can be used sufficiently. Can be representative of the measured data. When the dimensional variation is relatively small, it may be sufficient to measure one nozzle in one printing element substrate. However, how many nozzles are actually measured depends on the state of the manufactured nozzles. To decide.

  The recording head of this embodiment is preferably applied to a full-line type recording head as shown in FIG.

(Second Embodiment)
Next, the configuration of the recording head of the second embodiment will be described.

  In the first embodiment, as compared with the configuration in which the recording element substrates are arranged in the order of the discharge amount, in the present embodiment, as shown in FIGS. Each average discharge amount of the Nth printing element substrate is made substantially equal. Further, in this embodiment, the difference between the average discharge amounts of the adjacent printing element substrates between the first to Nth printing element substrates is made substantially constant, and the change in the discharge amount in the nozzle array direction is a gentle curve. Arranged to draw.

  The recording head having such a configuration is preferably applied to a so-called serial drive type recording apparatus as shown in FIG. This is because, in such a recording head used in the serial drive method, the first recording element substrate recorded in the next scan at the recording position corresponding to the Nth recording element substrate of the recording data recorded in a certain scan The recording positions corresponding to are adjacent. For this reason, since the discharge amounts of the first and Nth recording element substrates are made substantially equal, density unevenness in a portion where the recording positions are adjacent to each other can be suppressed. Also, the other recording element substrates between the 1st and the Nth are arranged so that the difference in the ejection amount is substantially constant, and the curve in which the ejection amount changes is gradual, thereby reducing the overall density unevenness. This is because high quality recording can be performed.

  Of course, it goes without saying that the recording head of this embodiment can also be applied to a full-line system.

  In the example shown in FIG. 4A, the recording element substrates are arranged so that the ejection amount of the recording element substrate near the center in the nozzle arrangement direction is larger than both sides in the nozzle arrangement direction. On the other hand, in the example shown in FIG. 4B, the discharge amount of the recording element substrate near the center in the nozzle arrangement direction is arranged to be small. In the example shown in FIG. 4C, the change in the discharge amount in the nozzle arrangement direction is arranged to draw a sine wave. Any configuration of these arrangements may be selected.

  Also in the present embodiment, instead of measuring the discharge amount, measurement of the discharge port diameter and the like are performed, and the respective recording element substrates are arranged based on the measurement data. Needless to say that is good.

  Finally, a method for manufacturing the recording head of the above-described embodiment will be described.

  FIG. 5 is a block diagram showing a recording head manufacturing apparatus according to this embodiment. As shown in FIG. 5, the recording element substrate is supplied in a wafer state to the nozzle dimension measuring unit. In this nozzle dimension measuring unit, the dimensions of each recording element substrate supplied in a wafer state, such as the ejection port diameter, are measured. As a measuring method, an optical system may be used and a laser microscope or the like may be used. Further, image processing such as pattern matching may be used. The type of measurement system to be selected may be determined in consideration of the required measurement accuracy, the shape of the nozzle, the manufacturing cost of the measurement device, and the like.

  The measurement data of each recording element substrate measured by the nozzle dimension measuring unit is computer processed by the controller. In the controller unit, based on the measured dimension data, a recording element substrate used for the same inkjet recording head and its arrangement position are determined. The arrangement positions may be arranged in descending order from one end side as in the first embodiment, or may be arranged as in the second embodiment.

  After the controller unit determines the computer processing, that is, the plurality of recording element substrates to be employed and their arrangement positions, the assembly is performed in the next assembly unit unit. In the assembly unit portion, a recording element substrate (wafer state) formed on the wafer and a plate for supporting it are supplied. Then, based on the information about the plurality of recording element substrates determined by the controller unit and their arrangement positions, the plurality of recording element substrates are arranged, and the recording element substrates are sequentially positioned on the plate and bonded and fixed. The The step of arranging the recording element substrates is performed by moving the recording element substrate in the wafer state to a tray or the like using a movable suction finger or the like based on information determined by the controller unit. Further, the positioning step can be performed with higher accuracy by using a positioning mark or the like formed on the recording element substrate with high accuracy by a semiconductor step or the like and using image processing or the like. Further, in the adhesive fixing step, the above-described ultraviolet curing combined type thermosetting adhesive or the like is used. As a method for applying the adhesive, a method in which the adhesive whose thickness is adjusted on the turntable by a squeegee or the like is transferred by using a metal block or the like is preferable.

  As described above, by using the substrate positioning and fixing device, it is possible to perform a series of steps from measuring the nozzle dimensions of the recording element substrate to positioning and fixing, improving the manufacturing efficiency, saving space, and reducing the manufacturing cycle. Shortening can be achieved. Further, according to the recording head manufactured by the manufacturing method using this substrate positioning and fixing device, density unevenness is reduced, and high-quality and high-speed recording can be performed.

  The present invention is applied to, in addition to a general printing apparatus, for example, a copying machine, a facsimile having a communication system, a word processor having a printing unit, or a multifunction recording apparatus in which these apparatuses are combined. be able to. In particular, it is suitable for use in a recording apparatus that performs high-speed and high-quality recording.

1 is an external perspective view illustrating a recording head according to an embodiment. (A) is a figure which shows the density | concentration of each recording element board | substrate of the recording head of 1st Embodiment, (b) is a figure which shows typically the recording state by the recording head of 1st Embodiment. 2A and 2B are diagrams illustrating the vicinity of a nozzle of a recording head according to the present embodiment, in which FIG. FIG. 6 is a diagram illustrating a change in density of each recording element substrate in a recording head of a second embodiment. FIG. 4 is a block diagram for explaining a recording head manufacturing apparatus. 1 is an external perspective view illustrating a recording head according to an embodiment. FIG. 2 is an exploded perspective view showing a recording head of the present embodiment. FIG. 3 is an exploded perspective view showing a recording element unit. It is a disassembled perspective view which shows an ink supply unit. 2A and 2B are diagrams for explaining a recording element substrate, in which FIG. 1A is a perspective view and FIG. 2B is a cross-sectional view taken along line AA in FIG. It is a figure for demonstrating the full line type inkjet recording device. It is a circuit diagram for demonstrating the drive circuit of an odd nozzle row. It is a circuit diagram for demonstrating the drive circuit of an even-numbered nozzle row. FIG. 6 is a circuit diagram for explaining signal wiring between four recording element substrates. It is a chart of a drive timing. It is a figure for demonstrating the serial drive system inkjet recording device. (A) is a figure which shows the density | concentration of each recording element board | substrate of the conventional recording head, (b) is a figure which shows typically the recording state by the conventional recording head.

Explanation of symbols

H1000 Recording head H1001 Recording element unit H1100 Recording element substrate H1102 Electrothermal conversion element H1105 Nozzle H1106 Nozzle group H1107 Foaming chamber M4000 Inkjet recording apparatus K1000 Recording medium

Claims (15)

In an inkjet recording head in which a plurality of recording element substrates in which a plurality of nozzles that eject ink and a plurality of recording elements that generate ejection energy are arranged are arranged along the nozzle arrangement direction,
An ink jet recording head, wherein a plurality of recording element substrates are arranged in the order of the average discharge amount of each recording element substrate. In an inkjet recording head in which a plurality of recording element substrates in which a plurality of nozzles that eject ink and a plurality of recording elements that generate ejection energy are arranged are arranged along the nozzle arrangement direction,
N recording element substrates are provided, and when the recording element substrates are first to Nth in order from one end side, the average discharge amounts of the first and Nth recording element substrates are substantially equal. An inkjet recording head, wherein the difference between the average ejection amounts of the recording element substrates adjacent to each other between the Nth recording element substrates is substantially constant.   The inkjet recording head according to claim 1, wherein a plurality of the recording element substrates are arranged in the order of the average discharge port diameter of each of the recording element substrates. Each recording element substrate has a plurality of foaming chambers each provided with a plurality of recording elements,
The inkjet recording head according to claim 1, wherein a plurality of the recording element substrates are arranged in the order of the average foaming chamber height of each recording element substrate. Each recording element substrate has a plurality of foaming chambers each provided with a plurality of recording elements,
The ink jet recording head according to claim 1, wherein a plurality of the recording element substrates are arranged in the order of the average foaming chamber volume of each recording element substrate.   The ink jet recording head according to claim 1, wherein the recording element is an electrothermal conversion element, and a discharge direction is a direction orthogonal to the surface of the electrothermal conversion element.   The ink jet recording head according to claim 1, wherein the ink jet recording head is configured to complete ejection of ink when bubbles generated during foaming communicate with outside air.   The ink jet recording head according to claim 1, wherein the nozzle is formed by a photolithography technique. In an inkjet recording head in which a plurality of recording element substrates in which a plurality of nozzles that eject ink and a plurality of recording elements that generate ejection energy are arranged are arranged along the nozzle arrangement direction,
Each of the recording element substrates has a dummy pattern formed of a nozzle forming material together with the nozzle formed by a photolithography technique in the nozzle forming step, and a plurality of the dummy patterns are arranged in order of size. An ink jet recording head comprising a recording element substrate.   The ink jet recording head according to claim 1, wherein the nozzle is of a full line type in which the nozzle is disposed over the entire width of the recording area of the recording medium. An ink jet recording head according to any one of claims 1 to 9, comprising:
While the ink jet recording head is main-scanned relative to the recording medium in a direction different from the nozzle arrangement direction, ink is ejected onto the recording medium, and the ink-jet recording head and the target are scanned every main scanning. An ink jet recording apparatus that performs recording by performing sub-scanning relative to a recording medium in the nozzle arrangement direction. A plurality of recording element substrates in which a plurality of nozzles for ejecting ink, a plurality of recording elements for generating ejection energy, and a plurality of foaming chambers each provided with a plurality of the recording elements are arranged along the nozzle arrangement direction An ink jet recording head manufacturing apparatus having a dummy pattern formed on a nozzle forming material together with the nozzles by photolithography technology on each recording element substrate,
A dimension measuring unit for measuring at least one dimension of a plurality of ejection element diameters of the recording element substrates, a height of the foaming chamber, a volume of the foaming chamber, or a shape dimension of the dummy pattern;
Based on the measurement data measured by the dimension measurement unit, a plurality of the recording element substrates used for the same inkjet recording head and a controller unit for determining the arrangement position thereof,
An apparatus for manufacturing an ink jet recording head, comprising: an assembly unit section that arranges, positions and fixes the recording element substrates based on information determined by the controller section.   The inkjet recording head manufacturing apparatus according to claim 12, wherein the dimension measuring unit measures a dimension of the recording element substrate formed on a wafer. A plurality of recording element substrates in which a plurality of nozzles for ejecting ink, a plurality of recording elements for generating ejection energy, and a plurality of foaming chambers each provided with a plurality of the recording elements are arranged along the nozzle arrangement direction Each of the recording element substrates is a method of manufacturing an ink jet recording head having a dummy pattern formed of a nozzle forming material together with the nozzles by photolithography technology,
A dimension measuring step for measuring at least one dimension of a plurality of ejection element diameters of the recording element substrates, a height of the foaming chamber, a volume of the foaming chamber, or a shape dimension of the dummy pattern;
Based on the measurement data measured in the dimension measurement step, a step of determining a plurality of the recording element substrates used in the same inkjet recording head and the arrangement position thereof by a controller unit;
An inkjet recording head manufacturing method comprising: an assembly step of arranging, positioning, and fixing the recording element substrates based on information determined by the controller unit.   The method of manufacturing an ink jet recording head according to claim 14, wherein in the dimension measuring step, a dimension of the recording element substrate formed on a wafer is measured.

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