JP2007160605A - Manufacturing method of resin molded product having glossiness on its surface and resin molded product manufactured thereby - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the design properties of a resin molded product by smoothing the surface of the resin molded product and developing glossiness on the surface of the resin molded product without newly providing a surface coating process. <P>SOLUTION: The resin molded product wherein a clear resin layer B3 having a smoothed surface and glossiness is formed on the surface of a resin base material is obtained by a manufacturing method comprising a process for forming the resin base material, a process for pressing a transfer film, which is constituted by successively forming the clear resin layer B3 with a thickness of 3-75 μm and an adhesive layer B4 on the surface of a base film, to the surface of the resin base material while pressurizing the same in a state heated to 150-250°C by a roll and transferring the clear resin layer B3 of the film to the surface of the resin base material and a process for peeling the base film of the transfer film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing a resin molded product having gloss on the surface and a resin molded product produced by this method, and belongs to the technical field of resin molding.

  In general, resin moldings molded by extrusion have fine irregularities formed on the surface, and when dust or dirt adheres to the surface of such molded articles, they can be easily wiped off due to the presence of irregularities. There is a problem that can not be. Moreover, in the resin molded product in which the printing process was given to the surface, an unevenness | corrugation becomes the cause of reducing the designability of a molded product.

  On the other hand, for a resin molded product whose surface is mainly printed, the surface may be coated with a resin after printing. As the surface coating treatment, for example, there is a method in which an ultraviolet curable resin is applied to the printing surface and a resin layer formed of the ultraviolet curable resin is irradiated with a UV lamp to cure the surface. As a result, the surface of the resin molded product is smoothed, and the design of the molded product is improved. However, newly incorporating a process for surface coating, that is, a process of applying a resin and a process of curing the resin increases costs and labor.

  On the other hand, Patent Document 1 discloses a method for manufacturing a resin molded product in which the surface modification of an extrusion molded product is performed without separately providing a step for surface coating.

That is, in the manufacturing method disclosed in Patent Document 1, a thermoplastic resin base material is formed by extrusion molding, and a transfer film in which a thin film layer made of a cured resin and an adhesive layer are sequentially formed on the base film surface is obtained. While pressing with a roll heated to ˜200 ° C., it is pressed against the surface of the base material, the thin film layer is transferred to the surface of the base material, and then the base film of the transfer film is peeled off to obtain a resin molded product. According to such a method, the surface of the resin molded product can be smoothed and increased in strength by the thin film layer, and further, by selecting a cured resin according to the application, the surface hardness can be increased, It is possible to reduce the surface reflectance or the surface resistance value.
JP 2004-90281 A

  By the way, although the manufacturing method of the resin molded product of the said patent document 1 reduces the surface reflectance about a thin film layer and may reduce the external light reflected on the surface, it does not express glossiness on the surface. . In order to give glossiness, it is the actual situation that the process of coating the surface of the resin molded product must be provided as described above.

  On the other hand, the present invention provides a method for producing a resin molded article that smoothens the surface and expresses gloss on the surface and improves the design without newly providing a step for surface coating, and this method An object of the present invention is to provide a resin molded product manufactured in (1).

  In order to solve the above problems, the present invention is configured as follows.

  First, the invention according to claim 1 of the present application includes a step of generating a resin base material, and a transfer film in which a clear resin layer having a thickness of 3 to 75 μm and an adhesive layer are sequentially formed on the base film surface. A process of pressing the surface of the resin base material while pressing with a roll while being heated to 250 ° C., transferring the clear resin layer of the film to the surface of the resin base material, and a process of peeling the base film of the transfer film It is characterized by having.

  The invention according to claim 2 is characterized in that, in the method for producing a resin molded article according to claim 1, the step of generating the resin base material is extrusion molding using a thermoplastic resin. .

  Furthermore, the invention according to claim 3 is the method for producing a resin molded article according to claim 1 or 2, wherein the step of generating the resin base and the clear resin layer of the transfer film on the surface of the resin base A step of performing a printing process on the surface of the resin base material between the step of transferring the transparent resin layer, and the step of transferring the clear resin layer of the transfer film onto the surface of the resin base material prints the clear resin layer of the film. It transfers to the surface of a process layer, It is characterized by the above-mentioned.

  On the other hand, the invention according to claim 4 is a resin molded product, wherein the transfer film is formed by forming a resin base material, a clear resin layer having a film thickness of 3 to 75 μm and an adhesive layer on the base film surface in order. And a clear resin layer transferred by being pressed against the surface of the resin base material while being pressed with a roll while being heated to ° C.

  The invention according to claim 5 is characterized in that, in the resin molded product according to claim 4, a print processing layer is provided between the resin base material and the clear resin layer.

  First, according to the invention described in claim 1, a transfer film in which a clear resin layer having a thickness of 3 to 75 μm and an adhesive layer are sequentially formed on the base film surface is rolled in a state heated to 150 to 250 ° C. The resin base material is sufficiently softened and dissolved at a high temperature of 150 to 250 [deg.] C. in the step of pressing to the surface of the resin base material while applying pressure and transferring the clear resin layer of the film to the surface of the resin base material Will be transferred to the surface. As the clear resin layer is softened and dissolved in this manner, a resin molded product in which the surface of the clear resin layer is smoothed after the base film of the transfer film is peeled is obtained. This smoothing can be easily removed when dust or dirt adheres to the surface, and provides an effect that good glossiness is exhibited on the surface of the clear resin layer. Moreover, when the clear resin layer is transferred at a high temperature, the transparency of the clear resin layer is improved and the design of the resin molded product is improved.

  Here, when the clear resin layer is transferred to the resin substrate while being heated to 150 ° C. or lower, the adhesive layer cannot be sufficiently dissolved, and the resin substrate and the clear resin layer are poorly bonded. As a result, peeling occurs between the layers of the clear resin layer, and as a result, the chemical resistance is lowered and the surface may become cloudy.

  Further, when the thickness of the clear resin layer is 3 μm or less, since the strength of the clear resin layer cannot be secured, there is a possibility that burrs or peeling may occur during transfer. Furthermore, when the film thickness is 75 μm or more, softening and dissolution of the clear resin layer becomes insufficient, and surface smoothness and glossiness are poor.

  Next, according to the invention described in claim 2, since the resin base material is generated by extrusion molding using a thermoplastic resin in the step of generating the resin base material, a belt-shaped resin base material is continuously obtained. Will be. Then, the resin base material is transferred under the conditions of the invention described in claim 1, and the base film is peeled off, whereby the surface of the clear resin is smoothed and has a glossy belt shape. Goods are obtained.

  According to the invention of claim 3, the printing process is performed on the surface of the resin base material between the step of generating the resin base material and the step of transferring the clear resin layer of the transfer film onto the surface of the resin base material. In the step of performing the printing process, for example, a printing process such as a wood grain pattern or letters is performed on the surface of the resin base material to form a printing process layer. Then, in the step of transferring the clear resin layer of the transfer film to the surface of the resin substrate, the clear resin layer of the transfer film is transferred to the surface of the print processing layer, and at this time, according to claim 1. Since the transfer is performed under the conditions of the invention, the effect of smoothing the surface and expressing gloss on the resin molded product subjected to the printing process can be obtained. Moreover, since the transparency of the clear resin layer is improved as described above, the appearance of the print processing layer is improved.

  On the other hand, the invention according to claim 4 corresponds to the resin molded product manufactured by the invention according to claim 1, and this resin molded product has the same function and effect as the invention according to claim 1. It will be.

  The invention according to claim 5 corresponds to the resin molded product produced by the invention according to claim 3, and this resin molded product has the same effect as that of the invention according to claim 3. It will be.

  Embodiments according to the present invention will be described below.

  First, FIG. 1 shows an extrusion molding machine 1 for producing a resin molded product in the present embodiment. This extrusion molding machine 1 includes an extruder 2 that melts a thermoplastic resin and extrudes a thermoplastic resin from a die 2a to obtain a strip-shaped substrate A, and a substrate A that is in a dissolved state immediately after being extruded from the die 2a. 3 and 3 polishing rolls 3 that are cooled and hardened, and a take-up roll 4 that takes up the substrate A with a constant tension. Furthermore, a pressure roll 5 is provided between the most downstream polishing roll 3 and the take-up roll 4 to heat the transfer film B and pressure-bond it to the surface of the substrate A. Transfer to the downstream side of the take-up roll 4 A support roll 6 for peeling the base film B1 from the film B is disposed.

The pressure roll 5 is composed of a pair of upper and lower rolls 5a and 5b sandwiching the substrate A, and the upper roll 5a has a variable pressure on the lower roll 5b, and the surface of the upper roll 5a is variable. The temperature (hereinafter simply referred to as “pressure roll surface temperature”) can be increased to 250 ° C. And in manufacture of the resin molded product C in this Embodiment, the pressure of the said pressurization roll 5 is set to 25-35 kg / cm < ² >, and the feed speed (2-6 m / cm) of the base material A according to external temperature. min range) and the surface temperature of the pressure roll 5 (within a range of 150 to 250 ° C.) are set.

  As described above, the transfer is performed under a high temperature condition. On the other hand, when the outside air temperature is high, the heat applied to the transfer film B may be relatively small. It is set to be relatively small or set so as to increase the feed rate and reduce the heat applied per unit area of the transfer film B. Conversely, when the outside air temperature is low, relatively high heat is required for the transfer film B. Therefore, the surface temperature of the pressure roll 5 is set to be relatively high, or the feeding speed is lowered to reduce the unit area of the transfer film B. It is set to increase the heat applied to the area.

  The thermoplastic resin substrate A is made of an amorphous material such as acrylic nitrile / butadiene / styrene copolymer (ABS), polystyrene (PS), polyethylene terephthalate (PET), acrylic resin, polypropylene (PP), polyethylene (PE), etc. Resin and non-crystalline resin of crystalline resin are used alone or as a mixture, and are extruded by extruder 2 so that the thickness becomes 0.5 to 6 mm. A crystalline resin such as polycarbonate (PC) or thermoplastic elastomer may be used as long as it can be extruded.

  Further, as shown in FIG. 2, the transfer film B has a structure in which a base film B1, a release layer B2, a clear resin layer B3, and an adhesive layer B4 are formed in this order. The base film B1 is made of PET, PE, PP, polyamide (PA) or the like alone or mixed, and has a film thickness of 18 to 20 μm. The release layer B2 is a wax-based, silicon-based or oil-based release agent having a film thickness of 1 to 2 μm. The clear resin layer B3 is a clear resin formed by mixing or mixing general resins such as acrylic and urethane, and has a film thickness of 3 to 75 μm. The adhesive layer B4 is an EVA (ethylene / vinyl acetate copolymer) -based, epoxy-based, urethane-based, acrylic-based adhesive or the like having a film thickness of 15 to 20 μm.

  In addition, as a general resin used as the clear resin, other thermoplastic resins such as polystyrene, ABS, polypropylene, polyamide, polycarbonate, and polyethylene terephthalate are used.

  And after transferring this transfer film B to the surface of the thermoplastic resin substrate A in a state heated to 150 to 250 ° C. and peeling the base film B1 as shown in FIG. 3, as shown in FIG. A resin molded product C in which the thermoplastic resin substrate A and the clear resin layer B3 are bonded by the adhesive layer B4 is obtained.

  The resin molded product C thus obtained has the clear resin layer B3 softened and dissolved by the high heat at the time of transfer. As a result, the surface of the clear resin layer B3 is smoothed, and the surface is smoothed along with the smoothing. Glossiness will be developed. In addition, the chemical resistance is ensured by the coating of the clear resin layer B3, and the effect that dust and dirt attached to the surface can be easily removed by smoothing the surface is obtained. Furthermore, the effect that the transparency of the clear resin layer B3 is improved by transfer under a high temperature condition is also obtained, and the design of the resin molded product C is improved together with the gloss.

  The method of heating when transferring the clear resin layer B3 of the transfer film B to the substrate A is not limited to increasing the surface temperature of the pressure roll 5 as described above, and the transfer is performed in a high-temperature atmosphere. In short, it is only necessary that the temperature of the clear resin layer B3 itself at the time of transfer can be increased to 150 to 250 ° C.

  On the other hand, as shown by a broken line in FIG. 1, when printing a wood grain pattern or characters on the surface of the thermoplastic resin substrate A, a printing device 7 is provided between the most downstream polishing roll 3 and the pressure roll 5. Provided. As shown in FIG. 5, a printing process is performed by the printing device 7 on the surface of the thermoplastic resin substrate A that has reached the downstream side of the polishing roll 3, and a printing process layer D is formed.

  The printing process is performed by direct printing, and the ink is urethane-based, acrylic-based, etc., and general organic solvent type ink is used. And the transfer of the clear resin layer B3 by the transfer film B was performed with respect to what the printing process layer D was formed in the surface of the base material A in this way, and the base film B1 was peeled as shown in FIG. Thereafter, as shown in FIG. 7, a resin molded product C ′ in which the print processing layer D and the clear resin layer B3 are bonded by the adhesive layer B4 is obtained. The printing process may be performed by screen printing or hot stamping.

  And even when such a printing process is performed, the effect of expressing the smoothness of the surface and glossiness can be obtained as described above, and the appearance of the printing process layer D can be improved by improving the transparency. It will be.

  Such surface coating by transfer using a clear resin can be applied not only to the base material A on which the object is extruded, but also to a base material formed by injection molding or the like. That is, according to the shape and size of the substrate, the clear resin layer is transferred to the substrate surface under a high temperature condition of 150 to 250 ° C. Thus, the above-described effect can be obtained.

  Examples of the present invention will be described below. In the following Examples 1 to 6, as shown in Table 1, the feed rate and the pressure roll surface temperature are set according to the outside air temperature, and a transfer film having a clear resin layer thickness of 3 μm or 75 μm is used. In addition to producing a resin molded product, the appearance of the resin molded product, particularly the glossiness of the surface, was observed.

  First, in Example 1, the thermoplastic resin was formed to have a thickness of 2 mm by mixing 5 parts of the colored master batch with respect to 100 parts of the ABS resin. The transfer film uses a 20 μm thick PET resin as the base film, a 2 μm thick wax release agent as the release layer, and a clear resin layer of 3 μm thick acrylic. A mixture of a resin based on urethane and a resin based on urethane was used, and an acrylic adhesive having a thickness of 2 μm was used as the adhesive layer.

  The outside air temperature was about 30 ° C., the base material feed rate was about 2 m / min, and the pressure roll surface temperature was set to about 160 ° C.

  The resin molded product obtained under these conditions was confirmed to have a smooth surface and to exhibit good glossiness on the surface. Moreover, the transparency improvement of the clear resin layer was confirmed.

  In Example 2, the same materials as in Example 1 were used. At this time, the outside air temperature was about 23 ° C., the base material feed rate was about 4 m / min, and the pressure roll surface temperature was set to about 215 ° C.

  The resin molded product obtained under the conditions in Example 2 was confirmed to have good glossiness and the like as in Example 1.

  Further, in Example 3, the same materials as in Example 1 were used. At this time, the outside air temperature was about 20 ° C., the substrate feed rate was about 6 m / min, and the surface temperature of the pressure roll was set to about 240 ° C.

  The resin molded product obtained under the conditions in Example 3 was confirmed to have a good glossiness and the like as in Example 1.

  On the other hand, in Example 4, each material similar to Example 1 was used except that the film thickness of the clear resin layer was 75 μm. At this time, the outside air temperature was about 30 ° C., the substrate feed rate was about 2 m / min, and the surface temperature of the pressure roll was set to about 160 ° C.

  The resin molded product obtained under the conditions in Example 4 was confirmed to have a good glossiness and the like as in Example 1.

  Moreover, in Example 5, each material similar to the said Example 1 was used except the film thickness of a clear resin layer being 75 micrometers. At this time, the outside air temperature was about 23 ° C., the base material feed rate was about 4 m / min, and the pressure roll surface temperature was set to about 215 ° C.

  The resin molded product obtained under the conditions in Example 5 was confirmed to have good glossiness and the like as in Example 1.

  And in Example 6, each material similar to the said Example 1 was used except the film thickness of a clear resin layer being 75 micrometers. At this time, the outside air temperature was about 20 ° C., the substrate feed rate was about 6 m / min, and the surface temperature of the pressure roll was set to about 240 ° C.

  The resin molded product obtained under the conditions in Example 6 was confirmed to have good glossiness and the like as in Example 1.

Next, Comparative Examples 1 to 8 in which the experimental conditions are different from those of the above examples will be described.
(Comparative Example 1)

  First, in the comparative example 1, each material similar to the said Example 1 was used except the film thickness of a clear resin layer being 1 micrometer. At this time, the outside air temperature was about 30 ° C., the substrate feed rate was about 2 m / min, and the surface temperature of the pressure roll was set to about 160 ° C.

In the resin molded product obtained under the conditions in Comparative Example 1, it was confirmed that the clear resin layer was burred or peeled off on the surface of the resin molded product.
(Comparative Example 2)

  In Comparative Example 2, the same materials as in Example 1 were used except that the thickness of the clear resin layer was 1 μm. At this time, the outside air temperature was about 23 ° C., the base material feed rate was about 4 m / min, and the pressure roll surface temperature was set to about 215 ° C.

The resin molded product obtained under the conditions in Comparative Example 2 was confirmed to have burrs or peeling of the clear resin layer as in Comparative Example 1.
(Comparative Example 3)

  And in the comparative example 3, each material similar to the said Example 1 was used except the film thickness of a clear resin layer being 1 micrometer. At this time, the outside air temperature was about 20 ° C., the substrate feed rate was about 6 m / min, and the surface temperature of the pressure roll was set to about 240 ° C.

The resin molded product obtained under the conditions in Comparative Example 3 was confirmed to have burrs or peeling of the clear resin layer as in Comparative Example 1.
(Comparative Example 4)

  First, in the comparative example 4, each material similar to the said Example 1 was used except the film thickness of a clear resin layer being 100 micrometers. At this time, the outside air temperature was about 30 ° C., the substrate feed rate was about 2 m / min, and the surface temperature of the pressure roll was set to about 160 ° C.

The resin molded product obtained under the conditions in Comparative Example 4 was confirmed to have poor surface smoothness and good glossiness.
(Comparative Example 5)

  In Comparative Example 5, the same materials as in Example 1 were used except that the thickness of the clear resin layer was 100 μm. At this time, the outside air temperature was about 23 ° C., the base material feed rate was about 4 m / min, and the pressure roll surface temperature was set to about 215 ° C.

It was confirmed that the resin molded product obtained under the conditions in Comparative Example 5 had poor surface smoothing and did not exhibit good gloss as in Comparative Example 4.
(Comparative Example 6)

  And in the comparative example 6, each material similar to the said Example 1 was used except the film thickness of a clear resin layer being 100 micrometers. At this time, the outside air temperature was about 20 ° C., the substrate feed rate was about 6 m / min, and the surface temperature of the pressure roll was set to about 240 ° C.

It was confirmed that the resin molded product obtained under the conditions in Comparative Example 6 had poor surface smoothness and did not exhibit good gloss as in Comparative Example 4.
(Comparative Example 7)

  On the other hand, in Comparative Example 7, the experimental conditions were the same as in Example 1 except that the surface temperature of the pressure roll was set to about 120 ° C.

In the resin molded product obtained under the conditions in Comparative Example 7, adhesion failure occurred during transfer, and as shown in FIG. 8, when the base film was peeled off, Since peeling occurred, the chemical resistance was lowered, and it was confirmed that the surface of the resin molded product became slightly cloudy.
(Comparative Example 8)

  In Comparative Example 8, the experimental conditions were the same as in Example 1 except that the thickness of the clear resin layer was 75 μm and the surface temperature of the pressure roll was set to about 120 ° C.

  The resin molded product obtained under the conditions in Comparative Example 8 was not good in appearance due to poor adhesion and white turbidity as in Comparative Example 7.

In addition, although each said Example and comparative example experimented with respect to the thing which is not provided with the printing process layer on the resin base material surface, it is what was provided with the printing process layer on the base material surface. On the other hand, it has been confirmed that the same appearance with respect to the glossiness of the surface and the like can be obtained when the transfer is performed under the respective conditions in each of the examples and comparative examples.

  The present invention relates to a resin molded product having gloss on the surface and can be widely used in the resin molding industry such as the plastic industry.

It is a schematic structure figure of an extrusion molding machine concerning an embodiment of the invention. It is explanatory drawing of a transfer film. It is explanatory drawing at the time of base film peeling. It is explanatory drawing of a resin molded product. It is explanatory drawing of a printing process layer. It is explanatory drawing at the time of base film peeling. It is explanatory drawing of a resin molded product. It is explanatory drawing of the delamination of a clear resin layer.

Explanation of symbols

1 Extruder 5 Pressure roll

Claims (5)

  While pressing a transfer film in which a clear resin layer having a film thickness of 3 to 75 μm and an adhesive layer are sequentially formed on the base film surface with a roll while being heated to 150 to 250 ° C. Production of a resin molded product comprising the steps of pressing the surface of the resin base material and transferring the clear resin layer of the film to the surface of the resin base material, and peeling the base film of the transfer film Method. In the manufacturing method of the resin molded product according to claim 1,
The method of producing a resin molded product, wherein the step of generating a resin base material is extrusion molding using a thermoplastic resin. In the manufacturing method of the resin molded product according to claim 1 or 2,
Between the step of generating the resin substrate and the step of transferring the clear resin layer of the transfer film to the surface of the resin substrate, the step of performing a printing process on the surface of the resin substrate,
The process for transferring the clear resin layer of the transfer film to the surface of the resin substrate includes transferring the clear resin layer of the film to the surface of the print processing layer.   The resin base material and the resin base material while pressing a transfer film in which a clear resin layer having a thickness of 3 to 75 μm and an adhesive layer are sequentially formed on the surface of the base film with a roll while being heated to 150 to 250 ° C. And a clear resin layer transferred by being pressed onto the surface of the resin molded product. In the resin molded product according to claim 4,
A resin molded product, wherein a print processing layer is provided between a resin base material and a clear resin layer.

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