JP2007158180A - Substrate unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable layout at short distances without having, conductive patterns mutually interefere electrically, whereby a plurality of first electrically driven components having their layouts determined, in response to their industrial designs are connected with a second electrically driven component for feeding drive or control signals for driving the first electrically driven components. <P>SOLUTION: In a substrate unit, the respective conductive patterns for connecting the respective ports of a micro-computer mounted on a first substrate with the respective contacts of the first substrate are so provided extended over a plurality of insulating layers of the substrate body constituting the first substrate, as to avoid electrical interferences caused by their contacting in a crossing manner with each other, on a single insulating layer. Consequently, there can be obtained a layout, such that when the first substrate is attached to a second substrate 5 in an overlapping manner, even though the respective ports of the microcomputer will not be disposed in the nearest peripheries of respective motors M1-M4 and a liquid crystal display DISP of control objectives, respective conductive patterns 53a-53h of the second substrate 5 are connected with respective contacts 51a-51j, disposed respectively and adjacent to the motors M1-M4 and the liquid crystal display DISP. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention provides a plurality of electric motors having a layout determined according to a design arrangement driven by a control signal or a drive signal or control signal output from a port in which function settings of the control chip are determined in advance. The present invention relates to a board on which components are mounted.

  As shown in a plan view in FIG. 4, for example, a combination meter that performs various displays in a vehicle includes a speedometer A, a tachometer B, a fuel gauge C, a water temperature gauge D, an odometer E, and the like that indicate measurement values by sensors. Is provided.

  Electric motors are used to rotate the speedometer A, tachometer B, fuel gauge C, and water temperature gauge D, and the odometer / trip can be switched between odometers and trips. As shown in the longitudinal sectional view of FIG. 5, the board CB on which the components necessary for the electrical wiring are mounted is a speedometer A, a tachometer B, and a fuel meter C inside the combination meter. And the dial S of the water thermometer D are arranged behind each dial S.

  On the substrate CB, as shown in a plan view in FIG. 6, a motor M1 for driving the pointers A1, B1, C1, D1 of the speedometer A, tachometer B, fuel gauge C, and water temperature gauge D shown in FIG. A plurality of electric parts such as M2, M3, M4 and a liquid crystal display DISP for switching and displaying the odometer / trip travel distance of the odometer E are provided, and these are basically sensors provided at various locations of the vehicle. Drive control is performed by a control chip (for example, a microcomputer μCOM shown in FIG. 6) that receives a signal from a class.

  The microcomputer μCOM is provided with a plurality of ports, and basically the function setting of each port is determined in advance. Therefore, to which port the motors M1, M2, M3, M4 and the liquid crystal display DISP are connected. This is usually determined by the specifications of the microcomputer μCOM.

  Further, for the convenience of the design of the combination meter, the layout of the speedometer A, the tachometer B, the fuel gauge C, the water temperature gauge D, and the odometer E is determined in advance as shown in FIG. 4, for example. Thus, the arrangement of the motors M1, M2, M3, M4 for driving the pointers A1, B1, C1, D1 and the liquid crystal display DISP for displaying the od / trip travel distance on the substrate CB is automatically determined as shown in FIG. Therefore, the positions of the motors M1, M2, M3, and M4 and the liquid crystal display DISP and the positions of the ports of the microcomputer μCOM corresponding to them are not necessarily close to each other.

  In addition, the conductive patterns PT1, PT2, PT3, PT4, and PT5 on the substrate CB that electrically connect the motors M1, M2, M3, and M4 corresponding to each port and the liquid crystal display DISP to electrically interfere with each other. It is necessary to arrange so as not to cross.

  Therefore, a certain conductive pattern PT1, PT2, PT3, PT4, PT5 is transferred to another conductive pattern PT1, PT2, PT3, PT4, PT5 or a motor M1, which is a connection target of the conductive patterns PT1, PT2, PT3, PT4, PT5. There is a case where a layout has to be made on the substrate CB so as to bypass the motors M2, M3, M4 and the liquid crystal display DISP and reach the motors M1, M2, M3, M4 and the liquid crystal display DISP which are their connection targets.

  For example, in the case of the layout shown in FIG. 6, even though there is a sufficient space between the motors M3 and M4 of the fuel gauge C and the water temperature gauge D and the microcomputer μCOM, the conductive patterns PT3 and PT4 thereof. Since the port of the microcomputer μCOM to be connected to the port, that is, the port of the microcomputer μCOM shown in the enlarged plan view in FIG. 7 is arranged on the side opposite to the side close to the motors M3 and M4, it bypasses the microcomputer μCOM. Thus, the conductive patterns PT3 and PT4 must be extended.

  In addition, when extending the conductive patterns PT3 and PT4 by bypassing the microcomputer μCOM, the layout space SP such as I / O elements and peripheral circuits arranged above the microcomputer μCOM becomes an obstacle. It is necessary to extend the conductive patterns PT3 and PT4, bypassing.

  Then, it is impossible to reduce the distance of the conductive patterns PT1, PT2, PT3, PT4, and PT5 necessary to increase resistance to conductive noise due to restrictions on the layout of the substrate CB. Therefore, it is not preferable to prevent malfunctions of the motors M1, M2, M3, and M4 and the liquid crystal display DISP due to conduction noise. Therefore, it is necessary to do something to shorten the conductive patterns PT1, PT2, PT3, PT4, and PT5. Become.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a plurality of electric parts whose layout is determined according to the layout on the design, such as a motor and a liquid crystal display in a combination meter, and the electric motors thereof. A board unit capable of laying out a conductive pattern for connecting a driving signal for driving a component or an electric component for supplying a control signal without electrically interfering with each other at a short distance, and the board unit Another object of the present invention is to provide a suitable relay board.

  The present invention described in claim 1 that achieves the above object relates to a relay substrate, and the present invention described in claim 2 relates to a substrate unit.

  The relay board according to the first aspect of the present invention includes a supply-side component for a drive signal or a control signal including a control chip having a plurality of ports each having a predetermined function setting. A relay board used for mounting on a main board on which a plurality of electric components driven by the supplied drive signal or control signal are mounted, and a board body in which a plurality of insulator layers are stacked, and the board body And a plurality of contact patterns respectively corresponding to a plurality of ports of the control chip, and a plurality of electrically conductive patterns electrically connected to each other, each connecting the contacts to a corresponding port of the control chip. And each contact is close to the electric component to which each contact is to be electrically connected among a plurality of sides of the substrate body in a state where the substrate body is mounted on the main substrate. They are respectively disposed, at least a portion the conductive pattern is characterized by being formed across the plurality of insulating layers.

  According to a second aspect of the present invention, there is provided a substrate unit including a control chip having a plurality of ports each having a predetermined function setting, a drive signal or control signal supply side component, and the supply side component. A board unit mounted with a plurality of electric components driven by the supplied drive signal or control signal and having a layout determined according to a design layout, on which the supply side component is mounted And a plurality of electric parts mounted thereon, and a main board on which the relay board is placed in a predetermined position excluding the mounting position of each electric part, and the relay board includes an insulator layer A plurality of stacked substrate bodies, a plurality of contacts disposed on the periphery of the substrate body, each corresponding to a plurality of ports of the control chip, and each of the contacts is connected to a corresponding port of the control chip. A plurality of electrically conductive patterns that are electrically independent from each other, and the main board is electrically connected to each of the contacts in a state where the relay board is placed on the predetermined position. A plurality of second conductive patterns electrically connected to each other, and at least a part of the conductive patterns are connected to the plurality of the second contacts. The contact points are formed across the insulator layer, and the contact points are arranged in a state in which the relay substrate is stacked on the predetermined portion of the main substrate among the plurality of sides of the substrate body. Each of the second conductive patterns is disposed on a side close to the electric component that is electrically connected via the second conductive pattern, and each of the second conductive patterns places the electric component on the predetermined position of the main board. Overlaying relay boards In wherein a second contact electrically connected via the conductive pattern and the contact port of the control chip corresponding to the each electric component, that are configured to respectively connect.

  According to the relay board of the present invention described in claim 1, each contact point connected to each port of the control chip via the conductive pattern is electrically connected to each contact point of each control chip. Since the drive signal or control signal is supplied from the port to the side near the electric component on the main board, the main board side conductive pattern from each contact point to the corresponding electric part is Without bypassing other conductive patterns on the board side and the electric parts to which the conductive patterns are connected, the main board side can be configured to reach the electric parts to be connected in a short distance. The resistance to conduction noise can be increased.

  Moreover, since at least some of the conductive patterns are formed across the plurality of insulator layers constituting the substrate body, they electrically interfere with each other on the same insulator layer as the other conductive patterns. Even in such a layout, it is possible to lay out so as to be electrically independent from each other via another insulator layer.

  Further, according to the board unit of the present invention described in claim 2, each contact is arranged except for the mounting position of each electric component on the main board among the plurality of sides of the board body of the relay board. Electrically connected to each port of the control chip connected to each contact through the conductive pattern with the relay board placed in a predetermined position over the second contact and the second conductive pattern on the main board. Since the second conductive pattern layout on the main board is a side close to the electric component to be connected without bypassing the other second conductive pattern and the electric component that is the connection target of the second conductive pattern, The layout can reach the electric parts to be connected in a short distance.

  Moreover, since at least some of the conductive patterns are formed across the plurality of insulator layers constituting the substrate body, they electrically interfere with each other on the same insulator layer as the other conductive patterns. Even in such a layout, it is possible to lay out so as to be electrically independent from each other via another insulator layer.

  For this reason, the layout of the plurality of second conductive patterns on the main board on which the plurality of electric parts whose layout is determined according to the layout on the design is mounted is short-range with high resistance to conduction noise and is electrically connected to each other. Pattern without causing interference.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view showing an embodiment of a board unit of a vehicle combination meter to which a relay board and a board unit of the present invention are applied. The board unit of this embodiment indicated by reference numeral 1 in FIG. Board 3 (corresponding to a relay board in the claims, see FIG. 2) and a second board 5 (corresponding to the main board in the claims).

  The second substrate 5 includes a meter for indicating a measurement value by a sensor, motors M1 to M4 for driving a gauge pointer (not shown), a liquid crystal display DISP for switching and displaying an odd / trip travel distance, A light emitting diode LED for light emitting display of indicators such as a blinker lamp, a beam lamp, and a warning lamp is mounted. These motors M1 to M4, the liquid crystal display DISP, and the light emitting diode LED are a meter or gauge as a combination meter, Od / trip meters and indicators are arranged at locations corresponding to the design arrangement.

  In this embodiment, for simplification of explanation, only the motors M1 to M4 and the liquid crystal display DISP are shown as examples of the electric parts in the claims, but the light emitting diode LED is also an example of the electric parts in the claims. It goes without saying that it can be an example.

  A mounting space 57 (corresponding to a predetermined portion in the claims) of the first substrate 3 (see FIG. 2) having a square shape is provided in a substantially central portion of the second substrate 5 where the motors M1 to M4 and the liquid crystal display DISP are not disposed. The contact points 51a to 51j (corresponding to the second contact point in the claims) for establishing electrical connection with the first substrate 3 side are provided near the four sides of the mounting space 57 in the vertical and horizontal directions. Is formed.

  Incidentally, although each of the contacts 51a to 51j is shown by enclosing the outer ring in a rectangular shape in FIG. 1 for easy viewing of the drawing, it actually comprises a collection of a large number of contacts.

  Reference numerals 53a to 53h in FIG. 1 are conductive patterns (corresponding to the second conductive pattern in the claims) for electrically connecting the contacts 51a to 51j to the motors M1 to M4 and the liquid crystal display DISP. Among them, the four conductive patterns 53a to 53d leading to the motors M1 to M4 are formed on the mounting surface of the liquid crystal display DISP indicated by the solid line in FIG. 1 and the mounting surfaces of the motors M1 to M4 on the back side indicated by the broken line. The formed part is configured to be electrically connected through a through hole (not shown).

  In this embodiment, the two motors M1 and M2 arranged on the left side of the mounting space 57 are connected to the center on the left side of the mounting space 57 close to the motors M1 and M2 and the bottom contacts 51b and 51c. The other motors M1 to M4 and the liquid crystal display DISP are electrically connected to each other by conductive patterns 53a and 53b extending without detouring.

  The two motors M3 and M4 arranged on the right side of the mounting space 57 are connected to the other motors M1 to 51f at the center and the lowermost contacts 51e and 51f on the right side of the mounting space 57 close to the motors M3 and M4. The conductive patterns 53c and 53d extending without bypassing the M4 and the liquid crystal display DISP are individually electrically connected.

  Further, the liquid crystal display DISP disposed at the lower left of the mounting space 57 includes a part of the contact 51c disposed at the bottom of the left side of the mounting space 57 close to the liquid crystal display DISP and the contacts 51i, 51j on the lower side. And four conductive patterns 53e to 53h that extend without bypassing the motors M1 to M4, respectively, are electrically connected individually to a part of the contact 51f arranged at the bottom on the right side. ing.

  In addition, signals from sensors (not shown) provided at various locations of the vehicle, which are the basis of the measured value indicated by the meter and the travel distance of the odd / trip displayed by the odd / trip meter, are supplied in FIG. The connector 55 on the second substrate 5 indicated by an imaginary line is electrically connected to contacts 51g, 51h, etc. on the upper side of the mounting space 57 via a conductive pattern (not shown).

  The first substrate 3 is a one-chip micro that drives and controls motors M1 to M4 and a liquid crystal display DISP in response to signals from the sensors (not shown) as shown in an enlarged plan view viewed from the back side in FIG. Computer (corresponding to control chip and supply side component in claims, hereinafter abbreviated as microcomputer) μCOM, memory MM and microcomputer μCOM in which parameters and data necessary for processing performed by microcomputer μCOM are rewritable A custom integrated circuit IC or the like that performs high-speed uniform processing before and after the processing to be performed is mounted.

The microcomputer μCOM is arranged at substantially the center of the first substrate 3, and a plurality of ports P _{L1 to} P _Ln and P _R1 to which function settings are set in advance are provided on four sides of the chip that has a square shape in plan view. P _Rn , P _{U1 to} P _Un , and P _{O1 to} P _On are provided.

Note that the ports P _{L1 to} P _Ln , P _{R1 to} P _Rn , P _{U1 to} P _Un , and P _{O1 to} P _On are shown somewhat schematically in FIG. 2 for easy viewing of the drawing.

  The first substrate 3 is formed in a square shape in plan view, and contacts 31a to 31j for making electrical connection with the second substrate 5 side in the vicinity of the four sides of the top, bottom, left, and right (contact points in claims) Is arranged and formed so that the contacts 31a to 31j face the corresponding contacts 51a to 51j of the second substrate 5 in a state where the back side is superimposed on the mounting space 57 with the back side being the second substrate 5 side. Has been.

  Incidentally, each of the contacts 31a to 31j is shown by enclosing the outer ring in a rectangular shape in FIG. 2 for easy viewing of the drawing, but actually, like the respective contacts 51a to 51j of the second substrate 5. , Consisting of a collection of many contacts.

Further, reference numerals 33a to 33h in FIG. 2 electrically connect the contacts 31a to 31j and the ports P _{L1 to} P _Ln , P _{R1 to} P _Rn , P _{U1 to} P _Un , and P _{O1 to} P _{On of the} microcomputer μCOM. Is a conductive pattern (corresponding to the conductive pattern in the claims) connected to.

  The first substrate 3 is based on a substrate body 35 in which a large number of insulator layers 35a to 35d (four layers in FIG. 3) are stacked, as shown in a partially cutaway enlarged perspective view seen from the back side of FIG. The microcomputer μCOM is mounted on the surface of the uppermost insulator layer 35a, and the contacts 31a to 31j are arranged on the surface of the lowermost insulator layer 35d.

  The conductive patterns 33a to 33h shown in FIG. 2 include, for example, the conductive pattern 331 of the contact a extending on the surface of the lowermost insulator layer 35d as shown in FIG. Contact extended from the second insulator layer 35c from the bottom to the second insulator layer 35b from the top by the layer connection by the via c, and extending to the surface of the bottom insulator layer 35d It is laid out so as not to cross-contact with the conductive pattern 333 of b.

Thus, conductive patterns 33a~33h, each port P _L1 to P _Ln microcomputer _{μCOM, P R1 ~P Rn, P} U1 ~P Un, the P _O1 to P _On, the port P _L1 to P _Ln, P _{R1 ~P Rn, P U1 ~P Un} , P O1 ~P to contact 31a~31j connection destination that is not located on the nearest side of _on, other conductive patterns 33a~33h the same insulator layer 35a~35d They are electrically connected without crossing over and electrically interfering with each other and without being blocked by the memory MM and the custom integrated circuit IC arranged around the microcomputer μCOM.

  The first substrate 3 configured as described above is a second substrate in which the contacts 31a to 31j are opposed to each other with the back side facing the second substrate 5 and superimposed on the mounting space 57 of the second substrate 5. It is attached on the second substrate 5 by being electrically connected to the corresponding contacts 51a to 51j of the substrate 5.

  The electrical connection between the contacts 31a to 31j of the first substrate 3 and the corresponding contacts 51a to 51j of the second substrate 5 may be realized by soldering such as reflow or a spacer. Then, it may be realized by using a component such as a connector.

According to the substrate unit 1 of the present embodiment configured as described above, each port P _{L1 to} P _Ln , P _{R1 to} P _Rn , P _{U1 to} P _Un , P _{O1 of} the microcomputer μCOM mounted on the first substrate 3. Each of the conductive patterns 33 a to avoid electrical interference due to cross contact on the same insulator layer 35 a to 35 d by extending P _On across the plurality of insulator layers 35 a to 35 d of the substrate body 35. Since the electrical connection is made to the contact points 31a to 31j of the connection destination by 33h, the second contact points 31a to 31j of the first substrate 3 and the back side of the first substrate 3 are set to the second substrate 5 side. The corresponding contacts 51a to 51j of the second substrate 5 that are electrically connected to the contacts 31a to 31j in a state where they are attached to the mounting space 57 of the substrate 5 are connected to the contacts 31a to 31j and 51a to 51a, respectively. 51j to be electrically connected to each It can be disposed respectively proximate to chromatography data M1~M4 or a liquid crystal display DISP.

  For this reason, each conductive pattern 53a-53h of the 2nd board | substrate 5 can be extended on the 2nd board | substrate 5 without detouring other motors M1-M4 and liquid crystal display DISP, and each conductive pattern 53a Conductive noise can be reduced by shortening the distance by ~ 53h.

Moreover, depending on the ports P _{L1 to} P _Ln , P _{R1 to} P _Rn , P _{U1 to} P _Un , and P _{O1 to} P _On of the microcomputer μCOM, the conductive patterns 53a to 53h and the contacts 51a of the second substrate 5 are used. Since it is not necessary to determine the layout of .about.51j, the second board 5 is shared if the motors M1 to M4 and the liquid crystal display DISP to be used are the same even if the combination meter has different specifications. Thus, it is possible to configure a combination meter having different specifications simply by changing the layout of the conductive patterns 33a to 33h on the first substrate 3 and the microcomputer μCOM mounted on the first substrate 3. is there.

  In the substrate unit 1 of the present embodiment, the case where only the microcomputer μCOM among the elements mounted on the first substrate 3 corresponds to the supply side component in the claims has been described. When the signal output from the port of the custom integrated circuit IC mounted on the substrate 3 is supplied as a drive signal or a control signal to the electric component on the second substrate 5, the first substrate 3 related thereto Along with a plurality of electric components whose layouts are determined according to the design arrangement, such as the arrangement of the conductive patterns and contacts, and the arrangement of the related conductive patterns and contacts on the second substrate 5 side, these electric components are driven. The present invention is also applicable when a plurality of types of components that supply signals or control signals are mounted on a substrate.

  Further, in the present embodiment, the case of the substrate unit 1 used in a vehicle combination meter has been described as an example. However, the present invention is not limited to a control chip or a port in which function settings of the control chip are set in advance. Needless to say, the present invention can be widely applied to all substrates on which a plurality of electric components, which are driven by output signals or control signals and whose layout is determined according to the design layout, are mounted.

It is a top view which shows one Embodiment of the board | substrate unit of the combination meter of the vehicle to which this invention is applied. It is the enlarged plan view which looked at the 1st board | substrate which concerns on one Embodiment of this invention which comprises the board | substrate unit of this invention with the 2nd board | substrate of FIG. 1 from the back side. FIG. 3 is a partially cutaway enlarged perspective view of the first substrate of FIG. 2. It is a front view which shows an example of the combination meter which performs the various displays in a vehicle. It is a longitudinal cross-sectional view of the combination meter of FIG. It is a top view of the board | substrate of FIG. FIG. 7 is an enlarged plan view showing an arrangement of ports of the microcomputer of FIG. 6.

Explanation of symbols

3 First board (relay board)
31a to 31j Contact 33a to 33h Conductive pattern 35 Substrate body 35a to 35d Insulator layer 5 Second substrate (main substrate)
51a to 51j contact (second contact)
53a to 53h conductive pattern (second conductive pattern)
57 Mounting space (predetermined location)
DISP liquid crystal display (electric parts)
M1 to M4 motor (electric parts)
P _{L1 to} P _Ln , P _{R1 to} P _Rn , P _{U1 to} P _Un , P _{O1 to} P _On port μCOM microcomputer (control chip, supply side component)

Claims (2)

A drive signal or a control signal supply side component including a control chip having a plurality of ports each having a predetermined function setting is driven by the drive signal or control signal supplied from the supply side component. A relay board used for mounting on a main board on which an electric component is mounted,
A substrate body in which a plurality of insulator layers are laminated;
A plurality of contacts disposed on a peripheral portion of the substrate body and corresponding to a plurality of ports of the control chip;
A plurality of electrically conductive patterns electrically connected to each other to connect each contact with a corresponding port of the control chip,
Each contact is disposed on a side close to the electric component to which each contact is to be electrically connected among a plurality of sides of the substrate body with the substrate body mounted on the main board. ,
At least a part of the conductive pattern is formed across the plurality of insulator layers,
A relay board characterized by that. A drive signal or control signal supply side component including a control chip having a plurality of ports each having a predetermined function setting, and driven by the drive signal or control signal supplied from the supply side component. A board unit on which a plurality of electric components whose layout is determined according to the arrangement of
A relay board on which the supply side component is mounted;
The plurality of electric parts are mounted, and the main board is provided with the relay board placed in a predetermined position excluding the mounting position of each electric part,
The relay substrate includes a substrate body in which a plurality of insulator layers are stacked, a plurality of contacts disposed on a peripheral portion of the substrate body, each corresponding to a plurality of ports of the control chip, and the contacts being connected to the control chip. A plurality of electrically conductive patterns, each electrically connected to a corresponding port of
The main board has a plurality of second contacts that are electrically connected to the respective contacts in a state where the relay board is placed at the predetermined position, and the second contacts are connected to the electric parts. A plurality of second conductive patterns electrically independent from each other;
At least a part of the conductive pattern is formed across the plurality of insulator layers,
Each of the contacts is electrically connected through the second contact and the second conductive pattern in a state where the relay substrate is placed on the predetermined position of the main substrate among a plurality of sides of the substrate body. Are arranged on the sides adjacent to the electric parts,
Each of the second conductive patterns has the conductive pattern and a port of the control chip corresponding to each of the electric components in a state in which the electric components are arranged with the relay substrate overlaid on the predetermined portion of the main substrate. A second contact that is electrically connected via the contact, each configured to connect;
A board unit characterized by that.

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