JP2007157868A - Dicing blade and dicing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing blade and a dicing device capable of accurately forming a plurality of trenches in approximately parallel at extremely narrow intervals. <P>SOLUTION: In the dicing blade 10, the edge thickness of an edge 21 is thinner than an annular section 22, and the edge face of the edge 21 is made approximately parallel with the side face of the annular section 22. The dicing device has a plurality of the dicing blades, and a space 25 is formed to the edge 21 of the adjacent dicing blade 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a dicing blade used for dicing a workpiece such as an optical waveguide substrate, a semiconductor substrate, and a metal substrate, and a dicing apparatus including a plurality of dicing blades.

  For example, when a semiconductor chip is diced from a semiconductor substrate, a dicing apparatus including one dicing blade needs to dic the semiconductor substrate several times.

  Conventionally, in order to reduce the man-hour required for dicing, the dicing apparatus includes a plurality of dicing blades. A conventional dicing apparatus will be described with reference to FIG. 11 using the multi-blade 90 disclosed in Patent Document 1 as an example. FIG. 11 is an enlarged view of the multi-blade 90. FIG. 11 illustrates a blade 91, a hub 92, and a hub blade 93. The hub blade 93 includes a blade 91 and a hub 92.

  The blade 91 is formed on the outer periphery of the hub 92. The thickness of the hub 92 is substantially the same as the size of the semiconductor chip formed on the semiconductor substrate. The multi-blade 90 includes a plurality of hub blades 93. Since the semiconductor substrate can be diced using a plurality of blades 91 at the same time, the multi-blade 90 can reduce the man-hours required for dicing.

JP 2002-246338 A

  However, since the accuracy of the stage on which the workpiece is placed is low and the workpiece needs to be diced at least twice to form the plurality of grooves, the dicing apparatus having one dicing blade has a plurality of grooves. There is a problem that it is difficult to form them substantially parallel with very narrow intervals.

  The multi-blade 90 is thin on the outer peripheral side of the hub 92, but there is a limit to reducing the outer peripheral side of the hub 92 in consideration of mechanical strength. A part of the side surface of the hub 92 cannot be adjacent to the side surface of another adjacent hub 92. Therefore, the hub 92 bends, and the multi-blade 90 has a problem that it is difficult to form a plurality of grooves substantially in parallel at an extremely narrow interval.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a dicing blade and a dicing apparatus capable of accurately forming a plurality of grooves substantially in parallel at very narrow intervals.

  In order to achieve the above object, the first invention of the present application is a dicing blade having blades whose blade thickness is thinner than between both side surfaces of the ring-shaped portion and whose blade surfaces are substantially parallel to both side surfaces of the ring-shaped portion.

  Specifically, the first invention of the present application is formed such that a central hole penetrating the both side surfaces is located on the central axis in a disk composed of opposing flat side surfaces and an outer peripheral surface substantially perpendicular to the both side surfaces. An annular portion having a blade thickness thinner than between both side surfaces of the annular portion, a blade surface being substantially parallel to the both side surfaces of the annular portion, and a blade formed on a part or all of the outer peripheral surface; And a dicing blade.

  In the dicing blade, the blade thickness of the blade is thinner than between the both side surfaces of the annular portion, and the blade surface of the blade is substantially parallel to the both side surfaces of the annular portion. Unlike the case where grooves are formed by etching, etc., the dicing blade can form a plurality of grooves with a very narrow interval and with high accuracy even if the material of the workpiece and the width and depth of the grooves to be formed are changed. can do. Therefore, it is possible to provide a dicing blade capable of forming a plurality of grooves with a very narrow interval and substantially in parallel.

  In order to achieve the above object, a second invention of the present application is a dicing apparatus having a space between a blade of the dicing blade and a blade of another dicing blade adjacent to the dicing blade.

  Specifically, the second invention of the present application includes a plurality of dicing blades according to claim 1 that are arranged adjacent to each other so that the side surfaces of the ring-shaped portion are in close contact with each other, and the center hole of the ring-shaped portion that passes through both ends. A dicing apparatus comprising: a blade holder that sandwiches and holds and fixes the plurality of dicing blades so as to cover part or all of the side surface of the ring-shaped portion of the dicing blade disposed on the dicing blade. A dicing apparatus having a space between the blade of the blade and the blade of another dicing blade adjacent to the dicing blade.

  By providing a plurality of the dicing blades, the dicing apparatus can dice the workpiece simultaneously. Therefore, the dicing apparatus can reduce the man-hour required for dicing. Since the side surface of the ring-shaped portion is in close contact and held and fixed by the blade holder, the dicing device is less likely to bend when dicing, and the accuracy is good. In addition, since the space is provided between the blade of the dicing blade and the blade of another dicing blade adjacent to the dicing blade, the dicing apparatus can accurately make a plurality of grooves substantially parallel to each other at extremely narrow intervals. Can be well formed. Therefore, it is possible to provide a dicing apparatus capable of forming a plurality of grooves at the same time with a very narrow interval and substantially in parallel.

  In the second invention of the present application, it is preferable to further include a rotation mechanism that rotates the blade holder so that a center axis of the ring-shaped portion becomes a rotation axis.

  By providing the rotation mechanism, the dicing apparatus can stably rotate the dicing blade. Therefore, a dicing apparatus with better accuracy can be provided.

  The present invention can provide a dicing blade and a dicing apparatus that can accurately form a plurality of grooves in a substantially parallel manner at an extremely narrow interval.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to embodiment shown below.

(Embodiment 1)
In the first embodiment of the present application, a ring-shaped portion is formed such that a center hole penetrating the both side surfaces is located on a central axis in a disk composed of opposed flat side surfaces and an outer peripheral surface substantially perpendicular to the both side surfaces. And a blade having a blade thickness thinner than between both side surfaces of the annular portion, a blade surface substantially parallel to the both side surfaces of the annular portion, and a blade formed on a part or all of the outer peripheral surface. It is a dicing blade.

  The dicing blade according to the first embodiment will be described with reference to FIG. In FIG. 1, the blade 21 has a uniform blade thickness, the blade surface 21 a of the blade 21 is substantially parallel to the side surface 22 a of the annular portion, and one blade surface 21 a of the blade 21 is an extended surface of the side surface 22 a of the annular portion 22. It is the figure of the dicing blade 10 located on the top. FIG. 1A is a side view of the dicing blade 10. FIG. 1B is a front view of FIG. FIG. 1C is an enlarged view of the blade 21. The dicing blade 10 in FIG. 1 includes a blade 21, a blade surface 21a, a ring-shaped portion 22, a side surface 22a, and an outer peripheral surface 22b.

  The ring-shaped portion 22 is formed by forming a center hole in a disk composed of opposite side surfaces 22a and an outer peripheral surface 22b substantially perpendicular to the both side surfaces 22a. The above-described center hole is formed so as to penetrate both side surfaces 22 a and be located on the center axis of the ring-shaped portion 22.

  The blade 21 has a blade thickness that is thinner than between both side surfaces 22 a of the annular portion 22. The blade 21 has a blade surface 21 a substantially parallel to the side surface 22 a of the annular portion 22. For example, as illustrated in FIG. 1C, one blade surface 21 a of the blade 21 may be located on an extended surface of the side surface 22 a of the annular portion 22.

  For example, the blade 21 may be one using diamond or CBN (cubic boron nitride) as abrasive grains, or one having methane bond or resin bond. The dicing blade 10 provided with the blade 21 using diamond as abrasive grains can include ceramics and glass as the material of the workpiece. The dicing blade 10 provided with the blade 21 using CBN as abrasive grains can raise a metal as a material of a workpiece. Moreover, the dicing blade 10 provided with the blade 21 which carried out the methane bond and the resin bond can mention ceramics and glass as a raw material of a workpiece. The dicing blade 10 does not limit the material of the workpiece to ceramics, glass, and metal.

  The blade 21 is formed on the outer peripheral surface 22 b of the annular portion 22. For example, as shown in FIG. 1A, the blade 21 may be formed on the entire outer peripheral surface 22 b of the annular portion 22.

  The disk and the blade 21 may be manufactured separately, and the annular portion 22 and the blade 21 may be integrated by welding or the like. For example, if a metal having high rigidity is used for the disk described above, the dicing blade 10 can have high rigidity. Moreover, you may manufacture the ring-shaped part 22 and the blade 21 integrally.

  Since the blade thickness of the blade 21 is thinner than between both side surfaces 22a of the ring-shaped portion 22, and the blade surface 21a is substantially parallel to both side surfaces 22a of the ring-shaped portion 22, the dicing blade 10 has a plurality of grooves in the workpiece. Can be formed substantially in parallel with a very narrow interval. For example, when a groove substantially parallel to the workpiece is formed by etching, if the material of the workpiece or the width or depth of the groove to be formed is changed, the etching conditions must be changed, and the accuracy is deteriorated. On the other hand, the dicing blade 10 has high accuracy since the blade thickness of the blade 21 and the width of the blade surface 21a need only be changed when changing the material or the width and depth of the groove to be formed. Therefore, it is possible to provide a dicing blade capable of forming a plurality of grooves with a very narrow interval and substantially in parallel.

  As shown in FIG. 2, the blade 21 may be formed on a part of the outer peripheral surface of the annular portion 22. FIG. 2 is a side view of the dicing blade 10 in which the blade 21 is formed on a part of the outer peripheral surface of the annular portion 22. FIG. 2 shows the blade 21 and the ring-shaped portion 22.

  The dicing blade 10 of FIG. 2 may be able to efficiently remove dust generated when the workpiece is ground or cut, and the cooling efficiency of the blade 21 may be improved. In addition, when forming the blade 21 in a part of outer peripheral surface of the ring-shaped part 22, the number of blades 21 and the position to form are not restricted to FIG. Further, in the following description, the formation of the blade 21 on a part of the outer peripheral surface of the annular portion 22 is omitted, but this does not prevent the blade 21 from being formed on a part of the outer peripheral surface of the annular portion 22. Note that the diameter of the center hole of the ring-shaped portion 22 is not particularly limited, and the same applies to the following description.

  As shown in FIG. 3 (c), both the blade surfaces 21 a of the blade 21 may be located inside the side surface 22 a of the ring-shaped portion 22.

  FIG. 3 is a view of the dicing blade 10 in which both the blade surfaces 21 a of the blade 21 are located inside the side surface 22 a of the annular portion 22. FIG. 3A is a side view of the dicing blade 10. FIG. 3B is a front view of the dicing blade 10. FIG. 3C is an enlarged view of the blade 21. FIG. 3 shows a blade 21, a blade surface 21a, a ring-shaped portion 22, a side surface 22a, and an outer peripheral surface 22b.

  The dicing blade 10 of FIG. 3 can obtain the same effects as the dicing blade 10 of FIG.

(Embodiment 2)
Specifically, in the second embodiment of the present application, a plurality of dicing blades according to the first embodiment of the present application that are adjacently arranged so that the side surfaces of the annular portion are in close contact with each other and the center hole of the annular portion are penetrated. And a blade holder that holds and fixes the plurality of dicing blades so as to cover part or all of the side surfaces of the ring-shaped portion of the dicing blades disposed at both ends. A dicing apparatus having a space between the blade of the dicing blade and the blade of another dicing blade adjacent to the dicing blade.

  A dicing apparatus according to the second embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a diagram of a dicing apparatus 11 including the dicing blade 10 of FIG. FIG. 4A is a front view of the dicing apparatus 11. FIG. 4B is an enlarged view of the blade 21. The dicing apparatus 11 includes a dicing blade 10, a blade holder 24, an axial center portion 24a, a lid portion 24b, and a space 25. The dicing blade 10 includes a blade 21 and a ring-shaped portion 22. The blade holder 24 includes an axial center portion 24a and a lid portion 24b. The width of the space 25 is the width a.

  FIG. 5 is a cross-sectional view of the optical waveguide substrate processed by the dicing apparatus 11 of FIG. FIG. 5 shows the core 32, the substrate 33, and the groove 34. The interval between the grooves 34 is the interval b.

  The dicing apparatus 11 includes three dicing blades 10 illustrated in FIG. Each dicing blade 10 is disposed adjacent to each other so that the side surface of the ring-shaped portion 22 is in close contact. The number of dicing blades 10 provided in the dicing apparatus 11 is not limited to three, and the same applies to the following description.

  The shaft center portion 24 a passes through the center hole of the ring-shaped portion 22. The lid portion 24 b is fixed to both end surfaces of the shaft center portion 24 a and covers part or all of the side surface of the annular portion 22. The blade holder 24 can hold and fix a plurality of dicing blades 10 in between.

  For example, the blade holder 24 can be made of metal.

  Since the plurality of dicing blades 10 are provided, the dicing apparatus 11 can simultaneously form a plurality of grooves in the optical waveguide substrate. Therefore, the dicing apparatus 11 can reduce the man-hour concerning dicing.

  Since the side surface of the ring-shaped portion 22 is in close contact and held and fixed by the blade holder 24, the dicing device 11 is less likely to be bent when dicing, and the dicing device 11 is highly accurate.

  Moreover, by having the space 25 between the blades 21 of the adjacent dicing blades 10, the dicing apparatus 11 can be formed substantially in parallel by making the width a of the space 25 equal to the interval b of the grooves 34. By diminishing the width a of the space 25, the dicing apparatus 11 can be formed such that the interval b between the three grooves 34 is extremely narrow. Therefore, it is possible to provide a dicing apparatus capable of forming a plurality of grooves at the same time with a very narrow interval and substantially in parallel.

  For example, the dicing apparatus 11 can be formed with the interval b between the grooves 34 being 20 micrometers or less. The width a of the space 25 and the interval b of the grooves 34 are not limited to the above.

  For example, the dicing apparatus 11 can form the groove for inserting the above-described minute shielding plate in the substrate at a very narrow interval in the manufacture of a MEMS (Micro Electro Mechanical System) having a plurality of minute shielding plates. Further, the dicing device 11 can form grooves in the ridge-type optical waveguide at an extremely narrow interval in manufacturing the ridge-type optical waveguide. The ridge-type optical waveguide manufactured using the dicing apparatus 11 can be used as a very narrow core between the grooves described above. Since grooves can be formed at extremely narrow intervals, the dicing apparatus 11 can make the above-mentioned MEMS and ridge-type optical waveguide smaller than before.

  As shown in FIG. 6, the dicing apparatus 11 may include the dicing blade 10 of FIG. FIG. 6 is a diagram of a dicing apparatus 11 including the dicing blade 10 of FIG. FIG. 6A is a front view of the dicing apparatus 11. FIG. 6B is an enlarged view of the blade 21. FIG. 6 illustrates the dicing blade 10, the blade holder 24, the shaft center portion 24a, the lid portion 24b, and the space 25.

  FIG. 7 is a cross-sectional view of the optical waveguide substrate processed by the dicing apparatus 11 of FIG. In FIG. 7, the core 32, the substrate 33, and the groove 34 are illustrated.

  As shown in FIG. 7, the dicing apparatus 11 of FIG. 6 can be formed on the optical waveguide substrate with the gap 34 being wider than the dicing apparatus 11 of FIG.

  As shown in FIG. 8, the dicing apparatus 11 may include the dicing blade 10 shown in FIGS. FIG. 8 is a diagram of a dicing apparatus 11 including the dicing blades of FIGS. 1 and 3 together. FIG. 8A is a front view of the dicing apparatus 11. FIG. 8B is an enlarged view of the blade 21. FIG. 8 illustrates the dicing blade 10, the blade holder 24, the shaft center portion 24a, the lid portion 24b, and the space 25.

  FIG. 9 is a cross-sectional view of the optical waveguide substrate processed by the dicing apparatus 11 of FIG. FIG. 9 illustrates the core 32, the substrate 33, the groove 34a, the groove 34b, and the groove 34c.

  As shown in FIG. 8, since the widths of the spaces are different, the dicing apparatus 11 can form the grooves 34a, 34b, and 34c having different intervals on the optical waveguide substrate. For example, as shown in FIG. 9, the dicing device 11 can be formed on the optical waveguide substrate by making the distance between the groove 34b and the groove 34c narrower than the distance between the groove 34a and the groove 34b.

  In the second embodiment of the present application, it is preferable to further include a rotation mechanism that rotates the blade holder so that the center axis of the ring-shaped portion is a rotation axis.

  A dicing apparatus 12 having a rotation mechanism will be described with reference to FIG. FIG. 10 is a conceptual diagram of the dicing apparatus 12. The dicing apparatus 12 includes a dicing blade 10, a blade holder 24, a rotation mechanism 25, a stage 36, an installation table 37, a rail 38, a rotation shaft 39, and an opening 40.

  The dicing blade 10 and the blade holder 24 are the same as described above.

  The rotating mechanism 25 may have an opening 40 on a side surface and have a rotating shaft 39 protruding from the opening 40. The rotation shaft 39 may move in the direction perpendicular to the installation table 37 within the range of the opening 40. The rotation mechanism 25 rotates the rotation shaft 39. For example, the rotating mechanism 25 can be an electric motor.

The installation base 37 may have two rails 38 and the rotation mechanism 25 in parallel on one surface.
The blade holder 24 may be fixed to the line shaft 39 so that the rotation shaft 39 is positioned on the central axis of the dicing blade 10. The stage 36 on which the workpiece is placed may be disposed on one surface of the installation table 37 via the two rails 38. Further, the stage 36 may move in the horizontal direction of the installation table 37 within the range of the rail 38.

  The dicing apparatus 12 may have a control mechanism that controls the rotational speed of the dicing blade 10, the movement of the stage 36, the movement of the rotating shaft 39, and the like. Further, the dicing device 12 may have a cooling mechanism for cooling the frictional heat between the dicing blade 10 and the workpiece. For example, the cooling mechanism may inject cooling water onto the dicing blade 10 and the workpiece.

  By providing the rotation mechanism 25, the dicing apparatus 12 can rotate the dicing blade 10 stably. Therefore, a dicing apparatus with better accuracy can be provided.

  The dicing blade and the dicing apparatus of the present invention can be used for forming a core of a ridge type optical waveguide and forming a MEMS mechanism.

It is a side view, a front view, and an enlarged view of a dicing blade in which the blade surface is substantially parallel to the side surface of the annular portion, and one blade surface of the blade is located on the extended surface of the side surface of the annular portion. It is a side view of the dicing blade in which the blade was formed in a part of the ring-shaped portion. It is a side view, a front view, and an enlarged view of a dicing blade in which the blade surface is substantially parallel to the side surface of the ring-shaped portion and both blade surfaces of the blade are located inside the side surface of the ring-shaped portion. It is the front view and enlarged view of a dicing apparatus provided with the dicing blade of FIG. It is sectional drawing of the optical waveguide board | substrate processed with the dicing apparatus of FIG. It is the front view and enlarged view of a dicing apparatus provided with the dicing blade of FIG. It is sectional drawing of the optical waveguide board | substrate processed with the dicing apparatus of FIG. FIG. 4 is a front view of a dicing apparatus provided with the dicing blade of FIGS. 1 and 3 together. It is sectional drawing of the optical waveguide board | substrate processed with the dicing apparatus of FIG. It is a conceptual diagram of a dicing apparatus provided with a rotation mechanism. It is an enlarged view of the conventional dicing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Dicing blades 11 and 12 Dicing apparatus 21 Blade 21a Blade surface 22 Ring-shaped part 22a Side surface 22b Outer peripheral surface 24 Blade holder 24a Axle core part 24b Cover part 25 Rotating mechanism 32 Core 33 Substrate 34, 34a, 34b, 34c Groove 36 Stage 37 Installation Base 38 Rail 39 Rotating shaft 40 Opening 90 Multi blade 91 Blade 92 Hub 93 Hub blade a Space width b Groove spacing

Claims (3)

A ring-shaped portion formed so that a center hole penetrating the both side surfaces is located on a central axis in a disk composed of opposing flat side surfaces and an outer peripheral surface substantially perpendicular to the both side surfaces;
A dicing blade comprising: a blade having a blade thickness thinner than between both side surfaces of the ring-shaped portion, a blade surface substantially parallel to the both side surfaces of the ring-shaped portion, and a blade formed on a part or all of the outer peripheral surface. . A plurality of dicing blades according to claim 1 arranged adjacent to each other so that the side surfaces of the ring-shaped portion are in close contact with each other.
A blade holder that holds and fixes the plurality of dicing blades so as to cover part or all of the side surface of the ring-shaped portion of the dicing blade disposed at both ends through the center hole of the ring-shaped portion. A dicing apparatus comprising:
A dicing apparatus comprising a space between the blade of the dicing blade and the blade of another dicing blade adjacent to the dicing blade. The dicing apparatus according to claim 2, further comprising a rotation mechanism that rotates the blade holder so that a center axis of the ring-shaped portion is a rotation axis.

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