JP2007157394A - Dye-sensitized solar battery module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dye-sensitized solar battery module having a structure easily manufactured by a simple process at low cost, and to provide its manufacturing method. <P>SOLUTION: The solar battery module is constituted by arranging a plurality of dye-sensitive solar battery cells in a plane with inter cellular areas interposed between, and by serially connecting them. Each cell is formed by laminating a transparent substrate, a transparent conductive film, a dye-carrying oxide semiconductor layer, an electrolyte solution layer, a rear-face conductive film, and a rear-face substrate sequentially from a light receiving side. The transparent substrate and the rear-face substrate are common and continuous single substrate to all of the plurality of dye-sensitized solar battery cells respectively. At the inter cellular area, either the transparent substrate or the rear-face substrate is plastically deformed toward the other, by the above, extended parts of both the transparent conductive film and the rear-face conductive film are adhered to each other to constitute an electrode connecting part. At the same time, a pair of inter cellular insulation barrier ribs are adhered to the electron connection part and liquid-tightly seal the electrode connecting part from both sides, and regulate the thickness of the electrolyte layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a dye-sensitized solar cell module and a method for manufacturing the same, and more particularly to a dye-sensitized solar cell module having an improved structure so that it can be manufactured at a low cost by a simplified manufacturing process.

  Dye-sensitized solar cells are representative of those first proposed by Gretzell et al. In Patent Documents 1 and 2, etc., and are less expensive than silicon solar cells because they do not require large-scale manufacturing facilities. It is attracting attention as a small-scale power supply source.

  However, in the past results, the photoelectric conversion efficiency does not reach the silicon solar cell, and the output voltage is small. Therefore, in practical use, it is indispensable to connect a plurality of cells in series to form a module.

  Since the primary advantage of the dye-sensitized solar cell is low cost, a simple and low-cost method and structure are required even when modularized.

  1 and 2 show a typical structure of a conventional dye-sensitized solar cell module.

  The structure shown in FIG. 1 is disclosed in Patent Documents 3 and 4 and the like, and each completed dye-sensitized solar cell 10 shown in FIG. As shown in FIG. 1, the module 100 is formed by connecting in series with connection leads.

  A dye-sensitized solar cell 10 in FIG. 1A is composed of a transparent substrate 12, a transparent conductive film 14, a dye-supported oxide semiconductor layer 16, and an electrolyte layer in order from the light receiving side (upward in the figure) of incident light L. 18, a back conductive film 20 (transparent or opaque) and a back substrate 22 (transparent or opaque) are laminated. In general, a catalyst layer 24 of Pt, C or the like is provided on the back conductive film 20, but this is not essential. The periphery of the cell 10 is liquid-tightly sealed with a sealing material 26 so as to prevent leakage of the electrolytic solution 18. The transparent conductive film 14 for sending electrons (e−) generated in the dye-carrying oxide semiconductor layer 16 to the outside is the negative electrode of the battery 10, and the back conductive film 20 for taking electrons (e−) from the outside is the battery. 10 positive electrodes.

  FIG. 1 (2) shows a module 100 in which three dye-sensitized solar cells 10 of FIG. 1 (1) are arranged in plane and connected in series. The positive electrode 20 and the negative electrode 14 of the adjacent cell 10 are electrically connected by an electrode connection line 28 and sandwiched between a transparent support substrate 30 and a back support substrate 32 (transparent or opaque) and sealed with a transparent insulating filler 34. The module 100 is stopped. Output terminals as the module 100 are a positive electrode 36 and a negative electrode 38.

  Thus, in order to manufacture the module 100 of FIG. 1, the complicated process which assembles the several single cell 10 as mentioned above is needed.

  Patent Document 5 proposes a method of collectively producing a module composed of a plurality of cells as shown in FIG. 2 without depending on the assembly of the single cells as described above.

  The dye-sensitized solar cell module 200 shown in FIG. 2 is collectively manufactured as an integrated structure in which regions of a plurality of dye-sensitized solar cells 210 and inter-cell regions 215 are alternately arranged in a plane. The cell 210 has the same basic structure as that of the unit cell 10 in FIG. 1A, and in order from the light receiving side (upward in the drawing) of the incident light L, the transparent substrate 212, the transparent conductive film 214, and the dye-carrying oxide semiconductor layer 216. The electrolyte layer 218, the back conductive film 220 (transparent or opaque), and the back substrate 222 (transparent or opaque) are laminated. Also in this example, the catalyst layer 224 of Pt, C, etc. is provided on the back surface conductive film 220, but it is not essential.

  As illustrated, each of the transparent substrate 212 and the back substrate 222 is a single continuous substrate common to all of the plurality of cells 210. Each of the transparent conductive film 214 and the back conductive film 220 includes electrode portions 214E and 220E in the cell 210 and extending portions 214T and 220T extending from one end of the electrode portion into the inter-cell region 215.

  The transparent conductive film 214 for sending electrons (e−) generated in the dye-carrying oxide semiconductor layer 216 to the outside is the negative electrode of the cell 210, and the back conductive film 220 for taking electrons (e−) from the outside is the cell. 210 is a positive electrode.

  In order to connect the cells 210 in series, in the inter-cell region 215, the extension 214T of the negative electrode 214 of the left cell 210 and the extension 220T of the positive electrode 220 of the right cell 210 are separate electrodes. They are electrically connected by a connection portion 228. The height of the electrode connection part 228 defines the thickness of the electrolyte layer 218. A pair of inter-cell insulating partition walls 226 are in close contact with both sides of the electrode connection portion 228 and are liquid-tightly sealed, whereby the electrolyte solution 218 is sealed in the cell 210 and the area of each cell 210 is determined.

  In this way, a module can be obtained by collectively manufacturing a plurality of cells connected in series on a single substrate. However, it is necessary to liquid-tightly seal both sides of the electrode connection portion 228 with an inter-cell insulating partition 226. is there. For this reason, the electrode connection portion 228 must be formed in the gap surrounded by the inter-cell insulating partition walls 226 on both sides, and a complicated manufacturing process is required.

  The greatest advantage of a dye-sensitized solar cell is that the manufacturing cost is low as well as the material cost. However, the module structures shown in FIGS. 1 and 2 both increase the number of module manufacturing steps and increase the number of manufacturing steps. There is a problem that the manufacturing cost increases due to the complexity.

Japanese Patent No. 2664194 Patent No. 2101079 JP 2001-185743 A (paragraph 0081 etc.) JP 2003-86822 A JP 2002-93475 A

  An object of the present invention is to provide a dye-sensitized solar cell module having a structure that can solve the above-described problems of the prior art and can be manufactured at low cost by a simple process and a method for manufacturing the same.

In order to achieve the above-mentioned object, according to the present invention, a plurality of dye-sensitized solar cells are arranged in a plane and sandwiched between the inter-cell regions, and are connected in series.
The dye-sensitized solar cell is formed by laminating a transparent substrate, a transparent conductive film, a dye-supported oxide semiconductor layer, an electrolyte layer, a back conductive film, and a back substrate in order from the light receiving side.
Each of the transparent substrate and the back substrate is a single continuous substrate common to all of the plurality of dye-sensitized solar cells,
Each of the transparent conductive film and the back conductive film is a dye-sensitized solar cell module including an electrode part in the cell and an extending part from one end of the electrode part to the inter-cell region.
In the inter-cell region, since at least one of the transparent substrate and the back substrate is plastically deformed toward the other side, the extending portions of the transparent conductive film and the back conductive film are in close contact with each other to form an electrode connection portion. A dye-sensitized solar cell comprising a pair of inter-cell insulating partition walls that are in close contact with the electrode connecting portion from both sides and liquid-tightly sealed, and that defines the thickness of the electrolyte layer A module is provided.

The method for producing the dye-sensitized solar cell module of the present invention includes:
On the transparent substrate, transparent conductive films and inter-cell insulating partition members are formed in an alternating arrangement corresponding to a plurality of cells that should be arranged in a plane across the inter-cell region. Forming a dye-carrying oxide semiconductor layer on the film to form a light-receiving side board;
Forming a back surface conductive film and inter-cell insulating partition walls in an alternating arrangement on the back substrate corresponding to the plurality of cells to form a back side board; and the light receiving side board and the back side Hold the inter-cell insulating partition wall member of one board in contact with the conductive film of the mating board, the inter-cell insulating partition wall member of the light receiving side board and the back surface In the inter-cell region having the inter-cell insulating partition wall member of the side board as both ends, by pressing both boards from the substrate side and plastically deforming the substrate of at least one board toward the other board, within the inter-cell region Forming an electrode connecting portion by bringing the conductive films of both boards into close contact with each other, and simultaneously forming an intercellular insulating partition member on both sides of the electrode connecting portion to form a liquid-tight intercell insulating partition. Toss The

  The dye-sensitized solar cell module of the present invention is a cell in which at least one of the light-receiving side substrate and the backside substrate is plastically deformed toward the other side in the inter-cell region, and the cell that is in close contact with the electrode connecting portion between adjacent cells and both sides thereof Since the inter-insulating partition can be formed at the same time, it can be manufactured at low cost without requiring a complicated process.

Embodiment 1
A dye-sensitized solar cell module according to a preferred embodiment of the present invention will be described with reference to FIG.

  The dye-sensitized solar cell module 300 of the present invention shown in FIG. 3 is collectively manufactured as an integrated structure in which regions of a plurality of dye-sensitized solar cells 310 and inter-cell regions 315 are alternately arranged in a plane. ing. Each cell 310 itself has the same basic structure as the conventional single cell 10 shown in FIG. 1A, and in order from the light receiving side (upward in the drawing) of incident light L, a transparent substrate 312, a transparent conductive film 314, A dye-supported oxide semiconductor layer 316, an electrolyte layer 318, a back conductive film 320 (transparent or opaque), and a back substrate 322 (transparent or opaque) are laminated. Here, the catalyst layer 224 on the back conductive film 220 as shown in FIG. 1A is not shown, but can be arbitrarily provided. As a material of the catalyst layer 224, Pt, Ru, Rh, Pd, C, or the like can be used.

  As shown, each of the transparent substrate 312 and the back substrate 322 is a single continuous substrate common to all of the plurality of cells 310. Each of the transparent conductive film 314 and the back conductive film 320 includes electrode portions 314E and 320E in the cell 310, and extending portions 314T and 320T extending from one end of the electrode portion to the inter-cell region 315.

  The transparent conductive film 314 for sending electrons (e−) generated in the dye-carrying oxide semiconductor layer 316 to the outside is the negative electrode of the cell 310, and the back conductive film 320 for taking in electrons (e−) from the outside is the cell. 310 is a positive electrode.

  As a feature of the present invention, in the inter-cell region 315, both the transparent substrate 312 and the back substrate 322 are plastically deformed so that the extending portions 314T and 322T of the transparent conductive film 312 and the back conductive film 322 are formed. The electrode connection part 328 is closely adhered to each other, and at the same time, the pair of inter-cell insulating partition walls 326 are in close contact with the electrode connection part 328 from both sides so as to be liquid-tightly sealed. The area of the cell 310 is determined. The height of the inter-cell insulating partition 326 defines the thickness d of the electrolyte layer 318.

  A manufacturing method of the dye-sensitized solar cell module 300 of FIG. 3 will be described with reference to FIGS.

  First, as shown in FIG. 4, a transparent conductive film 314 and an inter-cell insulating partition wall member 326 ′ are formed on a transparent substrate 312 corresponding to a plurality of cells 310 to be arranged in a plane with the inter-cell region 315 interposed therebetween. Are formed in an alternating arrangement, and a dye-carrying oxide semiconductor layer 316 is formed on each transparent conductive film 314 to form a light-receiving side board 330.

  On the other hand, on the back substrate 322, the back conductive film 320 and the inter-cell insulating partition members 326 ′ are formed in an alternating arrangement corresponding to the plurality of cells 310 to form the back board 332.

  Next, as shown in FIG. 5, the light receiving side board 330 and the back side board 332 face each other with the conductive films 314 and 320, and the inter-cell insulating partition wall member 326 ′ / 326 ′ of one board 330/332 is arranged. Is held in contact with the conductive film 320/314 of the mating board 332/330.

  In this state, in the inter-cell region 315 having both ends of the inter-cell insulating partition wall member 326 ′ of the light receiving side board 330 and the inter-cell insulating partition wall member 326 ′ of the back surface side board 332, the boards 330 and 332 are mounted on the substrates 312 and 322. The pressure terminal B is pressed as shown by the arrow F from the side. As the pressurization terminal B, a pressurization terminal of a high-frequency sewing machine or a laminator can be used, and it is desirable that heating and pressurization can be performed simultaneously or sequentially.

  3, the substrates 312 and 322 of both boards 330 and 332 are plastically deformed toward the other board, as shown in FIG. 3, and the conductive films 314 of both boards 330 and 332 are formed in the inter-cell region 315. 320 is formed in close contact with the electrode connection portion 328, and at the same time, the inter-cell insulating partition wall member 326 ′ (FIGS. 4 and 5) on both sides of the electrode connection portion 328 is also plastically deformed to be in close contact with both sides of the electrode connection portion 328. A liquid-tight inter-cell insulating partition wall 326 is formed. The inter-cell insulating partition wall 326 is in close contact with the conductive films 314 and 320 with which the inter-cell insulating partition wall member 326 ′ is in contact with each other, and is liquid-tightly sealed. The thickness d of the electrolytic layer 318 of the obtained cell 310 is determined. It stipulates.

  Thus, in the present invention, the negative electrode 314 of the cell 310 and the positive electrode 320 of the adjacent cell 310 are directly brought into close contact with each other to form the electrode connection portion 328. Thus, separate electrodes as in the conventional module 200 shown in FIG. The connection member 228 is not required, and the inter-cell insulating partition members 326 ′ located at both ends of the inter-cell region 315 simultaneously form the inter-cell insulating partition 326.

  Finally, the module 300 is completed by filling the electrolyte 318 and sealing the module end face with a sealing material. Typically, the module end face has the same structure as the cross section shown in FIG.

  As described above, in the present invention, the electrode connection between cells and the isolation between cells can be completed in one step, so that a dye-sensitized solar cell module can be realized at a low cost by an extremely simple process. Can do.

  As the transparent substrate 312 on the light receiving side, a transparent organic substrate that can be plastically deformed by pressing is suitable, and typical materials include PET (polyethylene terephthalate), PEN (polyethylene naphthalate), polypropylene, polyamide, cycloolefin polymer, Although polyethersulfin and polymethylmethacrylate are mentioned, it is not necessary to limit to these in particular.

As the transparent conductive film 314 provided on the transparent substrate 312, SnO ₂ (tin oxide), ATO (antimony-doped tin oxide), In ₂ O ₃ (indium oxide), ITO (indium / tin composite oxide), MgO (oxidation) Magnesium), ZnO (zinc oxide), and the like are typical materials, but there is no need to specifically limit them.

Examples of the dye-carrying oxide semiconductor 316 include TiO ₂ (titanium oxide), ZnO (zinc oxide), SnO ₂ (tin oxide), In ₂ O ₃ (indium oxide), Nb ₂ O ₅ (niobium oxide), WO ₃ ( Typical materials include tungsten oxide), ZrO ₂ (zirconium oxide), La ₂ O ₃ (lanthanum oxide), Ta ₂ O ₅ (tantalum oxide), SrTiO ₃ (strontium titanate), BaTiO ₃ (barium titanate), and the like. However, it is not necessary to limit to these.

  Since the back substrate 322 may be transparent or opaque, a fluororesin, Teflon (registered trademark), or the like can be used in addition to the material of the transparent organic substrate used for the transparent substrate 312.

  Since the back conductive film 320 provided on the back substrate 322 may be transparent or opaque, a carbon material or a metal material can be used in addition to the material of the transparent conductive film 314. Typical examples of the metal material include Pt, Au, stainless steel, Al, Ti, Cr, Fe, Ni, Cu, Zn, Mo, Pd, Ag, Sn, Ta, and W, but are particularly limited to these. There is no need. These metal materials can be used alone or as an alloy, and can be laminated in a single layer or multiple layers.

  As the material of the inter-cell insulating partition 326, those having necessary properties such as insulation, corrosion resistance to the electrolytic solution 318, plastic deformability, mechanical strength, and the like are suitable. (1) Thermosetting resin, (2) It is desirable to use a thermoplastic resin and (3) a photocurable resin.

  (1) As the thermosetting resin, epoxy resin, phenol resin, and diallyl phthalate resin are representative, but it is not necessary to limit to these. In the case of using a thermosetting resin, in the aforementioned pressing step, the pressure terminal B is pressed against the substrates 312 and 320 in the inter-cell region 315 to add an inter-cell insulating partition wall member 326 ′ made of a semi-cured resin. By heating after pressing, the member 326 ′ is easily plastically deformed together with the substrates 312, 322 and the conductive films 314, 320 and is in close contact with the electrode connecting portion 328 and the conductive film 314/320, and then cured and in this state. A partition wall 326 is formed. However, when the deformation is performed instantaneously, the same plastic deformation / curing action can be obtained even if the pressurization and heating are performed almost simultaneously.

  (2) Typical examples of the thermoplastic resin include ionomer resin, EVA resin (Ethylene-Vinyl Acetate (ethylene-vinyl acetate) copolymer resin), polyacetal resin, vinyl chloride resin, acrylic resin, and phenol resin. It is not necessary to limit to. When a thermoplastic resin is used, in the pressing step, the pressure terminal B is pressed against the substrates 312 and 320 in the inter-cell region 315, respectively, and the inter-cell insulating partition wall member 326 'at normal temperature is pressed while being heated, thereby pressing the substrate 312.・ Plastically deform together with 322 and conductive films 314 and 320, and release pressure terminal B from substrates 312 and 320 to finish heating and pressurization and freeze the deformed state to determine inter-cell insulating partition wall 326. .

  (3) As a photocurable resin, an ultraviolet curable epoxy resin and an ultraviolet curable acrylic resin are typical, but it is not necessary to limit to these. In the case of using a photo-curing resin, in the pressing step, the inter-cell insulating partition wall member 326 ′ made of a semi-cured resin is pressed with a pressure terminal B and then irradiated with light. As a result, in the inter-cell region 315, the member 326 ′ is easily plastically deformed together with the substrates 312 and 322 and the conductive films 314 and 320 to be in close contact with the electrode connection portion 328 and the conductive film 314/320, and then cured. It becomes the partition 326 in a state.

  The sealing material for sealing the end face of the module 300 can also be selected from the materials shown for the inter-cell insulating partition 326 described above.

[Embodiment 2]
A dye-sensitized solar cell module according to another preferred embodiment of the present invention will be described with reference to FIG.

  The dye-sensitized solar cell module 350 of the present invention shown in FIG. 6 has the same structure as the module 300 of FIG. 3 except that the back substrate 322 is deformed but the transparent substrate 312 is not deformed. All the reference numerals indicating the members in FIG. 6 have the same reference numerals as the corresponding members in FIG. Moreover, the material which comprises each member can be selected from the material demonstrated as an object for corresponding members in Embodiment 1.

  In the present embodiment, in the inter-cell region 315, the extension 320T of the back conductive film 320 is deformed along with the deformation of the back substrate 322, and is in close contact with the extension 312T of the undeformed transparent substrate 312. Part 328 is configured.

  In the present embodiment, it is assumed that a glass substrate that cannot be plastically deformed is used as the transparent substrate 312. However, it is needless to say that the above-mentioned transparent substrate material that can be plastically deformed may not be used for deformation.

  The material of other members is the same as that of the first embodiment.

  A manufacturing method of the dye-sensitized solar cell module 350 of FIG. 6 will be described with reference to FIGS.

  The structures of the light receiving side board 330 and the back side board 332 that are manufactured first are exactly the same as those of the first embodiment shown in FIG. The only difference is that a material that cannot be plastically deformed, such as a glass substrate, can be used as the transparent substrate 312.

  Next, as shown in FIG. 7, the light receiving side board 330 and the back side board 332 face each other with the conductive films 314 and 320, and the inter-cell insulating partition member 326 ′ / 326 ′ of one board 330/332. Is held in contact with the conductive film 320/314 of the mating board 332/330. It is the same as that of Embodiment 1 so far, and the following pressing steps are different.

  In the above state, the entire substrate 312 of the light receiving side board 330 is fixed in contact with the flat holder S, and the inter cell insulating partition wall member 326 ′ of the light receiving side board 330 and the inter cell insulating partition wall member of the back side board 332 are fixed. In the inter-cell region 315 having 326 ′ as both ends, the back surface side board 332 is pressed from the substrate 322 side by the pressure terminal B as indicated by an arrow F.

  As a result, as shown in FIG. 6, the substrate 322 of the back side board 332 is plastically deformed toward the light receiving side board 330, and the conductive films 314 and 320 of the boards 330 and 332 are brought into close contact within the inter-cell region 315. At the same time as forming the electrode connection portion 328, the inter-cell insulating partition wall members 326 ′ (FIGS. 4 and 7) on both sides of the electrode connection portion 328 are also plastically deformed and brought into close contact with both sides of the electrode connection portion 328, thereby being liquid-tight. An inter-cell insulating partition 326 is formed. The inter-cell insulating partition wall 326 is in close contact with the conductive films 314 and 320 with which the inter-cell insulating partition wall member 326 ′ is in contact with each other, and is liquid-tightly sealed. The thickness d of the electrolytic layer 318 of the obtained cell 310 is determined. It stipulates.

  As described above in Embodiments 1 and 2, in the present invention, the electrode connection portion 328 is formed by directly adhering the negative electrode 314 of the cell 310 and the positive electrode 320 of the adjacent cell 310, which is shown in FIG. Unlike the conventional module 200, a separate electrode connection member 228 is not required, and the cell spacing wall members 326 ′ located at both ends of the intercell region 315 simultaneously form the cell spacing walls 326.

  Finally, the module 350 is completed by filling the electrolyte 318 and sealing the module end face with a sealing material. Typically, the module end face has the same structure as the cross section shown in FIG.

  As described above, in the present invention, the electrode connection between cells and the isolation between cells can be completed in one step, so that a dye-sensitized solar cell module can be realized at a low cost by an extremely simple process. Can do.

  ADVANTAGE OF THE INVENTION According to this invention, the problem of a prior art is eliminated, The dye-sensitized solar cell module of the structure which can be produced cheaply with a simple process, and its manufacturing method are provided.

It is sectional drawing which shows the conventional dye-sensitized solar cell module of the structure which connected and embedded the single cell. It is sectional drawing which shows the conventional dye-sensitized solar cell module which produced the integrated structure which consists of a some cell collectively. 1 is a cross-sectional view of a dye-sensitized solar cell module according to an exemplary embodiment of the present invention. It is sectional drawing which shows the 1st process in the method of manufacturing the dye-sensitized solar cell module of this invention shown in FIG. 3 or FIG. FIG. 5 is a cross-sectional view showing a step subsequent to FIG. 4. FIG. 5 is a cross-sectional view of a dye-sensitized solar cell module according to another preferred embodiment of the present invention. It is sectional drawing which shows the process following FIG. 4 in the method of manufacturing the dye-sensitized solar cell module of this invention shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Conventional dye-sensitized solar cell module 10 Dye-sensitized solar cell 12 Transparent substrate 14 Transparent conductive film (negative electrode)
16 Dye-supporting oxide semiconductor layer 18 Electrolyte layer 20 Back conductive film (positive electrode)
DESCRIPTION OF SYMBOLS 22 Back substrate 24 Catalyst layer 26 Sealing material 28 Electrode connection line 30 Transparent support substrate 32 Back support substrate 34 Transparent insulation filler 36 Positive electrode 38 Negative electrode 200 Conventional dye-sensitized solar cell module 210 Dye-sensitized solar cell 215 Inter-cell region 212 Transparent substrate 214 Transparent conductive film 214E Electrode portion of transparent conductive film 214T Extension portion of transparent conductive film 214 216 Dye-carrying oxide semiconductor layer 218 Electrolyte layer 220 Back surface conductive film 220E Electrode portion of back surface conductive film 220 220T Extension part of back surface conductive film 220 222 Back surface substrate 224 Catalyst layer 226 Inter-cell insulating partition 228 Electrode connection part 300, 350 Dye-sensitized solar cell module 310 of the present invention 310 Dye-sensitized solar cell 315 Inter-cell region 312 Transparent substrate 314 Transparent conductive film 314E Electricity of transparent conductive film 314 Electrode part 314T Extension part of transparent conductive film 314 316 Dye-carrying oxide semiconductor layer 318 Electrolyte layer 320 Back face conductive film 320E Electrode part of back face conductive film 320 320T Extension part of back face conductive film 320 322 Back face substrate 326 Inter-cell insulation Partition wall 326 ′ Inter-cell insulating partition member 328 Electrode connection portion

Claims (8)

A solar cell module in which a plurality of dye-sensitized solar cells are arranged in a plane and connected in series across the inter-cell region,
The dye-sensitized solar cell is formed by laminating a transparent substrate, a transparent conductive film, a dye-supported oxide semiconductor layer, an electrolyte layer, a back conductive film, and a back substrate in order from the light receiving side.
Each of the transparent substrate and the back substrate is a single continuous substrate common to all of the plurality of dye-sensitized solar cells,
Each of the transparent conductive film and the back conductive film is a dye-sensitized solar cell module including an electrode part in the cell and an extending part from one end of the electrode part to the inter-cell region.
In the inter-cell region, since at least one of the transparent substrate and the back substrate is plastically deformed toward the other side, the extending portions of the transparent conductive film and the back conductive film are in close contact with each other to form an electrode connection portion. A dye-sensitized solar cell comprising a pair of inter-cell insulating partition walls that are in close contact with the electrode connecting portion from both sides and liquid-tightly sealed, and that defines the thickness of the electrolyte layer module.   2. The dye-sensitized solar cell module according to claim 1, wherein the transparent substrate and the back substrate are a transparent organic substrate and an organic substrate, respectively, and both of these substrates are plastically deformed toward each other.   The dye-sensitized solar cell module according to claim 1, wherein the transparent substrate and the back substrate are a transparent glass substrate and an organic substrate, respectively, and the back substrate is plastically deformed toward the transparent substrate.   The dye-sensitized solar cell module according to any one of claims 1 to 3, wherein the inter-cell insulating partition is made of any one of a thermoplastic resin, a thermosetting resin, and a photocurable resin. . A method for producing a dye-sensitized solar cell module according to any one of claims 1 to 4,
On the transparent substrate, transparent conductive films and inter-cell insulating partition members are formed in an alternating arrangement corresponding to a plurality of cells that should be arranged in a plane across the inter-cell region. Forming a dye-carrying oxide semiconductor layer on the film to form a light-receiving side board;
Forming a back surface conductive film and inter-cell insulating partition walls in an alternating arrangement on the back substrate corresponding to the plurality of cells to form a back side board; and the light receiving side board and the back side Hold the inter-cell insulating partition wall member of one board in contact with the conductive film of the mating board, the inter-cell insulating partition wall member of the light receiving side board and the back surface In the inter-cell region having the inter-cell insulating partition wall member of the side board as both ends, by pressing both boards from the substrate side and plastically deforming the substrate of at least one board toward the other board, within the inter-cell region Forming an electrode connecting portion by bringing the conductive films of both boards into close contact with each other, and simultaneously forming an intercellular insulating partition member on both sides of the electrode connecting portion to form a liquid-tight intercell insulating partition. Toss A method for producing a dye-sensitized solar cell module.   6. The method for producing a dye-sensitized solar cell module according to claim 5, wherein the inter-cell insulating partition member is made of a thermoplastic resin, and the pressing is performed while heating the inter-cell insulating partition member.   6. The method for producing a dye-sensitized solar cell module according to claim 5, wherein the inter-cell insulating partition member is made of a thermosetting resin, and the inter-cell insulating partition wall is heated after the pressing.   6. The method for producing a dye-sensitized solar cell module according to claim 5, wherein the inter-cell insulating partition member is made of a photo-curing resin, and the light is applied to the inter-cell insulating partition after the pressing.

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