JP2007153690A - Glass molding apparatus and glass molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass molding apparatus capable of controlling the temperature of a molding die by a simple constitution, and to provide a glass molding method. <P>SOLUTION: The glass molding apparatus 1 has a mold base 4 on which a molding die 2 is mounted, a pressure device 11 for pressurizing the molding die 2 and a heater block 5 for heating the die 2, and is provided characteristically with: a temperature sensor 9 for detecting the temperature of the die 2; the air cylinders 61, 62 for freely advancing or retreating the heater block 5 with respect to the die 2; and a controller for approximating/separating the heater block 5 to/from the die 2 by reciprocating the air cylinders 61, 62 so that the temperature of the die 2 becomes a prescribed set value on the basis of that temperature detected by the sensor 9. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a glass forming apparatus and a glass forming method, and more particularly to a glass forming apparatus and a glass forming method capable of controlling the temperature of a forming mold with a simple configuration.

In general, in glass molding equipment that molds optical parts such as optical lenses that require high precision and high resolution, it is dedicated to each process of heating, molding, and slow cooling to improve productivity. There is known a technique in which a plurality of optical components are continuously produced by sequentially moving each stage and simultaneously producing a plurality of optical components (for example, Patent Documents 1 and 2).
JP-A-8-259240 (FIG. 1, paragraphs 0021 to 0050 of the specification) JP 2001-58837 A (FIG. 1, paragraphs 0010 to 0012 of the specification)

However, if each stage is moved sequentially, the movement time not only increases the cycle time, but also the pressure applied to the mold must be released to move the stage. There was a risk of adversely affecting the molding accuracy.
On the other hand, although a molding apparatus that performs all heating, molding, and slow cooling processes in one stage is known, the response of temperature control is poor and the cycle time is increased. Also known is a glass forming device that is heated by an infrared lamp that can be heated rapidly in order to improve the temperature control response of the mold, but it is expensive and requires an additional device such as a reflecting mirror. There was also a problem of increasing complexity.

  Therefore, an object of the present invention is to provide a glass forming apparatus and a glass forming method capable of controlling the temperature of a forming die with a simple configuration in order to solve the above-described problems.

  In order to solve the above-described problems, a glass forming apparatus according to the present invention includes a mold table on which a forming mold is placed, a pressurizing apparatus that pressurizes the forming mold, and a heating unit that heats the forming mold. A molding apparatus, a movement means for moving the heating means relative to the mold, and a control device for controlling the operation of the movement means so that the temperature of the mold becomes a predetermined set value. And.

With such a configuration, the present invention provides a moving means for moving the heating means to move forward and backward with respect to the mold, and adjusts the positional relationship between the mold and the heating means by controlling the operation of the moving means by the control device. To do. Then, by adjusting the positional relationship between the two, the amount of heat transferred from the heating means to the mold is adjusted, and the temperature of the mold is controlled to be a predetermined set value.
Therefore, even if the temperature of the heating means itself is not raised or lowered, the mold can be heated rapidly if the heating means is brought closer to the mold, and if the heating means is moved away from the mold, the mold is rapidly cooled. You can also Further, by adjusting the positional relationship between the mold and the heating unit by moving the heating unit closer to or away from the mold, it is possible to maintain a constant temperature or to gradually cool the mold.
Therefore, it is not necessary to previously provide a stage for each heating process or cooling process and move the mold to each process, so that the cycle time can be shortened. Further, since it is not necessary to release the applied pressure unless the mold is moved, there is no possibility of adversely affecting the molding accuracy.

In the above-described present invention, a temperature sensor for detecting the temperature of the mold is provided, and the control device controls the operation of the moving unit based on the temperature of the mold detected by the temperature sensor. Can do.
According to such a configuration, the temperature of the mold is detected by providing a temperature sensor, and the mold is processed more accurately by comparing the detected temperature of the mold with a predetermined set temperature, so that the mold is more accurately obtained. It becomes possible to manage the temperature of the.

  In the present invention described above, a resistance heating type heater member can be used as the heating means. According to such a configuration, for example, by using a resistance heating type cartridge heater or the like, the mold can be heated with a simple configuration.

In the above-described present invention, it is preferable that the moving means includes a fluid cylinder, and the control device reciprocates the fluid cylinder to bring the heating means close to or away from the mold.
According to such a configuration, the temperature of the mold can be managed by a simple control mechanism by controlling the reciprocating movement of the fluid cylinder so that the heating means approaches or separates.

Further, the glass molding method according to the present invention is a glass molding method in which a glass material is charged into a molding die, and pressure molding is performed while heating, and a resistance heating type heater member is moved close to or away from the molding die. Then, the temperature of the mold is adjusted.
According to such a configuration, an inexpensive glass forming method is provided with a simple configuration in order to adjust the heating temperature of the forming die by bringing a resistance heating type heater member close to or away from the forming die. Can do.

  ADVANTAGE OF THE INVENTION According to this invention, the glass forming apparatus which can control the temperature of a shaping | molding die with a simple structure, and a glass forming method can be provided.

Embodiments of the present invention will be described in detail with reference to the drawings as appropriate.
In the drawings to be referred to, FIG. 1 is a cross-sectional view seen from the front for explaining the configuration of the glass forming apparatus according to the embodiment of the present invention, and FIG. 2 is each configuration of the glass forming apparatus according to the embodiment of the present invention. It is a block diagram for demonstrating the relationship of an element.

As shown in FIG. 1, a glass forming apparatus 1 according to an embodiment of the present invention includes a mold table 4 on which a mold 2 is placed, a heater block 5 that is a heating means for heating the mold 2, and a mold 2. And a temperature sensor 9 for detecting the temperature of the heater block 5, air cylinders 61 and 62 as moving means for moving the heater block 5 close to or away from the mold 2, and control for controlling the operation of the air cylinders 61 and 62. The apparatus 8 (refer FIG. 2) and the pressurization apparatus 11 which pressurizes the shaping | molding die 2 are provided.
In the present embodiment, a case where an optical lens is formed by heat-molding the glass material L will be described as an example.

The molding die 2 has molding surfaces L1 and L2 for molding the mirror surface of the optical lens. The lower die 21 fixed to the lower die base 41, the upper die 22 fixed to the upper die base 42, and the lower die 21 And a body mold 23 for guiding and positioning the upper mold 22. In the present embodiment, the lower mold 21 and the upper mold 22 are positioned using the body mold 23. However, it is not always necessary, and the lower mold 21 and the upper mold 22 can be positioned alone. . Further, for example, other positioning means using an inclined block or the like may be applied as appropriate.
In the mold 2, the glass material L is put into the lower mold 21. The upper mold 22 is fixed to an upper mold base 42 configured to be raised and lowered by the pressurizing device 11. With this configuration, the upper mold 22 is lowered and pressure molding is performed while heating in a state where the lower mold 21 and the upper mold 22 are matched.

The mold table 4 includes a lower mold table 41 that fixes the lower mold 21 and an upper mold table 42 that fixes the upper mold 22. The lower mold base 41 is fixed to the lower part of the frame 3 and includes a holder plate 41a that holds the lower mold 21, a heat insulating material 41b that blocks heat from the lower mold 21, and a base 41c. On the other hand, the upper mold base 42 includes a holder plate 42 a that holds the upper mold 22, a heat insulating material 42 b that blocks heat from the upper mold 22, and a lift plate 42 c. It is fixed at the top. For example, the elevating mechanism 43 is configured such that the elevating plate 42c can be raised and lowered with the guide post 42d as a sliding shaft, and is driven by the pressurizing device 11 described later.
In the present embodiment, the mold base 4 is configured by including the heat insulating materials 41b and 42b in consideration of the thermal effect on each sliding member and the like. However, the present invention is not limited to this and is appropriately placed in an appropriate place. Is to be placed.

The heater block 5 includes a lower mold heater block 51 that is a heating unit for the lower mold 21 and an upper mold heater block 52 that is a heating unit for the upper mold 22.
The heater block 5 can be configured by, for example, embedding a resistance heating type cartridge heater in a stainless steel block in consideration of heat resistance and the like. In the present embodiment, the heater block 5 is used as the heating means. However, the present invention is not limited to this, and other heating means such as a so-called high-frequency induction current method or a halogen lamp can be used. .
The lower die heater block 51 is connected to an air cylinder 61 that moves the lower die heater block 51 close to or away from the lower die 21, and the upper die heater block 52 is connected to the upper die heater block 52. An air cylinder 62 is connected to move the cylinder close to or away from the upper mold 22.

The moving means includes an air cylinder 61 that is a moving means for the lower die heater block 51 and an air cylinder 62 that is a moving means for the upper die heater block 52.
The air cylinder 61 is configured so that the lower die heater block 51 can be moved closer to or away from the lower die 21 by switching between the forward side and the return side with a switching valve 61a (see FIG. 2). . 1 shows a state in which a position lower mold heater block 51 is separated by [delta] _d from the holder plate 41a holding the lower die 21.
Similarly, the air cylinder 62 is configured such that the upper die heater block 52 can be moved closer to or away from the upper die 22 by switching between the forward side and the return side with a switching valve 62a (see FIG. 2). Has been. 1 shows a state in which a position for the upper heater block 52 is separated by [delta] _u from the holder plate 42a holding the upper die 22.
Here, the distance [delta] _d of the lower mold heater block 51 is separated from the holder plate 41a, and the distance [delta] _u of the upper-heater block 52 is separated from the holder plate 42a holding the upper die 22, always the same It is assumed that it will not be. Even if the lower die heater block 51 and the upper die heater block 52 have the same amount of heat, the heat tends to be transmitted upward, so the temperature of the lower die 21 tends to be higher than that of the upper die 22. is there.
In the present embodiment, the air cylinders 61 and 62 are used as the moving means. However, the present invention is not limited to this, and a hydraulic cylinder may be used. Further, the air cylinders 61 and 62 have a built-in position sensor to detect the position, or using another drive source such as a servo motor, the heater block 5 and the mold 2 are connected via a ball screw or a link mechanism. The positional relationship can also be adjusted.

  As shown in FIG. 1, the pressurizing device 11 is disposed at the upper part of the glass forming device 1, and a pressurizing motor 11 a as a driving source and a screw connected to the pressurizing motor 11 a via a speed reducer (not shown). 11b. And the raising / lowering plate 42c is connected with the screw 11b. With this configuration, the rotational movement of the screw 11b is converted into the reciprocating movement of the elevating plate 42c. For this reason, the pressurizing motor 11a is rotated forward or reversely to lower or raise the elevating plate 42c so as to clamp and open the mold, and adjust the pressurizing force as appropriate. In addition, although illustration is abbreviate | omitted, the heat insulation member is provided in the proper place so that sliding members, such as the screw 11b, may not receive the influence of the heat from the heater block 5. FIG.

As shown in FIG. 2, the control device 8 includes a mold temperature setting unit 81 configured by a memory that sets a predetermined mold temperature in advance, and a mold that is measured by the set predetermined mold temperature and the temperature sensor 9. 2 and a control unit 83 for controlling the switching valves 61a and 61b based on the calculation result.
Here, the temperature sensor 9 includes a lower mold temperature sensor 91 that measures the temperature of the lower mold 21, an upper mold temperature sensor 92 that measures the temperature of the upper mold 22, and a lower mold that measures the temperature of the lower mold heater block 51. And an upper mold heat source sensor 92a for measuring the temperature of the upper mold heater block 52. The lower mold heat source sensor 91a and the upper mold heat source sensor 92a are provided to detect the temperatures of the lower mold heater block 51 and the upper mold heater block 52, which are heat sources, respectively, and maintain the temperatures at a constant temperature. ing.
These temperature sensors 9 use various temperature detectors such as thermocouples, and are configured to be detachable from the mold 2 and the heater block 5 so that the temperature of the mold 2 and the heater block 5 can be detected more accurately. Yes.

Then, operation | movement of the glass forming apparatus which concerns on embodiment of this invention is demonstrated, referring FIGS. 1-3 suitably.
As described above, in the glass forming apparatus 1 according to the embodiment of the present invention, the lower die 21 is heated close to the lower die 21 and the upper heater block 52 is heated close to the upper die 22. Press molding. At this time, in order to control the temperature (mold temperature) of the lower mold 21 and the upper mold 22 to a predetermined set temperature, the mold temperature is detected by the lower mold temperature sensor 91 and the upper mold temperature sensor 92, respectively. Compare with The lower mold heater block 51 is moved closer to or away from the lower mold 21 to control the temperature of the lower mold 21, and the upper mold heater block 52 is moved closer to or separated from the upper mold 22. Is configured to control the temperature.

Here, the control of the mold temperature during molding will be described in detail with reference to FIG.
FIG. 3A is a graph showing the set value of the temperature of the mold, and the temperature of the mold 2 substantially changes in this way even during actual molding. FIGS. 3B and 3C are graphs showing how the heater block is moved close to or away from the mold.
The set temperature of the mold has a property that is appropriately determined depending on the material, shape, and other molding conditions of the glass of the molded product. Further, in the following description, for convenience of explanation, the lower die 21 and the upper die 22 are collectively referred to as the forming die 2, and the lower die heater block 51 and the upper die heater block 52 are collectively referred to as the heater block 5. There is. However, since the operations of the lower die heater block 51 and the upper die heater block 52 are controlled separately in consideration of differences in thermal conductivity and the like (see FIG. 2), the operations themselves are not necessarily identical. It is not a thing.

As shown in FIG. 3 (a), the glass molding is performed by heating the glass material L (see FIG. 1) to a transition point or higher at which the glass crystal shape changes, and molding the glass material L into the shape of an optical lens. It is comprised including the pressure molding process to perform. During the pressure molding process, the molding die is held in a heat-retaining state, and then molded while gradually cooling so as not to rapidly decrease the temperature.
First, in the heating process, the glass material L is charged into the lower mold 21, and the upper mold 22 is lowered by the pressurizing device 11 to start the mold clamping (see FIG. 1). At this time, as shown in FIG. 3 (a), it is necessary to rapidly increase the temperature of the mold 2 in order to heat the glass material L to a predetermined temperature equal to or higher than the transition point at which the glass can be molded ( t ₀ ~t _1).
Therefore, in the heating process, the heater block 5 is held at a position close to or in contact with the mold 2 as shown in FIG. 3B (t _{0 to} t ₁ ).

In this way, when the temperature of the mold 2 reaches a predetermined temperature equal to or higher than the transition point of the glass material L (t ₁ ), the process proceeds to the pressure molding process, and the pressure applied to the mold 2 is higher than that at the time of mold clamping. Is increased and molding is started. In the pressure molding step, the temperature of the molding die ₂ needs to be gradually cooled so as not to drop rapidly after being kept constant (t _{1 to} t ₂ ) from the viewpoint of molding accuracy (t _{1 to} t ₂ ). ₂ ~t _3).
Therefore, within a time period (t _{1 to} t ₂ ) in which the temperature of the mold 2 is kept constant (t _{1 to} t ₂ ), the heater block 5 is separated from the heat quantity ΔQ ₁ transmitted to the mold 2 in a state of being close to the mold 2. The proximity (or contact, hereinafter the same) state and the separation state are alternately repeated to the same extent so that the amount of heat ΔQ ₁ ′ dissipated from the mold 2 in this state becomes the same. Further, within the time (t _{2 to} t ₃ ) during which the temperature of the mold 2 is gradually cooled, the distance is larger than the amount of heat ΔQ ₂ transmitted to the mold 2 in a state where the heater block 5 is close to the mold 2. The proximity state and the separation state are alternately repeated so that the amount of heat ΔQ ₂ ′ dissipated in the state is increased.

Here, in the pressure molding step (t _{1 to} t ₃ ), the control in which the heater block 5 approaches or is separated from the mold 2 will be specifically described with reference to FIG. FIG. 4 is a flowchart for explaining a pressure forming process of the glass forming apparatus according to the embodiment of the present invention.
First, in step S1, the required set temperature of the predetermined mold 2 stored in the mold temperature setting unit 81 and the mold temperature detected by the lower mold temperature sensor 91 and the upper mold temperature sensor 92 are calculated. Part 82 compares.

If the set temperature is higher than the mold temperature as a result of comparison by the calculation unit 82, the process proceeds to step S2. In step S2, a signal is transmitted from the control unit 83 to the switching valves 61a and 62a so as to bring the heater block 5 close to the mold 2 in order to increase the temperature of the mold 2.
On the other hand, if the set temperature is lower than the mold temperature as a result of the comparison by the calculation unit 82, the process proceeds to step S3, and the heater block 5 is separated from the mold 2 to lower the temperature of the mold 2. A signal is transmitted from the control unit 83 to the switching valves 61a and 62a so as to cause the switching to occur.
Thus, the mold 2 is kept warm or gradually cooled by moving the heater block 5 close to or away from the mold 2 so that the temperature of the mold 2 is traced to a predetermined temperature. can do.
Thereafter, the process proceeds to step S4, it is determined whether or not the elapsed time t ₃ by the timer 84 incorporated in the control unit 8. If has elapsed the time t _3, the process proceeds to step S5 is held while it is separating the heater block 5.
On the other hand, if no elapsed time _{t 3,} the temperature control of the mold 2 is repeated back to step S1 (S2, S3 to S4)

After completion of the pressure molding process (t ₃ ), the heater block 5 is cooled in a state of being separated from the mold 2 until the shape of the optical lens is stabilized (t ₃ to t ₄ ). Open and take out the optical lens to finish the molding process (t ₄ ).

As described above, in the present embodiment, the lower die heater block 51 and the upper die heater block 52 (heater block 5) are moved forward and backward with respect to the lower die 21 and the upper die 22 (molding die 2). The air cylinders 61 and 62 are provided, and the positional relationship between the mold 2 and the heater block 5 is adjusted by controlling the operation of the air cylinders 61 and 62 by operating the switching valves 61 a and 62 a by the control device 8. Then, by adjusting the positional relationship between the two, the amount of heat transferred from the heater block 5 to the mold 2 is adjusted, and the temperature of the mold 2 is controlled so that a predetermined set value can be traced.
Accordingly, even if the temperature of the heater block 5 itself is not increased or decreased, the mold 2 can be heated rapidly if the heater block 5 is brought close to the mold 2 (heating process, t _{0 to} t ₁ ), and the heater If the block 5 is moved away from the mold 2, the mold 2 can be rapidly cooled (t _{3 to} t ₄ ). Further, the temperature of the molding die 2 is maintained by adjusting the positional relationship between the molding die 2 and the heater block 5 by moving the heater block 5 closer to or away from the molding die 2 (heat retention, t _{1 to} t ₂ ) and can be gradually cooled (slow cooling, t _{2 to} t ₃ ).
Therefore, it is not necessary to previously provide a stage for each heating process or cooling process and move the mold 2 to each process, so that the cycle time can be shortened. Further, since it is not necessary to release the applied pressure unless the mold 2 is moved, there is no possibility of adversely affecting the molding accuracy.

Next, another embodiment of the present invention will be described with reference to FIG.
In the above-described embodiment, the lower die heater block 51 and the upper die heater block 52 are moved closer to or away from each other between the two positions, and the holding time at the positions is changed to change the lower die heater block 51 and the upper die heater block 51. The amount of heat transferred from the mold heater block 52 to the lower mold 21 and the upper mold 22 was adjusted.
In another embodiment described here, the distance δ _d (see FIG. 1) between the lower die heater block 51 and the lower die 21 is changed, so that the lower die heater block 51 transmits the lower die 21 to the lower die 21. The amount of heat transmitted from the upper die heater block 52 to the upper die 22 is adjusted by adjusting the amount of heat and changing the distance δ _u (see FIG. 1) between the upper die heater block 52 and the upper die 22. It is.

Specifically, in the heating step, as in the above-described embodiment, the lower die heater block 51 is located close to or in contact with the lower die 21 as shown in FIG. The upper die heater block 52 is held at a position close to or in contact with the upper die 22 (t _{0 to} t ₁ ).
In the pressure molding process, the amount of heat transferred from the lower mold heater block 51 to the lower mold 21 within the time for keeping the temperature of the mold 2 constant (heat retention, t _{1 to} t ₂ ), The distance δ _d (see FIG. 1) between the lower die heater block 51 and the lower die 21 is set to δ ₁ so that the amount of heat dissipated from the die 21 is the same, and similarly the upper die heater block The distance δ _u (see FIG. 1) between the upper mold heater block 52 and the upper mold 22 is set to δ so that the amount of heat transferred from the upper mold 22 to the upper mold 22 is the same as the amount of heat dissipated from the upper mold 22. ₁ 'is set. The reason why δ ₁ and δ ₁ ′ are set separately for the distances δ _d and δ _u is that the lower mold 21 and the upper mold 22 may have different heat transfer conditions and the like. In this respect, the situation is the same in the above-described embodiment.

Further, within the time for gradually cooling the temperature of the mold 2 (slow cooling, t _{2 to} t ₃ ), the amount of heat dissipated from the mold 2 is larger than the amount of heat transmitted from the heater block 5 to the mold 2. The distance between the heater block 5 and the mold 2 is set so that there are more. Specifically, the distance δ _d (see FIG. 1) between the lower die heater block 51 and the lower die 21 is set to δ ₂ and the distance δ _u between the upper die heater block 52 and the upper die 22 (FIG. 1). Is set to δ ₂ ′.
When cooling the mold 2, the heater block 5 is separated from the mold 2 by a sufficient distance δ _3, and no heat is transferred from the lower mold heater block 51 and the upper mold heater block 52 to the mold 2. I am doing so. In this cooling, air can be actively cooled by blowing air on the mold 2 or the like.

Note that the temperature of the heater block 5, the distances δ ₁ , δ ₁ ′, δ ₂ , δ ₂ ′ between the heater block 5 and the mold ₂ , or the heater block 5 so that the temperature of the mold 2 becomes a predetermined temperature. It is also possible to set the timing of approaching or separating from each other in advance in the trial production stage of the mold 2. By doing so, it is not necessary to measure the temperature of the mold 2 with the temperature sensor 9 for each shot, or it can be determined at the beginning of the lot of the day. However, if the position of the heater block 5 is controlled while detecting the temperature of the mold 2 for each shot by the temperature sensor 9 instead of for each lot, the mold temperature can be managed more accurately.

Therefore, according to such another embodiment, the lower heater block 51 is kept at a certain distance δ from the lower mold 21 without raising or lowering the temperature of the lower mold heater block 51 and the upper mold heater block 52 itself. _The lower die 21 can be kept warm if it is close to _1, and the upper die 22 can be kept warm if the upper die heater block 52 is brought close to the upper die 22 to a certain distance δ ₁ ′ ( t ₁ ~t _2). Further, if the lower die heater block 51 is moved away from the lower die 21 to a certain distance δ _{2, the} lower die 21 can be gradually cooled, and the upper die heater block 52 is separated from the upper die 22 by a certain distance δ ₂ ′. The upper mold 22 can be gradually cooled (t _{2 to} t ₃ ).
Therefore, it is not necessary to previously provide a stage for each heating process or cooling process and move the mold 2 to each process, so that the cycle time can be shortened. Further, since it is not necessary to release the applied pressure unless the mold 2 is moved, there is no possibility of adversely affecting the molding accuracy.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and can be implemented with appropriate modifications.
For example, in the present embodiment, the air cylinders 61 and 62 are used as the moving means, and the switching valves 61a and 62a are used to switch between the forward side and the return side, so that the two-stage positions are close to or separated from the mold 2. Although control is used, the present invention is not limited to this, and a position of three or more stages may be set, or the position may be detected by a rotary encoder or the like and stopped at an arbitrary position. In the present embodiment, the switching valves 61a and 62a are switched to approach or separate from each other. However, the present invention is not limited to this, and other switching means such as a limit switch may be used.
In the present embodiment, the lower die heater block 51 and the upper die heater block 52 are slid by moving the lower die heater block 51 and the upper die heater block 52 by the sliding operation of the air cylinders 61 and 62. However, the present invention is not limited to this, and the sliding operation of the air cylinders 61 and 62 may be converted into a rotating operation by a link mechanism or the like. Further, the heater block 5 may be moved closer to or away from the mold 2 by a rotating operation by a servo motor or the like instead of the fluid cylinder.

  In the present embodiment, the control of the mold temperature in the pressure molding process has been simplified for the sake of convenience. However, in order to prevent mold temperature overshoot, the timing at which the heater block 5 approaches or separates in anticipation of the delay time. Can also be set. For this reason, it is also effective to control the position of the heater block 5 with reference to the speed gradient of the mold temperature change.

  In the present embodiment, the heater block 5 in which the cartridge heater is embedded is used as the heating means, and the heater block 5 is arranged close to or away from the mold 2. However, the present invention is not limited to this. Depending on the means, the cartridge heater can be moved so as to be embedded in the mold 2 or can be separated.

It is front sectional drawing for demonstrating the structure of the glass forming apparatus which concerns on embodiment of this invention. It is a block diagram for demonstrating the relationship of each component of the glass forming apparatus which concerns on embodiment of this invention. (A) is a graph which shows the setting value of the temperature of a shaping | molding die. And (b) and (c) are graphs showing how the heater block is brought close to or away from the mold, (b) shows this embodiment, and (c) shows another embodiment. It is a flowchart for demonstrating the press molding process of the glass forming apparatus which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass forming apparatus 2 Mold 3 Frame 4 Stand 5 Heater block (heating means, heater member)
DESCRIPTION OF SYMBOLS 8 Control apparatus 9 Temperature sensor 11 Pressurization apparatus 21 Lower mold 22 Upper mold 23 Body mold 41 Lower mold base 42 Upper mold base 51 Lower mold heater block 52 Upper mold heater block 61 Air cylinder (moving means)
62 Air cylinder (moving means)
91 Lower mold temperature sensor 91a Lower mold heat source sensor 92 Upper mold temperature sensor 92a Upper mold heat source sensor L Glass material

Claims (5)

A glass forming apparatus comprising: a mold table for placing a forming mold; a pressurizing device that pressurizes the forming mold; and a heating unit that heats the forming mold.
Moving means for moving the heating means relative to the mold;
A control device for controlling the operation of the moving means such that the temperature of the mold becomes a predetermined set value;
A glass forming apparatus comprising: A temperature sensor for detecting the temperature of the mold;
The glass forming apparatus according to claim 1, wherein the control device controls the operation of the moving unit based on the temperature of the mold detected by the temperature sensor.   The glass forming apparatus according to claim 1, wherein the heating unit is a resistance heating type heater member. The moving means comprises a fluid cylinder;
4. The glass molding according to claim 1, wherein the control device reciprocates the fluid cylinder to move the heating unit close to or away from the molding die. 5. apparatus. In a glass molding method in which a glass material is charged into a molding die and pressure molded while heating,
A glass molding method comprising adjusting a temperature of the molding die by moving a resistance heating type heater member close to or away from the molding die.

Images