JP2007147362A - Probe pin, and manufacturing method of probe pin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure high dimension accuracy and productivity of a tall probe pin. <P>SOLUTION: A groove 20 is formed on the side face of the probe pin 10, and the tip part side having a contact part 21 is bent from the groove 20 part. The tip of the probe pin 10 is formed in a sharpened shape and used as the contact part 21. The rear end side from the groove 20 of the probe pin 10 is bonded to a connection terminal 11a of a contactor 11, and the tip part side of the probe pin 10 is bent to the lower side having a wafer W from the groove 20 part. The contact part 21 of the probe pin 10 is brought into contact with the wafer W, and electric characteristics of the wafer W are inspected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a probe pin for contacting an object to be inspected and inspecting electrical characteristics of the object to be inspected, and a method of manufacturing the same.

  For example, the inspection of the electrical characteristics of an electronic circuit such as an IC or LSI formed on a semiconductor wafer is performed using a probe card attached to the probe device. The probe card usually has a circuit board and a contactor. A large number of probe pins are supported on the lower surface of the contactor facing the wafer, and the electrical characteristics of the wafer are inspected by bringing the numerous probe pins into contact with the electrodes of the electronic circuit.

  As shown in FIG. 19, the conventional probe pin is generally composed of a linear beam portion 100 and a contact portion 101 protruding perpendicularly to the distal end portion of the beam portion 100, and has a substantially L shape. Such probe pins are generally manufactured by being integrally formed by a plating technique such as electroforming (see, for example, Patent Document 1).

JP 2001-52779 A

  However, the probe pin has a relatively large aspect ratio (ratio of the width and height of the contact portion 101) because it is necessary to reduce the width of the contact portion 101 and ensure the height of the contact portion 101. For this reason, at the time of integral molding, for example, a cavity may be formed near the corner where the contact portion 101 and the beam portion 100 are in contact with each other, and the production efficiency and dimensional accuracy of the probe pin may be reduced. If the dimensional accuracy of the probe pin is reduced, the contact between the probe pin and the wafer becomes unstable, and a highly reliable inspection cannot be performed.

  In addition, when a foreign object such as a wafer fragment is attached to the wafer and the foreign object is located below the beam part 100, the foreign object may contact the beam part 100 during the inspection and damage the probe pin. There is sex. In order to reduce this possibility, a higher probe pin contact portion 101 is required. However, in practice, the aspect ratio of the conventional probe pin is limited to about 2, and if the aspect ratio becomes larger than this, the production efficiency and the dimensional accuracy are remarkably lowered. For this reason, with the conventional probe pin, the contact portion 101 cannot be made sufficiently high, and a probe pin that is sufficiently long in a direction in which an object to be inspected such as a wafer cannot be realized.

  The present invention has been made in view of the above points, and provides a probe pin sufficiently high in the direction of an object to be inspected while maintaining high dimensional accuracy and high production efficiency, and a method for manufacturing the probe pin. For that purpose.

  To achieve the above object, the present invention provides a probe pin for contacting an object to be inspected to inspect the electrical characteristics of the object to be inspected, having a groove on a side surface and contacting the object to be inspected The tip portion side having the portion is refracted from the groove portion.

  According to the present invention, since the groove is formed on the side surface of the probe pin and the tip end side of the probe pin is refracted from the groove portion, the probe pin can be obtained without performing processing with a high aspect ratio as in the prior art. Enough height is secured. In addition, productivity is increased because high aspect ratio processing is not required. Since the probe pin is formed by bending from the groove portion, the length and height on the tip side with the contact portion can be made constant, and high dimensional accuracy of the probe pin can be secured.

  The tip on the tip side may be formed in a pointed shape to form the contact portion. Further, the tip on the tip portion side may be formed in a protruding shape having a constant width to be the contact portion.

  The refraction angle on the tip end side may be set to 45 ° to 60 °.

  A conical apex serving as the contact portion is formed on the side surface of the refracted front end portion, and the inner angle of the apex portion is equally divided by a vertical line when the rear end portion side is maintained horizontal than the groove. As described above, the top portion may be formed.

  Another aspect of the present invention is a method of manufacturing a probe pin for contacting an object to be inspected to inspect the electrical characteristics of the object to be inspected, and protruding in parallel from a linear end surface of a substrate. A step of forming a plurality of straight pins, a step of forming a groove on a side surface of the plurality of pins on the tip end side, a step of bending the tip end side of the plurality of pins from a groove portion, and the plurality of pins Cutting the pin from the end face of the substrate.

  In the step of forming the plurality of pins, a photolithography technique is used to form the base material and the plurality of pin molds on a mother mold, and the matrix and the plurality of pins are formed on the mother mold by a plating technique. You may form integrally.

  The method of manufacturing the probe pin includes a step of forming a conical hole in a portion corresponding to the tip of each pin of the master die, and the base and the plurality of the base die are formed on the master die by the plating technique. When the pins are integrally formed, a conical apex is formed on the side surface on the front end side of each pin, and the rear end side is maintained horizontally with respect to the grooves of the plurality of pins. The top portion may be formed so that the inner angle of the top portion is equally divided by a vertical line when the tip end portion side of the head is bent.

  According to another aspect of the present invention, there is provided a method of manufacturing a probe pin for contacting an object to be inspected and inspecting the electrical characteristics of the object to be inspected. Forming a groove mold of the groove into a straight ridge, and then, using a photolithographic technique, intersecting the mother mold in a direction perpendicular to the groove mold and in a linear direction of the groove mold Forming a plurality of pin molds arranged in parallel along with each other, and subsequently forming a plurality of pins having grooves in the master mold using a plating technique, The method includes a step of removing from the mother die and a step of bending the tip end side of the plurality of pins from the groove portion. In addition, the content of “using photolithography technology” mentioned here includes the case where it is used in combination with other technologies.

  According to the present invention, since the groove is formed on the side surface of the probe pin and the tip end side of the probe pin is bent from the groove portion, the height is sufficiently high even without processing with a high aspect ratio as in the prior art. Probing pins can be manufactured. Further, since a groove with high positional accuracy and dimensional accuracy can be formed in the probe pin, a probe pin refracted from this groove can also be formed with high accuracy. In addition, since a plurality of probe pins are formed from a common mold, a large number of probe pins at the same groove position can be formed at a time, and the manufacturing efficiency of the probe pins can be increased.

  In the step of forming the plurality of pin molds, a substrate mold in which the plurality of pins are connected in parallel is also formed, and in the step of molding the plurality of pins, the plating technique is used to form the plurality of pins. In the step of integrally molding the base material and removing the plurality of pins from the mother die, the base material is removed from the mother die together with the plurality of pins, and the tip end side of the plurality of pins is removed from the groove portion. After the bending, the plurality of pins may be cut from the base material.

  The base material may have a linear end surface, and the plurality of pins may be formed to protrude in parallel from the end surface of the base material.

  A thin film may be coated on the surface of the mother mold between the step of forming the groove mold and the step of forming the plurality of pin molds.

  The step of forming the probe pin groove mold includes a step of forming a resist film on the mother mold, forming a linear groove on the resist film on the mother mold, and plating the groove of the resist film by plating. A step of embedding a mold material and a step of removing the resist film from the mother die to form a groove of the probe pin made of the mold material may be included.

  According to the present invention, a sufficiently high probe pin can be efficiently manufactured with high dimensional accuracy.

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is an explanatory diagram showing an outline of the configuration of the probe device 1.

  The probe device 1 is provided with, for example, a probe card 2 and a mounting table 3 on which a wafer W as an object to be inspected is mounted.

  The probe card 2 includes, for example, a contactor 11 that supports a plurality of probe pins 10 that contact the electrodes of the wafer W on the lower surface, and a printed wiring board 12 that transmits and receives electrical signals to the probe pins 10 through the main body of the contactor 11. . The contactor 11 and the printed wiring board 12 are formed, for example, in a substantially disk shape, and the printed wiring board 12 is arranged on the upper surface side of the contactor 11 so as to be able to energize the contactor 11.

  The probe pin 10 is joined to a connection terminal 11a formed on the lower surface of the main body of the contactor 11, for example.

  The probe pin 10 is formed of a metal conductive material such as a nickel alloy. The probe pin 10 is formed in an elongated, substantially rectangular parallelepiped shape, for example, as shown in FIG. A groove 20 is formed on the lower side surface of the probe pin 10. The groove 20 is formed, for example, at a predetermined position closer to the tip than the center of the probe pin 10, for example, with a width of 50 μm and a depth of about 20 μm. The rear end side of the groove 20 of the probe pin 10 is formed horizontally and is joined to the connection terminal 11a. The tip end side of the probe pin 10 with respect to the groove 20 is refracted downward from the groove 20 portion. The refraction angle θ on the distal end side of the probe pin 10 is set, for example, in the range of 45 ° to 60 °, more preferably 55 °. For example, as shown in FIG. 3, the tip of the probe pin 10 is formed in a pointed shape when viewed from above, and the tip is a contact portion 21 with the wafer W.

  As shown in FIG. 1, the mounting table 3 is configured to be movable left and right and up and down, for example, and three-dimensionally moves the mounted wafer W so that the probe pin 10 of the probe card 2 is moved to a desired position on the wafer W. Can be contacted.

  Next, a method for manufacturing the probe pin 10 described above will be described. First, as shown in FIG. 4, a comb-like body 33 is formed that includes a rectangular flat plate-like substrate 30 and a plurality of pins 31 protruding in parallel from one end surface of the substrate 30 in a comb-blade shape. The plurality of pins 31 are portions that will later become the probe pins 10, and are formed according to the dimensions of the desired probe pins 10. The base material 30 is formed with a positioning hole 34 for fixing the comb-like body 33 at a predetermined position during processing to be described later.

  The comb-like body 33 is formed using, for example, a photolithography technique and an electroforming technique. For example, first, as shown in FIG. 5, a film-like resist film R is formed on a stainless steel flat plate serving as a mother die 40 (FIG. 5A). The resist film R is exposed to a predetermined pattern and developed to form the mold 40a of the comb-like body 33 on the mother mold 40 ((b) of FIG. 5). The die 40a of the mother die 40 is plated with a nickel alloy to form a comb-like body 33 (FIG. 5 (c)).

  Next, the mother die 40 is fixed to a processing machine (not shown), and the groove 20 is formed on the tip end side of each pin 31 of the comb 33 as shown in FIG. The groove 20 of each pin 31 is formed in a lump by, for example, dicer cutting, and is formed along a straight line L orthogonal to the plurality of pins 31 arranged in parallel as shown in FIG. Thereby, the groove | channel 20 of each pin 31 is formed in the position of equal distance from a front-end | tip part. The groove 20 may be formed by etching. After forming the groove 20, the comb-like body 33 is removed from the mother die 40.

  Thereafter, as shown in FIG. 7, the tip end side of each pin 31 with respect to the groove 20 is refracted by an angle θ toward the side where the groove 20 is present. The refraction of the pin 31 is performed, for example, by pressing. Then, each pin 31 is cut | disconnected from the end surface of the base material 30 with a dicer, for example, and the several probe pin 10 of the same shape is formed. As described above, the formed probe pin 10 is joined to the lower surface of the contactor 11 so that the groove 20 faces downward and the tip end side is bent downward.

  When the electrical characteristics of the electronic elements on the wafer W are inspected, the wafer W is placed on the mounting table 3, and the wafer W is raised to the contactor 11 side by the mounting table 3. Then, each electrode of the wafer W is brought into contact with the contact portion 21 of the corresponding probe pin 10. An electrical signal is exchanged with the wafer W through the probe pin 10 via the printed wiring board 12 and the contactor 11, and the electrical characteristics of the electronic elements on the wafer W are inspected.

  According to the above embodiment, since the groove 20 is formed in the probe pin 10 and the tip end side of the probe pin 10 is refracted from the groove 20, the integral molding with a high aspect ratio is not performed as in the prior art. However, the contact portion 21 having a sufficiently high height can be formed. In addition, since it is not necessary to perform integral molding with a high aspect ratio, productivity can be increased. Since the light is refracted from the position of the groove 20, the position and height of the contact portion 21 are stabilized, and the probe pin 10 with high dimensional accuracy can be formed. Furthermore, the height of the contact portion 21 can be easily set by adjusting the position of the groove 20 and the refraction angle.

  Moreover, since the tip of the probe pin 10 is pointed to form the contact portion 21, a high contact pressure can be secured between the contact portion 21 and the wafer W, and the inspection by the probe pin 10 can be stabilized. .

  Since the refraction angle θ of the probe pin 10 is set in the range of 45 ° to 60 °, the contact between the probe pin 10 and the wafer W can be further stabilized.

  According to the above embodiment, when manufacturing the probe pin 10, the comb-like body 33 including the base material 30 and the plurality of pins 31 is formed, and the grooves 20 are formed in the plurality of pins 31 in this state. In addition, since the tip end side of each pin 31 is bent from the groove 20, a large number of probe pins 10 having the same dimensions can be manufactured at a time, and probe pins 10 having high dimensional accuracy can be manufactured with high productivity. it can.

  In addition, since the comb 40a of the comb-like body 33 is formed on the mother die 40 by the photolithography technique, and the comb-like body 33 is integrally formed on the mold 40a by the electroforming technique, the comb-like body 33 having high dimensional accuracy is compared. Can be formed easily.

  Since the positioning hole 34 is formed in the base material 30 of the comb-like body 33, high-precision processing for the pin 31 can be realized.

  In the above embodiment, the tip of the probe pin 10 is formed in a pointed shape. However, as shown in FIG. 8, the tip of the probe pin 10 is formed in a protrusion shape having a constant width and becomes a contact portion 21. It may be. The width of the protrusion at this time is set to about 10 μm to 15 μm, for example. In such a case, even if the contact portion 21 of the probe pin 10 is worn due to multiple contact between the probe pin 10 and the wafer W, the width of the contact portion 21 is maintained constant. Contact can be stabilized. As a result, stable inspection can be maintained.

  In the above embodiment, the tip of the probe pin 10 is the contact portion 21, but as shown in FIG. 9, a square pyramid top 50 is formed on the side surface of the probe pin 10 on the tip side. The top portion 50 may be the contact portion 21. In this case, the top 50 is formed on the same side as the groove 20 of the probe pin 10. As shown in FIG. 10, when the rear end side of the groove 20 of the probe pin 10 is horizontal and joined to the contact terminal 11a of the contactor 11, the vertical line Z bisects the inner angle θ1 of the top 50. Then, the top 50 is formed.

  Here, a method of forming the probe pin 10 having the top 50 will be described. As shown in FIG. 11, a hole 61 serving as a mold for the top 50 is formed in the above-described stainless steel mother die 40 by, for example, a diamond cone 60 inclined at a predetermined angle ((a) of FIG. 11). The hole 61 is opened at a position to be the die 40a on the tip end side of the pin 31 later. The direction of the top 50 is set according to the inclination angle of the cone 60 at this time. The inclination angle of the cone 60 becomes the final refraction angle θ2 (shown in FIG. 10) of the probe pin 10, and when the inclination angle θ2 of the cone 60 becomes larger than θ1 / 2, the vertical line Z bisects the angle. Thus, the inner angle θ1 of the top 50 cannot be formed. Therefore, the inclination angle θ2 of the cone 60 is set so as to satisfy the condition of θ2 <θ1 / 2. When the internal angle θ1 of the top 50 is 70 °, θ2 is preferably about 30 °, for example. Thereafter, a resist pattern to be the mold 40a of the comb-shaped body 33 is formed on the mother mold 40 ((b) of FIG. 11). Thereafter, the comb-like body 33 is formed on the mother die 40 by electroforming ((c) of FIG. 11). The comb-like body 33 is taken out from the mother die 40, and the comb-like body 33 having the pin 31 with the top 50 is formed ((d) of FIG. 11). Thereafter, as described above, the groove 20 is formed in the pin 31, the tip end side of the pin 31 is bent, the pin 31 is cut from the base material 30, and the probe pin 10 is formed.

  According to such an example, the apex 50 is formed at the refracted tip of the probe pin 10, and the apex 50 is formed so that the inner angle θ1 is divided into two equal parts by the vertical line Z. At the time of contact with W, the vertical component of the force acting on the wafer W from the probe pin 10 is increased, and the contact between the probe pin 10 and the wafer W can be stabilized. Further, since the hole 61 is formed by the cone 60 in the mother die 40 and the top portion 50 is integrally formed with the comb-like body 33 by electroforming, the probe pin 10 having the top portion 50 can be easily formed with relatively few steps.

  In addition, in the said example, the shape of the top part 50 is not restricted to a quadrangular pyramid, Another pyramid shape may be sufficient, and a cone shape may be sufficient. Further, as shown in FIG. 12, a minute flat surface 50a may be formed at the tip of the top 50. By doing so, the contact between the probe pin 10 and the wafer W can be further stabilized, and the wear of the tip portion of the top 50 due to the contact can be suppressed.

  Next, a method for manufacturing the probe pin 10 according to the second embodiment will be described. First, the comb-like body 33 shown in FIG. 4 is formed using, for example, a photolithography technique and an electroforming technique. For example, as shown in FIG. 13A, first, a film-like resist film R is formed on a stainless steel flat plate serving as a mother die 40. Next, the resist film R is exposed to a predetermined pattern and developed as shown in FIG. 13B, and a linear, constant width groove R1 is formed in the resist film R. Thereafter, as shown in FIG. 13C, the groove R1 of the resist film R is plated with, for example, nickel, which is a mold material, and the groove R1 is filled with nickel. Thereafter, the resist film R is removed, and a groove mold 40b (bump) of the probe pin 10 is formed on the mother mold 40 as shown in FIG. As shown in FIG. 14, the groove mold 40b is formed in a linear protrusion extending in a predetermined direction (X direction). Thereafter, the entire surface of the mother die 40 is coated with a thin film so as to cover the groove die 40b by plating or sputtering. As a result, the adhesion between the groove mold 40b and the mother body 40 is improved, and the peelability between the mother mold 40 and the comb 33 is improved.

  Subsequently, as shown in FIG. 15A, a film-like resist film R is formed again on the mother die 40. Next, as shown in FIG. 15 (b), the resist film R is exposed to a predetermined pattern and developed, and a die 40 c of a comb-like body 33 made up of a die of the substrate 30 and a die of the pin 31 is formed on the mother die 40. It is formed. At this time, as shown in FIG. 16, the die 40d of the pin 31 is formed so as to be orthogonal to the groove die 40b and arranged in parallel in the forming direction (X direction) of the groove die 40b.

  As shown in FIG. 15C, for example, a nickel alloy is plated on the mold 40 c of the mother mold 40 by electroforming to mold the comb-like body 33. Thereafter, the resist film R is removed from the mother die 40 as shown in FIG. Next, as shown in FIG. 18, the comb-shaped body 33 is removed from the mother die 40, and the comb-shaped body 33 is completed. At this time, the groove 20 of each pin 31 of the comb 33 is formed on a straight line L in the X direction orthogonal to the pin 31 as shown in FIG. Thus, the groove 20 of each pin 31 is formed at a predetermined position equidistant from the tip.

  Next, as in the first embodiment, the tip side of each pin 31 is refracted by an angle θ to the side where the groove 20 is located, as shown in FIG. Then, each pin 31 is cut | disconnected from the end surface of the base material 30 with a dicer, for example, and the several probe pin 10 of the same shape is formed.

  According to the embodiment described above, the groove mold 40b is formed in the mother mold 40 by using the photolithography technique, and the mold 40c of the comb-like body 33 is formed in the mother mold 40 by the photolithography technique. A comb-like body 33 is formed on the mother die 40 by electroforming technology. As described above, the groove mold 40b is formed by using a photolithography technique capable of fine processing, and the groove 20 is formed in the probe pin 10 by the mold 40b. Therefore, the groove 20 having high positional accuracy and dimensional accuracy is formed. The pin 31 can be formed. Since the probe pin 10 is formed by bending from the groove 20, the probe pin 10 with high accuracy can be formed.

  In addition, the groove mold 40b is formed in a straight protrusion, and the mold 40d of each pin 31 is formed orthogonally to the groove mold 40b and in parallel along the forming direction of the mold 40b. A large number of probe pins 10 having the following can be formed. Thereby, the manufacturing efficiency of the probe pin 10 can be improved.

  In the above embodiment, the mold 40c of the comb-like body 33 in which the plurality of pins 31 and the base material 30 are integrated is formed on the mother die 40, and the plurality of pins 31 and the base material 30 are integrally molded. A plurality of pins 31 can be bent together in a state of being attached to the substrate 30. Thereby, the bending position and bending angle of each probe pin 10 can be matched.

  After the groove mold 40b is formed, the entire surface of the mother mold 40 is plated with a thin film, so that the adhesion between the groove mold 40b and the mother mold 40 can be improved. As a result, when the comb-like body 33 is removed from the mother die 40, the groove die 40b can be prevented from peeling off from the mother die 40 together with the probe pins 10.

  The preferred embodiment of the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to such an example. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the spirit described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs. For example, in the above embodiment, the base material 30 integrally formed with the pins 31 has a rectangular flat plate shape, but may have other shapes. Further, only the pin 31 may be molded without the base material 30. In addition, the resist used for processing using a photolithography technique may be a liquid other than a film. The material of the mother die 40 is not limited to stainless steel, and may be a conductive material or a non-conductive base material coated with a conductive material. The material of the groove mold 40b and the probe pin 10 is not limited to nickel, and may be another electrodeposited metal. The present invention can also be applied to the case where the object to be inspected is another substrate such as an FPD (flat panel display) other than the wafer W, a mask reticle for a photomask, or the like.

  The present invention is useful in realizing a high probe pin with high dimensional accuracy.

It is a side view which shows the outline of a structure of a probe apparatus. It is explanatory drawing of the longitudinal cross-section which shows the structure of the attachment part of a probe pin. It is a top view of a probe pin. It is a top view of a comb-shaped body. (A) is explanatory drawing of the longitudinal cross-section which shows the state which formed the resist film into the mother mold. (b) is explanatory drawing of the longitudinal cross-section which shows the state which formed the type | mold of the comb-like body in the mother die. (C) is explanatory drawing of the longitudinal cross-section which shows the state which formed the comb-shaped body in the mother die. It is an enlarged view of a plurality of pins of a comb-like object. It is a perspective view which shows the state in which the pin was bent. It is a top view of the probe pin in which the protrusion was formed at the tip. It is a perspective view of the probe pin which has a top part. It is explanatory drawing of the state which attached the probe pin which has a top part to the contactor. (A) is explanatory drawing of the longitudinal cross-section which shows the state which opened the hole by the cone in the mother die. (B) is explanatory drawing of the longitudinal cross-section which shows the state in which the type | mold of the comb-like body which has a top part in the mother die was formed. (C) is explanatory drawing of the longitudinal cross-section which shows the state which formed the comb-like body which has a top part in a mother die. (D) is explanatory drawing of the longitudinal cross-section which shows the state which removed the comb-shaped body from the mother mold. It is a top view of the probe pin which has a flat surface at the top. (A) is explanatory drawing of the longitudinal cross-section which shows the state which formed the resist film into the mother mold. (B) is an explanatory view of a longitudinal section showing a state in which a groove is formed in a mother resist film. (C) is explanatory drawing of the longitudinal cross-section which shows the state which embed | buried nickel in the groove | channel of the resist film. (D) is explanatory drawing of the longitudinal cross-section which shows the state which formed the type | mold of the groove | channel in the mother die. It is a perspective view of a mother mold in which a mold of a groove is formed. (A) is explanatory drawing of the longitudinal cross-section which shows the state which formed the resist film into the mother die in which the type | mold of the groove | channel was formed. (b) is explanatory drawing of the longitudinal cross-section which shows the state which formed the type | mold of the comb-like body in the mother die. (C) is explanatory drawing of the longitudinal cross-section which shows the state which formed the comb-shaped body in the mother die. It is a perspective view of a part of a mother die in a state where a comb-like die is formed. It is a perspective view of a part of a mother die in a state where a resist film is removed. It is a perspective view which shows a mode that the comb-shaped body was removed from the mother die. It is explanatory drawing which shows the conventional probe pin.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe apparatus 2 Probe card 10 Probe pin 11 Contactor 11a Connection terminal 20 Groove 21 Contact part W Wafer

Claims (13)

A probe pin for contacting an object to be inspected to inspect the electrical characteristics of the object to be inspected,
Has a groove on the side,
A probe pin, characterized in that a tip end side having a contact portion that comes into contact with an object to be inspected is refracted from the groove portion. 2. The probe pin according to claim 1, wherein a tip on the tip end side is formed in a pointed shape to form the contact portion. 2. The probe pin according to claim 1, wherein the tip on the tip portion side is formed in a protrusion shape having a constant width and serves as the contact portion. The probe pin according to any one of claims 1 to 3, wherein a refraction angle on the tip end side is set to 45 ° to 60 °. On the side surface of the refracted tip portion side, a cone-shaped top portion serving as the contact portion is formed,
2. The probe according to claim 1, wherein the top portion is formed so that an inner angle of the top portion is equally divided by a vertical line when a rear end side of the groove is maintained horizontally. 3. pin. A method of manufacturing a probe pin for contacting an object to be inspected to inspect the electrical characteristics of the object to be inspected,
Forming a plurality of linear pins protruding in parallel from the linear end surface of the substrate;
Forming a groove on a side surface on a tip side of the plurality of pins;
Bending the tip end side of the plurality of pins from the groove portion;
And a step of cutting the plurality of pins from an end surface of the base material. In the step of forming the plurality of pins, a photolithography technique is used to form the base material and the plurality of pin molds on a mother mold, and the matrix and the plurality of pins are formed on the mother mold by a plating technique. The method of manufacturing a probe pin according to claim 6, wherein the probe pin is formed integrally. A step of forming a conical hole in a portion corresponding to the tip of each pin of the matrix;
When the base material and the plurality of pins are integrally formed on the matrix by the plating technique, a conical top is formed on the side surface on the tip end side of each pin,
When the rear end side of the plurality of pins is kept horizontal and the front end side of the plurality of pins is bent, the top angle is equally divided by the vertical line. The method for manufacturing a probe pin according to claim 7, wherein: A method of manufacturing a probe pin for contacting an object to be inspected to inspect the electrical characteristics of the object to be inspected,
Using a photolithographic technique, forming a probe pin groove mold into a linear protrusion on the master mold;
Thereafter, using a photolithography technique, a plurality of pin dies that intersects with the groove die in a direction perpendicular to the groove die and is arranged in parallel along the linear direction of the groove die is formed on the master die. Process,
Then, using a plating technique, forming a plurality of pins having grooves in the matrix,
Removing the plurality of pins from the matrix;
And a step of bending the tip end side of the plurality of pins from the groove portion. In the step of forming the plurality of pin molds, a base mold to which the plurality of pins are attached in parallel is also formed,
In the step of molding the plurality of pins, the plurality of pins and the base material are integrally molded by the plating technique,
In the step of removing the plurality of pins from the matrix, the substrate is removed from the matrix together with the plurality of pins,
The probe pin manufacturing method according to claim 9, wherein the plurality of pins are cut from the base material after the front end side of the plurality of pins is bent from the groove portion. The probe pin according to claim 10, wherein the base member has a linear end surface, and the plurality of pins are formed to protrude in parallel from the end surface of the base member. Production method. The thin film is coated on the surface of the mother die between the step of forming the groove die and the step of forming the plurality of pin die. Manufacturing method of the probe pin. Forming the probe pin groove mold,
Forming a resist film on the matrix and forming a linear groove in the resist film on the matrix;
Embedding a mold material in the resist film groove by plating;
The probe according to claim 9, further comprising a step of removing the resist film from the matrix and forming a groove mold of the probe pin made of the mold material. Pin manufacturing method.

Images