JP3082765U - Flexible test thin film - Google Patents

Abstract

(57) [Summary] [Problem] To provide a flexible test thin film. SOLUTION: An elastic thin film probe having a large number of curved, curved and uniformly arranged by etching is formed in a thin film structure having a circuit layout, and a flexible test thin film is brought into contact with a contact end point of an IC device to be tested by the thin film probe. After forming the electrical connection, a test signal is sent to the test machine via the circuit layout. The present invention has the advantages of good contact with the IC device to be tested and not damaging the contact end point, reduces the difficulty in manufacturing the test probe, and has a layout of the IC device that is different from time to time due to a different IC device layout. The array design can be modified.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention is a kind of test interface, and particularly relates to a flexible test thin film having elasticity.

[0002]

[Prior art]

 IC technology is evolving day by day, and the development of many IC devices or related devices is fairly rapid. In the IC area, test work plays a significant role. According to a well-known technique, when an electrical test is performed on an IC device, a metal probe made of tungsten steel is used as a test signal transmission medium between the IC device and a test stand. However, such a metal probe may be bent, causing the probe to bend and fail to completely contact the contact end point, and the test end of the metal probe to exhibit a sharp shape, thereby damaging the contact end point and causing a test. In some cases, the quality of the IC device used was destroyed. Due to the close contact points, the manufactured metal probe becomes very fine, fragile and easily broken.In addition, if the probe arrangement is too tight, signal interference is likely to occur and signal distortion is likely to occur. Become. According to another well-known technique, a test film is formed by forming a number of contact balls on a test thin film to form an electrical connection with a contact end point of a test object. However, such a design requires that the surface of the thin film be fairly flat, and that the manufacture of the contact sphere must be fairly small and matched, which is relatively difficult to manufacture and, once If one contact ball is relatively small and cannot completely contact the contact end point, the signal cannot be transmitted, and the defect of the IC circuit device to be tested is neglected. For this reason, the present invention provides a kind of flexible test thin film for the above-mentioned problems.

[0003]

[Problems to be solved by the invention]

 The main purpose of the present invention is to provide a kind of flexible test thin film, which has good contact property and does not damage the contact end point when contacting and testing the contact end point of the test object. It shall have high test results. Another object of the present invention is to provide a flexible test thin film which can sufficiently cope with the tendency of a high-density contact end point of a kind of IC device and has no difficulty in manufacturing.

[0004]

[Means for Solving the Problems]

 The invention of claim 1 is directed to a flexible test thin film which is a transmission interface between a test stand and a test object, wherein the flexible test thin film extends from at least one surface of the thin film structure. The flexible test thin film is characterized by being provided with many thin film probes that are warped and uniformly arranged and are provided for electrical connection with a test object. According to a second aspect of the present invention, there is provided the flexible test thin film according to the first aspect, wherein the thin film probe is formed of a flexible material. The invention according to claim 3 is characterized in that a circuit layout extending to a thin film probe is provided inside the thin film structure, and the circuit layout forms an electrical connection with a signal input / output terminal of a test machine stand. The flexible test thin film according to claim 1.

[0005]

[Embodiment of the invention]

 According to the present invention, an elastic thin film probe having a large number of curved and curved and uniformly arranged by etching is formed in a thin film structure having a circuit layout, and the flexible test thin film is tested by the thin film probe. After forming the electrical connection, the test signal is sent to the test machine via the circuit layout. The present invention has the advantages of good contact with the IC device to be tested and not damaging the contact end point, reduces the difficulty of manufacturing a test probe, and allows for a different IC device layout at any time. The array design of the proarb can be modified.

[0006]

【Example】

 The main feature of the present invention is to form an even number of flexible thin film probes in the thin film structure, which make good contact with each one contact end point of the test object, and make electrical connection. To perform a test.

[0007] As shown in FIG. 1, the present invention provides for a large number of uniformly outwardly extending flexures on one side of a thin film structure 12 having a circuit layout (not shown) formed therein. A thin-film probe 16 is formed, and the thin-film probe 16 is slightly curved and warped, and each contacts the contact end point of the device under test to form an electrical connection.

The thin film structure 12 is composed of a flexible material, and the flexible test thin film 10 is manufactured by first bending the thin film structure 12 and then etching the thin film structure 12 by etching technology. The probe 16 is cut out. This has the advantage of being very easy to manufacture and of eliminating the process of manually implanting the metal probe, thus saving labor and costs.

The test object is an IC device such as a driving module of a liquid crystal display, a soft board, a semiconductor die or a wafer, and the flexible test thin film 10 is mounted on a test load board (not shown). Will be installed. In the present invention, as shown in FIG. 2, the flexible test thin film 10 is set at any time by the contact end point 22 of the test object 20 so that the flexible test thin film 10 has a different layout on the test load board. Are arranged in an array corresponding to the contact end points 22 in the thin film structure 12, and accurately and quickly contact the DUT 20 to perform the test. During the test, as shown in FIG. 3, the load board is set on the test head of the machine, the test object 20 is clamped by the machine arm, and the contact end point 22 of the test object 20 and the flexible test thin film 10 are moved. After the bent thin film probe 16 contacts and forms an electrical connection, a test signal is introduced into the test load board from the contact end point 22 of the test object 20 by the flexible test thin film 10, and the test load board is connected. By connecting to the test head, it becomes a two-way communication bridge between the test stand and the DUT. Also, after the test is completed, depending on the test results, it is removed from the mechanical arm and placed in a different receiving box. As a result, the present invention can update the arrangement of the thin film probes 16 at any time and does not waste much time to affect the test efficiency. Therefore, no distortion occurs due to mutual interference in the test signal propagation process.

In the meantime, the formation of the thin film probe 16 is cut out by etching, whereby the pitch between each two adjacent thin film probes 16 achieves a finer and more precise fine pitch than a traditional metal probe, As a result, when the test object 20 having the high-density contact end points 22 is tested, all the contact end points 22 are all in contact with the thin-film probe 16, and a highly accurate test result can be obtained.

On the other hand, the thin film structure 12 of the present invention is made of a flexible material, so that the divided thin film probes 16 have elasticity, are relatively non-uniform in arrangement, and do not have the same height. The thin-film probe 16 makes good contact with the contact end point 22 and transmits a test signal between the device under test and the test machine, thereby increasing the test yield. In addition, even if the thin film material of the thin film probe 16 is brought into contact with the contact end point 22 many times, it does not damage the contact end point 22 and affect the quality of the IC device. Solving the shortcomings of fragility, fragility and short test life.

The embodiments described above are for explaining the present invention, and do not limit the scope of the present invention. Modifications or alterations of details that can be made based on the present invention are all described in the present invention. It belongs to the claims.

[0013]

[Effect of the invention]

 The present invention has the advantages of good contact with the IC device to be tested and not damaging the contact end point, reduces the difficulty of manufacturing a test probe, and allows for a different IC device layout at any time. The array design of the proarb can be modified.

[Brief description of the drawings]

FIG. 1 is a perspective view of the present invention.

FIG. 2 is a schematic view showing a first embodiment of the present invention;

FIG. 3 is an electrical connection side view of the flexible test thin film and the DUT of FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Flexible test thin film 12 Thin film structure 16 Thin film probe 20 DUT 22 Contact end point

Claims (3)

[Utility model registration claims] 1. A flexible test thin film serving as a transmission interface between a test machine base and a test object,
The flexible test film includes a number of curved, warped, and uniformly arranged thin film probes extending from at least one surface of the thin film structure, and is provided for electrical connection with a test object. Characterized by a flexible test thin film. 2. The flexible test thin film according to claim 1, wherein the thin film probe is formed of a flexible material. 3. A circuit layout extending to a thin film probe is provided inside the thin film structure, and the circuit layout forms an electrical connection with a signal input / output terminal of a test stand. Item 4. The flexible test thin film according to Item 1.