JP2007144611A5 - - Google Patents
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- Publication number
- JP2007144611A5 JP2007144611A5 JP2006283282A JP2006283282A JP2007144611A5 JP 2007144611 A5 JP2007144611 A5 JP 2007144611A5 JP 2006283282 A JP2006283282 A JP 2006283282A JP 2006283282 A JP2006283282 A JP 2006283282A JP 2007144611 A5 JP2007144611 A5 JP 2007144611A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- region
- forming
- sacrificial
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 7
- 238000001312 dry etching Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
- 238000001039 wet etching Methods 0.000 claims 2
- 239000010408 film Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006283282A JP5276785B2 (ja) | 2005-10-26 | 2006-10-18 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005312034 | 2005-10-26 | ||
| JP2005312034 | 2005-10-26 | ||
| JP2006283282A JP5276785B2 (ja) | 2005-10-26 | 2006-10-18 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007144611A JP2007144611A (ja) | 2007-06-14 |
| JP2007144611A5 true JP2007144611A5 (cg-RX-API-DMAC10.html) | 2009-11-19 |
| JP5276785B2 JP5276785B2 (ja) | 2013-08-28 |
Family
ID=38206618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006283282A Expired - Fee Related JP5276785B2 (ja) | 2005-10-26 | 2006-10-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5276785B2 (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009028807A (ja) * | 2007-07-24 | 2009-02-12 | Rohm Co Ltd | Ｍｅｍｓセンサ |
| EP2452349A1 (en) * | 2009-07-06 | 2012-05-16 | Imec | Method for forming mems variable capacitors |
| DE102011057169A1 (de) * | 2011-12-29 | 2013-07-04 | Maxim Integrated Products, Inc. | Mikroelektromechanisches System |
| WO2016019223A1 (en) * | 2014-08-01 | 2016-02-04 | Western Michigan University Research Foundation | Self-supported electronic devices |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0537082A (ja) * | 1991-07-26 | 1993-02-12 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体の加工方法 |
| JPH09113534A (ja) * | 1995-10-23 | 1997-05-02 | Yoshinobu Matsumoto | 加速度センサー |
| JP4081868B2 (ja) * | 1998-08-10 | 2008-04-30 | 日産自動車株式会社 | 微小装置の製造方法 |
| US6238946B1 (en) * | 1999-08-17 | 2001-05-29 | International Business Machines Corporation | Process for fabricating single crystal resonant devices that are compatible with integrated circuit processing |
| JP4772302B2 (ja) * | 2003-09-29 | 2011-09-14 | パナソニック株式会社 | 微小電気機械システムおよびその製造方法 |
| JP2005166512A (ja) * | 2003-12-04 | 2005-06-23 | Yokogawa Electric Corp | 継電器 |
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2006
- 2006-10-18 JP JP2006283282A patent/JP5276785B2/ja not_active Expired - Fee Related