JP2007142383A - Substrate for mounting light-emitting element, light emitting element mounting package, and surface light source device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting element mounting substrate capable of manufacturing a package having a light source of a distance between different light emitting elements in the same package, and capable of reducing a cost incurred in manufacturing and mounting the package, a light emitting element mounting package, and a surface light source device using the same. <P>SOLUTION: There is provided a light emitting element mounting substrate for mounting plural kinds of light emitting elements having different emitting colors respectively, wherein the light emitting elements according to emission colors are contained in the light emitting element mounting substrate having a light emitting element mounting part corresponding to each emission color, and a plurality of light emitting elements can be mounted in the light emitting element mounting part for each light emitting element mounting part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a light emitting element mounting substrate on which a light emitting element useful as a light source for illumination or a liquid crystal backlight is mounted, a light emitting element mounting package, and a surface light source device using the same.
More specifically, the present invention relates to a light emitting element mounting substrate, a light emitting element mounting package, and a surface light source device using the same, which are useful for mounting a plurality of light emitting elements having different emission colors useful as a white light source.

In recent years, luminous efficiency of light-emitting elements has been remarkably improved, and application to lighting has been advanced.
In particular, when a light-emitting diode (hereinafter also referred to as “LED”), which is one of solid-state light-emitting elements, is used as a backlight light source (surface light source) for a liquid crystal display, good color reproducibility and high-speed response are obtained. It can be realized and is expected to achieve high quality image quality.

  Conventionally, the backlight light source for such a liquid crystal display has been mainly the so-called edge light type in which a cold cathode tube is disposed on the end face of the casing as a light source for thinning and low power consumption. .

However, in recent years, demand for larger liquid crystal displays has increased, and the edge-light type has limitations in improving and uniforming luminance.
For this reason, adoption of direct light is being studied for large liquid crystal displays.

In addition, there is an increasing demand for image quality improvement, and the use of white light emitting diodes (LEDs) utilizing complementary colors of light emission of blue light emitting diodes and yellow phosphors is inferior in color reproducibility.
Against this background, a so-called three-in-one LED lamp has recently been developed in which light-emitting diode (LED) chips of three primary colors of red, green, and blue are put in one package and white color is emitted by mixing these colors. (For example, see Non-Patent Document 1 (Stanley Electric Co., Ltd. website)).

  As shown in FIG. 9, such a three-in-one package 100 has an outer shape of several millimeters square, an LED chip 102 that emits red light having a small size of approximately 0.35 mm square, and an LED chip 104 that emits green light. The LED chips 106 that emit blue light are each arranged close to the position corresponding to each vertex of the equilateral triangle.

As an advantage of the three-in-one type LED lamp (light source), it is easy to obtain white light by mixing three colors, and such a three-in-one package 100 is used.
Stanley Electric Co., Ltd. homepage, [online], Internet <http://www.stanley-components.com>

However, in order to obtain a white color with good color mixing, it is necessary to install the three LED chips 102, 104, and 106 close to each other, which is disadvantageous in terms of heat dissipation.
This is a particularly serious problem when a so-called high power LED having an LED chip size of 1 mm square or more is used.

Therefore, each of the three-in-one packages 100 having different distances between the LED chips must be prepared according to the size of the LED chip to be used.
In addition, when used as a backlight light source for a liquid crystal display, when the screen size is increased, mixing of the three colors is easier than when the size is small, and the backlight can be used even if the distance between the LED chips of the three colors is increased. A white light source can be obtained on the light surface.

Therefore, in order to effectively use such a situation, it is necessary to separately manufacture the three-in-one package 100 having a large distance between the LED chips.
Furthermore, since the conventional three-in-one type LED lamp has only three LED elements in close proximity to each other in one three-in-one package 100, the light emission luminance is low and the luminance is high. In order to develop luminance, it is necessary to arrange a large number of three-in-one packages 100 in an array.

  One of the objects of the present invention is to manufacture a light emitting device mounting package having light sources with different distances between light emitting devices in the same package, and one of the objects of the present invention is to manufacture the light emitting device mounting package and A light-emitting element mounting substrate, a light-emitting element mounting package, and a surface light source device using the same can be provided.

In order to solve the above problems, the present inventors have found a light emitting element mounting substrate, a light emitting element mounting package, and a surface light source device using the same.
That is, the present invention includes, for example, the following aspects (1) to (16).
(1)
A light-emitting element mounting substrate for mounting a plurality of types of light-emitting elements having different emission colors,
The light emitting element mounting substrate is
While storing the light emitting element according to the light emission color, and equipped with a light emitting element mounting portion corresponding to each light emission color,
The light emitting element mounting portion is
A substrate for mounting a light emitting element, wherein the light emitting element mounting portion is configured so that a plurality of the light emitting elements can be mounted for each light emitting element mounting portion.
(2)
The light emitting element mounting portion is
The light emitting element mounting substrate according to (1), wherein the number of the light emitting elements to be mounted is equal to or more than the number of different emission colors.
(3)
The light emitting element mounting portion is
The light emitting element mounting substrate according to (1) or (2), wherein the light emitting element mounting substrate is disposed at equal intervals on the light emitting element mounting substrate.
(4)
The light emitting element mounting portion is
(2) In the above (2), the light emitting element mounting substrate is extended in a circumferential direction of a circle centered on the fixed point from the fixed point of the light emitting element mounting substrate, and a plurality of the light emitting element mounting substrates are disposed at a predetermined angle. Light-emitting element mounting substrate.
(5)
The light emitting element mounting portion is
The regular polygon side having a fixed point of the light emitting element mounting substrate as a center of gravity and the longitudinal direction of the light emitting element mounting portion are disposed so as to substantially coincide with each other. Light-emitting element mounting substrate.
(6)
The fixed point is
The light emitting element mounting substrate according to (4) or (5), wherein the light emitting element mounting substrate is the center of the light emitting element mounting substrate.
(7)
The light emitting element mounting substrate according to (4) or (5), wherein the fixed point has a plurality of fixed points.
(8)
Protruding portions are provided at the arrangement positions of the light emitting element mounting portions of the light emitting element mounting substrate,
The light emitting element mounting substrate according to any one of (1) to (7), wherein the light emitting element mounting portion is disposed on the protruding portion.
(9)
The protrusion is
The light emitting element mounting substrate according to (8), wherein the light emitting element mounting substrate is formed of the same material as the light emitting element mounting substrate.
(10)
The light emitting element mounting substrate is
The light emitting element mounting substrate according to any one of (1) to (9), wherein the light emitting element mounting substrate is a metal base substrate.
(11)
The light emitting element mounting substrate according to any one of (1) to (10), wherein the light emitting element is a light emitting diode (LED).
(12)
The light emitting diode mounting board according to (11), wherein the light emitting diode (LED) is a light emitting diode (LED) chip.
(13)
On both sides of the light emitting element mounting portion,
The substrate for mounting a light-emitting element according to (12), wherein a substrate electrode pad connected to each of an anode and a cathode of the light-emitting diode (LED) chip by wire bonding is formed.
(14)
A light emitting device mounting, wherein a reflector having an opening is provided at a position corresponding to the light emitting device mounting portion on the light emitting device mounting substrate according to any one of (1) to (13). package.
(15)
The opening is
The light emitting element mounting package according to (14), wherein the light emitting element mounting package is embedded with a sealing resin so as to be substantially flat with a surface of the reflector.
(16)
A surface light source device, wherein the light emitting element mounting package according to (14) or (15) is mounted on a bottom surface of a housing.

  According to the light emitting element mounting substrate of the present invention, the light emitting elements having different emission colors can be mounted by changing the distance between adjacent light emitting elements. Since different types can be mounted as the same light emitting element mounting package, it is not necessary to design and manufacture various types of light emitting element mounting substrates and light emitting element mounting packages, thereby reducing costs.

In addition, since a plurality of sets of light emitting elements can be mounted on the same light emitting element mounting substrate in a light emitting element mounting package, high luminance can be achieved.
Therefore, an inexpensive and high-performance surface light source device can be obtained by using the light emitting element mounting package of the present invention.

Hereinafter, embodiments (examples) of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a schematic plan view showing a first embodiment of a light emitting element mounting substrate of the present invention, and FIG. 2 is a schematic cross-sectional view of the light emitting element mounting substrate of FIG.

  As shown in FIG. 1, in this embodiment, an LED chip R that emits red light, an LED chip G that emits green light, and an LED chip B that emits blue light are used, and from a fixed point O on the light emitting element mounting substrate 1. The light emitting element mounting portion 10 is extended in three circumferential directions centering on the fixed point O, and the light emitting element mounting portion 10 has a configuration in which three LED chips R, G, and B can be mounted.

This is a mounting substrate body 6 as a whole.
That is, when the mounting substrate 6 draws straight lines passing through the central portions in the longitudinal direction of the three light emitting element mounting portions 10 with the center O of the light emitting element mounting substrate 1 as a base point, each of the adjacent light emitting element mounting portions 10 is arranged. The angle formed by the straight line passing through the central portion of the head is approximately 120 (360/3) degrees.

Note that “approximately 120 degrees” does not have to be strictly 120 degrees, and it means that there is no problem even if there is a slight error, and it is preferable that the deviation be within 1/10 of the angle formed.
In the following description, the LED chip R that emits red light, the LED chip G that emits green light, and the LED chip B that emits blue light have a number added as a subscript when identifying a plurality of LED chips. To do.

  Specifically, R1, G1, and B1 LED chips are located at a distance d1 from the center O of the light-emitting element mounting substrate 1, R2, G2, and B2 LED chips are located at a distance d2, and R3 is located at a distance d3. , G3 and B3 LED chips can be mounted.

That is, the present invention can be applied to three types of configurations having different LED chip distances.
In FIG. 1, it is illustrated as d1 <d2 <d3.
The LED chip is bonded with a paste, heat radiation grease, or the like on a metal base substrate or metal foil such as copper or aluminum with good thermal conductivity so that the heat generated by the LED chip can be radiated to the outside.

  On both sides of each light emitting element mounting portion 10, LED chip electrodes (anode and cathode) (not shown) and substrate electrode pads (anode A and cathode C) electrically connected by wire bonding are mounted on the light emitting elements. It is arranged on the substrate 1 for use.

The electrode pads RA, RC, GA, GC, BA, BC of each color are electrically connected to the substrate wiring 3 for supplying current to them.
As shown in FIG. 2, an insulating layer 2 is formed on the surface of the light emitting element mounting substrate 1 other than the region where the LED chip is placed, and a substrate wiring 3 such as copper is formed on the insulating layer 2. Has been. Although not shown, an insulating layer 2 can be further formed on the substrate wiring 3 other than the substrate electrode pad region so as to be substantially flat with the surface of the substrate electrode pad.

As described above, the electrode of the LED chip and the substrate electrode pad are connected by wire bonding (not shown).
When a gold wire is used as the bonding wire, a gold plating layer is formed on the electrode of the LED chip and the surface of the substrate electrode pad in order to obtain a good connection.

  3 and 4 show a light emitting element mounting package in which a set of LED chips of R1, G1, and B1 is mounted only at a distance d1 from the center O of the light emitting element mounting substrate 1 (mounting substrate body 6). FIG. 12 is a schematic plan view and a schematic cross-sectional view of FIG.

  The light emitting element mounting package 12 shown in FIG. 3 has only R1, G1, and B1 LED chips mounted thereon, and efficiently reflects the light emitted from the LED chips upward on the light emitting element mounting substrate 1. Therefore, the reflector 4 having an opening is provided on the light emitting element mounting substrate 1 (mounting substrate body 6) so as to cover the periphery thereof.

Such a reflector 4 is preferably bonded to the surface of the mounting substrate body 6 via an adhesive.
For this reason, in the light emitting element mounting package 12 shown in FIG. 3, the portions other than the vicinity of R1, G1, and B1 are covered with the reflector 4 so that the wiring pattern on the surface of the other mounting substrate 6 cannot be seen.

Wire bonding is connected between electrode pads (not shown) of LED chips mounted on R1, G1, and B1 and substrate electrode pads in the vicinity thereof.
When using a small LED chip size, the LED chips of each color can be mounted at close positions where the distance from the substrate center O is small, as shown in FIG.

As the LED chip size increases, the heat dissipation associated with light emission increases.
Therefore, when a large LED chip is used, it can be mounted at a position where the distance from the center O of the light emitting element mounting substrate 1 (mounting substrate body 6) is larger.

As described above, it is possible to cope with the problem by simply changing the mounting position of the LED chip in the same light emitting element mounting package according to the LED chip size and the heat radiation amount.
The distance between the substrate electrode (anode and cathode) pads is larger than the width dimension of the light emitting element region formed so that the largest LED chip to be applied can be mounted.

  In the light emitting element mounting package 12 shown in FIG. 5 and FIG. 6, LED chips are mounted at all positions d1, d2, and d3 from the center O of the light emitting element mounting substrate 1 (mounting substrate body 6). ing.

By setting it as such a structure, the brightness | luminance as an LED lamp can be enlarged.
In this case, a reflector 4 having a circular opening for reflecting light emitted from the LED chip toward the top surface of the light emitting element mounting substrate 1 so as to cover the outside of the distance d3 from the substrate center O is mounted. It is provided on the substrate body 6.

  Wire bonding is performed by connecting electrode pads (not shown) of LED chips mounted on R1, G1, B1 and R2, G2, B2 and R3, G3, and B3 and substrate electrode pads in the vicinity thereof.

It is preferable to mount LED chips of the same light emission color on the same light emitting element mounting portion 10.
That is, R1, R2, and R3 are mounted on the first light emitting element mounting section, G1, G2, and G3 are mounted on the second light emitting element mounting section, and B1, B2, and B3 are mounted on the third light emitting element mounting section. It is preferable that the electrode pads of the color LED chip are wire-bonded to a single electrode pad provided on both sides of each light emitting element mounting portion.

Even if the LED chip has the same shape, the drive current differs for each emission color. For this reason, if LED chips of the same light emission color are mounted on the same light emitting element mounting portion 10, batch control is easy.
However, it is not excluded to make other arrangements.

The material of the reflector 4 to be used is not particularly limited, but a material having good reflectivity such as an aluminum material can be preferably applied.
The inner side surface 5 of the opening of the reflector 4 is processed into a taper shape (slope), and the light emitted from the LED chip is efficiently reflected upward in the light emitting element mounting substrate 1 (mounting substrate body 6). Has function. Preferably, the angle α formed by the extension line of the inner surface 5 can be set to 90 to 120 degrees.

  The opening of the reflector 4 is filled with a sealing resin 7 such as a silicone resin so as to be substantially flat with the upper surface of the reflector 4 to protect the bonding wire. The term “substantially flat” means that the surfaces do not have to be exactly the same, and there is no problem even if there are slight steps or surface waviness.

  In the light emitting element mounting package 12 shown in FIG. 5, LED chips are mounted at all positions of distances d1, d2, and d3 from the center O of the light emitting element mounting substrate 1, but the positions of d1 and d2 are the same. , D1 and d3, or only d2 and d3.

  In this embodiment, although the case where the light emitting element mounting part is provided in three different positions was illustrated, it is not limited to this, The light emitting element mounting part 10 can also be made into four or more places. . Further, in this embodiment, each light emitting element mounting portion is formed with a substantially equal width from the center of the substrate in the circumferential direction with the center of the substrate as the center of the circle, but with a wider width in the circumferential direction. It can also be formed.

  Further, in the present embodiment, up to three LED chips can be mounted on one light emitting element mounting portion 10, but the present invention is not limited to this, and the positions where the LED chips of each color are mounted. The number of LED chips that can be mounted can be selected as appropriate, and it is not always necessary to align them.

The light emitting element mounting substrate 1 shown in FIG. 7 is a schematic plan view of the light emitting element mounting substrate 1 according to the second embodiment of the present invention.
The light-emitting element mounting substrate 1 shown in FIG. 7 has basically the same configuration as the light-emitting element mounting substrate 1 of the first embodiment shown in FIG. A detailed description thereof will be omitted.

The difference from the first embodiment described above is that the protruding portion 8 is provided in the region where the LED chip of the metal base substrate 1 is mounted.
In order to dissipate the heat generated by the LED chip to the outside through the protruding portion 8, the protruding portion 8 is formed of a metal having a good thermal conductivity, such as copper or aluminum, or a ceramic material such as aluminum nitride, preferably a metal base. It is made of the same material as the substrate.

In the present embodiment, the first insulating layer 2 is formed so as to be substantially flat with the surface of the protruding portion 8, and the substrate wiring 3 is formed on the first insulating layer 2.
A second insulating layer 2 ′ is formed on the substrate wiring 3 other than the substrate electrode pad region so as to be substantially flat with the surface of the substrate electrode pad.

Use of a white resist as the second insulating layer 2 ′ is preferable because the light emitted from the LED chip can be efficiently reflected upward in the light emitting element mounting substrate 1.
A reflector (not shown) is provided on the second insulating layer 2 ′ and the substrate electrode pad region.

Since the surface of the second insulating layer 2 'and the surface of the substrate electrode pad region are substantially flat, there is almost no gap between the opposing surface of the reflector (not shown) and good adhesion can be obtained.
The light emitting element mounting substrate 1 shown in FIG. 8 is a schematic plan view of the light emitting element mounting substrate 1 according to the third embodiment of the present invention.

  The light-emitting element mounting substrate 1 shown in FIG. 8 has basically the same configuration as the light-emitting element mounting substrate 1 of the first embodiment shown in FIG. A detailed description thereof will be omitted.

In FIG. 8, only the LED chip mounting region and the substrate electrode pad are shown as a schematic plan view.
Also in this embodiment, the case where the LED chip of 3 colors is used is illustrated.

  As a fixed point of the light-emitting element mounting substrate 1, each side of an equilateral triangle having the center O as a center of gravity and a lengthwise direction of the light-emitting element mounting portion 10 on which each three LED chips between a pair of opposing substrate electrode pads can be placed. The straight line passing through the center portion is substantially overlapped. The term “substantially overlap” means that it does not have to overlap exactly, and there is no problem even if there is a slight inclination or deviation.

  Specifically, R4, G4, and B4 LED chips are positioned at a distance d4 from the center O of the light-emitting element mounting substrate 1, R5, G5, and B5 LED chips are positioned at d5, and R6 and G6 are positioned at d6. , B6 LED chip can be placed.

That is, the present invention can be applied to three types of configurations having different LED chip distances.
In FIG. 8, it is illustrated as d4 <d5 <d6.
As in the first embodiment, the LED chips can be mounted only in these one set of LED chip mounting areas, or can be mounted in two sets or all three sets.

Further, it is not always necessary to align the positions for mounting the LED chips of each color and the number of chips to be mounted.
In the first to third embodiments described above, the case of using three-color LED chips is illustrated, but it is also possible to use LED chips of four or more colors.

In the case of using four colors, yellow-green having a color rendering effect is preferably used as the fourth color.
In the case of an n (n ≧ 4) color and a configuration similar to that of the first and second embodiments, the angle formed by the n direction (the angle between adjacent directions from the center O of the light emitting element mounting substrate 1 is approximately (360). / N) degrees), a plurality of LED chips may be mounted.

That is, for the four colors, the angle formed by a straight line passing through the central portion of each adjacent light emitting element mounting portion may be approximately 90 degrees.
In the case of n (n ≧ 4) colors and a configuration similar to that of the third embodiment, a plurality of LED chips are formed on each side of a regular n-gon having the center O of the light emitting element mounting substrate 1 as the center of gravity. May be configured to have each light emitting element mounting portion on which can be mounted.

In addition, although all the said description is a case where the number of luminescent colors and the number of light emitting element areas are equal, it can also form more light emitting element areas than the number of luminescent colors.
As an example, the number of R light emitting element areas is 1, the number of G light emitting element areas is 2, and the number of B light emitting element areas is 1, that is, the number of light emitting element areas is 4, for the three colors R, G, and B. Can be mentioned.

In this case, the configuration of the number of light emitting element regions, electrode pads, and the like may be the same as the configuration of the four colors in the first to third embodiments.
As the metal base substrate used in the first to third embodiments described above, a printed circuit board based on a metal plate having good thermal conductivity is preferably used.

The material and manufacturing method of the metal base substrate are not particularly limited, and conventional printed circuit board materials and manufacturing techniques thereof can be applied as they are.
In this embodiment, a copper clad laminate having a glass epoxy material as an insulating layer is used on the surface of the copper plate, the copper foil is processed into a wiring pattern (a gold plating layer is formed on the electrode pad surface), and the light emitting element mounting portion is insulated. Manufactured by selectively removing the layer.

Moreover, the surface light source device using the light emitting element mounting package of the present invention can have a configuration similar to a conventional surface light source device. That is, a required number of the light emitting element mounting packages of the present invention can be mounted on the bottom surface of the housing such as an aluminum material. In each of the first to third embodiments, the center of the substrate is a fixed point, that is, a plurality of color LEDs are formed on one substrate.
However, the present invention is not limited to this case. Instead, when the substrate has a plurality of fixed points, that is, a single large-area substrate may have a plurality of light source units in a single row or an array.

In addition, as a surface light source device, the backlight and advertising lamp for liquid crystal display devices are mentioned, for example.
The preferred embodiments of the present invention have been described above, but the present invention is not limited to this. For example, the light emitting element mounting substrate and the package of the present invention include a plurality of light emitting elements having different emission colors. Although it is useful for mounting, it is also possible to mount a white light emitting element that does not require color mixing, and various modifications and function additions can be made without departing from the object of the present invention.

FIG. 1 is a schematic plan view showing a first embodiment of a light emitting element mounting substrate of the present invention. FIG. 2 is a schematic cross-sectional view of the light emitting element mounting substrate of FIG. 1 taken along line XX. 3 is a schematic plan view of a package in which one set of LED chips is mounted on the light emitting element mounting substrate of FIG. 4 is a schematic cross-sectional view of the package of FIG. FIG. 5 is a schematic plan view of a package in which three sets of LED chips are mounted on the light emitting element mounting substrate of FIG. FIG. 6 is a schematic cross-sectional view of the package of FIG. FIG. 7 is a schematic cross-sectional view similar to FIG. 2, showing a second embodiment of the light-emitting element mounting substrate of the present invention. FIG. 8 is a schematic plan view showing a third embodiment of the light emitting element mounting substrate of the present invention. FIG. 9 is a schematic plan view of a conventional three-in-one package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Light emitting element mounting substrate 2 ... Insulating layer (1st insulating layer)
2 ′ ·· second insulating layer 3 ··· substrate wiring 4 ··· reflector 5 ··· inner side surface of the reflector 6 ··· mounting substrate body 7 ··· sealing resin 8 ··· projecting portion 10 ··· -Light emitting element mounting part 12 ... Light emitting element mounting package O ... Center (fixed point)
Rn (n: 1 to 6) ··· Red LED chip Gn (n: 1 to 6) · · Green LED chip Bn (n: 1 to 6) · · Blue LED chip RA ·・ ・ Substrate electrode (anode) pad GA ・ ・ ・ Substrate electrode (anode) pad BA ・ ・ ・ Substrate electrode (anode) pad RC ・ ・ ・ Substrate electrode (cathode) pad GC ・ ・ ・ Substrate electrode (cathode) pad BC ・..Substrate electrode (cathode) pad d1..Distance from center (fixed point) d2..Distance from center (fixed point) d3..Distance from center (fixed point) d4..Distance from center (fixed point) d5.・ Distance from the center (fixed point) d6. ・ Distance from the center (fixed point) 100... Three-in-one package 102... LED chip that emits red light 104... LED chip that emits green light 106. L that emits light D chip

Claims (16)

A light-emitting element mounting substrate on which a plurality of types of light-emitting elements having different emission colors are mounted,
The light emitting element mounting substrate is
While storing the light emitting element according to the light emission color, and equipped with a light emitting element mounting portion corresponding to each light emission color,
The light emitting element mounting portion is
A substrate for mounting a light emitting element, wherein the light emitting element mounting portion is configured so that a plurality of the light emitting elements can be mounted for each light emitting element mounting portion. The light emitting element mounting portion is
The light emitting element mounting substrate according to claim 1, wherein the number of the light emitting elements to be mounted is equal to or more than the number of different emission colors. The light emitting element mounting portion is
The light emitting element mounting substrate according to claim 1, wherein the light emitting element mounting substrate is arranged at equal intervals on the light emitting element mounting substrate. The light emitting element mounting portion is
3. The light emitting device mounting substrate according to claim 2, wherein the light emitting element mounting substrate is extended from a fixed point in a circumferential direction of a circle centered on the fixed point, and is arranged at a predetermined angle apart. Light-emitting element mounting substrate. The light emitting element mounting portion is
3. The light emitting device according to claim 2, wherein the light emitting device mounting board is disposed so that a side of a regular polygon whose center of gravity is a fixed point of the light emitting device mounting substrate and a longitudinal direction of the light emitting device mounting portion substantially coincide with each other. Device mounting board. The fixed point is
The light emitting element mounting substrate according to claim 4, wherein the light emitting element mounting substrate is a center of the light emitting element mounting substrate.   The light emitting element mounting substrate according to claim 4, wherein a plurality of the fixed points are provided. Protruding portions are provided at the arrangement positions of the light emitting element mounting portions of the light emitting element mounting substrate,
The light emitting element mounting substrate according to claim 1, wherein the light emitting element mounting portion is disposed on the protruding portion. The protrusion is
The light emitting element mounting substrate according to claim 8, wherein the light emitting element mounting substrate is made of the same material as the light emitting element mounting substrate. The light emitting element mounting substrate is
The light emitting element mounting substrate according to claim 1, wherein the light emitting device mounting substrate is a metal base substrate.   The said light emitting element is a light emitting diode (LED), The board | substrate for light emitting element mounting in any one of Claim 1 to 10 characterized by the above-mentioned.   The light emitting element mounting substrate according to claim 11, wherein the light emitting diode (LED) is a light emitting diode (LED) chip. On both sides of the light emitting element mounting portion,
The substrate for mounting a light emitting element according to claim 12, wherein a substrate electrode pad is formed by wire bonding connection with an anode and a cathode of the light emitting diode (LED) chip. 14. A light emitting element mounting package, wherein a reflector having an opening is provided at a position corresponding to the light emitting element mounting portion on the light emitting element mounting substrate according to any one of claims 1 to 13. The opening is
The light emitting element mounting package according to claim 14, wherein the light emitting element mounting package is embedded with a sealing resin so as to be substantially flat with a surface of the reflector.   16. A surface light source device, wherein the light emitting element mounting package according to claim 14 or 15 is mounted on a bottom surface of a housing.

Images