JP2007141987A - Electronic component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that an existing electronic component has a limitation in reduction of height of the rear side because a substrate is used as its structural element. <P>SOLUTION: The electronic component comprises a protector 108 formed of resin, coil-shape internal electrodes 106a, 106b formed in the protector; external electrodes 100a, 100b connected within the protector 108 formed of resin to the internal electrodes 106a and 106b, and is partly exposed from the protector 108, and a charge preventing section 102 formed on the front surface of the protector 108. The electronic component can be prevented from charging with the charge preventing section 102. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component in which an external electrode is formed inside a protective portion made of resin, and a method for manufacturing the same.

  Conventionally, electronic components have been formed on a substrate.

  A conventional electronic component will be described using a planar coil as an example with reference to FIG. FIG. 8 is a perspective view of a planar coil. A coiled (or spiral) wiring 4 is formed on a substrate 2 such as an alumina substrate, and is covered with a protective portion 6 made of an insulating resin. . Reference numeral 8 denotes an external electrode connected to both ends of the wiring 4. Then, it is mounted on the printed wiring board via the external electrode 8.

  Next, downsizing of electronic parts will be described. FIG. 9 is a diagram showing dimensions of the electronic component.

  FIG. 9A is a diagram for explaining the external dimensions of an electronic component called 0402. In FIG. 9A, the external dimensions of the electronic component 10 are 0.2 mm in the X direction, 0.4 mm in the Y direction, and 0.2 mm in the Z direction. Such a shape is generally called 0402 (or 0.4 mm × 0.2 mm). In FIG. 9A, external electrodes and internal electrodes in the electronic component 10 are not shown.

FIG. 9B is a comparison graph of the product shape and area of the electronic component. In FIG. 9B, the X axis is the product shape, 3216 (3.2 mm × 1.6 mm), 20125 (2.0 mm × 1.25 mm), 1005 (1.0 mm × 0.5 mm), 0603 ( 0.6mm × 0.3mm) and 0402 (0.4mm × 0.2mm), which become smaller toward the right. Y-axis is product area (total area of 6 products, unit is mm ² , indicated by ○ and dotted line), weight (weight when product density is 1 g / cc, unit is mg, ◇ and dashed line And area / weight ratio (indicated by Δ and solid line). As shown in FIG. 9B, it can be seen that the smaller the product shape, the more rapidly the “area / weight” graph rises.

  For example, in the case of an electronic component mainly composed of a resin, a plastic powder less than 1 mm is easily affected by static electricity, so that the powder is adsorbed to various surfaces under the influence of static electricity.

  For example, a ceramic electronic component such as a multilayer ceramic capacitor has a specific gravity as large as about 3 to 10 as compared with an electronic component mainly composed of a resin as in the present invention, so that aggregation due to static electricity hardly occurs. Also, the square chip resistor and the planar coil shown in FIG. 9 are electronic components formed with the substrate 2 as a constituent element, and are not easily affected by static electricity because the substrate is heavy.

  On the other hand, an electronic component mainly composed of a resin has a specific gravity of the resin as small as about 1 and itself is light. Furthermore, the shape may have less difference in density and specific gravity between the upper and lower sides and the right and left sides. The smaller the chip size, the more susceptible to static electricity.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-9-270355

  However, since the conventional electronic component uses the substrate 2 as a constituent element, it has a problem that it cannot fully meet the needs for light and thin electronic components.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the conventional problems and to provide an electronic component that realizes a reduction in height by omitting a substrate from the components of the electronic component.

  In order to solve the above-described conventional problems, the present invention realizes a reduction in size and height of parts by omitting a substrate. Furthermore, the influence of static electricity on the electronic components that have been reduced in size and height by omitting the substrate is also reduced.

  The electronic component and the manufacturing method thereof according to the present invention can be reduced in height and size by omitting the substrate, and can be greatly improved in handling by introducing a new anti-static structure.

(Embodiment 1)
Hereinafter, the electronic component according to Embodiment 1 of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram for explaining an electronic component according to the first embodiment. 100a and 100b are external electrode portions, 102 is an antistatic portion, 104a and 104b are arrows, 106a and 106b are internal electrode portions, and 108 is a protective portion. is there. 1A is an external view, FIG. 1B is an external view seen from the back side of FIG. 1A, FIG. 1C is a cross-sectional view taken along an arrow 104a in FIG. 1A, and FIG. ) Is a cross-sectional view taken along arrow 104b in FIG.

  This will be described in more detail. FIG. 1A is an external view of an electronic component in Embodiment 1. FIG. In FIG. 1, the protective part 108 is made of an insulating resin, and internal electrode parts 106a and 106b (not visible in FIGS. 1A and 1B) are three-dimensional coils. It is formed as a wiring. Both ends of the internal electrode portions 106a and 106b are connected to the external electrode portions 100a and 100b, respectively. In FIG. 1A, the antistatic portion 102 is formed between the external electrode portions 100a and 100b on the protective portion 108 (or the surface).

  FIG. 1B is an external view showing a state in which the sample of FIG. In FIG. 1B, it can be seen that the protective portion 108 and the antistatic portion 102 are formed between the plurality of external electrode portions 100a and 100b.

  FIG. 1C is a cross-sectional view taken along arrow 104a in FIG. In FIG. 1C, the internal electrode portion 106b has a three-dimensional coil shape inside the protective portion 108, and one end of the internal electrode portion 106b is connected to the external electrode portions 100a and 100b as the internal electrode portion 106a. Coil parts (or inductor parts) are configured. And the three-dimensional coil pattern which consists of internal electrode part 106a, 106b is protected by the protection part 108 which consists of resin. Further, a part of the external electrode portions 100a and 100b is embedded in the protective portion 108, and one end is exposed to the outside from the protective portion 108, which corresponds to mounting such as soldering. The antistatic portion 102 is formed on the surface of the protective portion 108 (or so as to be exposed from the protective portion 108).

  FIG. 1D is a cross-sectional view taken along arrow 104b in FIG. In FIG. 1D, the internal electrode portion 106b is three-dimensionally connected by an interlayer connection portion (not shown in FIG. 1) or the like called a via, and in a state where a spiral coil pattern is formed. It is protected by a protection unit 108 made up of. An antistatic part 102 is formed on the surface of the protective part 108.

  Next, FIG. 2 shows how charging can be prevented. FIG. 2 is an equivalent circuit diagram of the coil component, and the case where the electronic component of the first embodiment is a coil component will be described.

  2A is an equivalent circuit diagram of the coil component when there is no antistatic portion, and FIG. 2B is an equivalent circuit diagram of the coil component when the antistatic portion 102 is provided. In FIG. 2, L corresponds to the inductance of the internal electrode portion 106 forming the coil (or the L component of the coil), and R1 corresponds to the equivalent series resistance (or resistance component) of the internal electrode portion 106 and the external electrode portion 100. R 2 corresponds to the resistance of the antistatic layer 102. In the samples as shown in FIGS. 1A and 1B, since the antistatic portion 102 is formed between the external electrode portions 100a and 100b, an equivalent circuit as shown in FIG. Form.

  Here, the coil has a high Q value (Q value is a method for evaluating the characteristics of the coil. The lower the wiring resistance value, the higher the Q value. The higher the Q value, the higher the electrical characteristics of the coil. Will be excellent). Here, in FIG. 2B, by setting the resistance value R2 of the antistatic layer 102 to be extremely larger than R1 << R2, that is, the resistance value R1 of the internal electrode portion 106 forming the coil, The influence of the antistatic layer 102 on the physical characteristics can be suppressed. The ratio of R2 and R1 is preferably 100,000 times (preferably 1 million times) or more. Thus, by making the ratio of R2 and R1 extremely large, the influence of the antistatic part on the coil characteristics can be suppressed. Specifically, R1 is desirably 1Ω or less (preferably 0.1Ω or less, more desirably 0.01Ω or less). If R2 exceeds 10 GΩ, the antistatic effect may not be obtained. Therefore, R2 is preferably 10 KΩ or more and less than 10 GΩ (more preferably 100 KΩ or more, or 1 GΩ or less).

(Embodiment 2)
Hereinafter, an electronic component according to Embodiment 2 of the present invention will be described with reference to the drawings.

  FIG. 3 is a diagram for explaining the electronic component according to the second embodiment. The difference between FIG. 1 and FIG. 3 is the shape of the external electrode. In FIG. 1, the external shape of the electronic component is a substantially hexahedron (or a substantially rectangular parallelepiped), and the external electrode portion 100a is exposed only on one surface, and the external electrode portion 100b is also exposed only on one surface. Therefore, the exposed surfaces of the external electrode portion were two surfaces of 1 + 1 = 2. However, as the electronic component is miniaturized, the exposed area of the external electrode portion is reduced, so that it is necessary to further increase the exposed area of the external electrode portion (or the area wetted by the solder) depending on the application. In such a case, as shown in FIG. 3, it is desirable that one external electrode portion 100a, 100b is exposed on two or more surfaces.

  This will be described in more detail with reference to FIG. FIG. 3A is an external view of an electronic component according to Embodiment 2. FIG. 3B is an external view when the top and bottom of FIG. From FIG. 3A and FIG. 3B, it can be seen that in the electronic component of the present embodiment, there is no substrate that was a conventional component. For this reason, in the electronic component of the second embodiment, the electronic component can be reduced in height, further downsized, and reduced in weight as in FIG.

  FIG. 3C is a cross-sectional view taken along arrow 104a in FIG. In FIG. 3C, the internal electrode portion 106b has a three-dimensional coil shape inside the protective portion 108, and one end of the internal electrode portion 106b is connected to the external electrode portions 100a and 100b as the internal electrode portion 106a. Coil parts (or inductor parts) are configured. And the three-dimensional coil pattern which consists of internal electrode part 106a, 106b is protected by the protection part 108 which consists of resin. Further, a part of the external electrode portions 100a and 100b is embedded in the protective portion 108, and one end is exposed to the outside from the protective portion 108, which corresponds to mounting such as soldering. The antistatic portion 102 is formed on the surface of the protective portion 108 (or so as to be exposed from the protective portion 108).

  FIG. 3D is a cross-sectional view taken along arrow 104b in FIG. As shown in FIG. 3D, the internal electrode portion 106b is three-dimensionally connected by an interlayer connection portion (not shown in FIG. 3) or the like called via, and in a state where a spiral coil pattern is formed. It is protected by a protection unit 108 made up of. An antistatic part 102 is formed on the surface of the protective part 108.

  As in the second embodiment, by increasing the exposed area and the number of exposed surfaces from the protective portions 108 of the external electrode portions 100a and 100b, it is easy to form a fillet at the time of soldering, and at the same time, improving reliability in soldering It is possible to improve the soldering strength and further improve the soldering inspection.

  As described above, even when the shapes of the external electrode portions 100a and 100b are optimized according to the application, the formation of the antistatic portion 102 makes it less susceptible to static electricity.

  Such static electricity of electronic parts is generated not only in the manufacturing process of electronic parts but also on the user side. In addition, depending on the packaging format of electronic parts (for example, a large number of electronic parts may be mounted in a plastic case), they are easily affected by static electricity. However, by forming the antistatic portion 102 as in the present embodiment, it becomes easier to handle individual electronic components and the mounting workability can be improved.

(Embodiment 3)
Hereinafter, as a third embodiment of the present invention, an example of an electronic component manufacturing method will be described with reference to the drawings. The third embodiment corresponds to an example of the electronic component manufacturing method shown in FIG. 3, for example.

  4-7 is sectional drawing explaining an example of the manufacturing method of the electronic component in Embodiment 3. FIG. 4 to 7, 110 is a base material, 112 is a resin, 114a and 114b are electrodes, and 118 is a groove. First, as shown in FIG. 4A, an appropriate base material 110 such as a glass plate or a silicon wafer is prepared, and a resin 112 is patterned thereon using a photoresist or the like. Then, as shown in FIG. 4B, the entire surface (including the resin 112) is covered with the electrode 114a. Here, a plating technique can be used as a method of forming the electrode 114a. Thus, by laminating the photosensitive resin and the electrode a plurality of times, the three-dimensional coil-shaped internal electrode portion 106 and the external electrode portion 100 can be collectively formed. And the electronic component which has the antistatic part 102 can be manufactured by including the process of forming the antistatic part 102, and the process of dividing | segmenting into an individual piece.

  Next, as shown in FIG. 4C, the electrode 114a covering the resin 112 is etched (chemical polishing method called CMP, polishing using abrasive grains) or mechanical processing (including cutting). Also good. In this process, there is no problem even if the surface of the resin 112 is somewhat mechanically scraped. In this way, as shown in FIG. 4C, the resin 112 and the wiring 114a are formed on the base material 110 so as to complement each other in a state where the heights are uniform.

  By repeating these steps, as shown in FIGS. 5A and 5B, a plurality of layers of the resin 112 and the electrode 114a can be stacked. Alternatively, an electrode 114b having a floating island structure as illustrated in FIG. 5C can be formed. Then, as shown in FIG. 5D and others, by forming vias (not shown) in the process, the floating island state electrodes 114b can be connected to each other to form a spiral three-dimensional coil. Thus, as shown in FIG. 5D, a laminate is formed by laminating the photosensitive resin and the electrodes in the thickness direction.

  In FIG. 6, reference numeral 116 denotes an antistatic material. Next, as shown in FIG. 6, an antistatic material 116 is formed on the resin 110. Here, as the antistatic agent, a nonmagnetic conductive material (for example, carbon black or the like) dispersed in a resin as a conductive agent is desirable. Here, the average particle diameter of the nonmagnetic conductive material is preferably 1 nm (nanometer) or more and less than 20 microns. When the average particle diameter is less than 1 nm, the nonmagnetic conductive material becomes expensive and dispersion into the resin may be difficult. If the particle size is 20 microns or more, it may affect the thinning of the antistatic portion. When a fibrous conductive member such as carbon nanotube is used for the antistatic portion, it is desirable that the diameter of the fiber be the average particle diameter (in other words, the diameter of the carbon nanotube is desirably 1 nm or more). Commercially available conductive paste, conductive paint, and conductive resin can also be used. Such products are commercially available that can be cured after printing or application. Such an antistatic material 116 is formed on the resin 112 and the electrode 114a with a thickness of 0.1 to 50 microns. Here, when the thickness of the antistatic material 116 is less than 0.1 microns, a sufficient antistatic effect may not be obtained. If the thickness exceeds 50 microns, the magnetic field formed by the coil is affected, which may affect the product thickness. Note that even if the antistatic material 116 has pinholes, coating unevenness, or formation unevenness, the antistatic effect is not particularly affected. Note that in FIGS. 5A and 5B, the resin 112 is described as having a plurality of layers in order to show a state in which the resin 112 and the electrode 114a are stacked. However, the resin 112 is integrated. Therefore, in FIGS. 5C and 5D, the resin 112 is illustrated as an integral body.

  FIG. 6B shows a state where the sample is divided into pieces. The sample shown in FIG. 6A is divided into individual pieces by forming grooves 118 at a certain distance using a laser device or a dicing device. Finally, the sample is peeled off from the substrate 110 as shown in FIG. Thus, in FIG. 6C, the electrodes 114a and 114b become the internal electrode portions 106a and 106b and the external electrode portions 100a and 100b. Similarly, the resin 112 serves as the protection unit 108, and the antistatic material 116 serves as the antistatic unit 102.

  FIG. 7 is a perspective view for explaining how a sample is divided into pieces, and 120 is a cutting machine, for example, a dicing apparatus. In FIG. 7A, a sample covered with a resin 112 is formed on a substrate 110 (note that the electrode 114 is covered with the resin 112, and therefore cannot be seen in FIG. 7A). ). Then, an antistatic material 116 is formed thereon as indicated by an arrow 104. As a method for forming the antistatic material 116, application (brush coating, roller coating, rotary spinner, spray, dip or immersion) or the like can be used. In this way, the state of FIG.

  Thereafter, as shown in FIG. 7B, the sample is separated into pieces by the cutting machine 120. Thus, the state of FIG. 6B is formed.

  In this way, the antistatic part 102 made of the antistatic material 116 can be formed on at least one surface of the electronic component. Thus, it goes without saying that the electronic component of Embodiment 3 is less likely to be charged with static electricity by having the antistatic portion 102 even when it is miniaturized to 1005, 0603, and 0402. Further, since the antistatic material 116 is not added to the resin 112, it does not affect the electrical characteristics of the coil, and since the antistatic material 116 is exposed on the surface, an excellent antistatic effect is obtained. Needless to say.

  Note that the order of the step of forming the antistatic portion 102 and the step of dividing into pieces can be changed.

(Embodiment 4)
Embodiment 4 of the present invention will be described below. The difference between the fourth embodiment and the first embodiment is the difference in the formation surface of the antistatic portion 102. In the first embodiment, the protective portion 108 is formed only on one surface of the outer shape of the electronic component. In the form 4, the protection part 108 is formed on a plurality of surfaces of the electronic component.

  In addition, as a non-magnetic conductive material, carbon-based members, that is, carbon black (including acetylene black, graphite, graphite, ketjen black sold by Lion Corporation, and also carbon nanotubes, graphite, etc.) Can be used. The nonmagnetic conductive material mainly composed of carbon is sufficient if the carbon component is 60 wt% (preferably 70 wt% or more), and a dispersant, a stabilizer, an auxiliary agent, and the like can be further added. As described above, the carbon-based conductive member is a non-magnetic material and does not react to magnetism, so that the magnetic circuit by the wiring portion 106 is not affected. Moreover, the effect which prevents that resin which forms the protection part 108 which consists of resin by using coloring, such as black, deteriorates with external light or UV light is also acquired. Note that the light-shielding property or the coloration property is not limited as long as external light can be absorbed. Therefore, it is desirable that the light transmittance is less than 10% (90% or more of the input light is absorbed) of 0.001% or more regardless of the color tone. When the light transmittance is 10% or more, there is a possibility of being influenced by light reaching the inside. Further, it may be technically difficult to make the light transmittance less than 0.001% in terms of cost.

  The standard of the antistatic layer can be determined by referring to, for example, JISL 1964A (woven fabric and fabric charging test method, surface leakage resistance measurement method / crimping measurement method). In this case, for example, after applying the applied voltage of 10 KV for 2 minutes, the charged voltage of the sample is measured 30 seconds later and 1 minute later, and the attenuation characteristics of the surface potential can be compared. According to the experiments by the inventors, the surface resistance is preferably 1 KΩ / □ or more and less than 10 GΩ / □, or the volume resistance is 1 KΩcm or more and less than 10 GΩcm. If the surface resistance is less than 1 KΩ / □, the characteristics of the electronic component may be affected. If the surface resistance is 10 GΩ / □ or more, the antistatic effect may be affected. Similarly, when the volume resistance is less than 1 KΩcm, the characteristics of the electronic component may be affected. If the volume resistance is 10 GΩcm or more, the antistatic effect may be affected. A commercially available measuring machine can be used for evaluation of area resistance (sometimes referred to as sheet resistance) and volume resistance and quality control.

  It goes without saying that the resistance value of the antistatic portion can be adjusted according to the chip size, chip weight, handling environment by the user, and the like. Also in this case, the coil wiring vicinity, which is a feature of the present invention, is insulated with a highly insulating resin, and the portion farthest from the coil wiring (or the product surface which is the outermost layer of the product) is affected by magnetism. By forming the antistatic layer using a conductive material that is not applied, the electrical characteristics are not affected.

  As described above, a protection part made of at least a resin, a coiled wiring formed in the protection part, and an electronic component consisting of an external electrode connected to the wiring and partially exposed from the protection part, By using an electronic part having an antistatic part formed on the surface of the protective part, it is possible to reduce the height of the electronic part by eliminating the substrate that was a component of the conventional electronic part, and to prevent static electricity. The influence on workability by etc. can be suppressed.

  The resin that forms the protective part that covers the coiled wiring part is made of an insulating resin having a volume resistance of 10 GΩcm or more, so that leakage current in the wiring part that forms the coil can be suppressed, and stable coil characteristics can be achieved. Can provide electronic parts.

  Further, the antistatic portion has a surface resistance of 10 KΩ / □ or more and 10 GΩ / □ or less, or a volume resistance of 10 KΩcm or more and 10 GΩcm or less, thereby suppressing the influence on workability due to static electricity or the like.

  The antistatic part is made of a nonmagnetic conductive material having an average particle diameter of 1 nm or more and 20 microns or less dispersed in the resin, so that the antistatic part can be made uniform, lightweight, easy to form, durable, etc. Can provide enhanced electronic components.

  By forming the antistatic portion so as to be in contact with at least one or more external electrode portions, it is possible to provide an electronic component capable of obtaining stable coil characteristics.

  Since the nonmagnetic conductive material is a member mainly composed of carbon, it is possible to prevent an influence on the magnetic field, and thus it is possible to provide an electronic component capable of obtaining stable coil characteristics.

  By providing the antistatic portion with coloring or light shielding properties, it is possible to provide an electronic component that can prevent the protective portion made of resin from being affected by external light or the like.

  By setting the thickness of the antistatic portion to 0.1 μm or more and 50 μm or less, it is possible to provide an electronic component that realizes a low profile and antistatic property.

  As described above, the electronic component and the manufacturing method thereof according to the present invention contribute to the miniaturization and high performance of various electronic devices by reducing the height and size of the electronic component and further improving its handling. can do.

FIG. 6 illustrates an electronic component in Embodiment 1. Equivalent circuit diagram of coil parts 8A and 8B illustrate an electronic component in Embodiment 2. Sectional drawing explaining an example of the manufacturing method of the electronic component in Embodiment 3 Sectional drawing explaining an example of the manufacturing method of the electronic component in Embodiment 3 Sectional drawing explaining an example of the manufacturing method of the electronic component in Embodiment 3 Sectional drawing explaining an example of the manufacturing method of the electronic component in Embodiment 3 Perspective view of planar coil Diagram showing dimensions of electronic components

Explanation of symbols

100a, 100b External electrode part 102 Antistatic part 104, 104a, 104b Arrow 106a, 106b Internal electrode part 108 Protection part 110 Base material 112 Resin 114a, 114b Electrode 116 Antistatic material 118 Groove 120 Cutting machine

Claims (9)

A protective part made of resin; a coil-shaped wiring formed in the protective part; and an external electrode connected to the wiring in the protective part and partially exposed from the protective part. An electronic component having an antistatic portion formed on the surface thereof. The electronic component according to claim 1, wherein the resin forming the protective portion that covers the coiled wiring portion is an insulating resin having a volume resistance of 10 GΩcm or more. 2. The electronic component according to claim 1, wherein the antistatic portion has a surface resistance of 10 KΩ / □ to 10 GΩ / □, or a volume resistance of 10 KΩcm to 10 GΩcm. The electronic component according to claim 1, wherein the antistatic portion is a nonmagnetic conductive material having an average particle diameter of 1 nm or more and 20 microns or less dispersed in a resin. The electronic component according to claim 1, wherein the antistatic portion is formed so as to be in contact with at least one or more external electrode portions. The electronic component according to claim 4, wherein the nonmagnetic conductive material is a member mainly composed of carbon. The electronic component according to claim 1, wherein the antistatic portion has a coloring property or a light shielding property. The electronic component according to claim 1, wherein the antistatic portion has a thickness of 0.1 to 50 microns. It is a manufacturing method of the electronic component according to any one of claims 1 to 8, Comprising: At least a process of laminating a photosensitive resin and an electrode a plurality of times, a process of forming an antistatic part, and a piece The manufacturing method of the electronic component including the process to do.

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