JP2007129092A - Electronic component mounting printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electronic component mounting printed wiring board in which an electronic component is detachably mounted to an opening formed in the printed wiring board, and which can prevent a thermal stress from occurring in detaching the electronic component. <P>SOLUTION: In inner peripheries 2a, 2b of an opening 2 formed in a printed wiring board 1; a protruding terminal 4 is provided to be connected to a circuit pattern 3 and to protrude to an inside of the opening 2, and a lead 12 of an electronic component 10 is connected to the protruding terminal 4 by insulation displacement, while the electronic component 10 is detachably forced into the opening 2 for mounting. Consequently, the lead 12 can be reliably connected by the protruding terminal 4, and the electronic component 10 can be fixed to the opening 2 by a holding force upon being connected to the protruding terminal 4 by insulation displacement. Also, when the electronic component 10 is reused, the electronic component 10 can be easily detached from the opening 2 without being heated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting printed board in which an opening is provided in a printed board and an electronic component is mounted in the opening.

  Conventionally, various printed circuit boards have been proposed, and Patent Document 1 discloses a printed circuit board as an example.

The printed circuit board of the above publication is formed with an opening for mounting and mounting a current-carrying element that is an electronic component on the substrate, and leads that are electrode terminals of the electronic component are formed on the inner periphery of the opening. It is designed to be fixed to the inner surface of the through hole. Therefore, the electronic component is fixed to the substrate body via a lead fixed by soldering to the through hole.
JP-A-2-232986

  In the printed circuit board, since the opening is formed and the electronic component is mounted therein, the thickness of the entire printed circuit board including the electronic component can be reduced. However, since the lead of the electronic component is soldered and fixed to the through hole in the inner periphery of the opening, it is necessary to make the lead into a dedicated shape, and the electronic component and the printed board become expensive.

  In addition, when reusing the electronic component mounted on the printed circuit board, the solder to which the lead is fixed is remelted and removed, but heat stress is given to the electronic component due to the heat applied at the time of remelting, In some cases, functional damage or breakage of electronic components occurs, making reuse impossible.

  Furthermore, even when using a heating device that is set so that the electronic component is not damaged or broken, it is necessary to extrude the electronic component after remelting the solder. It becomes complicated and large, and the cost for reusing electronic components increases.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to detachably mount an electronic component in an opening formed in a printed circuit board, and heat stress is generated in the electronic component when the electronic component is removed. An object of the present invention is to provide an electronic component mounting printed circuit board in which the above is suppressed.

  In order to achieve the above object, the invention of claim 1 is a printed circuit board provided with an opening for fitting an electronic component, at a position corresponding to the electrode terminal of the electronic component on the inner periphery of the opening. Protruding terminals connected to the circuit pattern of the printed circuit board and protruding inward of the opening are provided, and the electronic component is press-fitted into the opening while the electrode terminals of the electronic component and the protruding terminals are pressed against each other. It is mounted detachably.

  According to a second aspect of the present invention, the protruding terminal is formed such that a plurality of through holes are overlapped with each other substantially along the outline of the opening formed in the printed circuit board, and formed between the overlapping through holes. A conductive layer connected to the circuit pattern is provided on the inner surface of the through hole including the projected portion.

  The invention according to claim 3 is characterized in that the protruding terminal is smoothly inclined inward of the opening as it goes from the insertion side of the electronic component to the opposite side with respect to the thickness direction of the printed circuit board. And

  According to the first aspect of the invention, when the electronic component is mounted in the opening provided in the printed circuit board, the electrode terminal of the electronic component is pressed against the protruding terminal, so that the electrode terminal is connected to the circuit pattern. The electronic component can be securely connected to the protruding terminal, and the electronic component can be fixed to the opening by a pressing force when the electrode terminal is pressed against the protruding terminal.

  In other words, the electronic component has a special shape for the electronic component because the electrode terminal is fitted and held in the opening in a state where the electrode terminal is press-contacted to the protruding terminal formed on the inner periphery of the opening. It can be easily mounted on a printed circuit board without providing a lead. Moreover, when reusing an electronic component, the electronic component can be easily removed from the opening without being heated.

  For this reason, it is possible to use general-purpose electronic components, and since there is no heat stress on the electronic components, electronic components with low heat resistance can be used. In order to improve the reusability, an inexpensive printed circuit board can be provided by adopting an inexpensive electronic component and the reused electronic component, and further, environmental deterioration during industrial waste processing and product manufacturing can be suppressed.

  According to the invention of claim 2, since the protruding terminal is formed on the protruding portion where the plurality of through-holes overlap each other, the protruding portion can be formed into a pointed mountain shape, thereby opening the electronic component. When the electrode terminal is press-fitted into the portion and pressed into contact with the protruding terminal, the protruding portion bites into the electrode terminal, and the electrode terminal and the protruding terminal can be more reliably connected.

  According to the invention of claim 3, since the protruding terminal is inclined inward of the opening as it goes from the insertion side of the electronic component to the opposite side, the electronic component is inserted into the opening. Accordingly, the biting of the protruding terminal is increased, the pressing force between the electrode terminal and the protruding terminal can be further increased, and the holding force of the electronic component in the opening can be further increased, and the opening can be connected to the insertion side of the electronic component. Since the width on the opposite side becomes smaller, it is possible to suppress the reverse assembly by suppressing the electronic component from being inserted from the opposite side of the opening.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments embodying the invention will be described with reference to the drawings. 1 to 9 show an embodiment of the present invention, FIG. 1 is a perspective view of a state in which an electronic component is mounted on a printed board, and FIG. 2 is a state in which the electronic component is to be mounted in an opening of the printed board. FIG. 3 is a cross-sectional perspective view of an electronic component mounted on a printed circuit board, and FIG. 4 is an enlarged cross-sectional view taken along line AA in FIG.

  5 is a plan view showing the opening of the printed circuit board, FIG. 6 is an enlarged view of a portion B in FIG. 5, FIG. 7 is an enlarged perspective view of the protruding terminal, and FIG. 8 is a formation of the protruding terminal. FIG. 9 is an explanatory diagram showing a flowchart of a manufacturing process of a printed circuit board.

  The electronic component mounting printed circuit board (hereinafter referred to as a printed circuit board) 1 according to the present embodiment is provided with an opening 2 as shown in FIGS. 1 and 2, and the electronic component 10 is fitted into the opening 2. Implemented.

  The electronic component 10 is an element such as a light emitting diode (LED), a capacitor, a resistor, a transistor, or an IC. However, in this embodiment, the case where a light emitting diode is used as the electronic component 10 is illustrated.

  The electronic component 10 is generally formed in a substantially rectangular shape having a predetermined thickness, and a plurality (three pairs in this embodiment) of leads 12 as electrode terminals of the electronic component 10 are mutually connected to the electronic component main body 11. It protrudes from the opposite side wall surfaces 11a and 11b and is formed along the lower surface 11c.

  As shown in FIG. 5, the inner peripheries 2 a and 2 b facing both side wall surfaces 11 a and 11 b of the opening 2 are connected to the circuit pattern 3 of the printed circuit board 1 at positions corresponding to the leads 12. A protruding terminal 4 protruding in the direction is provided.

  The electronic component 10 is detachably press-fitted into the opening 2 while the lead 12 of the electronic component 10 is pressed between the electronic component main body 11 and the protruding terminal 4.

  As shown in FIGS. 6 and 7, the protruding terminals 4 are formed by two acute angle mountain-shaped protrusions 4 a extending in the thickness direction of the printed circuit board 1, and between the two protrusions 4 a and the protrusion 4 a. Are formed by the arc-shaped concave portions 4b formed on the outer side portions of the first and second outer sides, and in the present embodiment, they are formed through the process shown in FIG.

  That is, the protruding terminal 4 is processed before the opening 2 is formed in the printed circuit board 1 and substantially follows the outline 2c of the opening 2 formed in the printed circuit board 1 as shown in FIG. As shown in FIG. 8B, a plurality (three in this embodiment) of through holes 5 are formed so as to overlap each other, and a protruding portion 4a is formed between the overlapping through holes 5, As shown in FIG. 8C, through-hole plating 6a as a conductive layer connected to the circuit pattern 3 shown in FIG. 8D is provided on the inner surface of the through-hole 5 including the protrusion 4a. is there. In this case, copper plating is used as the through-hole plating 6a.

  Then, as shown in FIG. 8 (e), by projecting the opening 2 along the contour 2c, the projecting terminals are formed on the inner circumferences 2a and 2b of the opening 2 as shown in FIG. 4 is provided.

  Finally, as shown in FIG. 8 (f), a conductive layer in contact with the lead 12 as the electrode terminal of the electronic component 10 is formed by electroless plating 6b on the inner surface of the through hole 5 including the protrusion 4a. The In this case, as the electroless plating 6b, plating with gold, silver, tin or the like is used.

  FIG. 9 shows the manufacturing process of the printed circuit board 1 including the formation of the opening 2 and the projecting terminals 4 in order. In the first process S1, as shown in FIG. A primary pattern image (through-hole portion etching) step for forming the through-hole 5 is performed on the conductive layer 7 such as a copper foil on the surface of the base material 1a formed of an insulating material such as resin.

  At this time, as shown in FIG. 8A, the formation portion of the through hole 5 is provided with a removal portion 7a for removing the conductive layer 7 in a region slightly larger in diameter than the diameter of the through hole 5. The base material 1a is exposed at the portion 7a, and when the through hole 5 is drilled, the conductive layer 7 is prevented from being peeled off or burnt at the peripheral edge thereof.

  Next, in the second step S2, as shown in FIG. 8 (b), after the through hole 5 is formed in the removed portion 7a, the inner surface of the through hole 5 and the conductive layer 7 on the peripheral portion thereof in the third step S3. Through hole plating 6a is applied to the removed portion 7a.

  Then, in the fourth step S4, as shown in FIG. 8D, the secondary pattern image (etching: circuit) for forming the circuit pattern 3 including the through-hole plating 6a applied to the inner surface of the through-hole 5 is formed. (Pattern formation) process is performed.

  Next, in a fifth step S5, after applying a resist coating a portion that needs to ensure insulation, in a sixth step S6, silk printing for printing characters and lines of circuit symbols is performed, and a seventh step In S7, the opening 2 is processed as shown in FIG.

  Then, after the electroless plating 6b is applied to the protruding terminals 4 and the substrate electrodes in the eighth step S8 to form the printed circuit board 1, the printed circuit board 1 is inspected in the ninth step S9, and the tenth step S10 The printed circuit board 1 is provided as a finished product.

  Further, in the printed circuit board 1 of the present embodiment, the protruding terminals 4 are arranged on the opposite side (printed side) from the insertion side (the upper surface side of the printed circuit board 1 in this embodiment) of the electronic component 10 with respect to the thickness direction of the printed circuit board 1. It is desirable to smoothly incline toward the inside of the opening 2 as it goes to the lower surface side of the substrate 1.

  With the above configuration, according to the printed circuit board 1 of the present embodiment, when the electronic component 10 is mounted in the opening 2 provided in the printed circuit board 1, the lead 12 of the electronic component 10 is connected to the inner periphery 2 a of the opening 2. , 2b, the lead 12 can be reliably connected by the protruding terminal 4 connected to the circuit pattern 3. At this time, the electronic component 10 can be fixed to the opening 2 by a holding force when the lead 12 is pressed against the protruding terminal 4, that is, a holding force when the electronic component 10 is press-fitted into the opening 2. .

  That is, as shown in FIGS. 3 and 4, the electronic component 10 is fitted and held in a state where the lead 12 is pressed against the protruding terminals 4 formed on the inner circumferences 2 a and 2 b of the opening 2. Since the lead 12 of the electronic component 10 is not soldered, the electronic component 10 can be easily removed from the opening 2 without using heating means by extruding the electronic component 10 from the back side of the printed circuit board 1. it can.

  For this reason, since heat does not affect both when the electronic component 10 is mounted and removed, an electronic component with low heat resistance can be used, and when the electronic component 10 is removed, there is no occurrence of thermal stress, Since the occurrence of breakage is prevented and the reliability when the electronic component is reused is ensured, an inexpensive printed circuit board can be provided by the reused electronic component 10 along with the adoption of the inexpensive electronic component. Environmental degradation during processing and product manufacturing can be suppressed.

  In the present embodiment, in addition to the above-described effects, the plurality of through holes 5 are formed so as to overlap each other substantially along the outline 2c of the opening 2 where the protruding terminals 4 are formed in the printed circuit board 1. Since the protruding portion 4a is formed between the overlapping through holes 5, the protruding portion 4a has a pointed mountain shape, and the protruding portion 4a bites into the lead 12 when the lead 12 is brought into pressure contact with the protruding terminal 4. Thus, the lead 12 and the projecting terminal 4 can be more reliably connected.

  Further, since the protruding terminal 4 is inclined inward of the opening 2 as it goes from the insertion side of the electronic component 10 to the opposite side, the protruding shape is increased as the electronic component 10 is inserted into the opening 2. Since the bite of the terminal 4 is increased, the fixing force of the electronic component 10 can be further increased while further increasing the contact force between the lead 12 and the protruding terminal 4.

  In addition, since the projecting terminal 4 is inclined, the opening 2 has a smaller width on the opposite side than the insertion side of the electronic component 10 at the portion where the projecting terminal 4 is formed. It is possible to prevent reverse assembly by preventing insertion from the opposite side.

  The present invention can be embodied in another embodiment as follows. In other embodiments described below, the same operations and effects as in the above embodiments can be obtained.

  (1) In the above embodiment, the case where a light-emitting diode is used as an electronic component has been illustrated. However, other electronic components can be implemented in exactly the same manner.

  (2) The number of the projecting terminals can be set as appropriate, and the projecting terminals may be provided not only on the pair of peripheral walls facing each other but also on all the peripheral walls. Further, the shape of the opening itself is not limited to a rectangular shape.

  Further, technical ideas other than the claims that can be grasped from the above embodiment will be described together with the effects thereof.

  (A) In the electronic component mounting printed circuit board according to any one of claims 1 to 3, it is preferable to provide a plurality of protrusions on the protrusion-shaped terminal provided on the inner periphery of the opening.

  In this way, since it is possible to provide a plurality of electrical connection points and mechanical fixing points of the electrode terminals of the electronic component with respect to each protruding terminal, the connection reliability of the electrode terminals and the fixing reliability of the electronic component can be further improved. it can.

  (B) In the electronic component mounting printed circuit board according to any one of claims 1 to 3 or (a), it is preferable that the protruding terminals are surface-treated by electroless plating such as gold, tin, or copper. .

  In this case, the protruding terminal and the electrode terminal of the electronic component can be electrically connected by a general manufacturing method, so that the printed board can be provided at a low cost.

  (C) In the electronic component mounting printed circuit board according to any one of claims 1 to 3 and (a), it is preferable that the protruding terminals are solder-coated (solder-coated).

  In this case, the protruding terminal and the electrode terminal of the electronic component can be electrically connected by a general manufacturing method, so that the printed board can be provided at a low cost.

  (D) A printed circuit board manufacturing method for forming an opening on which an electronic component is mounted includes a primary pattern image (etching) process for removing a conductive layer on a substrate surface of the printed circuit board, and an outline of the opening. A through hole forming process for forming a plurality of through holes, a through hole plating process for copper plating on the inner surface of the through hole, and a secondary pattern for forming a circuit pattern to be connected to the copper plating applied to the inner surface of the through hole It is preferable to include an image (etching) step, an opening forming step for forming an opening along the contour, and an electroless plating step for performing electroless plating on the protruding terminals and the land portion.

  In this way, since the printed circuit board of the present invention can be formed by the conventional printed circuit board manufacturing method, it is possible to provide an electronic component mounting printed circuit board under substantially the same cost conditions as the conventional manufacturing cost without incurring a special manufacturing cost. it can.

  (E) A printed circuit board manufacturing method for forming an opening on which an electronic component is to be mounted. In contrast to the printed circuit board manufacturing method described in (d) above, a solder coat (solder coat) is used instead of an electroless plating process. It is preferable to perform the treatment between the secondary pattern process and the opening forming process.

  If it carries out like this, the printed circuit board of this invention can be formed with the manufacturing method of a conventional printed circuit board, and the electronic component mounting printed circuit board which suppressed manufacturing cost further than the manufacturing method as described in (D) can be provided.

The perspective view of the state which mounted the electronic component on the printed circuit board concerning one Embodiment of this invention. 1 is a perspective view of a state in which an electronic component according to an embodiment of the present invention is to be mounted in an opening of a printed board. 1 is a cross-sectional perspective view of an electronic component mounted on a printed circuit board according to an embodiment of the present invention. The expanded sectional view along the AA line in FIG. The top view which shows the opening part of the printed circuit board concerning one Embodiment of this invention. The enlarged view of the B section in FIG. The expansion perspective view of the protruding terminal concerning one embodiment of the present invention. Explanatory drawing which shows the formation process of the protruding terminal concerning one Embodiment of this invention later on to (a)-(f). Explanatory drawing which shows the flowchart of the manufacturing process of the printed circuit board concerning one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting printed circuit board 2 Opening part 2a, 2b Opening inner periphery 2c Outline 3 Circuit pattern 4 Protruding terminal 4a Protruding part 5 Through hole 6a Copper plating 6b Electroless plating 10 Electronic component 11 Electronic component main body 12 Lead (electrode terminal)

Claims (3)

A printed circuit board provided with an opening for fitting an electronic component,
Protruding terminals connected to the circuit pattern of the printed circuit board and protruding inward of the opening are provided at positions corresponding to the electrode terminals of the electronic component on the inner periphery of the opening,
An electronic component mounting printed circuit board, wherein the electronic component is press-fitted into the opening while being detachably mounted while the electrode terminal of the electronic component and the protruding terminal are in pressure contact with each other.   A plurality of through-holes are formed so as to overlap each other substantially along the outline of the opening formed in the printed circuit board, and the protrusion-shaped terminal includes a protrusion formed between the overlapping through-holes. 2. The electronic component mounting printed circuit board according to claim 1, wherein a conductive layer connected to the circuit pattern is provided on the inner surface of the hole.   3. The projecting terminal is smoothly inclined toward the inside of the opening as it goes from the insertion side of the electronic component to the opposite side with respect to the thickness direction of the printed circuit board. Electronic component mounting printed circuit board described in 1.

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