JP2007127593A - Sample-heating or sample-cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a sample-heating or a sample-cooling device, provided with a mechanism for removing the positional variation on the surface of the sample due to heat expansion or heat shrinkage of the heating or cooling member or the sample. <P>SOLUTION: The sample-heating or sample-cooling device comprises a sample support mechanism provided with a recess; a sample-holding mechanism stored in the recess for holding the sample-heating member or sample-cooling member; the heat insulation mechanism for surrounding the sample-holding mechanism; the sample-fixing mechanism fixed by the sample support mechanism, while pressing the sample from above; and the elastic damping mechanism, interposed in between the bottom of the heat insulation mechanism and the bottom of the recess of the sample support mechanism. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sample heating or cooling device that performs measurement while heating or cooling a sample and changing the temperature in a microscope or an analytical instrument.

An existing sample heating or cooling device used for microscope measurement or the like directly heats or cools a sample on a fixed energizing heater or the like.
In a conventional sample heating or cooling device, the temperature change caused by heating or cooling greatly changes the position of the sample surface due to thermal expansion and contraction of the sample and the heating or cooling member, which hinders measurement and observation. Yes. That is, in a microscope system or analyzer that measures the reflection or emission intensity from the sample surface, the position of the sample surface is slightly increased due to heating or cooling when the sample is heated or cooled, or due to thermal expansion or contraction of the sample. There is a drawback that the change directly leads to a large deterioration of the measurement signal.

For example, Non-Patent Document 1 describes a sample heating device for measuring optical properties of a semiconductor sample. In this document, a configuration of a sample heating device including a sample support mechanism having a recess, a sample heating member, and a heat insulation mechanism by a radiation shield is shown. In such a device, the heat of the sample accompanying a temperature change due to heating is shown. Due to the expansion, the distance between the sample surface and the measuring device fluctuates, which has the drawback of deteriorating the accuracy of measurement and observation.
Takasuka et al., Applied Physics Letters vol.67 (5) pp.2590-2594 (1997)

  The problem to be solved by the present invention is to provide a sample heating or cooling device having a mechanism for removing the above-mentioned drawbacks and removing fluctuations in the position of the sample surface due to thermal expansion or contraction of the heating or cooling member or the sample. Is to get.

  In order to solve the above-described problems, the present invention provides a sample support mechanism having a recess, a sample holding mechanism that is accommodated in the recess and has a sample heating member or a sample cooling member, and holds the sample. In a sample heating or cooling device comprising a heat insulating mechanism surrounding the mechanism and a sample fixing mechanism fixed to the sample support mechanism and holding the sample from above, an elastic force is provided between the bottom of the heat insulation mechanism and the recess of the sample support mechanism. The present invention provides a sample heating or cooling device with a buffer mechanism interposed.

  The present invention also provides a sample heating or cooling device in which a cooling or heating means is installed in the sample supporting mechanism around the recess of the sample supporting mechanism.

  The present invention also provides a sample heating or cooling device in which cooling or heating means are embedded in the sample supporting mechanism around the recess of the sample supporting mechanism.

  The present invention also provides a sample heating or cooling device in which a temperature measuring means is embedded in the sample holding mechanism.

  The present invention also provides a sample heating or cooling device in which the elastic buffer mechanism is a spring installed in the sample support mechanism or partially embedded in the sample support mechanism.

  According to the present invention, the introduction of the elastic buffer mechanism realizes a mechanism in which thermal expansion / contraction due to heating / cooling of the sample does not change the position of the sample surface. In addition, the sample support mechanism is provided with cooling or heating means to suppress the expansion and contraction of the sample support mechanism that accompanies the heating or cooling of the sample. Can be greatly improved.

The sample heating or cooling device of the present invention will be described with reference to a sample heating device.
FIG. 1 shows a principle diagram of a sample heating apparatus.
In FIG. 1, 1 is a sample. Reference numeral 2 denotes a sample holding mechanism, which includes a sample stage, a heater, and a container that accommodates these. The sample 1 is placed on the sample stage of the sample holding mechanism 2 and heated to a desired temperature by a heater. Reference numeral 3 denotes a heat insulation mechanism, which is arranged so as to surround the sample holding mechanism 2 as shown in FIG. The heat insulation mechanism 3 suppresses the elongation of the sample support mechanism accompanying the heat retention of the sample holding mechanism 2 and the temperature rise of the sample holding mechanism 2.

Reference numeral 5 denotes a sample support mechanism having a recess for accommodating the sample holding mechanism 2 and the heat insulation mechanism 3. A sample fixing mechanism 7 is disposed above the sample support mechanism 5. The sample fixing mechanism 7 fixes the sample in cooperation with the elastic buffer mechanism 4 by pressing the periphery of the surface of the sample 1.
The tip portion of the sample fixing mechanism 7 (contact portion with the sample 1) prevents heat from flowing from the surface of the sample due to heat conduction by using a heat insulating material processed into a knife edge shape.
The sample support mechanism 5 is provided with support mechanism cooling means 6 for cooling so that the influence of heat generated by the sample heating member does not reach the sample support mechanism. The cooling by the cooling means 6 is for keeping the temperature of the support mechanism constant by circulating a coolant such as water in the support mechanism.

  Reference numeral 4 denotes an elastic buffer mechanism according to the present invention, which includes a spring, an electromagnetic spring, rubber, an air bag, and the like. The elastic buffer mechanism 4 keeps the distance between the measurement surface of the sample 1 and the measurement device constant by absorbing the elongation deformation of the sample and the sample holding mechanism due to heating. The spring or the like may be placed on the concave surface of the sample support mechanism, but may be installed in the sample support mechanism or may be installed so as to be partially embedded in the sample support mechanism.

  A temperature measuring means may be embedded in the sample holding mechanism to monitor the temperature of the sample. That is, a through hole extending from the lower part of the sample support mechanism to the surface of the sample stage through the heat insulating mechanism 3 is provided, and temperature measuring means such as a thermistor is embedded in the through hole.

  Although the present invention has been described above with reference to the principle diagram of FIG. 1, the principle diagram of FIG. 1 is only for facilitating the understanding of the present invention, and the present invention is not limited to this. That is, modifications and other aspects based on the technical idea of the present invention are naturally included in the present invention.

  Although the sample heating apparatus is illustrated in the principle diagram of FIG. 1, the present invention is naturally applicable to a sample cooling apparatus for cooling and measuring a sample. In this case, for example, an electronic cooling device based on the Peltier effect is used as the sample cooling member, and heating means such as hot water is circulated in the sample support mechanism so that the influence of the cooling of the sample cooling member does not reach the sample support mechanism. Thus, the temperature of the support mechanism may be kept constant.

It is principle explanatory drawing of the sample heating apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sample 2 Sample holding mechanism 3 Thermal insulation mechanism 4 Elastic buffer mechanism 5 Sample support mechanism 6 Cooling means 7 Sample fixing mechanism

Claims (5)

A sample support mechanism having a recess;
A sample holding mechanism that holds the sample and has a sample heating member or a sample cooling member while being housed in the recess;
A heat insulating mechanism surrounding the sample holding mechanism;
In the sample heating or cooling device, which is fixed to the sample support mechanism and includes a sample fixing mechanism that holds the sample from above,
An apparatus for heating or cooling a sample, characterized in that an elastic buffer mechanism is interposed between the bottom of the heat insulation mechanism and the recess of the sample support mechanism.   2. The sample heating or cooling device according to claim 1, wherein a cooling or heating means is installed in the sample supporting mechanism around the concave portion of the sample supporting mechanism.   2. The sample heating or cooling device according to claim 1, wherein cooling or heating means is embedded in the sample supporting mechanism around the recess of the sample supporting mechanism.   4. The sample heating or cooling device according to claim 1, wherein temperature measuring means is embedded in the sample holding mechanism. 5. The sample heating according to claim 1, wherein the elastic buffering mechanism is a spring installed in the sample support mechanism or so as to be partially embedded in the sample support mechanism. Or a cooling device.

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