JP2007121938A - Optical transmission module, method of manufacturing same, optical interconnection circuit and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical transmission module that can highly accurately connect an optical element with an optical wiring and that can facilitate these assemblies. <P>SOLUTION: The optical transmission module 1 is provided for transmitting or receiving optical signals La, Lb through optical wirings 150a, 150b. The module is equipped with: optical elements 61a, 61b capable of transmitting or receiving the optical signals La, Lb; and an optical reflection surface 120 provided on an optical path between the optical element 61a, 61b and the optical wiring 150a, 150b. The module is characterized in that the optical reflection surface 120 has a shape of a paraboloid of revolution and that the optical elements 61a, 61b are arranged on the focal point of the paraboloid of revolution. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical transmission module, an optical transmission module manufacturing method, an optical interconnection circuit, and an electronic device.

  In recent years, as one method for solving the data transmission bottleneck, a technique for connecting modules using an optical wiring capable of sending a signal at a higher speed and lower power than an electric wiring has been developed. Such a technique is called an optical interconnection, and has attracted attention as a technique for dramatically improving data transmission efficiency in inter-board connection or inter-chip connection.

In order to transmit data using an optical signal, a light emitting element and a light receiving element capable of outputting and inputting the optical signal and an optical wiring for connecting the light emitting element and the light receiving element are required. The optical wiring is connected to a module (light transmission module) including a light emitting element and a light receiving element, and exchanges optical signals with the module. As such an optical wiring, one using an optical fiber or one using an optical waveguide formed on an electronic substrate is known (see, for example, Patent Documents 1 and 2).
JP 2004-54003 A JP 2004-177985 A

  In a circuit using optical interconnection (optical interconnection circuit), in order to efficiently transmit the optical signal output from the light emitting element to the light receiving element, the light emitting element, the optical fiber and the light receiving element are precisely aligned with each other. Need to be assembled. For example, when using an optical fiber as the optical wiring, it is necessary to efficiently couple (optically connect) the light emitted from the light emitting element or received by the light receiving element to the minute core portion of the optical fiber. For this reason, extremely strict tolerances are required for matching between the operating portion (functional portion) of the light emitting element and the light receiving element and the core portion of the optical fiber.

  In order to alleviate the matching tolerance between the operating part of such a light emitting element and a light receiving element (hereinafter, collectively referred to as an optical element) and the core part of the optical fiber, Patent Document 1 discloses an optical element. An aspherical mirror is provided between the optical fiber and the optical fiber so that the transmitted optical signal is condensed on the core of the optical fiber. However, in this method, it is necessary to accurately align the three positional relationships of the operating part of the optical element, the aspherical mirror, and the core end of the optical fiber, and the attachment of each element has a three-dimensional degree of freedom. Therefore, there is a problem that the adjustment takes time and requires high costs.

  On the other hand, Patent Document 2 discloses an optical transmission module in which an optical element is molded with a resin and an aspherical mirror is provided on the surface of the resin. However, in the resin molding method, it can be said that it is extremely difficult to match the relative position between the outer shape of the mold and the optical element embedded therein.

  The present invention has been made in view of such circumstances, and an optical transmission module that can connect an optical element and an optical wiring with high accuracy and can easily assemble them. An object is to provide a manufacturing method. It is another object of the present invention to provide an optical interconnection circuit and an electronic apparatus that have improved data transmission efficiency by including such an optical transmission module.

In order to solve the above problems, an optical transmission module according to the present invention is an optical transmission module that transmits or receives an optical signal via an optical wiring, and an optical element capable of transmitting or receiving the optical signal. And a light reflecting surface provided on an optical path between the optical element and the optical wiring, and the light reflecting surface has a shape of a rotating paraboloid, and is at a focal point of the rotating paraboloid. The optical element is arranged.
According to this configuration, since all the light emitted from the optical element can be converted into collimated light, alignment of the collimated light in the optical axis direction is not required for connection of the optical wiring, and substantially two-dimensional. Positioning can be performed with a degree of freedom. Also, the alignment of the optical element and the optical wiring is performed in two steps: the alignment of the optical element and the focal point of the paraboloid and the alignment of the optical wiring and the optical axis of the collimated light. Therefore, the connection work becomes much easier as compared with the conventional method in which the optical element and the optical wiring must be simultaneously adjusted with three-dimensional degrees of freedom.

In the present invention, the substrate may have a groove for positioning the optical axis of the optical wiring in a direction parallel to the central axis of the paraboloid of revolution.
According to this configuration, since the positioning can be performed simply by fitting the optical wiring into the groove, the connection work of the optical wiring becomes very simple.

In the present invention, the light reflecting surface may be formed on the substrate. Moreover, in this invention, the said light reflection surface shall be formed in the one end side of the said groove | channel.
According to this configuration, it is possible to position the optical axis of the optical wiring and the central axis of the paraboloid with high accuracy.

In the present invention, the light reflecting surface comprises a groove having a shape of a rotating paraboloid formed on the substrate and a light reflecting film formed on a surface of the groove having a shape of the rotating paraboloid. can do.
According to this configuration, since the light reflecting film is provided on the surface of the groove, the optical signal can be transmitted more efficiently.

In the present invention, the optical element may be disposed on the substrate, and the operation unit of the optical element may be located at the focal point of the paraboloid of revolution. In the present invention, a semiconductor substrate may be bonded to the substrate, and the optical element may be bonded to a position facing the light reflecting surface on the semiconductor substrate. In this case, it is preferable that the optical element is formed on a substrate different from the semiconductor substrate and transferred onto the semiconductor substrate using a transfer technique (micro tile element).
According to this configuration, an input / output signal of the semiconductor substrate can be converted into an optical signal by attaching the micro tile-like element to an arbitrary position of the semiconductor substrate. In addition, by making the micro tile-like element very small (for example, having an area of several hundred μm square or less and a thickness of several tens of μm or less), it has a very compact configuration, but it is more than conventional. Signal processing can be performed at high speed.

In the present invention, the light reflecting surface may be formed on a member different from the substrate, and the member may be fitted on one end side of the groove. In this case, the member is made of a member having transparency with respect to the optical signal, and a groove having the shape of the paraboloid for forming the light reflecting surface is provided on a predetermined surface of the member. The optical element can be bonded to a position opposite to the predetermined surface of the member and facing the light reflecting surface.
According to this configuration, since the member having the light reflecting surface is provided separately from the substrate forming the module main body, the handling of each member is facilitated and the yield is improved. In addition, since such a member can be manufactured by injection molding or the like, the shape of the rotating paraboloid is accurately formed on the light reflecting surface, or the focal point of the rotating paraboloid on the surface on which the optical element is installed. It is also easy to arrange them accurately. In this case, the adjustment of the position of the optical element can be performed only on the surface of the member, that is, in the biaxial direction within the surface, so that the adjustment work becomes very simple.

The method for manufacturing an optical transmission module of the present invention is a method for manufacturing an optical transmission module that transmits or receives an optical signal via an optical wiring, on a substrate that includes a light reflecting surface having the shape of a paraboloid of revolution. A step of bonding a semiconductor substrate having an optical element capable of transmitting or receiving the optical signal, wherein the optical element is arranged at a focal point of the paraboloid of revolution in the bonding step of the semiconductor substrate. As described above, the position of the semiconductor substrate is adjusted.
According to this method, since the optical element is disposed at the focal point of the paraboloid of revolution, all the light emitted from the optical element can be converted into collimated light. In such an optical transmission module, as long as the optical wiring is placed on the optical axis of the collimated light, light can be incident on the optical wiring. Therefore, the alignment of the optical wiring is substantially perpendicular to the collimated light. This is possible with only two axes of freedom. Also, the alignment of the optical element and the optical wiring is divided into two alignment processes, that is, the alignment of the optical element and the focal point of the paraboloid and the alignment of the optical wiring and the optical axis of the collimated light. Since it can be performed, the connection work becomes much easier as compared with the conventional method in which the optical element and the optical wiring must be simultaneously adjusted with three-dimensional degrees of freedom.

In the present invention, in the semiconductor substrate bonding step, the light is emitted from the optical element, and the light reflected by the light reflecting surface becomes collimated light in the direction in which the optical wiring is arranged. The position of the semiconductor substrate can be adjusted.
According to this method, the optical element can be reliably arranged at the focal point of the paraboloid of revolution.

In the present invention, in the bonding step of the semiconductor substrate, the light reflecting surface is observed from the direction in which the optical wiring is arranged, and the optical element is imaged on the light reflecting surface. The position can be adjusted.
According to this method, the optical element can be reliably arranged at the focal point of the paraboloid of revolution. Further, this method can be applied even if the optical element does not have a light emitting function.

The optical transmission module manufacturing method of the present invention is an optical transmission module manufacturing method for transmitting or receiving an optical signal via an optical wiring, wherein the optical element capable of transmitting or receiving the optical signal is the optical signal. A step of joining on a member having a light reflecting surface having transparency and a shape of a rotating paraboloid inside, and a step of joining the member to a substrate to which the optical wiring is connected In the optical element joining step, a member having a focal point of the paraboloid on the surface facing the light reflecting surface is used as the member, and the focal point on the surface is positioned. The position of the optical element is adjusted so that the optical element is disposed.
According to this method, it is not necessary to align the collimated light in the optical axis direction with respect to the connection of the optical wiring, and the alignment between the optical element and the optical wiring is aligned between the optical element and the focal point of the paraboloid of revolution. And the alignment of the optical wiring and the optical axis of the collimated light can be performed in two steps, so that the optical element and the optical wiring must be adjusted simultaneously with three-dimensional degrees of freedom. Compared with the conventional method, the connection work becomes much easier.
In addition, since the member provided with the light reflecting surface is provided separately from the substrate forming the module main body, the individual members can be handled easily and the yield is improved as compared with the case where these members are integrally formed. In addition, since such a member can be accurately manufactured by injection molding or the like, it is easy to accurately place the focal point of the paraboloid on the surface on which the optical element is installed. Since the adjustment of the arrangement position can be performed only on the surface of the member, that is, in the biaxial direction within the surface, the adjustment operation is very simple.

In the present invention, in the bonding step of the optical element, the collimated light is applied to the light reflecting surface from the direction in which the optical wiring is arranged, and the collimated light reflected by the light reflecting surface is observed. The position of the optical element can be adjusted so that the optical element is disposed at a position where the collimated light is focused.
According to this method, the optical element can be reliably arranged at the focal point of the paraboloid of revolution.

In the present invention, in the bonding step of the optical element, an alignment mark may be formed on the member in advance, and the position of the optical element may be adjusted using the alignment mark as a reference.
According to this method, the optical element can be arranged more easily.

In the present invention, in the step of joining the members, a substrate having a groove for positioning the optical axis of the optical wiring in a direction parallel to the central axis of the paraboloid of revolution is used as the substrate. The member can be joined to the substrate by fitting the member into one end side.
According to this method, the member can be joined to the substrate more easily. In addition, since the groove for fitting the member and the groove for positioning the optical wiring are integrally formed, the optical axis of the optical wiring and the center axis of the paraboloid of revolution can be positioned with higher accuracy. Can be done.

An optical interconnection circuit and an electronic apparatus according to the present invention include the above-described optical transmission module according to the present invention. In this case, a sleeve to which a collimator lens and the optical wiring are connected may be disposed in the groove.
According to this configuration, it is possible to provide an optical interconnection circuit and an electronic device with high data transmission efficiency.

Embodiments of the present invention will be described below with reference to the drawings.
In each of the following drawings, the scale of each layer or each member is made different so that each layer or each member has a size that can be recognized on the drawing.

[First Embodiment]
[Optical transmission module]
FIG. 1 is a schematic configuration diagram showing an optical interconnection circuit using the optical transmission module 1 according to the first embodiment of the present invention. FIG. 1A is an exploded perspective view showing the main part, and FIG. 1B is a partial cross-sectional view of the main part.

  As shown in FIG. 1, the optical transmission module 1 includes a surface emitting laser 61a that is an optical element (light emitting element) that transmits an optical signal La, and a photodiode 61b that is an optical element (light receiving element) that receives an optical signal Lb. A substrate 71 electrically connected to the surface emitting laser 61a and the photodiode 61b, and an optical transmission substrate 100 on which the substrate 71 is mounted.

  Each of the surface emitting laser 61a and the photodiode 61b is a small tile-shaped semiconductor device (micro tile-shaped element), for example, a rectangular plate shape having a thickness of 1 μm to 20 μm and a vertical and horizontal size of several tens μm to several hundreds μm. It is a member. The surface emitting laser 61a and the photodiode 61b are bonded to the upper surface of the substrate 71 made of a silicon substrate or the like, that is, the surface of the substrate 71 facing the optical transmission substrate 100, respectively. These micro tile elements are produced using a technique called an epitaxial lift-off method.

  The substrate 71 is, for example, a silicon substrate, and includes an integrated circuit including a surface emitting laser 61a and a driver circuit for the photodiode 61b. The substrate 71 is connected to the optical transmission substrate 100 by mounting bumps 140 that are connection members provided on the substrate 71 on pads 101 provided in advance on the optical transmission substrate 100.

  On the surface of the optical transmission substrate 100, a shape obtained by cutting the rotating paraboloid in a direction parallel to the central axis of the rotating paraboloid (hereinafter sometimes abbreviated as the shape of the rotating paraboloid). A groove 110 is provided. The grooves 110 are provided at positions facing the surface emitting laser 61a and the photodiode 61b, respectively, and the surface thereof is a light reflecting surface 120. The light reflecting surface 120 is provided for each of the surface emitting laser 61a and the photodiode 61b, and each operation part (functional unit) 13 of the surface emitting laser 61a and the photodiode 61b is respectively a corresponding light reflecting surface 120 ( That is, it is disposed at the focal point F of the paraboloid of revolution.

  In FIG. 1B, the symbol C is the central axis of the paraboloid of revolution. In this specification, the direction parallel to the central axis C is the Z-axis direction, the direction perpendicular to the optical transmission substrate 100 is the Y-axis direction, the direction parallel to the plane of the optical transmission substrate 100 and the direction perpendicular to the Z-axis is X Axial direction.

  The light reflecting surface 120 is connected to the groove 130 on one end side of the groove 110. The groove 130 is a groove (guide groove) for positioning the optical axes of the optical fibers 150a and 150b, which are optical wirings, in a direction parallel to the central axis of the light reflecting surface 120 (the central axis C of the paraboloid of revolution). .

  FIG. 2A is a schematic plan view of the structure of the optical transmission substrate 100 including the guide groove 130 as viewed from the substrate 71 side. FIG.2 (b) is sectional drawing which follows the AA line of Fig.2 (a). Moreover, FIG.2 (c) is sectional drawing which follows the BB line of Fig.2 (a).

  As shown in FIG. 2A, grooves 111 are provided on the surface of the optical transmission substrate 100 at positions facing the surface emitting laser 61a and the photodiode 61b, respectively. A portion 110 of the groove 111 facing the surface emitting laser 61a and the photodiode 61b has a curved shape that forms the shape of a rotating paraboloid, and the center axis C of the rotating paraboloid is parallel to the Z axis. Has been placed. The groove 111 extends to the outside of the substrate 71, and a portion disposed outside the substrate 71 serves as a guide groove 130. The guide groove 130 extends linearly in the Z-axis direction, and its central axis coincides with the central axis C of the paraboloid of the groove 110. The guide groove 130 and the light reflecting surface groove 110 continuously form a single groove 111, whereby the guide groove 130 and the light reflecting surface 120 are integrated.

  As shown in FIG. 2B, the light reflecting surface 120 has a curved shape that forms the shape of a rotating paraboloid, and more specifically, above the curved light reflecting surface 120, the rotation thereof. A surface emitting laser 61a and a photodiode 61b are disposed at the position of the focal point F on the paraboloid.

  A guide groove 130 shown in FIG. 2C is connected to the light reflecting surface 120. In this guide groove 130, a sleeve 170 for accommodating the optical fibers 150a and 150b is fitted. In FIG. 2C, the guide groove 130 has a curved shape. However, the cross-sectional shape of the guide groove 130 is not necessarily limited thereto, and may be a rectangular shape or a V-shaped cross-sectional shape.

  Here, the optical fibers 150a and 150b are inserted into a cylindrical sleeve 170 shown in FIG. At the center of the sleeve 170, a fine hole is provided along the central axis of the cylinder, and the end portions of the optical fibers 150a and 150b are inserted into the fine hole. In addition, openings having an outer diameter larger than the pores are formed at both ends in the central axis direction of the cylinder. The covering portion 160 of the optical fibers 150a and 150b is inserted into and fixed to one opening portion of the sleeve 170. Further, a collimating lens 180 having a bullet-shaped shape is provided in the other opening, and the end faces of the optical fibers 150a and 150b are installed at the center of the end face of the collimating lens 180. In addition, as such an optical fiber, what was disclosed by Unexamined-Japanese-Patent No. 2005-128093 can be used, for example.

  The sleeve 170 is fixed to the guide groove 130 shown in FIG. 2, so that the central axes of the optical fibers 150a and 150b and the optical axis L of the collimating lens 180 are the central axis C (Z axis) of the paraboloid of revolution. It is fixed in the direction parallel to.

  Under this configuration, the light emitted from the optical fiber 150b is converted into light (collimated light) parallel to the Z axis by the collimating lens 180, and rotated by the light reflecting surface 120 having the shape of a rotating paraboloid. The light is condensed on the operating portion 13 (light receiving portion) of the photodiode 61b disposed at the focal point F of the paraboloid. On the other hand, the light emitted from the surface emitting laser 61a is light parallel to the Z-axis direction by the light reflecting surface 120 (because the operating portion 13 (light emitting portion) is disposed at the focal point F of the paraboloid of revolution). Collimated light) and condensed by the collimating lens 180 on the core of the optical fiber 150a.

  As described above, the light reflecting surface 120 and the collimator lens 180 respectively transmit an optical signal between the surface emitting laser 61a or the photodiode 61b (hereinafter, abbreviated as an optical element) and an optical fiber. The collimating optical system which can be transmitted as is configured. When such a collimating optical system is disposed on the optical path between the optical elements 61a and 61b and the optical fibers 150a and 150b, the connection work when connecting the optical fibers 150a and 150b to the optical transmission board 100 is very simple. Become. In general, alignment of an optical member using a collimating optical system is easier than alignment of an optical member using a condensing optical system. In the case of a condensing optical system, since the focal point is fixed at one point, the optical members must be aligned with high accuracy with three-dimensional freedom. In the case of a collimating optical system, the light of collimated light is used. This is because if it is in a plane perpendicular to the axis, it can be made incident at a desired position by a collimating lens or the like even if the position is slightly shifted. For example, when the light La output from the optical element 61a is converted into collimated light, if the collimating lens 180 is attached to the optical fiber 150a, even if the position is slightly shifted within the effective diameter of the collimating lens 180, All collimated light can be condensed on the core of the optical fiber 150a. That is, the alignment between the optical fiber and the collimating optical system can be performed with only two-dimensional degrees of freedom, and the operation is much easier than the conventional method in which the alignment is performed with three-dimensional degrees of freedom.

  Returning to FIG. 1, metal wiring 91 is provided from the upper surface of the optical elements 61 a and 61 b to the upper surface of the substrate 71. The metal wiring 91 is a metal pattern that electrically connects the optical elements 61 a and 61 b and the substrate 71. The metal wiring 91 is preferably formed by a droplet discharge method in which a metal pattern or the like is formed by discharging a droplet containing metal from an inkjet nozzle (not shown). Thereby, the amount of the constituent material can be reduced, the design change can be easily handled, and the manufacturing cost can be reduced as compared with the case where the metal pattern is formed by photolithography, etching or the like.

  In the present embodiment, the case where the substrate 71 on which the optical elements 61a and 61b are mounted is bonded to the optical transmission substrate 100 is described. However, the present invention is not limited to this, and the optical elements 61a and 61b may be directly bonded. At this time, the optical element may be mounted face up or face down. In the face-up mounting, the optical element may be bonded to the optical transmission substrate 100 with an adhesive, and a metal wiring may be provided from the bonding pad of the optical element to the pad 101 of the optical transmission substrate 100. In face-down mounting, bonding may be performed by mounting bumps, which are connection members provided on the bonding pads of the optical element, on the pads 101 of the optical transmission substrate 100.

  In the present embodiment, the case where the light transmission substrate 100 includes the two light reflecting surfaces 120 has been described.

  In this embodiment, a surface emitting laser is used as the optical element 61a and a photodiode is used as the optical element 61b. However, the present invention is not limited to this, and the light element is a light emitting diode (LED), a high electron mobility transistor (HEMT), A hetero bipolar transistor (HBT) or the like may be used.

  Moreover, although this embodiment demonstrated the case where two optical elements were provided, you may provide not only this but one or two or more optical elements.

[Method for manufacturing optical transmission module]
Next, a method for manufacturing the optical transmission module 1 will be described with reference to FIGS.
In the present manufacturing method, a case where compound semiconductor devices (compound semiconductor elements) are used as the optical elements 61a and 61b and bonded to a silicon LSI chip serving as the substrate 71 will be described. The type of chip is not necessarily limited to this. In addition, the “semiconductor substrate” in the present embodiment refers to an object made of a semiconductor material, but is not limited to a plate-shaped substrate, and any shape of a semiconductor material is included in the “semiconductor substrate”. .

  Further, as the substrate 71, not only a silicon semiconductor but also a quartz substrate or a plastic film may be applied. When a silicon semiconductor is used as the final substrate 71, a substrate having a CCD (charge coupled device) may be used.

<First step>
FIG. 3 is a schematic cross-sectional view illustrating a first step of the method for manufacturing the optical transmission module 1.
In this step, the above-described silicon LSI chip is bonded to the optical transmission substrate 100. In this step, the position of the substrate 71 is adjusted so that the optical element 61 (surface emitting laser 61a, photodiode 61b) is disposed at the focal point F of the paraboloid of revolution on the light reflecting surface 120.

  Specifically, the substrate emits light from the operating portion 13 of the optical element 61 and the light Lc reflected by the light reflecting surface 120 becomes collimated light in the Z-axis direction (direction in which the optical fiber is disposed). 71 is adjusted. This is because if the operating unit 13 is disposed at the focal point F, all the light Lc reflected by the light reflecting surface 120 becomes collimated light.

  When the position of the substrate 71 is adjusted in this way, the substrate 71 and the optical transmission substrate 100 are joined by the bumps 140 shown in FIG. As the optical transmission substrate 100, for example, a glass epoxy substrate, a polyimide substrate, a heat-resistant plastic substrate, a ceramic substrate, a metal substrate, or the like can be used.

  As described above, the optical transmission substrate 100 is provided with a linear groove including the light reflecting surface groove 110 and the guide groove 130. Such an optical transmission substrate 100 can be manufactured by die cutting, stamping, injection molding, cutting, or the like. According to these methods, a desired groove can be accurately formed on the optical transmission substrate 100 at a low cost.

  A light reflecting film having a high reflectance is formed in the groove 110 for the light reflecting surface. Various methods such as sputtering, vapor deposition, plating, ink jet, and spray can be used to form the light reflecting film, and any method can form the light reflecting surface 120 having sufficient reflectivity. it can.

  In FIG. 3, the optical element 61 is disposed on the surface of the substrate 71 facing the light reflecting surface 120. However, since a long wavelength light exceeding 1100 nm is transmitted through a silicon substrate or the like, When data transmission is performed using light, the optical element 61 can be disposed on the surface opposite to the light reflecting surface 120.

FIG. 4 is a schematic cross-sectional view showing another example of the first step.
In FIG. 4, the position of the substrate 71 is adjusted so that the operation unit 13 of the optical element 61 forms an image on the light reflection surface 120 when observed with the camera 300 from the Z-axis direction. This method can be applied regardless of whether the operation unit 13 is a light emitting element or a light receiving element.

<Second step>
As described above, when the optical transmission module 1 is completed, the optical fiber is installed in the guide groove 130 of the optical transmission substrate 100.
An optical fiber provided with the collimating lens 180 shown in FIG. Such an optical fiber can be manufactured, for example, by the method disclosed in Japanese Patent Application Laid-Open No. 2005-128093. Specifically, an optical fiber is inserted into the sleeve 170 described above and fixed. Then, a transparent adhesive is provided on the bottom surface of the bullet-shaped collimator lens 180 and adhered to the sleeve 170. Before the adhesive is cured, the collimating lens 180 is aligned. The alignment of the collimating lens 180 is performed by image recognition or visual observation from the lens surface side. Alternatively, laser light may be transmitted from the optical fiber side and a wavefront measuring device placed on the lens surface side for observation. Since a bullet-type lens is used, the lens optical axis and the axis of the sleeve 170 are automatically parallel.

  The optical fiber can be installed by fitting a sleeve 170 accommodating the optical fiber into the guide groove 130. Since the guide groove 130 is formed with high accuracy with respect to the optical transmission substrate 100, the guide groove 130 and the axis of the sleeve 170 are substantially parallel even if the sleeve 170 is fitted into the guide groove 130. is there.

  As described above, the light from the operating unit 13 is collimated parallel to the Z axis, and the Z axis is parallel to the guide groove 130 and the lens optical axis is parallel to the axis of the sleeve 170. Become parallel. In this case, all the collimated light within the effective diameter of the collimating lens 180 is collected at the focal point of the collimating lens 180, that is, the core portion of the optical fiber. Therefore, as long as the collimated light is within the lens effective diameter, alignment of the optical fibers 150a and 150b (that is, the sleeve 170) is unnecessary.

  As described above, in the optical transmission module 1 of the present embodiment, a collimating optical system (optical) capable of transmitting an optical signal as collimated light on the optical path between the optical elements 61a and 61b and the optical fibers 150a and 150b. Since the reflecting surface 120 and the collimating lens 180) are provided, the alignment of the optical fibers 150a and 150b is not required in the alignment in the Z-axis direction, and the X-axis and the Y-axis are substantially free of two axes. It becomes possible to perform alignment. The optical elements 61a and 61b and the optical fibers 150a and 150b are aligned with the optical elements 61a and 61b and the focal point F of the paraboloid, and the optical fibers 150a and 150b and the optical axis L of the collimated light. As compared with the conventional method in which the optical elements 61a and 61b and the optical fibers 150a and 150b must be adjusted simultaneously with three-dimensional degrees of freedom, respectively. The connection work becomes much easier.

  In addition, since the guide groove 130 and the light reflecting surface 120 are integrally formed on the optical transmission substrate 100, the optical axis (lens optical axis) of the optical fibers 150a and 150b and the central axis (rotational release) of the light reflecting surface 120 are provided. The center axis C) of the object surface can be positioned with high accuracy.

  In addition, since the optical elements 61a and 61b are formed as optical elements having a light emitting function or a light receiving function and are bonded to the substrate 71 via an adhesive, signal processing can be performed at high speed while having a very compact configuration. Is possible.

  In the present embodiment, the optical fibers 150a and 150b are used as the optical wiring for connecting the optical transmission modules. However, the optical wiring is not necessarily an optical fiber, and any optical fiber can be used as long as it can transmit an optical signal. It may be in such a form. Further, although a surface emitting laser is used as the light emitting element 61a and a photodiode is used as the light receiving element 61b, the light emitting element and the light receiving element are not necessarily limited to these. Further, the light receiving element 61b is formed as an optical element and is bonded to the substrate 71. However, since the light receiving element 61b can be formed with sufficient performance even with silicon, it is directly formed on the substrate 71 together with other driver circuits. It may be formed.

[Second Embodiment]
[Optical transmission module]
FIG. 15 is an exploded perspective view showing a main part of an optical interconnection circuit using the optical transmission module 2 according to the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected about the component similar to 1st Embodiment, and detailed description is abbreviate | omitted.

  As shown in FIG. 15, the optical transmission module 2 includes a surface emitting laser 61a that is an optical element (light emitting element) that transmits an optical signal La, and a photodiode 61b that is an optical element (light receiving element) that receives an optical signal Lb. A transparent member 500 to which the surface emitting laser 61a and the photodiode 61b are joined, a substrate 71 electrically connected to the surface emitting laser 61a and the photodiode 61b, an optical transmission substrate 100 on which the substrate 71 is mounted, have.

  The surface emitting laser 61a and the photodiode 61b are each a small tile-shaped semiconductor device (a small tile-shaped element). These are each bonded to the upper surface 503 of the transparent member 500 via a transparent adhesive. Here, “transparent” means having transparency to the optical signal transmitted through the optical fibers 150a and 150b.

  On the lower surface 504 of the transparent member 500, grooves 510 having a paraboloidal shape are provided at positions facing the surface emitting laser 61a and the photodiode 61b, respectively. The surface of the groove 510 is a light reflecting surface 520, and the focal point (that is, the focal point of the paraboloid of revolution) is provided on the surface opposite to the side where the groove 510 is provided, that is, the upper surface 503. Yes. The upper surface 503 is a flat surface, and the surface emitting laser 61a and the photodiode 61b are bonded on the flat surface. The light reflecting surface 520 is provided for each of the surface emitting laser 61a and the photodiode 61b, and each operation portion 13 of the surface emitting laser 61a and the photodiode 61b is disposed at the focal point of the corresponding light reflecting surface 520, respectively. ing.

  A plurality of bonding pads 501 are provided on the upper surface 503 of the transparent member 500. A metal wiring 502 is provided from the upper surface of the surface emitting laser 61 a to the upper surface 503 of the transparent member 500. The metal wiring 502 is also provided from the upper surface of the photodiode 61b to the upper surface 503 of the transparent member 500. The metal wiring 502 is a metal pattern that electrically connects the surface emitting laser 61a and the bonding pad 501 and the photodiode 61b and the bonding pad 501.

  The metal wiring 502 is preferably formed by a droplet discharge method in which a droplet including metal is discharged from an inkjet nozzle (not shown) to form a metal pattern or the like. Thereby, the amount of the constituent material can be reduced, the design change can be easily handled, and the manufacturing cost can be reduced as compared with the case where the metal pattern is formed by photolithography, etching or the like.

  The transparent member 500 is bonded onto the optical transmission substrate 100 with the lower surface 504 facing down. A groove 105 is provided on the surface of the optical transmission substrate 100, and the transparent member 500 is fixed by fitting the transparent member 500 into the groove 105. The upper surface 106 of the optical transmission substrate 100 (the surface where the groove 105 is not formed) is continuous with the upper surface 503 of the transparent member 500, and a plurality of pads 103 and 104 are provided on the upper surface 106 of the optical transmission substrate 100. ing. A substrate 71 is mounted on the pads 103 and 104 via bumps (not shown) which are connecting members, whereby the substrate 71 and the optical transmission substrate 100 are electrically connected. Further, the pad 103 and the pad 501 of the transparent member 500 are connected by a metal wiring (not shown), whereby the substrate 71 and the surface emitting laser 61a and the photodiode 61b are electrically connected.

  The groove 105 is connected to the groove 130 at one end side thereof. The groove 130 is a groove (guide groove) for positioning the optical axes of the optical fibers 150a and 150b, which are optical wirings, in a direction parallel to the central axis of the light reflecting surface 120 (the central axis of the paraboloid of revolution).

  FIG. 6A is a schematic plan view of the structure of the optical transmission substrate 100 including the guide groove 130 as viewed from the upper surface side of the transparent member 500. FIG.6 (b) is sectional drawing which follows the DD line | wire of Fig.6 (a).

  As shown in FIG. 6A, guide grooves 130 are formed on the surface of the optical transmission substrate 100 at positions facing the surface emitting laser 61a and the photodiode 61b, respectively. These guide grooves 130 are connected to a fitting groove 105 for fitting the transparent member 500 on one end side, whereby the guide groove 130 and the fitting groove 105 form an integral groove 112. ing. The guide groove 130 extends linearly in the Z-axis direction, and the center axis thereof coincides with the center axis C of the light reflecting surface 520 (rotary paraboloid) provided on the transparent member 500.

  As shown in FIG. 6 (b), the light reflecting surface 520 has a curved shape that forms the shape of a rotating paraboloid, and more specifically, above the curved light reflecting surface 520, the rotation thereof. A surface emitting laser 61a and a photodiode 61b are disposed at the position of the focal point F on the paraboloid.

[Method for manufacturing optical transmission module]
Next, a method for manufacturing the optical transmission module 2 will be described.
First, the transparent member 500 for installing the surface emitting laser 61a and the photodiode 61b is manufactured. The transparent member 500 can be manufactured by die cutting, die pressing, injection molding, cutting, or the like. According to these methods, the desired groove 510 can be accurately formed in the transparent member 500 at a low cost. A light reflecting film having a high reflectance is formed in the groove 510. Various methods such as sputtering, vapor deposition, plating, ink jet, and spray can be used to form the light reflecting film, and any method can form the light reflecting surface 120 having sufficient reflectivity. it can. However, in the case where the refractive index difference at the interface of the transparent member 500 is large, total reflection can be generated at the interface without forming the light reflecting film. In this case, the light reflecting film is omitted. be able to.

  Next, the surface emitting laser 61a and the photodiode 61b made of a micro tile element are bonded to the upper surface 503 of the transparent member 500, that is, the surface opposite to the surface 504 on which the groove 510 is formed. The micro tile element can be manufactured by the same method as that shown in the first embodiment.

FIG. 7 is a schematic cross-sectional view showing a process of bonding optical elements.
In FIG. 7, the collimated light Lr is applied to the light reflecting surface 520 from the direction in which the optical fiber is disposed (Z-axis direction), and the light reflected by the light reflecting surface 520 is observed by the camera 300 while this light is being observed. The position of the optical element is adjusted so that the optical element is arranged at a position where the lens is focused. When viewed from the Y-axis direction (the direction in which the optical element is arranged) with the camera 300 focused on the upper surface 503 of the transparent member 500, the position F at which the light is focused can be observed. Thus, the position of the optical element can be accurately determined.

  The method for positioning the optical element is not limited to such an optical method. For example, when the transparent member 500 is injection-molded, an alignment mark is formed on the upper surface 503 in advance, and the light is used as a reference. The position of the element may be adjusted.

  When the surface emitting laser 61a and the photodiode 61b are joined to the transparent member 500, the transparent member 500 is joined to the optical transmission substrate 100 as shown in FIG. The optical transmission board 100 is provided with the groove 112 described above. Such an optical transmission substrate 100 can be manufactured by die cutting, stamping, injection molding, cutting, or the like. According to these methods, a desired groove can be accurately formed on the optical transmission substrate 100 at a low cost. The transparent member 500 is fixed by being fitted into one end side (in the groove 105) of the groove 112.

  As described above, when the optical transmission module 2 is completed, an optical fiber is installed in the guide groove 130 of the optical transmission substrate 100. An optical fiber provided with the collimating lens 180 shown in FIG. The optical fiber can be installed by fitting a sleeve 170 accommodating the optical fiber into the guide groove 130. In this step, since the guide groove 130 is formed with high accuracy with respect to the optical transmission board 100, it is only necessary to fit the optical fiber into the guide groove 130 of the optical transmission board 100 together with the sleeve 170, and substantially the position. No adjustment is necessary.

  As described above, in the light transmission module 2 of the present embodiment, the member 500 including the light reflection surface 520 is provided separately from the light transmission substrate 100 that forms the module main body. Compared to the configuration of the first embodiment in which the substrate 100 is integrally formed, handling of individual members is facilitated, and the yield is improved. Further, since such a member 500 can be manufactured by injection molding or the like, the shape of the rotary paraboloid is accurately formed on the light reflecting surface 520, or on the surface 503 on which the optical elements 61a and 61b are installed. It is easy to accurately place the focal point F of the paraboloid of revolution. In this case, the adjustment of the positions of the optical elements 61a and 61b can be performed only on the upper surface 503 of the transparent member 500, that is, by adjustment in the biaxial direction within the surface.

[Optical interconnection circuit]
Next, an optical interconnection circuit using the optical transmission module will be described.
FIG. 19 is a schematic conceptual diagram showing an example in which the optical transmission module of the above embodiment is used for general short-distance communication. The electrical signal output from the personal computer 1001 is transmitted through the electrical cable 1002 to the optical transmission module 2000 of the above embodiment. This electrical signal is converted into an optical signal in the optical transmission module 2000 and output to the optical fiber 150 (150a, 150b). This optical signal is transmitted through the optical fiber 150 to the communication partner optical transmission module 2000. This optical signal is converted into an electrical signal in the optical transmission module 2000 and output to a peripheral device such as the Internet, a LAN, a projector, or an external monitor. It is to be noted that signals can be transmitted in the opposite direction to the flow of these signals in the same manner as described above.

  As described above, a collimating optical system capable of transmitting an optical signal as collimated light is provided on the optical path between the optical element provided in the optical transmission module 2000 and the optical fiber 150. Communication with the Internet, LAN, or peripheral devices can be speeded up at a lower cost than before, wiring used for the communication can be made compact, and the occurrence of electromagnetic interference (EMI) can be suppressed. can do.

[Electronics]
Next, an electronic device provided with the light transmission module will be described.
FIG. 10 is a schematic conceptual diagram showing an example in which the optical transmission module of the above embodiment is used as a component of a notebook personal computer. A notebook personal computer 1001 includes a CPU 1011, a video controller 1012, a pair of optical transmission modules 2000, optical fibers 150 (150 a and 150 b), and a display 1013. A signal indicating an image output from the CPU 1011 is input to the video controller 1012 and converted into a desired image signal. This image signal is input to the optical transmission module 2000 disposed on the main body side (keyboard side) of the notebook personal computer 1001, converted into an optical signal, and output to the optical fiber 150. This optical signal is input to the optical transmission module 2000 disposed on the lid side (display side) of the notebook personal computer 1001 through the optical fiber 150, converted into an electrical signal, and output to the display 1013. As a result, an image corresponding to a signal indicating an image output from the CPU is displayed on the display 1013.

  Here, the routing of the signal line in the hinge portion 1014 that connects the main body and the lid of the notebook personal computer 1001 has dimensional restrictions and restrictions for preventing the occurrence of electromagnetic interference (EMI). However, according to this electronic apparatus, since the optical fiber 150 is used for routing the signal line in the hinge portion 1014, the transmission rate of one communication path is increased, and one to several optical fibers are connected to the hinge portion. Just pass through 1014. In addition, since light does not emit electromagnetic waves, the occurrence of electromagnetic interference (EMI) can be suppressed. In order to apply the optical transmission module to the notebook personal computer 1001 or the cellular phone, an ultra-small optical transmission module is required. However, if the optical transmission module of this embodiment is used, the notebook personal computer 1001 can be easily used. Alternatively, it can be incorporated into a mobile phone. Furthermore, since a collimating optical system capable of transmitting an optical signal as collimated light is provided on the optical path between the optical element provided in the optical transmission module 2000 and the optical fiber 150, the data transmission efficiency is improved. High-speed data processing is possible.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

It is a schematic block diagram of the optical transmission module which concerns on 1st Embodiment. It is the top view and sectional drawing which show the principal part structure of an optical transmission module. It is process drawing which shows the 1st process of the manufacturing method of an optical transmission module. It is process drawing which shows the other example of a 1st process. It is a perspective view which shows schematic structure of the optical transmission module which concerns on 2nd Embodiment. It is the top view and sectional drawing which show the principal part structure of an optical transmission module. It is process drawing which shows 1 process of the manufacturing method of an optical transmission module. FIG. 8 is a process diagram following FIG. 7. It is a schematic conceptual diagram which shows the example of the short distance communication using the optical transmission module of this invention. It is a schematic conceptual diagram which shows an example of the electronic device provided with the optical transmission module of this invention.

Explanation of symbols

1, 2, 2000 ... optical transmission module, 61 ... minute tile-shaped element, 61a ... surface emitting laser (optical element), 61b ... photodiode (optical element), 71 ... substrate (semiconductor substrate), 100 ... optical transmission substrate, 105, 110, 111, 112, 130 ... groove, 120 ... light reflecting surface, 150, 150a, 150b ... optical fiber (optical wiring), 500 ... transparent member, 510 ... groove, 520 ... light reflecting surface, C ... rotating release Center axis of the object plane, F ... Focus of the rotating paraboloid

Claims (19)

An optical transmission module that transmits or receives an optical signal via an optical wiring,
A substrate,
An optical element capable of transmitting or receiving the optical signal;
A light reflecting surface provided on an optical path between the optical element and the optical wiring;
The light transmission module according to claim 1, wherein the light reflecting surface has a shape of a rotating paraboloid, and the optical element is disposed at a focal point of the rotating paraboloid.   The optical transmission module according to claim 1, wherein the substrate has a groove for positioning the optical axis of the optical wiring in a direction parallel to a central axis of the paraboloid of revolution.   The optical transmission module according to claim 1, wherein the light reflecting surface is formed on the substrate.   The optical transmission module according to claim 3, wherein the light reflecting surface is formed on one end side of the groove.   The said light reflection surface consists of the groove | channel of the shape of the rotation paraboloid formed in the said board | substrate, and the light reflection film | membrane formed in the surface of the groove | channel of the shape of the said rotation paraboloid. 5. The optical transmission module according to 3 or 4.   The light according to claim 1, wherein the optical element is disposed on the substrate, and an operation unit of the optical element is located at the focal point of the paraboloid of revolution. Transmission module.   3. The optical transmission module according to claim 1, wherein a semiconductor substrate is bonded to the substrate, and the optical element is bonded to a position facing the light reflecting surface on the semiconductor substrate.   The optical transmission module according to claim 2, wherein the light reflecting surface is formed on a member different from the substrate, and the member is fitted into one end of the groove.   The member is made of a member having transparency to the optical signal, and a groove having a shape of the rotary paraboloid for forming the light reflecting surface is provided on a predetermined surface of the member, 9. The optical transmission module according to claim 8, wherein the optical element is bonded to a surface of the member opposite to the predetermined surface and facing the light reflecting surface. An optical transmission module manufacturing method for transmitting or receiving an optical signal via an optical wiring,
Bonding a semiconductor substrate provided with an optical element capable of transmitting or receiving the optical signal on a substrate provided with a light reflecting surface having the shape of a rotating paraboloid;
In the semiconductor substrate bonding step, the position of the semiconductor substrate is adjusted so that the optical element is arranged at the focal point of the paraboloid of revolution.   In the bonding step of the semiconductor substrate, the position of the semiconductor substrate is such that the light emitted from the optical element and reflected by the light reflecting surface becomes collimated light in the direction in which the optical wiring is arranged. The method of manufacturing an optical transmission module according to claim 10, wherein:   In the semiconductor substrate bonding step, the light reflecting surface is observed from the direction in which the optical wiring is arranged, and the position of the semiconductor substrate is adjusted so that the optical element is imaged on the light reflecting surface. The method of manufacturing an optical transmission module according to claim 10. An optical transmission module manufacturing method for transmitting or receiving an optical signal via an optical wiring,
Bonding the optical element capable of transmitting or receiving the optical signal onto a member having a light reflecting surface having transparency to the optical signal and having a shape of a paraboloid inside;
Bonding the member to a substrate to which the optical wiring is connected,
In the optical element bonding step, a member having a focal point of the paraboloid of revolution on a surface facing the light reflecting surface is used as the member, and the optical element is disposed at the focal position on the surface. As described above, a method of manufacturing an optical transmission module, wherein the position of the optical element is adjusted.   In the bonding step of the optical element, the collimated light is irradiated while irradiating the light reflecting surface from the direction in which the optical wiring is arranged and observing the collimated light reflected by the light reflecting surface. The method of manufacturing an optical transmission module according to claim 13, wherein the position of the optical element is adjusted so that the optical element is disposed at a position where the lens is focused.   14. The optical transmission module according to claim 13, wherein in the optical element joining step, an alignment mark is formed on the member in advance, and the position of the optical element is adjusted with reference to the alignment mark. Production method.   In the step of joining the members, a substrate having a groove for positioning the optical axis of the optical wiring in a direction parallel to the central axis of the paraboloid of revolution is used as the substrate, and the substrate is provided at one end of the groove. The method for manufacturing an optical transmission module according to claim 13, wherein the member is joined to the substrate by fitting the member.   An optical interconnection circuit comprising the optical transmission module according to claim 1.   The optical interconnection circuit according to claim 17, wherein a sleeve to which a collimator lens and the optical wiring are connected is disposed in the groove. An electronic apparatus comprising the optical transmission module according to claim 1.

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