JP2007121346A5 - - Google Patents
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- JP2007121346A5 JP2007121346A5 JP2005309242A JP2005309242A JP2007121346A5 JP 2007121346 A5 JP2007121346 A5 JP 2007121346A5 JP 2005309242 A JP2005309242 A JP 2005309242A JP 2005309242 A JP2005309242 A JP 2005309242A JP 2007121346 A5 JP2007121346 A5 JP 2007121346A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005309242A JP4859437B2 (ja) | 2005-10-25 | 2005-10-25 | 被膜形成用樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005309242A JP4859437B2 (ja) | 2005-10-25 | 2005-10-25 | 被膜形成用樹脂組成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007121346A JP2007121346A (ja) | 2007-05-17 |
JP2007121346A5 true JP2007121346A5 (pt) | 2008-12-04 |
JP4859437B2 JP4859437B2 (ja) | 2012-01-25 |
Family
ID=38145293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005309242A Expired - Fee Related JP4859437B2 (ja) | 2005-10-25 | 2005-10-25 | 被膜形成用樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4859437B2 (pt) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4763511B2 (ja) * | 2006-05-26 | 2011-08-31 | 信越化学工業株式会社 | レジスト保護膜材料及びパターン形成方法 |
JP5045759B2 (ja) * | 2007-09-27 | 2012-10-10 | Jsr株式会社 | 微細パターン形成用樹脂組成物および微細パターン形成方法 |
US7745077B2 (en) * | 2008-06-18 | 2010-06-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
JP5573578B2 (ja) * | 2009-10-16 | 2014-08-20 | 信越化学工業株式会社 | パターン形成方法及びレジスト材料 |
KR101311446B1 (ko) * | 2011-01-21 | 2013-09-25 | 금호석유화학 주식회사 | 수용성 수지 조성물 및 이를 이용하여 미세패턴을 형성하는 방법 |
KR102028109B1 (ko) * | 2011-12-23 | 2019-11-15 | 금호석유화학 주식회사 | 미세패턴 형성용 수용성 수지 조성물 및 이를 이용한 미세패턴의 형성방법 |
US9448483B2 (en) * | 2014-07-31 | 2016-09-20 | Dow Global Technologies Llc | Pattern shrink methods |
JP6483397B2 (ja) * | 2014-10-17 | 2019-03-13 | 東京応化工業株式会社 | レジストパターン形成方法 |
JP6503206B2 (ja) | 2015-03-19 | 2019-04-17 | 東京応化工業株式会社 | レジストパターン修復方法 |
TWI627220B (zh) | 2015-06-03 | 2018-06-21 | 羅門哈斯電子材料有限公司 | 用於圖案處理之組合物及方法 |
TWI617900B (zh) | 2015-06-03 | 2018-03-11 | 羅門哈斯電子材料有限公司 | 圖案處理方法 |
TWI615460B (zh) | 2015-06-03 | 2018-02-21 | 羅門哈斯電子材料有限公司 | 用於圖案處理的組合物和方法 |
TWI606099B (zh) | 2015-06-03 | 2017-11-21 | 羅門哈斯電子材料有限公司 | 圖案處理方法 |
US10133179B2 (en) | 2016-07-29 | 2018-11-20 | Rohm And Haas Electronic Materials Llc | Pattern treatment methods |
CN114431339B (zh) * | 2022-02-14 | 2023-06-27 | 浙江汇能生物股份有限公司 | 一种低添加增稳微囊化二甲酸钾饲料添加剂及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5672954A (en) * | 1979-11-19 | 1981-06-17 | Sumitomo Chemical Co | Article molded with coating polycarbonate group resin |
JPH07119374B2 (ja) * | 1987-11-06 | 1995-12-20 | 関西ペイント株式会社 | ポジ型感光性カチオン電着塗料組成物 |
DE3742472A1 (de) * | 1987-12-15 | 1989-06-29 | Belland Ag | Aminogruppen enthaltendes polymerisat, verfahren zu seiner herstellung und verwendung |
CA2020629C (en) * | 1989-07-21 | 2000-02-01 | Frank Landy | Shelf stable fast-cure aqueous coating |
US6818384B2 (en) * | 2002-10-08 | 2004-11-16 | Samsung Electronics Co., Ltd. | Methods of fabricating microelectronic features by forming intermixed layers of water-soluble resins and resist materials |
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2005
- 2005-10-25 JP JP2005309242A patent/JP4859437B2/ja not_active Expired - Fee Related
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