JP2007121346A5 - - Google Patents
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- JP2007121346A5 JP2007121346A5 JP2005309242A JP2005309242A JP2007121346A5 JP 2007121346 A5 JP2007121346 A5 JP 2007121346A5 JP 2005309242 A JP2005309242 A JP 2005309242A JP 2005309242 A JP2005309242 A JP 2005309242A JP 2007121346 A5 JP2007121346 A5 JP 2007121346A5
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Description
重合開始剤は、モノマー組成物を溶媒に溶解させた溶液を攪拌しながら、その溶液に添加すればよい。重合開始剤の量は、通常、モノマー組成物１００重量部あたり、重合反応を促進させる観点から、好ましくは０．０１重量部以上、より好ましくは０．１重量部以上であり、得られる樹脂組成物と基材との密着性を高める観点から、好ましくは３０重量部以下、より好ましくは５重量部以下である。 The polymerization initiator may be added to a solution obtained by dissolving the monomer composition in a solvent while stirring the solution. The amount of the polymerization initiator is usually a monomer composition, per 100 parts by weight from the viewpoint of accelerating the polymerization reaction, is preferably 0.01 parts by weight or more, more preferably 0.1 by weight or more parts, the resulting resin From the viewpoint of enhancing the adhesion between the composition and the substrate, the amount is preferably 30 parts by weight or less, more preferably 5 parts by weight or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005309242A JP4859437B2 (en) | 2005-10-25 | 2005-10-25 | Film forming resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005309242A JP4859437B2 (en) | 2005-10-25 | 2005-10-25 | Film forming resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007121346A JP2007121346A (en) | 2007-05-17 |
| JP2007121346A5 true JP2007121346A5 (en) | 2008-12-04 |
| JP4859437B2 JP4859437B2 (en) | 2012-01-25 |
Family
ID=38145293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005309242A Expired - Fee Related JP4859437B2 (en) | 2005-10-25 | 2005-10-25 | Film forming resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4859437B2 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4763511B2 (en) * | 2006-05-26 | 2011-08-31 | 信越化学工業株式会社 | Resist protective film material and pattern forming method |
| JP5045759B2 (en) * | 2007-09-27 | 2012-10-10 | Ｊｓｒ株式会社 | Resin composition for forming fine pattern and method for forming fine pattern |
| US7745077B2 (en) * | 2008-06-18 | 2010-06-29 | Az Electronic Materials Usa Corp. | Composition for coating over a photoresist pattern |
| JP5573578B2 (en) * | 2009-10-16 | 2014-08-20 | 信越化学工業株式会社 | Pattern forming method and resist material |
| KR101311446B1 (en) * | 2011-01-21 | 2013-09-25 | 금호석유화학 주식회사 | Water-soluble resin composition and method of forming fine patterns by using the same |
| KR102028109B1 (en) * | 2011-12-23 | 2019-11-15 | 금호석유화학 주식회사 | Water-soluble resin composition for forming fine patterns and mothod of forming fine patterns by using the same |
| US9448483B2 (en) * | 2014-07-31 | 2016-09-20 | Dow Global Technologies Llc | Pattern shrink methods |
| JP6483397B2 (en) * | 2014-10-17 | 2019-03-13 | 東京応化工業株式会社 | Resist pattern forming method |
| JP6503206B2 (en) | 2015-03-19 | 2019-04-17 | 東京応化工業株式会社 | Resist pattern repair method |
| TWI617900B (en) * | 2015-06-03 | 2018-03-11 | 羅門哈斯電子材料有限公司 | Pattern treatment methods |
| TWI615460B (en) | 2015-06-03 | 2018-02-21 | 羅門哈斯電子材料有限公司 | Compositions and methods for pattern treatment |
| CN106249540A (en) | 2015-06-03 | 2016-12-21 | 陶氏环球技术有限责任公司 | Pattern treatment method |
| TWI627220B (en) | 2015-06-03 | 2018-06-21 | 羅門哈斯電子材料有限公司 | Compositions and methods for pattern treatment |
| US10133179B2 (en) | 2016-07-29 | 2018-11-20 | Rohm And Haas Electronic Materials Llc | Pattern treatment methods |
| CN114431339B (en) * | 2022-02-14 | 2023-06-27 | 浙江汇能生物股份有限公司 | Low-additive stability-increasing microencapsulated potassium diformate feed additive and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5672954A (en) * | 1979-11-19 | 1981-06-17 | Sumitomo Chemical Co | Article molded with coating polycarbonate group resin |
| JPH07119374B2 (en) * | 1987-11-06 | 1995-12-20 | 関西ペイント株式会社 | Positive type photosensitive cationic electrodeposition coating composition |
| DE3742472A1 (en) * | 1987-12-15 | 1989-06-29 | Belland Ag | POLYMERISATE CONTAINING AMINO GROUPS, METHOD FOR THE PRODUCTION AND USE THEREOF |
| CA2020629C (en) * | 1989-07-21 | 2000-02-01 | Frank Landy | Shelf stable fast-cure aqueous coating |
| US6818384B2 (en) * | 2002-10-08 | 2004-11-16 | Samsung Electronics Co., Ltd. | Methods of fabricating microelectronic features by forming intermixed layers of water-soluble resins and resist materials |
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2005
- 2005-10-25 JP JP2005309242A patent/JP4859437B2/en not_active Expired - Fee Related
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