JP2007116199A - Component feeder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component feeder that efficiently feeds components, in which a wafer supply plate and a tray supply plate are mixedly housed, and the components are automatically fed from a plate, which is selected from the above plates, irrespective of a kind of the plate. <P>SOLUTION: Depending on a kind of a plate disposed in a plate disposing device of the component feeder, for the tray supply plate, a lowering position of a plate pressing body is restricted, thereby the plate is securely held, and for the wafer supply plate, restriction of the lowering position is released, thereby while the wafer supply plate is securely held, expanding to wafer is performed. Consequently, appropriate holding operation or expanding operation is performed selectively and automatically depending on a kind of the plate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wafer supply plate for mounting a wafer on which a plurality of wafer supply components among components mounted on a substrate are placed, and a tray for mounting a component supply tray on which a plurality of tray supply components are placed. The present invention relates to a component supply device that supplies each wafer supply component and each tray supply component from a supply plate to a mounting portion in a component mounting apparatus so that the components can be mounted.

  Conventionally, in such a component supply apparatus, a wafer supply plate on which a wafer on which a plurality of wafer supply components among components mounted on a substrate are arranged or a plurality of tray supply components is arranged. Any one of the tray supply plates on which the component supply trays are placed is selectively stored, and the wafer supply plate or the tray supply plate is taken out, and the respective wafer supply components or The tray supply component is supplied to a mounting portion or the like of a component mounting apparatus (see, for example, Patent Document 1).

  Further, in such a component supply apparatus, in order to enable supply of the respective wafer supply components from the wafer placed on the wafer supply plate, the dicing wafer is expanded. It is necessary to make it. Therefore, the component supply device is provided with a device for performing this expansion. Furthermore, it is also necessary to push the wafer supply component supplied from the wafer to which the expand has been applied from the lower surface so that it can be taken out. Therefore, the component supply device is also provided with a push-up device that performs this push-up operation.

  On the other hand, in the component supply apparatus, in order to enable the supply of the respective tray supply components from the component supply tray placed on the component supply plate, an expansion, a push-up, or the like as with respect to the wafer is performed. There is no need to perform the operation.

  Accordingly, the operation for supplying the respective components differs depending on whether the wafer supply plate is accommodated in the component supply apparatus or the tray supply plate is accommodated.

  Currently, in component mounting, the production of multi-chip mounting substrates, which are produced by mounting various types of components on a single substrate, has become mainstream. Among the various types of components, many of the wafer supply components and the tray supply components are included. On the other hand, improvement in productivity in the production of such a multichip mounting substrate is also strongly desired.

JP 2000-91385 A

  However, in the conventional component supply apparatus, there is no way to automatically cope with the difference in operation between the supply operation of the respective wafer supply components and the supply operation of the respective tray supply components. Depending on the supply mode of the parts, such as whether the wafer is supplied from the wafer supply plate or from the tray supply plate, the expansion device or the push-up device is not operated or the operation is not performed. Therefore, there is a problem that the production efficiency in parts supply is remarkably lowered.

  Also, at the site of component mounting, whether the wafer supply component or the tray supply component is first mounted on the substrate differs depending on the type of the substrate and the like. Accordingly, replacement of the component parts in the component supply apparatus, and replacement work of replacing each of the plates stored in the component supply apparatus between the wafer supply plate and the tray supply plate. There is also a problem that such work becomes very troublesome for the worker and the work efficiency is remarkably lowered.

  Furthermore, due to the difference in shape of the wafer and the component supply tray, the supply height position of the respective wafer supply components on the wafer supply plate and the supply height of the respective tray supply components on the tray supply plate The position is not the same height position. Accordingly, it is necessary to supply the parts with the same supply height position in any of the plates in a state where the respective parts can be supplied. The work of adjusting the height position of the support part for supporting each plate according to the supply form of the parts (for example, replacement of the parts of the support part) is required, and the work efficiency is further reduced. There is also.

  In addition, there are various problems as will be described later in the maintenance in the component supply apparatus, and there is also a problem that the maintainability of the component supply apparatus is not good and efficient component supply cannot be performed. .

  Accordingly, an object of the present invention is to solve the above-described problem, and includes a wafer supply plate for placing a wafer on which a plurality of wafer supply components among components mounted on a substrate are placed, and a plurality of trays. A component supply device for supplying each of the wafer supply components and each of the tray supply components to a mounting portion of the component mounting apparatus so that the components can be mounted from a tray supply plate on which a component supply tray on which supply components are arranged is placed. The wafer supply plate and the tray supply plate can be mixed and stored, and the plate selected from the respective plates is the wafer supply plate or the tray supply plate. Regardless of the above, it is possible to automatically supply the parts from the selected plate, and to perform maintenance. To provide a component supply apparatus capable of efficient component supply it can also be improved.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a wafer supply plate for placing a wafer on which a plurality of wafer supply components among components mounted on a substrate are placed, and a component supply in which a plurality of tray supply components are arranged In the component supply apparatus for supplying the respective wafer supply components and the respective tray supply components in a mountable manner with the tray supply plate on which the tray is placed.
A plate storage unit including a storage body for storing a plurality of the wafer supply plates and the plurality of tray supply plates in a stacked manner;
Any one of the respective plates so that the supply height of each of the wafer supply components by the wafer supply plate is substantially the same as the supply height of the respective tray supply components by the tray supply plate. A plate placement device for selectively placing and holding the plates, and allowing each of the wafer supply components from the wafer or the tray supply components to be supplied from the component supply tray;
A plate moving device that holds the plate releasably and removes it from the storage body, and moves the plate placing device so that the plate can be held,
The plate storage part
A base that supports the storage body and the storage body lifting unit;
The arrangement position of the base can be held, the holding is released, and a linear motion guide portion that guides the linear movement of the base and the movement while rotating the base A base holding part having a rotation guide part,
The base includes an engaging portion that can selectively engage with the linear motion guide portion and the rotation guide portion, and the engagement portion is engaged with the linear motion guide portion, thereby The linear movement of the base is possible, the engagement between the engagement portion and the linear motion guide portion is released, and the engagement portion is engaged with the rotation guide portion. Thus, it is possible to provide a component supply device that enables movement while rotating the base.

According to the second aspect of the present invention, the plate moving device comprises:
A holding part for releasably holding the plate;
A holding unit moving unit that moves the holding unit so as to move the plate held by the holding unit from the storage body to the plate placement device;
Each of the plates having a plate outlet portion through which the one held plate together with the holding portion can pass, and being housed in the housing body of the plate housing portion other than the one plate, is The component supply device according to the first aspect, further comprising a pop-out prevention plate having a plate restricting portion formed around the take-out port portion that can be prevented from popping out from a storage body so as to be able to be opened and closed.

According to the third aspect of the present invention, the plate storage portion raises or lowers the storage body to place one of the plates stored in the storage body into the plate moving device. A storage body lifting / lowering part positioned at a lifting height position that can be held by the holding part,
The component supply according to the second aspect, wherein the protrusion prevention plate prevents the respective plates other than the one plate positioned at the elevation height position by the storage body elevating part from jumping out of the storage body. Providing equipment.

  According to a fourth aspect of the present invention, in the second aspect or the third aspect, the plate arrangement device further includes a pop-up detection unit capable of detecting the plate positioned in the outlet portion of the pop-out prevention plate. A component supply apparatus according to the description is provided.

  According to the present invention, regardless of whether the plate to be arranged and supplied is a wafer supply plate or a tray supply plate, the supply heights of the components arranged on the respective plates are substantially the same. Thus, it is possible to supply each of the above parts. Therefore, it is possible to supply parts in an appropriate state selectively and automatically according to the type of the plate while the above-mentioned plates are mixedly mounted, and the parts can be supplied efficiently. it can.

  In addition, since the plate supply unit is equipped with a mechanism capable of performing a combination of linear movement and rotation when the plate storage unit is mounted on or released from the component supply device, the plate storage unit is stored in a narrower space. It is possible to securely store and equip the portion, or to pull out the plate storage portion from the space more easily and smoothly. Therefore, even when such a component supply device is arranged in a more compact space, the plate storage portion can be easily and smoothly inserted and maintained, and the maintainability can be improved.

  In addition, since the pop-out prevention plate is installed on the plate placement device side so that it can be opened and closed, the pop-out prevention plate can be moved by opening and closing and improving maintainability. be able to. Further, since the pop-out detection portion that can detect the plate located in the pick-out portion is provided in the pick-out portion, the pop-out prevention plate is moved to open during the maintenance, etc. Even when the function cannot be achieved, the plate protruding from the storage body can be detected, and the maintenance performance can be improved while enhancing the safety.

  Before continuing the description of the present invention, the same parts are denoted by the same reference numerals in the accompanying drawings.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
An electronic component mounting apparatus that is an example of a component mounting apparatus that includes the component supply apparatus 4 that is an example of the component supply apparatus according to the first embodiment of the present invention, and that mounts the component supplied from the component supply apparatus 4 on a substrate. A perspective view of 101 is shown in FIG. Prior to describing the detailed structure and operation of the component supply device 4, the overall configuration and operation of the electronic component mounting apparatus 101 including the component supply device 4 will be described with reference to FIG. .

(About electronic component mounting equipment)
As shown in FIG. 1, an electronic component mounting apparatus 101 is a device that performs a mounting operation for mounting an electronic component 2 such as a chip component or a bare IC chip, which is an example of a component, on a substrate. 2 is provided, and a mounting portion 5 that performs a mounting operation for mounting each electronic component 2 supplied from the component supply device 4 on a substrate is provided.

  In the component supply apparatus 4 shown in FIG. 1, wafer supply in which a wafer on which a plurality of wafer supply components 2w (an example of components) among a large number of electronic components 2 mounted on a substrate are placed is placed on the upper surface thereof. Plate and a tray supply plate on which a plurality of component supply trays in which a tray supply component 2t (which is an example of a component) among the numerous electronic components 2 is arranged and accommodated are placed on the upper surface of the plate. The lifter device 10, which is an example of a plate storage portion that stores each of the plates so as to be selectively supplied, is installed on the front side in the Y-axis direction of the component supply device 4. In the following description, when the wafer supply plate or the tray supply plate is not used in a limited manner, it is described as each of the plates, and the wafer supply component 2w or the tray supply component 2t is referred to as the plate. When not used in a limited manner, the electronic component 2 is described. The description of the configuration of each of the plates and the like will be described later. The wafer supply component 2w includes a bare IC chip formed mainly by dicing the wafer. The tray supply component 2t is an IC chip other than the bare IC chip and the bare IC chip. (For example, a packaged IC chip) and chip parts.

  In addition, the component supply device 4 is provided with a plate arrangement device 12 that arranges the respective plates that are selectively supplied from the lifter device 10 so that the electronic component 2 can be taken out from the respective plates. In the case where the wafer supply plate is supplied from the lifter device 10 and is placed on the plate placement device 12, the plate placement device 12 uses the wafer placement plate for the wafer placed on the wafer supply plate. The expanding operation is performed.

  Further, the component supply device 4 is mounted by sucking and holding the electronic components 2 individually from the wafer or the component supply tray placed on the plate that is selectively placed on the plate placement device 12. A reversing head device 14 is provided that moves along the X-axis direction in the drawing toward the unit 5 and reverses the electronic component 2 held by suction in the vertical direction. Instead of the case where the component supply device 4 includes the reversing head device 14, the electronic component mounting device 101 is provided together with the component supply device 4 as a device having a different configuration from the component supply device 4. It may be the case.

  In addition, as shown in FIG. 1, the mounting unit 5 includes a mounting head unit 20 that holds the electronic component 2 by suction and mounts it on the substrate. In addition, a component supply position where the electronic component 2 held by the reversing head device 14 can be delivered to the mounting head unit 20, and the electronic component 2 with respect to the board, which are disposed along the X-axis direction shown in the drawing. An X-axis robot 22, which is an example of a moving device that moves forward and backward along the X-axis direction in the figure while supporting the mounting head unit 20 with respect to the substrate mounting region where the mounting operation is performed, further moves to the mounting unit 5. Is provided.

  The mounting head unit 20 can be driven up and down by moving means such as a voice coil motor, and the bonding energy such as pressing energy, ultrasonic vibration energy, and thermal energy can be applied through the electronic component 2 held by suction. And a holding portion (not shown) configured to be able to be applied to the bonding portion between the electronic component 2 and the substrate, and the bonding energy can be applied while pressing the electronic component 2 against the substrate. ing. Further, the X-axis robot 22 is provided with a moving mechanism (not shown) using, for example, a ball screw shaft portion and a nut portion screwed to the ball screw shaft portion.

  Further, as shown in FIG. 1, on the base 24 of the mounting unit 5 below the mounting head unit 20 and the X-axis robot 22, the substrate can be moved in the X-axis direction and the Y-axis direction shown in the figure, and An XY table 26 is disposed for positioning the position where the electronic component 2 is mounted on the substrate with respect to the mounting head portion 20. The XY table 26 can be moved and driven by, for example, a servo motor in each of the illustrated X-axis direction and Y-axis direction, and can be positioned by full-closed control using a linear scale. Further, on the upper surface of the XY table 26, a substrate holding base 28 for holding and fixing the substrate releasably is installed. In FIG. 1, the X-axis direction and the Y-axis direction are directions along the surface of the substrate and are orthogonal to each other.

  As shown in FIG. 1, the electronic component mounting apparatus 101 includes a board 24 along the board conveyance direction B, which is a leftward direction in the X-axis direction in the figure, at the end on the front side of the base 24 in the Y-axis direction in the figure. A substrate transport device 30 is provided for transporting the substrate, supplying the substrate to the substrate holding table 28, and discharging the substrate from the substrate holding table 28. The substrate transport device 30 includes a loader 32 that is an example of a loader unit that transports and supplies a substrate from the right end in the X-axis direction of the electronic component mounting apparatus 101 to the substrate holding table 28 on the XY table 26. An unloader 34, which is an example of an unloader unit that transports and discharges the substrate, is provided from the substrate holder 28 to the left end of the electronic component mounting apparatus 101 in the X-axis direction in the figure. In the present embodiment, the XY table 26 in the electronic component mounting apparatus 101 is an example in which the XY table 26 is also used as the board holding and moving apparatus included in the board carrying apparatus 30. The XY table 26 and the substrate support 28 are an example of a substrate holding and moving device that performs the above movement and holding of the substrate. Further, instead of the case of being used in this way, even if the substrate holding / moving device is provided in the substrate transporting device 30 separately from the XY table 26 in the electronic component mounting apparatus 101. Good.

  The electronic component mounting apparatus 101 shown in FIG. 1 is a perspective view in a state where a casing cover that covers the entire upper surface of the base 24 is removed in consideration of the convenience of the description of the configuration.

  Next, the mounting operation of the electronic component 2 on the substrate in the electronic component mounting apparatus 101 having such a configuration will be described.

  In the electronic component mounting apparatus 101 of FIG. 1, the board holding table 28 is moved by the XY table 26 so as to be positioned between the loader 32 and the unloader 34 on the base 24. At the same time, a substrate on which each electronic component 2 is to be mounted by the electronic component mounting apparatus 101 is supplied to the loader 32 of the substrate transport apparatus 30 from, for example, another apparatus adjacent to the electronic component mounting apparatus 101. The substrate is transported in the substrate transport direction B by the loader 32, and the substrate is supplied to the substrate holder 28 and held. Thereafter, the XY table 26 is moved in the X-axis direction or the Y-axis direction shown in the drawing, and the substrate is moved to the substrate mounting region.

  On the other hand, in the component supply device 4, one plate is selected from each plate stored in the lifter device 10 and is taken out and placed in the plate placement device 12. Thereafter, the electronic component 2 is sucked and held by the reversing head device 14 from the arranged plate, and the electronic component 2 is reversed and moved to the component supply position. In addition, the mounting head unit 20 is moved to the component supply position by the X-axis robot 22 in the mounting unit 5, and the electronic component 2 is delivered from the reversing head device 14 to the mounting head unit 20. Thereafter, the mounting head portion 20 in a state where the delivered electronic component 2 is sucked and held is moved by the X-axis robot 22 to above the board mounting area.

  After that, the electronic component 2 sucked and held by the mounting head unit 20 and the position where the electronic component 3 is to be mounted on the board held by the board holding base 28 are aligned by moving the XY table 26. Is called. After this alignment, the mounting head unit 20 is moved up and down, and the mounting operation of the electronic component 2 on the substrate is performed. In the case where the mounting operation of the plurality of electronic components 2 is performed, the mounting operation of each electronic component 2 is performed by repeatedly performing each of the above operations.

  Thereafter, when the mounting operation of each electronic component 2 is completed, the substrate on which each electronic component 2 is mounted is placed between the loader 32 and the unloader 34 by the XY table 26 together with the substrate holding table 28. The substrate is moved to the position, and the substrate is transferred from the substrate holder 28 to the unloader 34, and the substrate is transported along the substrate transport direction B by the unloader 34, and the substrate is discharged from the electronic component mounting apparatus 101. The discharged board is supplied to, for example, another apparatus that is installed adjacent to the electronic component mounting apparatus 101 and performs the next processing of the component mounting, or a board storage apparatus or the like as a board on which the component has been mounted. Or is stored.

  In this way, in the electronic component mounting apparatus 101, the operation of mounting each electronic component 2 on the board is performed. In addition, after the board | substrate with which each electronic component 2 was mounted is discharged | emitted by the unloader 34, when another new board | substrate is supplied by the loader 32, each electronic component is sequentially supplied with respect to each board | substrate. Implementation of 2 is performed.

(About parts supply equipment)
Next, the detailed configuration of the component supply device 4 included in the electronic component mounting apparatus 101 that performs such a configuration and component mounting operation will be described, particularly focusing on the lifter device 10 and the plate arrangement device 12 and the related components. To do. FIG. 2 shows a semi-transparent perspective view of the lifter device 10 and the plate placement device 12 in such a component supply device 4.

  As shown in FIG. 2, in addition to the lifter device 10 and the plate placement device 12 described above, the component supply device 4 further holds and takes out each plate stored in the lifter device 10, and the plate placement device 12. A plate moving device 40 for moving the plate is provided. Further, the plate moving device 40 can move the plate so as to hold the plate placed on the plate placing device 12 and store it again in the lifter device 10.

  First, the lifter device 10 is a magazine cassette which is an example of a storage body having a box-like shape in which a plurality of the wafer supply plates and the plurality of tray supply plates are mixedly mounted and stacked in the vertical direction. 50 and the magazine cassette 50 are supported, and the magazine cassette 50 is moved up and down so that one of the plates stored in the magazine cassette 50 can be taken out by the plate moving device 40. A cassette lifting / lowering part 51 which is an example of a storage body lifting / lowering part positioned at a certain lifting / lowering height position, and a base to which the cassette lifting / lowering part 51 is attached and which can guide the lifting / lowering operation of the magazine cassette 50 by the cassette lifting / lowering part 51 52.

  Here, an enlarged perspective view (semi-transparent perspective view) of the magazine cassette 50 is shown in FIG. As shown in FIG. 3, in the magazine cassette 50, the C direction shown in the drawing is the direction in which the respective plates are taken out from the plate placement device 12 (hereinafter, referred to as plate take-out direction C). Further, the magazine cassette 50 is provided with side wall portions 50a so as to face each other in the direction orthogonal to the plate take-out direction C, and along the plate take-out direction on the side surfaces facing each other of the side wall portions 50a. A plurality of groove portions 50b are formed. Each of the plates (hereinafter referred to as plate 6) is held and accommodated in the magazine cassette 50 by engaging with the groove portion 50b of the respective side wall portion 50a at the opposite end portions thereof. In addition, each groove part 50b is formed with a fixed space | interval pitch in each side wall part 50a, and the plate 6 is in a state where the surface of the plate 6 is substantially horizontal while being engaged with each groove part 50b. Has been. Further, each plate 6 is in a state capable of moving forward and backward (that is, sliding) along the plate extraction direction while being guided along the forming direction of each groove 50b. Further, in the magazine cassette 50, since each of the stored plates 6 is taken out, a side wall portion is not provided on the plate taking-out direction C side so as not to obstruct the taking out, and the magazine cassette 50 is always open. It is said that it was in the state. In FIG. 3, the plate 6 stored in the upper part of the figure is the wafer supply plate 6w, and the plate 6 stored in the lower part of the figure is the tray supply plate 6t.

  Next, FIG. 4 is a perspective view of the wafer supply plate 6w, and FIG. 5 is a perspective view of the tray supply plate 6t. The structure of each plate will be described.

  As shown in FIG. 4, the wafer supply plate 6 w has a substantially disc shape having an outer peripheral portion in which a linear portion and a curved portion are combined. Further, the respective end portions opposed to each other across the plate extraction direction C are considered to be engaged with the respective groove portions 50b of the magazine cassette 50, thereby forming the linear outer peripheral portion. Further, as shown in FIG. 4, the wafer supply plate 6w is a stretchable sheet, and a wafer sheet 8 on which a dicing wafer 7 is stuck and placed, and an annular plate In addition, a wafer ring 9 that holds the wafer sheet 8 in the vicinity of the outer peripheral end thereof is provided so that the wafer 7 is positioned inside the annular shape. Since the wafer supply plate 6w is formed in this way, by extending the wafer sheet 8 radially, the arrangement positions of the respective wafer supply components 2w arranged in a grid can also be extended radially. It is possible to perform so-called expansion.

  On the other hand, as shown in FIG. 5, the tray supply plate 6t has an outer diameter similar to that of the wafer supply plate 6w described above. Thus, the wafer supply plate 6w and the tray supply plate 6t can be mixed and stored in the common magazine cassette 50. Further, as shown in FIG. 5, the tray supply plate 6t has a substantially same outer peripheral shape as the wafer ring 9, and a tray ring 59 which is an annular plate having a substantially square inner peripheral hole portion. A tray mounting portion 58 is provided which is attached to the inner peripheral hole portion and detachably mounts a plurality of component supply trays 57. The tray placing portion 58 is formed so as to be one step lower than the surface of the tray ring 59. When the component supply tray 57 is placed, each tray supply stored in the component supply tray 57 is performed. The upper surface height position of the component 2 t is formed to be substantially the same as the surface height position of the trailing ring 59. By being formed in this way, the height position of the tray supply component 2t in the tray supply plate 6t is set to a height position substantially the same as the height position of the wafer supply component 2w in the wafer supply plate 6w. . In FIG. 5, four component supply trays 57 having a substantially square planar shape are arranged in two rows and placed on the tray placing portion 58. In addition, instead of the case where the tray mounting portion 58 is formed separately from the trailing ring 59 and attached to the inside of the trailing ring 59, the tray mounting portion 58 is formed integrally with the trailing ring 59. It may be the case. As shown in FIG. 5, the position in the vicinity of the end of the tray ring 59 on the plate take-off direction C side of the tray supply plate 6t is the holding position of the tray supply plate 6t by the plate moving device 40. In this portion, an identification hole 56 for identifying the tray supply plate 6t is formed. In the wafer supply plate 6w shown in FIG. 4, the identification hole 56 for the identification is not provided although the portion is in the holding position. As will be described later, this is for discriminating between the tray supply plate 6t and the wafer supply plate 6w based on the presence or absence of the identification hole 56.

  Further, as shown in FIG. 6, the cassette lifting / lowering portion 51 in the lifter device 10 is provided with a cassette support base 51 a that places and holds the magazine cassette 50 on the upper surface thereof. Here, the magazine cassette 50 handled in the lifter device 10 has a plurality of types of sizes, for example, a 6-inch size, an 8-inch size, or a 12-inch size. In order to detect such a difference in the size of each magazine cassette 50, the upper surface of the cassette support base 51a is detected on the upper surface of the cassette support base 51a by detecting the difference in the respective planar sizes. A 6-inch cassette detection sensor 53a, an 8-inch cassette detection sensor 53b, and a 12-inch cassette detection sensor 53c that can detect the size are installed.

  Next, a semi-transparent perspective view of the plate placement device 12 is shown in FIG. As shown in FIG. 7, the plate placement device 12 is an example of a plurality of elastic support members that can support the placed plate 6 from the lower surface side in the vicinity of the outer peripheral portion and the support height position is variable. The plate support 60 and the plate 6 supported by these plate support 60 are pressed from the upper surface side in the vicinity of the outer periphery so as to be sandwiched between the upper ends of the respective plate support 60. The plate pressing body 61 that holds the support position of the plate 6 and the pressing body lifting / lowering unit 62 that moves the plate pressing body 61 up and down are provided.

  As shown in FIG. 7, the plate pressing body 61 has a semicircular cutout portion, and a pair of symmetrical shapes arranged so that the cutout portions face each other in the same plane. It is a plate. Further, since the semicircular cutout portion is formed in this way, each plate pressing body 61 is pressed by contacting the lower surface thereof only with the upper surface of the wafer ring 9 of the wafer supply plate 6w. In addition, only the upper surface of the tray ring 59 of the tray supply plate 6t can be pressed against its lower surface. Moreover, in the plate arrangement | positioning apparatus 12, the four plate support parts 60 are provided, and each plate support part 60 is a part which presses the wafer ring 9 or the tray ring 59 of each plate press body 61, for example. It is arranged below. Thereby, it is possible to support the wafer ring 9 or the tray ring 59 on each lower surface side by the respective plate support portions 60. It is desirable that the plate support portions 60 are disposed at substantially equal intervals along the outer periphery of the wafer ring 9 or the tray ring 59 disposed above the plate support portions 60. In addition, as shown in FIG. 7, the plate placement device 12 has a tapered slope at the top end on the left side in the Y-axis direction in the vicinity of the circumference where each plate support 60 is placed. The taper support part 65 which is an example of another elastic support member which has an edge part and with which the edge part of the plate 6 contact | abuts in the said inclination edge part is provided.

  Further, the plate placement device 12 is configured so that the wafer sheet 8 between the outer periphery of the wafer 7 and the inner periphery of the wafer ring 9 in the wafer supply plate 6w in a state where the wafer ring 9 is supported by the respective plate support portions 60. The expansion member 63 includes an annular contact portion that can contact the lower surface at its upper end, and an arrangement frame 64 that fixes and supports the expand member 63 on its upper surface. In addition, in the plate arrangement | positioning apparatus 12, the two press body raising / lowering parts 62 are attached to the arrangement | positioning frame 64, and are attached to each side surface in the X-axis direction of the arrangement | positioning frame 64 in FIG. Yes. In addition, each plate pressing body 61 is integrally moved up and down by each pressing body lifting section 62.

  Next, FIG. 8 shows an enlarged cross-sectional view of the arrangement portion in a state where the wafer supply plate 6w is arranged in the plate arrangement apparatus 12 having such a configuration, and FIG. 8 shows the arrangement portion in a state where the tray supply plate 6t is arranged. FIG. 9 shows an enlarged cross-sectional view.

  First, as shown in FIG. 8, the expanding member 63 having an annular shape is provided with a flange portion 63b formed in the lower portion in the outer peripheral direction, and the plate support portion 60 and the taper support portion 65 are respectively connected to the flange portion 63b. It is attached to the flange part 63b so that raising and lowering is possible. The plate support portion 60 has a shaft-like support pin 60b having a support end portion 60a having a flat or moderately raised shape at the top end of the plate support portion 60, and the support pin 60b always attached to the flange portion 63b. An urging spring 60c disposed on the outer periphery of the support pin 60b is provided so as to be urged. Note that the upper limit position in the upward biasing of the support pin 60b by the biasing spring 60c is mechanically limited. Further, in FIG. 8, the plate support portion 60 is attached to the flange portion 63 b of the expanding member 63 via the attachment member 66, and is formed on the inner peripheral surface of the pin hole portion 66 a formed in the attachment member 66. Along with this, the raising and lowering of the support pins 60b can be guided. Therefore, when an external force is applied downward to the support end portion 60a, the biasing spring 60c is contracted and the support pin 60b is lowered along the inner peripheral surface of the pin hole portion 66a, and the external force is weakened. Alternatively, by being released, the biased spring 60c that has been shrunk is extended, and the support pin 60b is raised along the inner peripheral surface of the pin hole portion 66a.

  Further, the taper support portion 65 also has a mechanism based on the same concept as each plate support portion 60 except for the shape of the upper end portion thereof, and as shown in FIGS. A pin 65b, an urging spring 65c, a mounting member 67, and a pin hole portion 67a are provided. Further, the upper end portion is an inclined end portion 65a having a tapered shape, and this angular resistance is reduced by contacting the outer peripheral end portion of the wafer ring 9 to the inclined surface of the inclined end portion 65a. By utilizing this, it is possible to hold the support position in the direction along the surface of the wafer ring 9. As shown in FIGS. 7, 8, and 58, the taper support portion 65 is provided with a guide portion 65d for guiding the raising and lowering of the support pin 65b. As shown in FIG. 8, the expanding member 63 has an annular tip 63 a formed on the upper portion thereof, and the tip 63 a is a wafer between the outer periphery of the wafer 7 and the inner periphery of the wafer ring 9. It can come into contact with the lower surface of the sheet 8.

  In such a configuration, the wafer ring 9 in a state of being supported by being sandwiched between the lower surface of each plate pressing body 61 and each plate supporting portion 60 is used for each plate pressing body 61 by the pressing body lifting / lowering portion 62. As the wafer ring 9 is lowered, the wafer sheet 8 is extended radially while the tip 63a of the expanding member 63 is brought into contact with the lower surface of the wafer sheet 8 and lowered with the lowering operation. Can be made. Thereby, the arrangement positions of the respective wafer supply components 2w adhered to the upper surface of the wafer sheet 8 are also radially extended, and so-called expansion of the wafer 7 can be performed. As shown in FIG. 7, a lower limit position of the lowering of each plate pressing body 61 is brought into contact with the lower surface of each lowering plate pressing body 61 below the plate pressing body 61 on the upper surface of the arrangement frame 64. A plurality of expand lower limit stoppers 68 capable of regulating the above are attached, and the lower limit position is regulated in this way, so that the range of extension of the wafer sheet 8 in the expand can be regulated.

  Next, FIG. 9 shows a state in which the tray supply plate 6t is arranged on the plate arrangement device 12 having the above-described configuration. As shown in FIG. 9, the tray supply plate 6 t is supported so that the tray ring 59 is sandwiched between each plate pressing body 61 and the support end 60 a of each plate support 60. Further, since the outer peripheral end portion of the trailing ring 59 is in contact with the inclined surface of the inclined end portion 65a of the taper support portion 65, the support position in the direction along the surface of the trailing ring 59 is held by the angular resistance. Yes. In addition, the tray mounting portion 58 located at a height lower than the tray ring 59 is disposed inside the annular expanding member 63. Further, in the holding state of the tray supply plate 6t, a gap is secured between the leading end portion 63a of the expanding member 63 and the lower surface of the tray ring 59 located above the expanding member 63 so as not to contact each other. Yes. Thereby, when the front-end | tip part 63a contacts the trailing ring 59, it can prevent that the said front-end | tip part 63a being damaged. In addition, such a clearance is ensured by restricting the lowered position of each plate pressing body 61 by another member. This regulation method will be described with reference to a partially enlarged perspective view of the plate arrangement device 12 shown in FIG.

  As shown in FIG. 10, an intermediate stopper driving unit that is an example of a regulating unit that regulates the lowered position of each plate pressing body 61 is located in the vicinity of the front end of the arrangement frame 64 of the plate arrangement device 12. 69 is provided. The intermediate stopper drive unit 69 includes an intermediate stopper 69a, which is an example of a contact portion disposed near the left front end in the figure on the upper surface of the arrangement frame 64, and an abutment for moving the intermediate stopper 69a along the end. And a stopper moving part 69b which is an example of a contact part moving mechanism. The stopper moving portion 69b includes, for example, a cylinder that can be driven in the vertical direction by supplying and exhausting compressed air, and a link mechanism that is attached to the cylinder and mechanically transmits the driving of the cylinder to the intermediate stopper 69a. It is comprised by. Here, FIG. 11 shows a schematic explanatory diagram for explaining the operation of the intermediate stopper driving unit 69.

  As shown in FIG. 11, a regulation pin 61 a is provided at the lower part of the plate pressing body 61. When the plate pressing body 61 is lowered, the restriction pin 61a is disposed so that the lower end thereof can come into contact with the upper end of the intermediate stopper 69a. On the other hand, the stopper moving portion 69b is a position below the restriction pin 61a along the upper surface of the arrangement frame 64, and a contact position where the intermediate stopper 69a can come into contact with the restriction pin 61a and the restriction pin 61a are lowered. However, the intermediate stopper 69a can be moved back and forth between the intermediate stopper 69a and the retracted position where the contact with the regulation pin 61a can be retracted. Accordingly, by lowering each plate pressing body 61 in a state where the intermediate stopper 69a is located at the retracted position, the state of the wafer supply plate 6w shown in FIG. 8 can be achieved. In a state where the plate pressing body 61 is moved to the above-mentioned contact position, the intermediate stopper 69a and the regulation pin 61a are brought into contact with each other to regulate the lowering position of each plate pressing body 61. 9 can be in the state of the tray supply plate 6t. That is, in the state where the intermediate stopper 69a and the regulation pin 61a are in contact with each other, the gap is secured between the trailing ring 59 and the tip 63a of the expanding member 63 as shown in FIG. Yes. In the plate placement device 12, an intermediate stopper driving unit 69 is individually provided so that the lower limit position of the lowering of each plate pressing body 61 can be regulated, and the intermediate stopper driving units 69 are synchronized with each other. Driven.

  Here, FIG. 13 shows an air circuit diagram of the pressing body lifting / lowering unit 62. As shown in FIG. 13, the pressing body lifting / lowering unit 62 includes a plurality of cylinders 71 that can be driven by supply / exhaust of compressed air, and is a lifting / lowering compressed air supply line 73 that is an example of a lifting / lowering compressed air supply unit. The supplied air is selectively passed through the ascending regulator 75 or the descending regulator 76 by the electromagnetic valve 77 and is supplied to the respective cylinder portions 71 to selectively perform the ascending or descending operation. Is possible.

  On the other hand, in such an elevating mechanism using compressed air, there is a problem of how to perform an emergency stop for safety. In general, in the case of an emergency stop, measures are taken to stop the supply of compressed air from the ascending / descending compressed air supply line 73 and to exhaust all the compressed air in each cylinder portion 71. Yes. By taking such a measure, there is an advantage that when each plate pressing body 61 is lowered downward, it cannot be suddenly raised. However, when each of the plate pressing bodies 61 is positioned above, if such a measure is taken, each of the plate pressing bodies 61 will move downward as a result of the emergency stop. Become. In this case, there is a problem that each plate pressing body 61 mistakenly sandwiches a plate positioned below the plate pressing member 61, for example, a plate 6 that has been conveyed halfway due to a movement error or the like. Can happen and become very dangerous.

  Therefore, in this embodiment, the structure which can hold | maintain the position, without lowering each plate press body 61 of the state located upwards by an emergency stop is taken. Specifically, by using a mechanical lock valve 70 which is an example of a compressed air selection valve, when the switch portion 70a of the mechanical lock valve 70 mechanically enters, the compression for lifting to the respective cylinder portions 71 through the lifting regulator 75 is performed. The compressed air is supplied from the air line 73, and another compressed air having a lower pressure than the compressed air for raising and lowering is supplied from the holding compressed air line 72 through the holding regulator 74 to each cylinder portion 71. To supply. The pressure of the compressed air for holding is such a pressure that can hold the lift position of each plate pressing body 61 and cannot be raised. The holding regulator 74 is an example of a holding compressed air supply unit.

  As shown in FIG. 12 which is a partially enlarged perspective view of FIGS. 10 and 10, the mechanical lock valve 70 is fixed to the arrangement frame 64 with the switch portion 70 a facing downward, and the plate pressing body 61. Is attached with a contact bar 78 having a contact portion capable of pressing the switch portion 70a. Further, when the plate pressing body 61 is positioned above the raising / lowering range, the contact portion of the contact bar 78 presses the switch portion 70a so that the switch portion 70a is inserted. When it is positioned below the lifting range, the contact portion of the contact bar 78 is not in contact with the switch portion 70a, and the switch portion 70a is not included. With this configuration, when the plate pressing body 61 is positioned above (for example, the upper limit position) in the ascending / descending range, the holding regulator 74 from the holding compressed air line 72 in FIG. When the compressed air for holding is supplied to the respective cylinder portions 71 through the mechanical lock valve 70, and the plate pressing body 61 is positioned below the elevation range (for example, a position other than the upper limit position). The up and down compressed air is selectively supplied from the up and down compressed air line 73 through the ascending regulator 75 or the descending regulator 76 by the electromagnetic valve 77.

  Next, a perspective view of the plate moving device 40 is shown in FIG. As shown in FIG. 14, a chuck portion 41 that is an example of a holding portion that releasably holds the plate 6, an arm mechanism 42 that has a substantially L-shape in plan and is attached to the tip of the chuck portion 41, A moving unit 44 that is an example of a holding unit moving unit that moves the arm mechanism 42 forward and backward in the Y-axis direction is provided. The moving part 44 is fixed to one end of the ball screw shaft part, a ball screw shaft part 44a disposed in the Y-axis direction, a nut part 44b screwed to the ball screw shaft part 44a, and the ball screw shaft part. There is provided a moving motor 44c for rotating the nut portion 44b in the Y-axis direction in the drawing by rotating the shaft 44a around its axis. Further, the end of the arm mechanism 42 on the side where the chuck portion is not attached is fixed to the LM block 43a, and the LM block 43a extends along the LM rail 43b arranged in the Y-axis direction in the figure. The movement can be guided, and the LM block 43a is fixed to the nut portion 44b and moved together with the nut portion 44b, so that the arm mechanism 42 can be moved.

  Further, as shown in FIG. 14, adjacent to the chuck portion 41, the held plate 6 is the wafer supply plate 6 w or the tray supply plate 6 t based on the shape of the end of the plate 6. A plate identification sensor 41b, which is an example of a plate identification unit that identifies whether or not, is attached to the arm mechanism 42. The plate identification sensor 41b is not formed in the wafer ring 9 in FIG. 4, and the presence or absence of the identification hole 56 formed in the trailing ring 59 in FIG. 5 is identified by using a transmission type sensor. The plate 6 is identified. Further, a plate presence / absence detection sensor 41 a for detecting whether or not the chuck portion 41 holds the plate 6 is attached to the arm mechanism 42 on the opposite side of the plate identification sensor 41 b with the chuck portion 41 interposed therebetween. The plate presence / absence detection sensor 41a uses a transmission type sensor to detect the presence / absence of the plate 6 based on whether or not light from the sensor is detected by the edge of the wafer ring 9 or the trailing ring 59. Note that, based on the identification result of the plate identification sensor 41b, the movement position of the intermediate stopper 69a by the intermediate stopper driving unit 69 in the plate placement device 12 is determined.

  As shown in FIG. 14, the arm mechanism 42 is configured to automatically center the position in the X-axis direction while mechanically converging the shaking in the X-axis direction of the chuck unit 41 in the X-axis direction. 42a. Such a centering mechanism is not limited to the illustrated X-axis direction, and may be such that centering in the illustrated Y-axis direction is performed. Furthermore, the arm mechanism 42 includes a collision detection sensor 42b that can detect that the arm mechanism 42 interferes (collises) with other components on the back side in the Y-axis direction in the drawing. When the collision is detected by the collision sensor 42b, the movement of the moving unit 44 is stopped to prevent a failure of the apparatus due to the collision or damage of each electronic component 2 being held. .

  Next, a method for placing each component supply tray 57 on the tray supply plate 6t will be described. FIG. 15 is a partially enlarged perspective view of the tray mounting portion 58, and FIG. 16 is a schematic explanatory view of a cross section of the tray mounting portion 58.

  As shown in FIG. 15, the tray mounting portion 58 is disposed in parallel with each other along the direction orthogonal to the plate take-out direction C, and is in contact with the respective opposite end portions of the component supply tray 57, Two holding members capable of holding the arrangement position are attached so as to sandwich the component supply tray 57. In addition, the holding member arranged on the side in the plate take-out direction C of the two holding members is individually so as to urge the component supply tray 57 to the end portion on the contact side with the component supply tray 57. A slide-side holding member 80 (which is an example of a movable-side holding member) having two slide portions 80a that can be slid to each other. The fixed-side holding member 81 fixes the arrangement position of the component supply tray 57. With this configuration, the component supply tray 57 is inserted from above the tray mounting portion 58 so as to slide the slide portions 80a of the slide-side holding member 80 in the plate take-out direction C. The component supply tray 57 can be placed on the tray placing portion 58 by being sandwiched between the side holding member 80 and the fixed side holding member 81. As shown in FIG. 16, the abutting portions of the slide-side holding member 80 and the fixed-side holding member 81 with the end portions of the component supply tray 57 are inclined so as to face each other. The component supply tray 57 is prevented from popping out from the tray mounting portion 58. In FIG. 15, a total of four component supply trays 57 are arranged in two rows on the tray mounting portion 58, so that the fixed-side holding member 81 is connected to the component supply tray 57. Another component supply that is provided adjacent to the component supply tray 57 in the plate take-out direction C by providing each slide portion 80a of the slide-side holding member 80 at the end opposite to the contact side end. The tray 57 (not shown) is configured to have a function as a slide side holding member 80. Further, instead of the case where each slide portion 80a is slidably provided on the slide-side holding member 80, as shown in FIG. 17, a slide portion 80b having two contact portions is integrally provided. It may be the case. Moreover, the case where the locking mechanism which can lock the sliding operation | movement of each slide part 80a with which the slide side holding member 80 is equipped may be provided.

  In addition, there is a case where the component supply tray 57 in which the minute components 2 are arranged is placed on the tray supply plate 6t. In particular, such a minute component 2 may jump out of the component supply tray 57 even if a minute vibration is applied to the component supply tray 57, and the tray supply plate 6t of such a component supply tray 57 is considered. Care must be taken when placing the unit on the head.

  In particular, in the mounting method of the component supply tray 57 as shown in FIG. 16, the operator holds the component supply tray 57 with one hand, and slides the slide-side holding member 80 with the other hand. Work using both hands is required, the work state becomes unstable, and vibration may be applied to the component supply tray 57.

  Therefore, for example, as shown in FIG. 57, the operator holds the component supply tray 57 with one hand or both hands, and slides the slide side holding member 80 at the end of the component supply tray 57 to If the supply tray 57 is placed, the placing operation can be performed in a more stable state.

  In addition, since it may be necessary for the operator to hold the tray supply plate 6t with the other hand, the operator's finger is placed in the vicinity of the center portion like the tray supply plate 206t shown in FIG. A plurality of holding holes 293 may be formed. In such a case, the holding can be performed more reliably, and the jump-out of the minute parts can be surely prevented.

(About the operation of the parts supply device)
Next, an operation from taking out each plate 6 from the magazine cassette 50 in the component supply device 4 having such a configuration to arranging the respective electronic components 2 on the plate placement device 12 so as to be taken out will be described.

  First, in FIG. 2, the magazine cassette 50 is raised or lowered by the cassette lifting / lowering portion 51 of the lifter device 10, and the plate 6 to be taken out from the magazine cassette 50 is positioned at the height position of the chuck portion 41 of the plate moving device 40. Let me. At the same time, each plate pressing body 61 is raised to the upper limit position of the lifting and lowering by the pressing body lifting / lowering section 62 in the plate placement device 12. At this time, the switch portion 70a of the mechanical lock valve 70 is pressed by the abutment bar 78 so that the switch portion 70a is inserted, and the compressed air for holding the respective cylinder portions of the pressing body lifting / lowering portion 62. 71, the lift position of each plate pressing body 61 is held at the upper limit position of the lift.

  Next, the arm mechanism 44 is moved to the left in the Y-axis direction in FIG. Thereafter, when the vicinity of the outer peripheral edge of the plate 6 to be taken out from the magazine cassette 50 is detected by the plate presence / absence identification detection sensor 41 a installed adjacent to the chuck portion 41, the vicinity of the outer peripheral portion is detected by the chuck portion 41. Retained. At the same time, the plate identification sensor 41b installed adjacent to the chuck portion 41 identifies whether the held plate 6 is the wafer supply plate 6w or the tray supply plate 6t. The Thereafter, the movement of the arm mechanism 42 toward the right in the Y-axis direction by the moving unit 44 is started, and the held plate 6 is moved along the respective groove portions 50b of the magazine cassette 50 and taken out.

  Thereafter, the plate 6 held by the chuck portion 41 is moved so as to pass between each plate pressing body 61 and each plate support portion 60 of the plate placement device 12, and each plate support portion 60 performs the movement. The plate 6 is stopped at a position where it can be supported. Thereafter, each plate pressing body 61 is lowered by the pressing body elevating part 62 to push down the upper surface of the outer peripheral part of the plate 6 and to bring the lower surface of the outer peripheral part into contact with the upper end of each plate support part 60. Thus, the plate 6 is held so as to be sandwiched between the respective plate pressing bodies 61 and the respective plate support portions 60. At the same time, the holding of the plate by the chuck portion 41 is released, and the arm mechanism 42 is moved to the right in the Y-axis direction in FIG. 2 by the moving portion 44, so that the planar position interference between the chuck portion 41 and the plate 6 occurs. It stops at the position where there is no more.

  On the other hand, in response to the identification result of the type of the plate 6 by the plate identification sensor 41b, the movement position of the intermediate stopper 69a is determined by the intermediate stopper driving unit 69. First, when the plate 6 is the wafer supply plate 6w, the intermediate stopper 69a is moved to the retracted position, and the contact between the respective regulation pins 61a and the intermediate stopper 69a is retracted. State. Thereafter, the respective plate pressing bodies 61 are further lowered, the respective plate support portions 60 are pushed down, and the wafer sheet 8 is stretched with the tip portion 63a of the expanding member 63 as a fulcrum, and the expansion is performed. . Each lowered plate pressing body 61 is brought into contact with each expanding lower limit stopper 68 and its lower limit position is regulated. In this state, the lowering of each plate pressing body 61 is stopped. In such a state, each wafer supply component 2w can be taken out and supplied from the wafer supply plate 6w, and each wafer supply component 2w is pushed up from below the wafer sheet 8 and pushed up. Is held by the reversing head device 14 to take out the respective wafer supply components 2w.

  On the other hand, in the case where the plate 6 is the tray supply plate 6t, the intermediate stopper 69a is moved to the contact position, and the contact between the respective regulation pins 61a and the intermediate stopper 69a is possible. State. Thereafter, the respective plate pressing bodies 61 are further lowered and the respective plate support portions 60 are pushed down. The respective regulating pins 61 and the respective intermediate stoppers 69a are brought into contact with each other, and the respective plate pressing bodies 61 are lowered. The position is regulated. In this state, as shown in FIG. 9, a gap is secured between the lower surface of the trailing ring 59 and the front end portion 63 a of the expanding member 63 so as not to contact each other. Further, in such a state, the lowering of each plate pressing body 61 is stopped, and each tray supply component 2t can be taken out from the tray supply plate 6t. In such a state, the reversing head device 14 takes out the respective tray supply components 2t from the respective component supply trays 57 placed on the tray placement portion 58 by holding them.

  As described above, after each electronic component 2 is taken out from the wafer supply plate 6w or the tray supply plate 6t, each plate 6 follows the reverse of the above procedure, and the magazine is moved by the plate moving device 40. The cassette 50 is moved and stored.

  Next, the structure which makes the maintainability in the components supply apparatus 4 favorable is demonstrated.

  First, a description will be given of a plate for preventing the plates 6 stored in the magazine cassette 50 of the lifter device 10 from jumping out from the magazine cassette 50. Note that the electronic component mounting apparatus 101 shown in FIG. 1 shows a state in which a pop-out prevention plate having a conventional configuration is attached to the lifter apparatus 10.

  As shown in FIG. 18, the component supply device 4 is roughly divided into a movable lifter device 10 and other portions, and the other portions are covered with a casing 82. A door 83 that can be opened and closed in a flip-up manner is installed on the lifter device 10 side of the casing 82. A pop-out prevention plate 84 (which is also an example of a plate restricting portion) is attached to a lower portion of the door 83. Here, FIG. 19 shows an explanatory view of a schematic cross section near the door 83. As shown in FIG. 19, in a state where the door 83 is closed, each plate 6 except for the one plate 6 to be taken out, which is stored in the magazine cassette 50, is formed in the magazine cassette. The magazine cassette 50 is arranged on the left front side in the figure so as not to jump out from 50. Further, a plate outlet portion 84a is provided below the pop-out prevention plate 84, and the one plate 6 to be taken out is passed through the plate outlet portion 84a, so It can be placed.

  Further, as shown in FIGS. 20 and 21, there may be a case where another pop-out prevention plate 86 is provided below the door 83. In such a case, a plate outlet portion 86a is provided below another pop-out prevention plate 86. Furthermore, the protrusion detection part 85 which can detect the plate 6 which passes the plate extraction part 86a can be provided in the both ends of the plate extraction part 86a. Thus, in the case where the pop-out detection unit 85 is provided, as shown in FIG. 21, the door 83 is opened and the pop-out prevention plate 84 cannot fulfill its function during maintenance or the like. Even if it exists, the plate 6 jumping out from the magazine cassette 50 can be detected.

  Next, the structure which equip | installs with the components supply apparatus 4 of the lifter apparatus 10, and the apparatus cancellation | release is demonstrated.

  As shown in FIG. 22, the lifter device 10 is capable of holding the base 52 that supports the cassette lifting / lowering unit 51 together with the magazine cassette 50 and the arrangement position of the base 52 when the component supply device 4 is mounted. And a base holding frame 91 which is an example of a base holding part capable of releasing the holding and releasing the equipment. Note that the base holding frame 91 can hold the base 52 so that the base 52 is in contact with the base 52 in three directions excluding the front surface portion thereof. Further, as shown in FIG. 22, the base holding frame 91 is engaged with the lower side surface on the right side in the X-axis direction of the base 52 in the illustrated direction so that the base 52 is linearly moved, A mechanism is provided for guiding rotation, which is movement while rotating. This mechanism will be described below.

  As shown in FIG. 22, the base holding frame 91 serves as the mechanism when releasing the equipment of the base 52, that is, when moving the base 52 from the component supply device 4. It is an example of the linear motion guide part which can guide linear motion, Comprising: The linear motion guide rail 93 arrange | positioned in the Y-axis direction in the lower part vicinity, and the edge part of the Y-axis direction left side of this linear motion guide rail 93 in the illustration Y-axis direction A rotation guide rail 94 which is an example of a rotation guide unit capable of guiding the rotation of the bases 52 arranged so as to be adjacent to each other is provided. Further, below the side surface of the base 52 on the side in contact with the mechanism, the linear motion is guided while being in contact with the linear motion guide rail 93, and is engaged with the rotation guide rail 94. A first guide roller 92, which is an example of an engaging portion that is guided to rotate in a state of being, is attached. Further, two LM rails 96 arranged along the Y-axis direction in the figure are fixed to the side surface of the base 52. Further, an LM block 97 is engaged with each of the two LM rails 96 so as to be movable along the respective LM rails 96. Each of the LM blocks 97 is fixed to a rotation shaft 98 attached to the base support frame 91, and is rotatable about the axis of the rotation shaft 98 as a rotation center. In addition, four moving rollers 99 are installed on the bottom surface of the base 52, and the base 52 is supported by the respective moving rollers 99 so as to be movable. Further, a second guide roller 99 that can contact the lower portion of the side surface of the base 52 and guides the linear movement of the base 52 is installed outside the rotation guide rail 94.

  In such a configuration, the operation of releasing the above-described holding of the base 52 held by the base holding frame 91 from the component supply device 4 will be described. Further, FIG. 23 shows such a series of operation states displayed in a planar manner.

  As shown in FIGS. 22 and 23, in a state where the base 52 is held by the base holding frame 91, the first guide roller 92 abuts in the vicinity of the end on the far side of the linear guide rail 93. In addition, each LM block 97 is positioned in the vicinity of the front end portion of each LM rail 96. In this state, the holding position is fixed on the rear side surface of the base 52 by a holding mechanism provided in the base holding frame 91 (not shown).

  In order to start the movement of the base 52, first, the holding by the holding mechanism is released. Thereafter, the base 52 that has been released from the holding is started to move to the left in the Y-axis direction in FIG. As a result, the first guide roller 92 is guided to rotate while being in contact with the linear motion guide rail 94, and the linear motion of the base 52 is guided. Further, the second guide roller 95 is rotated while the side surface of the base 52 is in contact with the base 52 to guide the linear movement of the base 52. Each LM rail 96 travels while being guided by each LM block 97. At this time, since the rotation of the base 52 is restricted by the first guide rail 92 and the linear motion guide rail 93, the rotation shaft 98 cannot rotate.

  Thereafter, when the first guide roller 92 passes through the front end portion of the linear motion guide rail 93 and the contact with the linear motion guide rail 93 is released, the rotational guide rail 94 is moved to the first position. One guide roller 92 is engaged. As a result, the restricted rotation is made possible, and the base 52 is rotated while the first guide roller 92 is guided by the rotation guide rail 94. At this time, since the LM block 97 is fixed to the rotation shaft 98, the LM block 97 is rotated around its rotation center. In this way, the base 52 is rotated, and as shown in FIG. 23, the base 52 is pulled out from the component supply device 4 while being rotated approximately 90 degrees in a plane. it can.

(Effect by embodiment)
According to the above embodiment, the following various effects can be obtained.

  First, since the lower position of each plate pressing body 61 in the plate placement device 12 of the component supply device 4 can be selectively restricted by the intermediate stopper drive unit 69, the type of the plate 6 placed in the plate placement device 12 Accordingly, the tray supply plate 6t can be reliably held by restricting the lowered position, and the wafer supply plate 6w can be reliably held by releasing the restriction of the lowered position. However, the wafer sheet 8 can be stretched and expanded. Therefore, an appropriate holding operation and expanding operation can be selectively and automatically performed according to the type of the plate 6 to be arranged and supplied, and the parts can be supplied efficiently.

  Further, the type of the plate 6 is identified adjacent to the chuck portion 41 that grips the end portion of the plate 6 when each plate 6 mixedly mounted in the magazine cassette 50 is taken out by the plate moving device 40. The plate identification sensor 41b can be used. Specifically, an identification hole 56 is provided only at the end of the plate 6 for the tray supply plate 6t, and the presence / absence of the identification hole 56 is identified by the plate identification sensor 41b. Can be identified. Further, by determining the moving position of the intermediate stopper 69a by the intermediate stopper driving unit 69 based on the identification result, the lowering position of each plate pressing body 61 can be selectively controlled.

  Further, the respective plate pressing bodies 61 are arranged so that the tip 63a of the expanding member 63 that expands by contacting the wafer sheet 8 of the wafer supply plate 6w does not contact the lower surface of the tray supply plate 6t. Since the lowering position is regulated, it is possible to prevent the tip of the expanding member 63 from being damaged.

  Moreover, in the plate arrangement | positioning apparatus 12, each plate 6 is supported in the outer peripheral part vicinity of each plate 6 by providing the some plate support part 60 which the support height position was made variable. In addition, it is possible to freely change the support height position while performing the above-mentioned support in accordance with the raising / lowering operation of each plate pressing body 61, and the above-described effects can be achieved. .

  In addition, since the tapered support portion 65 having the inclined end portion 65a is provided at the tip thereof, the end portion of the plate 6 is brought into contact with the inclined end portion 65a, and the direction along the surface of the plate 6 is caused by the angular resistance. The supporting position can be held, and a reliable and accurate holding is possible.

  Further, in the tray mounting portion 58 of the tray supply plate 6t, the slide-side holding member 80 and the fixed-side holding member 81 are provided in the direction orthogonal to the plate extraction direction C, so that the component supply tray 57 is provided. The component supply tray 57 can be held so that the component supply tray 57 is sandwiched between the slide side holding member 80 and the fixed side holding member 81. The space required for mounting can be reduced. Accordingly, a total of four component supply trays 57 can be mounted in two rows on the tray mounting portion 58 of the tray supply plate 6t, and the area accommodation rate of the component supply tray 57 in the tray supply plate 6t can be improved. it can.

  In addition, in the conventional parts supply device, since the pop-out prevention plate for preventing the jump-out of each plate from the magazine cassette is attached to the lifter device, during the maintenance, the pop-out prevention plate becomes an obstacle and the plate There has been a problem that it is difficult to perform maintenance of the placement device and the like. However, in the present embodiment, since the pop-out prevention plate 84 is provided on the door 83, the pop-out prevention plate 84 can be moved by opening and closing the door 83, and the maintainability can be improved. . In addition, since the pop-out detecting portions 85 that can detect the plate 6 passing through the plate take-out portion 86a are provided at both ends of the plate take-out portion 86a, the door 83 is opened during the maintenance or the like to prevent pop-out. Even if the plate 84 cannot fulfill its function, the plate 6 protruding from the magazine cassette 50 can be detected, and maintenance can be improved while improving safety.

  Moreover, since the mechanism which can perform the movement at the time of equip | installing or canceling | releasing the lifter apparatus 10 with respect to the component supply apparatus 4 is provided, it can provide the lifter apparatus 10 in a narrower space. The lifter device 10 can be reliably stored and installed, or the lifter device 10 can be pulled out more easily and smoothly from the space. Therefore, even when such a component supply device 4 is arranged in a more compact space, the lifter device 10 can be easily put in and out and the maintainability can be improved.

(Second Embodiment)
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, a component supply apparatus according to a second embodiment of the present invention will be described below. The component supply device of the second embodiment is the same as the component supply device 4 of the first embodiment, although the basic configuration is the same although the following partial configuration is different. For the purpose of facilitating understanding, the same reference numerals are assigned to the same components as those of the component supply device 4 of the first embodiment.

  In the component supply device 204 shown in FIG. 24, the lifter device 10 is provided with a magazine cassette 250 that stores a plurality of wafer supply plates and a plurality of tray supply plates in a mixed manner. As in the first embodiment, the magazine cassette 250 is provided with side wall portions 250a so as to face each other in the direction orthogonal to the plate take-out direction C, and the plate take-out side is provided on each of the mutually facing side surfaces. A plurality of groove portions 250b are formed along the direction C. Further, each plate is held by the magazine cassette 250 by being engaged with and supported by the respective groove portions 250b of the respective side wall portions 250a that are disposed so as to be opposed to each other at both ends facing each other. Each of these groove portions 250b is an example of a support guide portion. In addition, each groove part 250b is formed in each side wall part 250a with a fixed space | interval pitch, and each plate has a substantially horizontal surface in a state of being engaged with and held by each groove part 250b. It is said that. Furthermore, each plate is in a state capable of moving forward and backward (that is, sliding) along the plate extraction direction C while being guided along the forming direction of the pair of grooves 50b facing each other.

  FIG. 25 is a partial sectional view of the side wall 250a of the magazine cassette 250. As shown in FIG. 25, the side wall portion 250a is integrally formed by using Duracon (registered trademark, DURACON: POM: Polyoxymethylene), which is a thermoplastic resin, on an aluminum plate 250c, which is a metal material. Each formed groove portion 250b has a fixed structure. Since this Duracon has a feature that its surface hardness is lower than that of a stainless steel material (for example, JIS standard: SUS304) which is a forming material of the tray ring 59 and the wafer ring 9, it is a soft material. Even when 250b and the plate 6 are in contact with each other on their respective contact surfaces, the amount of chips and the like generated due to the contact wear can be reduced. Also. By using the thermoplastic resin material, it is possible to easily form each groove 250b having a structure in which a plurality of concave and convex portions are continuous. Note that the combination of the forming materials such as the respective groove portions 250b and the trailing ring 59 is not limited to the above combination. It is only necessary that the hardness of the forming material of each groove portion 250b is lower than that of the forming material of the trailing ring 59, and various other combinations can be adopted under such conditions.

  Further, FIG. 26A shows a side view of one groove portion 250b showing a more detailed structure of each groove portion 250b, and FIG. 26B shows a front view thereof. In addition, although each groove part 250b is integrally formed, in order to make an understanding of the description of the structure of the groove part 250b easy in the following, in FIG. 26A and FIG. 26B, the said one groove part 250b is shown. The figure is cut out and displayed.

  As shown in FIG. 26A, the end of the groove 250b on the side of the plate extraction direction C, that is, the insertion end portion 250d of each plate 6 is an inclined surface that is slightly inclined with respect to the plate extraction direction C. A surface (which is an example of a smooth surface portion) is formed. In addition, as shown in FIG. 26B, the inclined surface includes a lower inclined surface 250e inclined downward in the figure, which is a direction perpendicular to the surface of the plate 6 with respect to the plate extraction direction C, and the plate 6 approximately. It is comprised by the side part side inclined surface 250f inclined in the illustration left direction which is a direction along the surface.

  In this manner, the lower end inclined surface 250e and the side inclined surface 250f are formed at the insertion end portions 250d of the respective groove portions 250b, so that the plate 6 is inserted in the direction opposite to the illustrated plate extraction direction C. Even in such a case, friction due to contact between the end portion of the plate 6 and the insertion end portion 250d of each groove portion 250b that supports and guides the plate 6 can be reduced, and smooth insertion of the plate 6 is realized. can do. Further, when the plate 6 is inserted, in the direction orthogonal to the plate take-out direction C, the position shift between the support position of the plate 6 by each groove 250b and the position where the plate 6 is inserted into each groove 250b. Even when such a situation occurs, there is an effect that the plate 6 is inserted while being guided by the lower-side inclined surface 250e and the side-side inclined surface 250f, and the above-described positional deviation can be corrected.

  Next, FIG. 27 shows an external perspective view of the tray supply plate 6t. 27. Four connecting portions (R) of mutually opposing ends (linearly formed ends) and partial arc-shaped ends along the plate extraction direction C of the tray ring 59 of the tray supply plate 6t shown in FIG. ), A corner portion of the lower end portion thereof is scraped off to form a smooth surface portion 59a constituted by a smooth curve. Since each of such connecting portions R is a contact portion with each set of groove portions 250b of the magazine cassette 250, as shown in FIG. 28, in the state of being supported by each groove portion 250b, the plate extraction direction C Even when the tray supply plate 6t is moved forward and backward along the line, the frictional force between the respective smooth surface portions 59a and the groove portions 250b can be reduced. Therefore, when each tray supply plate 6t is inserted into or removed from the magazine cassette 250, it is possible to reduce the amount of chips generated due to contact wear between the tray supply plate 6t and each groove 250b. The formation of the smooth surface portion 59a in the tray supply plate 6t is effective when applied to the tray supply plate 6t having a feature that its weight is heavier than that of the wafer supply plate 6w. The respective smooth surface portions may be formed on the plate 6w to further reduce the amount of chips generated.

  Further, as shown in FIG. 29, in each groove portion 250b of the magazine cassette 250, a plurality of roller portions 250g as an example of a rotating member that supports each plate 6 and guides the movement along the plate extraction direction C. May be provided. By providing each of such roller portions 250g, the frictional force due to the contact between each plate 6 and the groove portion 250b can be remarkably reduced, and the generation of chips and the like due to the contact is suppressed. be able to. In addition, as shown in FIG. 30, each such roller part 261a supports each plate 6 in the lower surface of the plate press body 261 of the plate arrangement | positioning apparatus 212 in which each plate 6 is inserted and arrange | positioned. It may be provided. In such a case, not only the magazine cassette 250 but also the plate placement device 12 can reduce the generation amount of chips and the like due to contact wear of each plate 6.

  Here, in the side wall part 250a of the magazine cassette 250, each groove part 250b is formed in the aluminum plate 250c using Duracon which is a thermoplastic resin, and the tray ring 59 and the wafer ring 9 are formed of a stainless material. The case where it forms with another material instead of the case where it exists is demonstrated.

  As described above, by forming each groove 250b with resin, it is possible to reduce the amount of chips and the like due to contact with each plate 6, but at the site of component mounting, the magazine cassette 250 Considering versatility, there are many requests to make the magazine cassette 250 as standard as possible. In such a case, conversely, the selection of the respective forming materials is made so that the surface hardness of the forming material of each plate 6 is lower than the forming material of the respective groove portions 250b in the magazine cassette 250. By doing so, the same effect as the above can be obtained.

  Specifically, as shown in the external perspective view of the plate of FIG. 42, for example, the tray supply plate 306t, the opposite ends 359b along the plate extraction direction C of the tray ring 359 are made of resin, for example, PEEK resin. Form. Further, as shown in a side view (including a partial cross section) of the tray supply plate 306t in a state of being supported by each groove 350b of the magazine cassette as viewed from the plate take-out direction C in FIG. 42, each groove 350b is made of aluminum. It is formed with. As shown in FIG. 43, the main body 359a of the trailing ring 359 is formed of, for example, an aluminum plate, and each end of the main body 359a is bent to form a stepped portion 359c. A plate made of PEEK resin is attached to the stepped portion 359c by, for example, screwing, whereby each end portion 359b is formed.

  In this way, the end portion 359b of the tray ring 359 and the respective groove portions 350b of the magazine cassette are configured, so that the magazine cassette that is required to be versatile is not specially specified, such as chips due to mutual contact wear. The amount of generation can be reduced. Note that a simple surface treatment may be performed on the surface of the end portion 359b of the trailing ring 359 or the surface of each groove 350b of the magazine cassette.

  Next, a configuration for realizing a measure for preventing the tray supply component 2t from popping out from the tray supply plate 6t in the component supply device 204 of the second embodiment will be described.

  Although details have not been described in the first embodiment, the plate 6 supplied to the plate arranging device 212 is disposed on the lower surface of the plate pressing body 261 of the plate arranging device 212 as shown in the schematic diagram of FIG. Is provided at each of the opposite ends thereof. Further, each of these support portions 261b constitutes a concave portion whose surfaces facing each other are opened with the lower surface of the plate pressing body 261, and the end portion of the plate 6 can be inserted and supported in the concave portion. It is possible. Further, as shown in FIG. 31, each of the recesses has a thickness of the plate 6 so that the plate 6 in which the end portion is inserted and supported in the recess can be easily slid. It is formed so as to have a sufficient margin.

  In the plate arrangement device 212 having such a configuration, operations and problems when the configuration of the second embodiment to be described later is not described will be described with reference to FIGS.

  First, the tray supply plate 6t supplied to the plate arrangement device 212 is supported by the respective support portions 261b of the plate pressing body 261. In this state, the upper surface of the end portion of the tray supply plate 6t and the lower surface of each plate pressing body 261 are not in contact with each other, and a gap is secured. Thereafter, when each plate pressing body 261 is lowered by the pressing body lifting / lowering portion 62, the lower surface of the end portion of the tray supply plate 6t comes into contact with each plate supporting portion 60. By further descending, as shown in FIG. 32, the end portion of the tray supply plate 6t is supported while being sandwiched between the lower surface of each plate pressing body 261 and each plate support portion 60. . In such a state, the end portion of the tray supply plate 6t is in a state of being lifted from the respective support portions 261b. On the contrary, when the respective plate pressing bodies 261 are raised from such a state, the lower surface of the tray supply plate 6t is lifted from the respective plate support portions 60 as shown in FIG. At that time, the tray supply plate 6t vibrates in the vertical direction in each of the recesses. In such a case, as shown in FIG. 33 and FIG. 34, there may be a problem that the tray supply component 2t protrudes from the component supply tray 57 due to the vibration. In such a case, smooth component supply is hindered.

  A configuration in the second embodiment for achieving such a measure for preventing the tray supply component 2t from popping out will be described below.

  As shown in FIG. 35, each plate pressing body 261 in the plate placement device 212 has a tray supply plate 6t supported by each support portion 261b or supported by each plate support portion 60. An urging portion 261c that is an example of an urging member that urges the support portion 261b or the plate support portion 60 by always pressing downward from the upper surface thereof is provided. Two urging portions 261c are provided in each plate pressing body 261.

  Here, an enlarged external view of the urging portion 261c is shown in FIG. As shown in FIG. 36, the urging portion 261c is brought into contact with the upper surface of the tray supply plate 6t, and the urging roller portion 262 that can be rotated along the plate take-out direction C, and the urging roller portion 262. A rotary member 263 that is rotatably provided at one end thereof, and is supported by a rotary member 263 that is rotatably supported in a plane substantially perpendicular to the plate 6 with the intermediate position as a fulcrum, and the rotary member 263 as a plate pressing body 261. A fixing member 264 that rotates and urges the rotation member 263 so that the urging roller portion 262 is always urged downward with the intermediate position as a fulcrum.

  As shown in FIG. 37 and FIG. 38, by providing such an urging portion 261c, the lower surface of the end portion of the tray supply plate 6t is always provided regardless of the position of raising and lowering each plate pressing body 261. Since it can be pressed and urged so as to come into contact with the respective support portions 261b or the plate support portion 60, it can be reliably prevented from moving up and down due to vibration in the recess. Therefore, the vertical movement of the tray supply plate 6t accompanying the raising and lowering of the plate pressing body 261 can be reliably prevented, and the occurrence of the tray supply component 2t protruding from the component supply tray 57 can be reliably prevented. Further, the urging roller portion 262 can rotate along the surface of the tray supply plate 6t with the urging roller portion 262 urged so as to press the upper surface of the tray supply plate 6t downward. In addition, since the rotation direction is along the plate take-out direction C, the supply / placement operation of the tray supply plate 6t to the plate placement device 212 or the take-out operation of the tray supply plate 6t from the plate placement device 212 is performed. At this time, each of the urging roller portions 262 is configured not to obstruct each of the above operations. In the above description, the tray supply plate 6t having the characteristic that the weight of each plate 6 is relatively heavy has been described. However, the same can be applied to the wafer supply plate 6w. Note that the number of the urging portions 261c is not limited to the above four, but is preferably three or more in order to stably support the plane. However, when the shape of the urging portion in the urging portion has a relatively large area such as a rod shape or a U shape, for example, even when only one or two pieces are installed. Good.

  Next, a description will be given of a configuration in which the tray supply plate 206t having a feature that its weight is relatively heavier than that of the wafer supply plate 6w can be reliably pulled out from the magazine cassette 250.

  First, FIG. 39 shows a plan view of the tray supply plate 206t, FIG. 40 shows a plan view of the chuck portion 241 that releasably holds the tray supply plate 206t, and FIG. 40 shows the tip portion of the chuck portion 241 shown in FIG. A cross-sectional view is shown in FIG. As shown in FIG. 39, at the upper end of the tray ring 259 in the tray supply plate 206t in the drawing, unlike the tray supply plate 6t of the first embodiment, an elongated slot 291 (an example of an engaging portion). Are) further formed. As shown in FIGS. 40 and 41, a protrusion 241 c that can be engaged with the elongated hole 291 is formed at the tip of the chuck 241. Note that a plate presence / absence detection sensor 241a and a plate identification sensor 241b are provided on both sides of the chuck portion 241 as in the first embodiment.

  In this way, at the holding position of the tray supply plate 206t by the chuck portion 241, the long hole portion 291 is formed, and the long hole portion 291 is engaged with the protrusion 241 c formed at the tip of the chuck portion 241. Thus, since the tray supply plate 206t can be held by the chuck portion 241, the tray supply plate 206t having a characteristic that its weight is relatively heavy can be reliably held.

  Further, by forming the long hole portion 291 in the wafer supply plate 6w in addition to the protrusion 241c of the chuck portion 241, the wafer supply plate 6w can be reliably held. Further, since the protruding portion of the chuck portion 241 is formed only on the side in contact with the upper surface of the wafer supply plate 6w, the wafer sheet 7 is not damaged during the engagement.

  As shown in FIG. 37, the tray supply plate 206t can be reduced in weight by forming a plurality of holes 292 in the tray supply plate 206t.

  According to the second embodiment, when the tray supply plate 6t having the feature that its weight is heavier than that of the wafer supply plate 6w is inserted into the magazine cassette 250 and stored, or when it is taken out from the magazine cassette 250. Even if each groove part 250b and the plate 6 are moved in contact with each other, the amount of chips generated due to the sliding wear can be significantly reduced.

  Further, unlike the wafer supply plate 6w, the tray supply plate 6t is configured to be capable of storing a large number of types of components in a single tray supply plate 6t, so that the removal of a certain type of component is completed. Each time the tray supply plate 6t is stored in the magazine cassette 250, and then different parts are taken out from the stored tray supply plate 6t, the magazine cassette 250 is taken out again. It also has the feature that the frequency of Thus, even when the frequency of taking in and out is high, since the measures for suppressing the generation of chips are taken, the occurrence of drive troubles due to the generation of chips and the deterioration of maintainability are prevented. In the component supply apparatus in which the wafer supply plate 6w and the tray supply plate 6t are mixedly mounted, the maintainability can be improved and the efficient component supply can be realized.

  Further, the vibration generated in the tray supply plate 6t as the plate pressing bodies 261 are moved up and down can be reliably prevented by providing each plate pressing body 261 with an urging portion 261c. It is possible to reliably prevent the tray supply component 2t from jumping out from the component supply tray 57, and to prevent the adverse effects of the mixed supply of the wafer supply plate and the tray supply plate. Can be realized.

  Further, by forming a long hole portion 291 that can be engaged with the protruding portion 241c of the chuck portion 241 in the tray supply plate 206t, the tray supply plate 206t is held by the chuck portion 241 while both are engaged with each other. Thus, the tray supply plate 206t having the characteristic of being relatively heavy can be reliably and stably held.

(Third embodiment)
Next, a component supply apparatus according to a third embodiment of the present invention will be described below. Although the component supply device of the third embodiment is different from the component supply device 4 of the first embodiment in the following partial configuration, the basic configuration is common, so that the following description will be given. For the purpose of facilitating understanding, the same reference numerals are given to the same components as those of the component supply device 4 of the first embodiment.

  Prior to the description of the component supply device of the third embodiment, there are some possibilities that may arise when the component supply device 4 of the first embodiment performs random access to each plate 6. Explain the problem.

  First, as shown in the perspective view of the component supply device 4 in FIG. 2, each plate 6 accommodated in the magazine cassette 50 is taken out and moved while being held by the plate moving device 40, and is arranged on the plate arranging device 12. For example, since the plate 6 has a substantially disk shape, the plate 6 is horizontal to the plate extraction direction C in the magazine cassette 50 as shown in the schematic diagram of FIG. In such a case, contact (or collision) between the peripheral portion of the plate 6 and the groove portion of the magazine cassette 50 occurs, and the play of the plate 6 is not stable. May occur. In particular, when the plate 6 is a tray supply plate 6t on which a plurality of tray supply components 2t are placed on the upper surface thereof, each of the trays described above is caused by the occurrence of the rattling. The supply component 2t may scatter from the tray supply plate 6t.

  Further, in order to make random access to the plurality of plates 6 accommodated in the magazine cassette 50 more effective for component mounting, the magazine cassette 50 has a narrow pitch between the grooves 50b. In order to increase the number of grooves 50b formed, a larger number of plates 6 can be accommodated. However, such a narrow pitch of the intervals between the groove portions 50b is such that the grooves facing each other as shown in the schematic explanatory view of FIG. 45 when the operator accommodates the plates 6 in the magazine cassette 50. It may be difficult to support and store the plate 6 in the 50b, and it may be difficult to store the plate 6 in a horizontal support posture in the magazine cassette 50 (that is, in an obliquely inserted state). In such a case, an obstacle occurs in the operation of taking out the plate 6 from the magazine cassette 50.

  Accordingly, in the third embodiment, various problems due to the accommodation posture of each plate 6 in the magazine cassette 50 are solved, and the respective plates 6 are smoothly taken out from the magazine cassette 50. The idea of making random access more effective will be described.

  A schematic explanatory view of the magazine cassette 450 viewed from the front side of the magazine cassette 450 provided in the component supply apparatus according to the third embodiment is shown in FIG.

  As shown in FIG. 46, a large number of groove portions 450b arranged opposite to each other are formed inside each side wall portion 450a of the magazine cassette 450, and the plate 6 is placed in each set of groove portions 450b facing each other. By supporting the respective end portions, it is possible to accommodate the plate 6 while maintaining a substantially horizontal posture. Further, a back side wall portion 450c is also provided on the back side of the magazine cassette 450 in the figure, and the back side wall portion 450c is engaged with the end portion of the plate 6 so that the horizontal posture of the plate 6 and the plate A posture guide unit 490 is provided that enables the horizontal posture with respect to the take-out direction C to be maintained in a normal posture.

  More specifically, although not described in detail in the first embodiment, as shown in FIG. 5, the end of the tray supply plate 6t opposite to the plate takeout direction C (that is, the trailing ring). A posture guide block 59 a that can be engaged with the posture guide portion 490 is formed on the lower surface of the end portion 59.

  Here, FIG. 47 shows an enlarged plan view of the engagement state between the posture guide block 59a provided in the tray supply plate 6t and the posture guide portion 490 provided in the back side wall portion 450c of the magazine cassette 450. . 48 is a detailed front view of the magazine cassette 450 in the same direction as FIG. 46, and FIG. 49 is a cross-sectional view taken along the line V-V in the magazine cassette 450 of FIG.

  As shown in FIGS. 48 and 49, a plurality of posture guide portions 490 are arranged in the vertical direction near the center of the back side wall surface 450c of the magazine cassette 450 at the same interval pitch as the formation interval pitch of the respective groove portions 450b. Are arranged in a row. In addition, as shown in FIG. 47, the posture guide portion 490 has, for example, a screw on the back side wall surface 450c so that the two pin-like members 491 in a bent state face each other and keep a predetermined distance. It is formed by being attached by a stopper or the like. Further, the predetermined interval between the respective pin-shaped members 491 is substantially the same as the formation width of the posture guide block 59a of the tray supply plate 6t in the vicinity of the back side wall part 450c, and from the back side wall part 450c. As the distance increases, the distance is increased.

  As described above, each of the magazine cassettes 450 is provided with each posture guide portion 490, and each tray supply plate 6t is provided with the posture guide block 59a. As shown in FIG. 47, the tray supply plate 6t in a state in which the opposite ends are supported is further engaged with the posture guide block 59a and the posture guide portion 490, whereby the tray supply plate 6t is removed. The normal posture can be maintained in the horizontal direction with respect to the direction C, and the support posture by the respective groove portions 450b can be maintained in a horizontal posture. In particular, since the interval between the pin-like members 491 in the posture guide portion 490 is tapered as shown in FIG. 47, the posture guide block 59a and the posture guide portion 490 can be easily engaged. And the posture of the tray supply plate 6t inclined in the horizontal direction with respect to the plate take-out direction C can be engaged while correcting in this engagement process.

  Since the support posture of each plate 6 accommodated in the magazine cassette 450 is maintained in a normal state as described above, the respective plates 6 are taken out from the magazine cassette 450 as shown in the schematic diagram of FIG. Can be performed smoothly, and it is possible to prevent the component 2 from jumping out of the tray supply plate 6t. Therefore, random access to each plate 6 accommodated in the magazine cassette 450 can be performed efficiently, and efficient component supply can be realized.

  In the above description, the case where the plate 6 is the tray supply plate 6t has been described as a representative, but the wafer supply plate 6w can have the same configuration.

  Further, in the magazine cassette 450 in which such a wafer supply plate 6w and tray supply plate 6t are accommodated, there is a concern that the influence on each component 2 due to the charging of the magazine cassette 450 may be concerned. For example, the charge amount is usually about 400V to 600V. As shown in FIG. 56, the bottom of the magazine cassette 450 includes, for example, three connection blocks 471 (an example of a fixing portion) for connecting (fixing) the magazine cassette 450 and the base 52. It has been. In order to prevent the influence on the component due to such charging, for example, at least one of the three connection blocks 471 is formed of a conductive material, thereby functioning as a ground terminal portion. The magazine cassette 450 can be grounded, and the charge amount can be reduced to about several volts, for example, about 2V.

  In the above description, the case where the posture guide portion 490 is formed on the back side wall surface 450c of the magazine cassette 450 has been described. However, the third embodiment is not limited to such a case. Instead of such a case, a magazine cassette that can improve the workability while obtaining the effect of the above-described posture guide unit 490 will be described as a modification of the fourth embodiment.

  In a component supply apparatus or a component mounting apparatus in which a magazine cassette that accommodates a large number of plates 6 is used, it is necessary to replace or replenish each plate 6 accommodated in the magazine cassette. Therefore, for efficient component mounting and component supply, it is required to improve the workability in replacing the plate 6 with respect to such a magazine cassette.

  However, in the magazine cassette 500 as shown in the schematic diagram of FIG. 51, the rear side wall surface 500c is fixed to the main body of the magazine cassette 500 when viewed from the plate take-out direction C of the magazine cassette 500. For replacement or the like, the magazine cassette 500 is positioned at a predetermined position by the cassette lifting / lowering unit 51, the magazine cassette 500 is removed from the base 52, and the magazine cassette 500 is opened from the opening in the plate extraction direction C side. It is necessary to replace the plate 6 or the like. In addition, such a magazine cassette is generally heavy, and for example, has a weight of about 20 to 30 kg. Therefore, such an operation of detaching the magazine cassette 500 by an operator hinders improvement in work efficiency. It becomes a factor. Further, removing the magazine cassette 500 also stops the operation of the component supply apparatus, and from this point of view, improvement in work efficiency is desired. The present modification aims to solve various problems in random access and realize further improvement in work efficiency.

  First, FIG. 52 shows a schematic perspective view of a magazine cassette 550 according to this modification, and FIG. 53 shows a schematic explanatory view of a cross-sectional view of this magazine cassette 550.

  As shown in FIGS. 52 and 53, in the magazine cassette 550, the back side wall surface with respect to the plate extraction direction C is an open / close cover portion 550c which is an example of an openable / closable door portion. It has a different configuration from the magazine cassette 450 of the third embodiment. In addition, as with the back side wall surface 450c of the magazine cassette 450, a posture guide portion 590 for keeping the support posture of each plate 6 in a normal posture is provided inside the open / close cover portion 550c. .

  Since the opening / closing cover portion 550c is provided in this manner, each plate 6 can be replaced by opening the opening / closing cover portion 550c without removing the magazine cassette 550 from the base 52. It becomes. Therefore, workability in such replacement work can be remarkably improved. In addition, since each posture guide portion 590 is provided in the opening / closing cover portion 550c, each plate 6 is accommodated in the magazine cassette 550, and then the opening / closing cover portion 550c is closed, so that each plate 6 The posture guide block and the posture guide portion 590 of the opening / closing cover portion 550c can be engaged, and the posture of each plate 6 can be kept normal by the engagement.

  Further, when the plate 6 is accommodated in the magazine cassette 550 in an inclined posture instead of being in a horizontal state, the posture guide block and the posture guide portion 590 cannot be engaged with each other, and the open / close cover portion 550c is not provided. It cannot be completely closed. By utilizing such a feature, when the operator completes the replacement operation of each plate 6 in the magazine cassette 550, when the opening / closing cover portion 550c is closed, it is confirmed whether or not it is completely closed. It becomes possible to determine whether each plate 6 is accommodated in a normal posture.

  In this case, instead of the case where the operator visually confirms the open / close state of the open / close cover portion 550c, the open / close cover portion 550c is provided with an open / close detection sensor 580 capable of detecting the open / close state. May be. For example, as shown in FIGS. 52 and 53, the opening / closing cover portion 550c is provided with a detection portion 580a of the opening / closing detection sensor 580, and when the opening / closing cover portion 550c is closed, the detection portion 580a can be detected. The detection unit 580b can be provided on the main body side of the magazine cassette 550.

  By detecting the opening / closing in a controlled manner as described above, it is possible to prevent an operator's visual error and the like, and to perform reliable detection. For example, the opening / closing detection sensor 580 closes the opening / closing cover portion 550c. It is also possible to provide an interlock circuit that activates the component supply device only after detecting this.

  Further, as shown in FIG. 53, in a state where each plate 6 in which the magazine cassette 550 is accommodated by the cassette elevating part 51 can be replaced, for example, at the origin position, the magazine cassette 550 is moved by the plate moving device 40. A plate accommodating portion 570 in which the plate 6 can be taken in and out is provided at the lower portion of the magazine cassette 550. For example, only one plate 6 can be accommodated in the plate accommodating portion 570, and each plate 6 is being replaced with respect to the magazine cassette 550 positioned at the origin position. However, the plate 6 accommodated in the plate accommodating portion 570 is taken out by the plate moving device 40 to supply the component 2, and the plate 6 to which the component 2 has been supplied is accommodated in the plate accommodating portion 570. It is possible to make it.

  Since the magazine cassette 550 is provided with such a plate storage portion 570, it can be stored in the plate storage portion 570 even while the plates 6 stored in the magazine cassette 550 are being replaced. By using the plate 6 that has been made, component supply can be continued, and efficient component supply can be performed.

  54A and 54B are partial enlarged views (left side and right side) of the respective side wall portions 550a at the opening end portion of the opening / closing cover portion 550c in the main body portion of the magazine cassette 550. As shown in FIGS. For example, a step number may be displayed for each pair of the groove portions 550b provided in the cassette 550 that face each other. In such a case, when the worker accommodates each plate 6 in the magazine cassette 550, it is possible to prevent the right and left groove portions 550b from being mistaken in the number of stages.

  The procedure for exchanging each plate 6 accommodated in the magazine cassette 550 using the respective configurations as described above is shown in the flowchart of FIG. 55 as a plate exchanging operation process (or component supply operation process). .

  As shown in FIG. 55, plate replacement work is started in step S1. This work start can be performed, for example, by operating a control device or the like provided in the component mounting apparatus as a replacement work mode. Next, in step S2, the magazine cassette 550 is moved up and down by the cassette lifting / lowering unit 51 and positioned at the origin position.

  Thereafter, in step S3, the open / close cover portion 550c of the magazine cassette 550 is opened, and each plate 6 is exchanged. At this time, in the case where there is a plate 6 that is in the process of supplying components in the plate placement device 12, and when the supply of the components is completed, the plate 6 is stored in the plate storage unit 570 by the plate moving device 40. (Step S4).

  When the replacement operation of each plate 6 is completed, the step number in which each plate 6 is accommodated is confirmed in step S5 to confirm that it is not accommodated in an oblique posture. Thereafter, by closing the opening / closing cover portion 550c and confirming the closing, it is possible to confirm that the respective plates 6 are accommodated in a normal posture. The confirmation of the closing can also be performed by the open / close detection sensor 580 as described above. Thereby, plate exchange operation is completed (step S7).

  By performing the plate replacement operation in such a procedure, the respective plates can be replaced smoothly and efficiently without interrupting the component supply operation by the component supply device, and more efficient. Parts can be supplied.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

  Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as being included therein, so long as they do not depart from the scope of the present invention according to the appended claims.

1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention. It is an expansion semi-transparent perspective view of the component supply apparatus with which the electronic component mounting apparatus of FIG. 1 is provided. It is a semi-transparent perspective view of the magazine cassette in the lifter apparatus of the said component supply apparatus. It is a perspective view of the plate for wafer supply handled with the said component supply apparatus. It is a perspective view of the plate for tray supply handled with the said component supply apparatus. It is a perspective view of the cassette raising / lowering part in the said lifter apparatus. It is a perspective view of the plate arrangement | positioning apparatus of the said component supply apparatus. It is sectional drawing of the state by which the said plate for wafer supply was arrange | positioned at the said plate arrangement | positioning apparatus. It is sectional drawing of the state by which the said plate for tray supply was arrange | positioned at the said plate arrangement | positioning apparatus. It is a partial expansion perspective view of the said plate arrangement | positioning apparatus. It is a schematic explanatory drawing of the intermediate stopper drive part in the said plate arrangement | positioning apparatus. It is a perspective view which shows the attachment state of the mechanical lock valve in the said plate arrangement | positioning apparatus. It is an air circuit of the press body raising / lowering part in the said plate arrangement | positioning apparatus. It is a perspective view of the plate moving apparatus in the said component supply apparatus. It is a partial expansion perspective view of the said tray supply plate. It is a schematic cross section of the tray supply plate. It is a partial expansion perspective view of the said tray supply plate. It is a perspective view of the said component supply apparatus. It is a perspective view of the pop-out prevention plate of the said component supply part. It is a perspective view of the said component supply apparatus of the state in which the door provided with the said pop-out prevention board was closed. It is a perspective view of the said component supply apparatus of the state by which the door provided with the said pop-out prevention board was open | released. It is a perspective view which shows the relationship between the base in the said lifter apparatus, and a base support frame. It is a schematic plan view which shows the locus | trajectory of the drawer | drawing-out operation | movement of the said base. It is an expansion semi-transparent perspective view of the components supply apparatus concerning 2nd Embodiment of this invention. It is sectional drawing of the side wall part of the magazine cassette with which the components supply apparatus of FIG. 1 is provided. It is a side view of a groove part showing a groove part of a magazine cassette. It is a front view of the groove part of FIG. 26A which shows the groove part of a magazine cassette. It is an external appearance perspective view of a tray supply plate. FIG. 28 is a schematic cross-sectional view showing a state in which the tray supply plate of FIG. 27 is supported by the groove portion. It is a fragmentary sectional view which shows the form of the groove part concerning the modification of the said 2nd Embodiment, and is a figure which shows the form of the groove part provided with a roller part. It is a fragmentary sectional view in the state where the roller part was provided in the plate pressing body. It is a schematic cross section of a state where a tray supply plate is supported by each support part of a plate pressing body. It is a schematic cross section in the state where the tray supply plate is supported by the plate support part. FIG. 6 is a schematic cross-sectional view showing a state where the support of the tray supply plate by the plate support portion is released and component jumping occurs. FIG. 6 is a schematic cross-sectional view showing a state where the support of the tray supply plate by the plate support portion is released and component jumping occurs. It is an external appearance perspective view of a plate arrangement | positioning apparatus. It is an external appearance perspective view of the energizing part with which a plate press object is provided. FIG. 37 is a schematic cross-sectional view showing a support state of the tray supply plate when the urging portion of FIG. 36 is equipped, and a view showing a state in which the tray supply plate is supported by each support portion. FIG. 37 is a schematic cross-sectional view showing a support state of the tray supply plate when the urging portion of FIG. 36 is installed, and a view showing a state where the tray supply plate is supported by each plate support portion. It is a top view of a tray supply plate provided with a long hole part. It is a top view of a chuck | zipper part provided with a projection part. It is sectional drawing in the front-end | tip of the chuck | zipper part of FIG. It is a perspective view of the tray supply plate concerning the modification of the said 2nd Embodiment. 43 is a side view of the tray supply plate of FIG. 42. FIG. It is a schematic explanatory diagram for explaining a problem that may occur in the case of taking out a plate by random access, and the plate is taken out in a state where the plate is inclined in the horizontal direction with respect to the plate taking out direction. FIG. It is a schematic explanatory drawing which shows the state in which the plate was accommodated in the magazine cassette in the diagonal attitude | position. It is a typical side view of the magazine cassette concerning a 3rd embodiment of the present invention. It is an enlarged plan view of the attitude | position guide part with which the magazine cassette of FIG. 46 is provided. It is the side view seen from the plate extraction direction side of the magazine cassette of FIG. It is the VV sectional view taken on the line of the magazine cassette of FIG. It is a schematic explanatory drawing which shows the state from which the plate accommodated in the magazine cassette of FIG. 46 is taken out. It is a model perspective view of the magazine cassette for comparison for demonstrating the structure of the magazine cassette concerning the modification of the said 3rd Embodiment. It is a model perspective view of the magazine cassette concerning the modification of the said 3rd Embodiment. FIG. 53 is a schematic cross-sectional view showing the configuration of the magazine cassette of FIG. 52. It is a figure which shows the opening edge part for the opening / closing cover part in the main body of a magazine cassette, and is a figure which shows a left side edge part. It is a figure which shows the opening edge part for the opening / closing cover part in the main body of a magazine cassette, and is a figure which shows a right side edge part. It is a flowchart which shows the procedure of a plate exchange operation process. It is a figure which shows the bottom part of a magazine cassette. It is a figure which shows the modification of the attachment operation | work of the component supply tray to the tray supply plate of FIG. It is an enlarged side view of a taper support part.

Explanation of symbols

2 Electronic Components 2w Wafer Supply Components 2t Tray Supply Components 4 Component Supply Devices 5 Mounting Parts 6 Plates 6w Wafer Supply Plates 6t Tray Supply Plates 7 Wafers 8 Wafer Sheets 9 Wafer Rings 10 Lifter Devices 12 Plate Placement Devices 14 Reverse Head Devices 20 Mounting head portion 22 X-axis robot 24 Base 26 XY table 28 Substrate holding base 30 Substrate transport device 32 Loader 34 Unloader 40 Plate moving device 41 Chuck portion 41b Plate identification sensor 44 Moving portion 50 Magazine cassette 51 Cassette lifting / lowering portion 52 Base 56 Identification hole 57 Component supply tray 58 Tray mounting portion 59 Tray ring 60 Plate support portion 61 Plate pressing body 62 Pressing body lifting / lowering portion 63 Expanding member 64 Arrangement frame 65 Taper support portion 69 Intermediate stopper driving portion 69 Intermediate stopper 70 mechanical lock valve 72 holding the compressed air line 73 lifting compressed air line 80 slide-side holding member 81 fixed holder member 84 jump-out preventing plate 101 mounting apparatus C plate removal direction

Claims (4)

A wafer supply plate for mounting a wafer on which a plurality of wafer supply components are arranged among components mounted on a substrate, and a tray supply plate for mounting a component supply tray on which a plurality of tray supply components are arranged More, in the component supply apparatus that supplies the respective wafer supply components and the respective tray supply components in a mountable manner.
A plate storage unit including a storage body for storing a plurality of the wafer supply plates and the plurality of tray supply plates in a stacked manner;
Any one of the respective plates so that the supply height of each of the wafer supply components by the wafer supply plate is substantially the same as the supply height of the respective tray supply components by the tray supply plate. A plate placement device for selectively placing and holding the plates, and allowing each of the wafer supply components from the wafer or the tray supply components to be supplied from the component supply tray;
A plate moving device that holds the plate releasably and removes it from the storage body, and moves the plate placing device so that the plate can be held,
The plate storage part
A base that supports the storage body and the storage body lifting unit;
The arrangement position of the base can be held, the holding is released, and a linear motion guide portion that guides the linear movement of the base and the movement while rotating the base A base holding part having a rotation guide part,
The base includes an engaging portion that can selectively engage with the linear motion guide portion and the rotation guide portion, and the engagement portion is engaged with the linear motion guide portion, thereby The linear movement of the base is possible, the engagement between the engagement portion and the linear motion guide portion is released, and the engagement portion is engaged with the rotation guide portion. Thus, the component supply device can be moved while rotating the base. The plate moving device is
A holding part for releasably holding the plate;
A holding unit moving unit that moves the holding unit so as to move the plate held by the holding unit from the storage body to the plate placement device;
Each of the plates having a plate outlet portion through which the one held plate together with the holding portion can pass, and being housed in the housing body of the plate housing portion other than the one plate, is The component supply device according to claim 1, further comprising a pop-out prevention plate having a plate restricting portion formed around the take-out port portion that can be prevented from popping out from the storage body so as to be openable and closable. The plate storage portion raises or lowers the storage body so that one of the plates stored in the storage body can be held by the holding portion of the plate moving device. A storage body lifting part to be positioned,
The component supply according to claim 2, wherein each of the plates other than the one plate positioned at the elevation height position by the storage body lifting / lowering unit is prevented from jumping out of the storage body by the protrusion prevention plate. apparatus.   The said plate arrangement | positioning apparatus is a components supply apparatus of Claim 2 or 3 further equipped with the protrusion detection part which can detect the said plate located in the said extraction port part in the said protrusion prevention board.

Images