JP2007110870A5 - - Google Patents

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Publication number
JP2007110870A5
JP2007110870A5 JP2005301502A JP2005301502A JP2007110870A5 JP 2007110870 A5 JP2007110870 A5 JP 2007110870A5 JP 2005301502 A JP2005301502 A JP 2005301502A JP 2005301502 A JP2005301502 A JP 2005301502A JP 2007110870 A5 JP2007110870 A5 JP 2007110870A5
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JP
Japan
Prior art keywords
semiconductor modules
main terminals
power conversion
same polarity
conversion device
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JP2005301502A
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Japanese (ja)
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JP2007110870A (en
JP4567570B2 (en
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Claims (3)

電力変換回路における各相が、複数の半導体モジュールを電気的に並列接続してなる電力変換装置において、
上記半導体モジュールはそれぞれ、スイッチング素子と該スイッチング素子が配線により接続された複数の主端子とを有し、
上記半導体モジュール相互の同一極性の主端子同士を直接接触させて接続したことを特徴とする電力変換装置。 In the power conversion device in which each phase in the power conversion circuit is formed by electrically connecting a plurality of semiconductor modules in parallel,
Each of the semiconductor modules has a switching element and a plurality of main terminals to which the switching element is connected by wiring,
A power conversion device, wherein the main terminals of the same polarity of the semiconductor modules are connected in direct contact with each other. 上記半導体モジュールはそれぞれ、上記主端子の組を複数組有し、上記半導体モジュール相互の上記同一極性の主端子同士が鏡面対象に配列されていることを特徴とする請求項１記載の電力変換装置。 2. The power conversion device according to claim 1 , wherein each of the semiconductor modules has a plurality of sets of the main terminals, and the main terminals having the same polarity between the semiconductor modules are arranged in a mirror surface. . 上記同一極性の主端子同士の接続が、金属接合によることを特徴とする請求項１または２記載の電力変換装置。 The power converter according to claim 1 or 2 , wherein the main terminals having the same polarity are connected by metal bonding .
JP2005301502A 2005-10-17 2005-10-17 Power converter Active JP4567570B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005301502A JP4567570B2 (en) 2005-10-17 2005-10-17 Power converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005301502A JP4567570B2 (en) 2005-10-17 2005-10-17 Power converter

Publications (3)

Publication Number Publication Date
JP2007110870A JP2007110870A (en) 2007-04-26
JP2007110870A5 true JP2007110870A5 (en) 2007-11-29
JP4567570B2 JP4567570B2 (en) 2010-10-20

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JP2005301502A Active JP4567570B2 (en) 2005-10-17 2005-10-17 Power converter

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4667476B2 (en) * 2008-02-18 2011-04-13 三菱電機株式会社 Electrical component connection method and connection structure, and power conversion device using the connection structure
JP5532955B2 (en) * 2010-01-22 2014-06-25 株式会社デンソー Rotating electric machine for vehicles
JP5213884B2 (en) * 2010-01-27 2013-06-19 三菱電機株式会社 Semiconductor device module
JP5532984B2 (en) * 2010-02-04 2014-06-25 株式会社デンソー Rotating electric machine for vehicles
JP5464159B2 (en) * 2011-03-08 2014-04-09 三菱電機株式会社 Power module
CN111048491B (en) * 2012-03-01 2023-04-18 三菱电机株式会社 Power semiconductor module and power conversion device
JP2014033118A (en) * 2012-08-06 2014-02-20 Mitsubishi Electric Corp Semiconductor module pair and semiconductor device
WO2015121899A1 (en) * 2014-02-11 2015-08-20 三菱電機株式会社 Power semiconductor module
JP6223296B2 (en) * 2014-07-29 2017-11-01 三菱電機株式会社 Semiconductor device
JP2017050488A (en) 2015-09-04 2017-03-09 株式会社東芝 Semiconductor package
EP3246945B1 (en) * 2016-05-19 2018-10-03 ABB Schweiz AG Power module with low stray inductance
JP6702154B2 (en) 2016-11-21 2020-05-27 株式会社デンソー Switch drive
JP7099422B2 (en) * 2019-09-10 2022-07-12 株式会社デンソー Power converter

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5565705A (en) * 1994-05-02 1996-10-15 Motorola, Inc. Electronic module for removing heat from a semiconductor die
JP2000308364A (en) * 1999-04-22 2000-11-02 Fuji Electric Co Ltd Semiconductor power conversion circuit
JP4468614B2 (en) * 2001-07-03 2010-05-26 三菱電機株式会社 Power semiconductor device
JP2004022968A (en) * 2002-06-19 2004-01-22 Mitsubishi Electric Corp Semiconductor device and method of manufacturing the same
JP4363190B2 (en) * 2004-01-08 2009-11-11 株式会社豊田自動織機 Semiconductor device and manufacturing method thereof

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