JP2007103865A - Device for supplying/recovering flux in electronic component packaging equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To variably supply a quantity of flux required for transfer depending on the type of an electronic component with a simple structure while minimizing degradation in quality of flux itself. <P>SOLUTION: The device for supplying/recovering flux comprises a transfer belt 12 traveling in one direction and capable of mounting flux F, a flux chamber 14 having a blade 20 abutting against the surface 12A of the transfer belt 12 and capable of storing flux F, a belt guide mechanism 16 for altering the traveling direction of the transfer belt 12 from X1 to X2 at a predetermined position P1, and a drive mechanism 18 for altering the distance L1 between the blade and the predetermined position. A gap 60 is formed variably between the blade 20 and the surface 12A of the transfer belt through alteration of the distance L1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an apparatus for rationally supplying and collecting flux in an electronic component mounting apparatus.

  A mounting apparatus for mounting electronic components such as an IC, an LSI, a flip chip, a resistor chip, and a chip capacitor at a predetermined position on a substrate is disclosed. This type of mounting apparatus includes a suction head having a nozzle that vacuum-sucks these electronic components, and the suction head (specifically, a holder holding the head) in the XY direction (horizontal drive) and Z While combining the movement in the axial direction (vertical drive) and the rotation of the head itself around the Z axis (θ drive), the electronic component provided for the parts feeder is mounted on the substrate.

  As a method for mounting an electronic component, when solder bonding is employed, a method of transferring a paste-like flux to bumps on the electronic component is widely known for the purpose of improving solder bonding.

  The size of the bump of the electronic component varies depending on the type of the electronic component. Therefore, the amount of flux to be attached to the bump (necessary transfer amount of flux) needs to be changed according to the size of the bump.

  In Patent Document 1, in order to achieve this object, a flux supply device as shown in FIG. 6 is disclosed. The supply device 110 forms a plurality of flat coating film surfaces 113 b to 13 e provided at different heights with respect to the horizontal film thickness reference surface 113 a in the transfer unit 113. Here, if the sliding contact portion 114c of the squeegee 114 is moved while being in contact with the coating film reference surface 113a, a plurality of flux films having different film thicknesses can be formed on the coating film surfaces 113b to 113e.

  At the time of product type switching, an adsorption head carrying electronic parts is moved to any part of the plurality of flux films, and an appropriate amount of flux is transferred by descending there.

JP2003-142814

  In recent years, mounting of electronic parts has been increasingly in a small quantity and a wide variety, and high quality is demanded for each product. Since the flux is generally corrosive, it is necessary to perform the minimum transfer corresponding to the bump to be transferred. Accordingly, there is an increasing need to change / adjust the supply amount of flux when transferring more finely according to the type of electronic component.

  However, in the flux supply apparatus according to Patent Document 1 described above, the range of film thickness change or the amount of film thickness change per stage is limited, so an attempt was made to obtain a variety of film thicknesses. In some cases, the apparatus becomes proportionally larger and more complicated.

  In addition, due to the structure of the apparatus, it is necessary to always keep the flux thinly applied on a wide plane, and there is a problem that the quality of the flux itself is likely to deteriorate.

  The present invention has been made to solve such a conventional problem, and according to the type of electronic component, it is possible to variably supply or collect a flux amount necessary for transfer with a simple structure. It is an object of the present invention to provide a flux supply / recovery device that is capable of minimizing the deterioration of the quality of the flux itself.

  The present invention is a flux supply device in an electronic component mounting device, has a predetermined width on which flux can be placed, and is arranged so as to cover the surface of the transfer belt, the transfer belt traveling in one direction, The blade has a blade capable of coming into contact with the surface of the transfer belt, and the flux chamber capable of storing the flux, and the traveling direction of the transfer belt is changed from a predetermined position to a side opposite to the side where the flux chamber exists. A belt guide mechanism; and a drive mechanism that changes a distance between the blade and the predetermined position, and the gap between the blade and the surface of the transfer belt can be changed by changing the distance by the drive mechanism. The flux can be continuously placed and supplied on the surface of the transfer belt from the flux chamber to the flux transfer section. By the, it is obtained by solving the above problems.

  In the present invention, the transfer belt on which the flux is placed is advanced in a specific direction and supplied to the flux transfer unit. The thickness of the flux placed on the transfer belt is variably controlled by a gap formed between the blade provided in the flux chamber and the surface of the transfer belt. In the present invention, the control of the gap is not performed by a general technique of “moving the blade tip in the thickness direction of the flux (a direction perpendicular to the belt traveling direction or a direction including the component thereof)” A method of “changing the traveling direction of the transfer belt from a predetermined position to a direction opposite to the direction in which the flux chamber exists and changing the relative distance between the predetermined position and the blade” is employed. As a result, the gap between the blade and the surface of the transfer belt can be adjusted, and a very delicate fine adjustment can be realized with a simple structure.

  Further, only the flux necessary for the transfer is supplied to the flux transfer portion, and basically most of the flux is stored in the flux chamber, so that deterioration with time can be minimized.

  Various variations of the present invention are possible.

  For example, the flux chamber is disposed at a portion where the traveling direction of the transfer belt is inclined, and the traveling direction of the transfer belt is horizontally changed by an idler roller disposed at the predetermined position and constituting the belt guide mechanism. And it is good also as a structure which arrange | positions the said flux transcription | transfer part in this horizontal part.

  The drive mechanism that changes the distance between the blade and the predetermined position may move the arrangement position of the flux chamber on the transfer belt with respect to the predetermined position along with the blade. .

  The belt guide mechanism that changes the traveling direction of the transfer belt is configured by an idler roller, and the drive mechanism that changes the distance between the blade and the predetermined position sets the rotation support position of the idler roller to the blade. It may be set as the structure moved with respect to it.

  The present invention also provides a flux supply / recovery device in an electronic component mounting apparatus, having a predetermined width on which the flux can be placed, and an endlessly proceeding transfer belt, and covering the surface of the transfer belt. A flux chamber that is disposed and stores the flux and that can be supplied onto the transfer belt, and the flux remaining on the transfer belt after the transfer of the flux from a recovery port formed on the upstream side of the flux chamber. By making it possible to collect in the chamber, the above-mentioned problem is solved.

  In this case, for example, it is preferable that the arrangement position of the flux chamber can be moved further upstream along the surface of the transfer belt, and the recovery port is opened along with the movement.

  The present invention also provides a flux supply / recovery device in an electronic component mounting apparatus, having a predetermined width on which the flux can be placed, and an endlessly proceeding transfer belt, and covering the surface of the transfer belt. A flux chamber arranged and having a blade capable of contacting the surface of the transfer belt, and capable of storing flux; and a predetermined direction of the moving direction of the transfer belt from the side opposite to the side where the flux chamber exists A belt guide mechanism for changing to the above and a drive mechanism that allows the flux chamber to move along the surface of the transfer belt together with the blades, and the flux chamber on the transfer belt together with the blades during the transfer process. By moving downstream and adjusting the distance of the blade from the predetermined position, the blade A gap capable of supplying flux can be formed with the transfer belt, and after the transfer process is completed, the flux chamber is moved to the upstream side of the transfer belt together with the blade, and the blade is moved away from the predetermined position. The blade is brought into contact with the surface of the transfer belt, and the flux remaining on the transfer belt can be completely recovered from the recovery port formed on the upstream side of the flux chamber. .

  Depending on the type of electronic component, the amount of flux required for transfer can be variably supplied or recovered with a simple structure, and deterioration of the quality of the flux itself can be minimized.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings.

  2 is an overall schematic diagram illustrating an example of a flux transfer device to which a flux supply / recovery device according to an embodiment of the present invention is applied, and FIG. 3 is an oblique plan view viewed from the direction of arrow III in FIG. FIG. 1 is an enlarged view of a main part in the vicinity of the arrow I in FIG.

  The flux transfer device 10 includes a transfer belt 12, a flux chamber 14, a belt guide mechanism 16, and a drive mechanism 18.

  The transfer belt 12 has a predetermined width W1 on which the flux F can be placed (see FIG. 3), and can advance in a predetermined direction X endlessly. The flux chamber 14 is disposed so as to cover the surface 12A of the transfer belt 12, has a blade 20 capable of contacting the surface 12A of the transfer belt 12, and can store the flux F. The belt guide mechanism 16 changes the advancing direction of the transfer belt 12 by an angle α to the side opposite to the side where the flux chamber 14 exists, and is specifically constituted by an idler roller 22. Thus, the traveling direction X of the transfer belt 12 is changed from the direction X1 in the figure to the direction X2 (horizontal direction) after the predetermined position P1. The drive mechanism 18 reciprocates the flux chamber 14 together with the blade 20 along the surface 12A of the transfer belt 12 in the direction of X1 in the drawing to change the distance L1 between the blade 20 and the predetermined position P1.

  Hereinafter, the configuration of each unit will be described in more detail.

  The frame 30 is provided with a driving roller 32 and a driven roller 34 connected to the motor M1. As the driven roller 34 rotates, the transfer belt 12 rotates endlessly in a substantially triangular shape via the idler roller 36 and the idler roller 22 described above. The transfer belt 12 is stretched with a constant tension by a tensioner screw 38 attached to the shaft 36A of the idler roller 36. The width W1 of the transfer belt 12 is set larger than the width W2 of the flux chamber 14 (see FIG. 3).

  A backup plate 40 is disposed inside the transfer belt 12 between the idler rollers 36 and 22. The backup plate 40 is inclined with the idler roller 36 as a base point, and its upper surface is positioned on a tangent to the idler rollers 36 and 22. The flux chamber 14 is disposed in a portion where the traveling direction X of the transfer belt 12 is inclined in the direction (angle) X1.

  A backup plate 42 is horizontally disposed inside the transfer belt 12 between the idler roller 22 and the driven roller 34. The upper surface of the backup plate 42 is positioned horizontally on the tangent line between the idler roller 22 and the driven roller 34. The flux transfer portion A is disposed at a portion where the traveling direction of the transfer belt 12 is changed to the horizontal X2 direction by the idler roller 22.

The flux chamber 14 has four belt traveling directions with respect to X1, ie, a front wall 46, an upper wall 48, a right wall 50, and a left wall 52, and the lower surface is open to the transfer belt 12.
Of these, the front wall 46 is integrated with the blade 20, and the rear wall is also used by a collection gate 72 described later. The opening on the lower surface of the flux chamber 14 is W3 on the downstream side (supply side) in the belt traveling direction and W4 on the upstream side (collection side), and the upstream side is formed wider. The flux chamber 14 is positioned with respect to the frame 30 by the chamber hinge 54 being hooked on the chamber hook portion 55.

  Spring 58 is applied to both ends of the chamber hinge 54. The spring 58 has a function of pressing the flux chamber 14 toward the transfer belt 12 passing over the backup plate 40 via the chamber hinge 54 and the chamber hook portion 55, and the flux chamber 14 is in close contact with the surface 12 A of the flux belt 12. Yes.

  The flux chamber 14 reciprocates along the upper surface of the backup plate 40 (with each blade 20) by a chamber moving motor M2 and a chamber moving screw 59 which are main components of the drive mechanism 18. When the flux chamber 14 moves downstream and the tip 20A of the blade 20 reaches the R portion of the idler roller 22 beyond the predetermined position P1, a gap 60 is formed between the surface 12A of the transfer belt 12 and the surface. Has been. Depending on the amount of movement of the flux chamber 14, that is, the distance L1 between the tip 20A of the blade 20 and the predetermined position P1 (overhang from the predetermined position P1 of the tip 20A) L1, the height S of the gap 60 (of the flux film Ff (Corresponding to the thickness t) can be arbitrarily adjusted.

  When the transfer belt 12 rotates, the flux F in the flux chamber 14 passes through the gap 60 while adhering to the transfer belt 12. Since the flux film Ff is regulated by the gap 60 and the opening width W3 on the flux supply side, a sheet shape having a thickness t corresponding to the height S of the gap 60 on the transfer belt 12 and a width of the opening width W3 on the supply side. In this state, it is supplied from the flux chamber 14.

  On the downstream side of the idler roller 22, a film thickness detection sensor 62 for detecting the thickness t of the flux film Ff coming out of the gap 60 is disposed. When the thickness t of the flux film Ff measured by the film thickness detection sensor 62 is different from the optimum film thickness for the bump to be transferred, the chamber moving motor M2 is feedback controlled to change the overhang L1. Thus, the height S of the gap 60 is adjusted.

  The chamber moving frame 64 is guided by the guide rail 66 and reciprocates in parallel with the backup plate 40 from the standby position to the flux film forming position by the chamber moving motor M2. When the flux chamber 14 moves upstream in conjunction with the chamber moving frame 64, the collection gate pin 68 is pushed up by the collection gate opening / closing cam 70 against the urging force of the gate spring 69. As a result, the recovery gate 72 integrated with the recovery gate pin 68 is pushed open around the gate hinge 73, and the flux (flux remaining on the transfer belt after transfer) F returned through the flux recovery port 74 is removed. The flux is collected in the flux chamber 14.

  In FIG. 2, reference numeral 78 denotes a suction head, 80 denotes a nozzle, 82 denotes an electronic component, and 84 denotes a bump.

  Next, the operation of the flux transfer device 10 will be described.

  In the standby position shown in FIG. 4A, the gap 60 is closed, and the collection gate 74 is also closed, so that the flux chamber 14 is sealed to prevent the flux F from drying. The transfer belt 12 is not rotating at this point. When the electronic component 82 to be flux-transferred is selected, the suction head 78 sucks the corresponding electronic component 82 from a component supply device (not shown) and conveys it to the flux transfer unit A. In the flux transfer portion A, the flux chamber 14 is moved to the flux film forming position shown in FIG. 4B by the chamber moving motor M2, and the tip 20A of the blade 20 is at a predetermined position P1 corresponding to the axis of the idler roller 22. After passing through, a gap 60 is formed between the belt and the transfer belt 12. The height S of the gap 60 changes according to the distance (overhang) L1 between the predetermined position P1 and the tip 20 of the blade 20. Here, the transfer belt 12 starts to rotate.

  On the other hand, data relating to the formation thickness t of the flux film Ff corresponding to the size of the bump 84 of the electronic component 82 is given from a control unit (not shown), and the flux film Ff having the required thickness t (width W3) is obtained. It is formed. The film thickness detection sensor 62 measures the thickness t of the flux film Ff coming out of the flux chamber 14, feeds back to the control unit of the chamber moving motor M2, adjusts the overhang L1, and controls the height S of the gap 60. Therefore, the flux film Ff with high accuracy can be formed.

  When it is confirmed that the thickness t of the flux film Ff formed by the film thickness detection sensor 62 is stabilized to the intended value, the transfer belt 12 is stopped, the suction head 78 is lowered, and the bump 84 of the electronic component 82 is lowered. Is lowered until it contacts the transfer belt 12. Since the transfer belt 12 in the flux transfer section A is backed up horizontally by the backup plate 42, the backup plate 42 is used even when the electronic component 82 is attracted to the nozzle 80 at a slight angle. In response to the reaction force from the side, the electronic component 82 can receive the transfer of the flux F in a state where the electronic component 82 is correctly leveled.

  When the transfer is completed, the suction head 78 rises and the bumps 84 are separated from the transfer belt 12. FIG. 4B shows a state where the transfer is completed and the flux F is transferred to the bumps 84. When the transfer belt 12 rotates, new flux films Ff are continuously formed one after another, so that the flux transfer can be performed continuously. Further, even if the thickness t of the flux film Ff to be formed is changed by changing the electronic component to be transferred, the overhang L1 is changed by driving the chamber moving motor M2, and the height S of the gap 60 is changed. Can be easily handled.

  When the series of transfer processes is completed, the flux chamber 14 moves to the flux collection position shown in FIG. 4C and closes the gap 60. Accordingly, the formation of a new flux film Ff is stopped here. However, since the collection gate pin 68 is pushed up by the collection gate opening / closing cam 70 at this position, the collection gate 72 is kept open with the gate hinge 73 as the center. The flux F returned from 74 is collected.

  When the transfer belt 12 rotates for one round or more and the recovery of the flux F is completed, the flux chamber 14 returns to the standby state shown in FIG. 4A, the flux recovery port 74 is closed by the action of the gate spring 69, and the flux chamber 14 is sealed. As described above, the flux F in the flux chamber 14 is basically placed on the transfer belt 12 only when necessary, but is collected in the flux chamber 14 each time one round is completed, and complete when the transfer process is completed. It will be stored in a sealed state. Therefore, quality degradation can be minimized.

  In the above-described embodiment, the arrangement of the flux chamber 14 is disposed in the portion where the transfer belt 12 is inclined, and the function of forming a part of the endless rotation mechanism of the transfer belt 12 on the idler roller 22 and the transfer belt 12. However, the flux supply / recovery measure according to the present invention does not necessarily incline the flux chamber. There is no need to place it in the raised part. For example, as shown in FIG. 5, the flux chamber 90 itself is arranged in a horizontal state, and is moved by the idler roller 92 toward the lower side (the side opposite to the side where the flux chamber 90 is present) from the horizontal. Even if X is changed (X3 → X4), the height of the gap 94 can be adjusted by adjusting the overhang L2, and the same effect can be obtained.

  In the case of this embodiment, since the flux chamber 90 is disposed horizontally, the flux F can be more reliably accommodated in the flux chamber 90 depending on the viscosity (or consistency) of the flux F. When this configuration is employed, a backup plate 98 may be disposed on the descending portion 96.

  Further, in the above embodiment, in order to change the distance (overhang) L1 between the tip 20A of the blade 20 and the predetermined position P1 where the change of the moving direction of the transfer belt 12 is started, the predetermined position P1 is changed. Thus, the flux chamber 14 including the blade 20 is moved. However, this distance (overhang) may be changed, for example, by changing the axial center position 92A of the idler roller 92 in a state where the flux chamber 90 is fixedly arranged as indicated by an arrow Xp in FIG. It can be adjusted. In this case, it is preferable to move the shaft center 92A of the idler roller 92, the backup plate 98, and the idler roller 99 together. When the position of the axis 92A of the idler roller 92 is changed, the tension of the transfer belt 12 changes. In this regard, a known automatic tension adjusting mechanism having a spring or the like (not shown) may be appropriately combined. In this configuration, since there are few movable parts, the cost can be further reduced. The collection gate 95 is opened and closed by a separate motor or the like (not shown).

  Further, in the above embodiment, the moving direction of the transfer belt 12 is changed using the idler roller 22. However, in the present invention, the moving direction of the transfer belt is set to the side where the flux chamber exists. The configuration for changing to the opposite side is not limited to this method. For example, instead of the idler roller 92 of FIG. 5, a backup plate (not shown) formed of a material having a small friction coefficient and having a desired shape (not shown) is brought into contact with this position from the back side of the transfer belt 12. The traveling direction can be changed even if it is made to do. Since this method can stabilize the behavior of the transfer belt 12 particularly near the gap 94, the height of the gap 94 can be adjusted more accurately and with less variation.

  In the above embodiment, the transfer belt 12 is stopped at the time of transfer. However, the suction head 78 is lowered while moving in synchronization with the progress of the transfer belt 12 without stopping the transfer belt 12. May be.

  The electronic component mounting apparatus can be applied to an apparatus for transferring a flux to bumps of the electronic component.

The principal part expanded sectional view of the flux transcription | transfer apparatus to which the supply / collection apparatus of the flux which concerns on embodiment of this invention was applied Overall transfer front view and arrow IIA view of the transfer device Arrow III view of the transfer device Process diagram for explaining flux supply / recovery action in the transfer device The principal part schematic front view which shows the structural example of the flux supply and collection | recovery apparatus which concerns on other embodiment of this invention. The perspective view which shows the structure of the conventional flux supply apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 12 ... Transfer belt 14 ... Flux chamber 16 ... Belt guide mechanism 18 ... Drive mechanism 20 ... Blade 22 ... Idler roller 30 ... Frame 32 ... Drive roller 34 ... Follower roller 36 ... Idler roller 38 ... Tensioner screw 40, 42 ... Backup plate 60 ... Gap 70 ... Recovery gate opening / closing cam 72 ... Recovery gate 74 ... Flux recovery port 82 ... Electronic component 84 ... Bump P1 ... Predetermined position L1 ... Distance (overhang)
F ... Flux Ff ... Flux film S ... Hap height t ... Flux film thickness W3 ... Flux film width

Claims (7)

In the flux supply device in the electronic component mounting device,
A transfer belt having a predetermined width on which the flux can be placed and traveling in one direction;
A flux chamber that is disposed so as to cover the surface of the transfer belt, has a blade that can contact the surface of the transfer belt, and can store a flux;
A belt guide mechanism that changes a traveling direction of the transfer belt from a predetermined position to a side opposite to a side where the flux chamber exists;
A drive mechanism for changing a distance between the blade and the predetermined position;
By changing the distance by the drive mechanism, a gap is variably formed between the blade and the surface of the transfer belt, and the flux is transferred from the flux chamber to the flux transfer portion on the surface of the transfer belt. A flux supply device for an electronic component mounting device, characterized in that it can be placed and supplied continuously. In claim 1,
The flux chamber is disposed in a portion where the moving direction of the transfer belt is inclined, and the moving direction of the transfer belt is changed horizontally by an idler roller constituting the belt guide mechanism, and the flux transfer is transferred to the horizontal portion. A flux supply device in an electronic component mounting apparatus, characterized in that a portion is arranged. In claim 1 or 2,
The drive mechanism that changes the distance between the blade and the predetermined position is configured to move the arrangement position of the flux chamber on the transfer belt with respect to the predetermined position along with the blade. A flux supply device in a mounting apparatus for electronic components. In any one of Claims 1-3,
A belt guide mechanism for changing a traveling direction of the transfer belt is constituted by an idler roller; and
Flux supply in an electronic component mounting apparatus, wherein the drive mechanism for changing the distance between the blade and the predetermined position is configured to move the rotation support position of the idler roller relative to the blade. apparatus. In flux supply / recovery equipment for electronic component mounting equipment,
A transfer belt having a predetermined width on which the flux can be placed and proceeding endlessly;
A flux chamber that is arranged to cover the surface of the transfer belt, stores flux and can be supplied onto the transfer belt,
The flux remaining on the transfer belt after the transfer of the flux can be collected in the flux chamber from the collection port formed on the upstream side of the flux chamber. apparatus. In claim 5,
An electronic component mounting apparatus characterized in that an arrangement position of the flux chamber can be moved further upstream along a surface of the transfer belt, and the recovery port is opened along with the movement. Flux supply / recovery equipment. In flux supply / recovery equipment for electronic component mounting equipment,
A transfer belt having a predetermined width on which the flux can be placed and proceeding endlessly;
A flux chamber that is disposed so as to cover the surface of the transfer belt, has a blade that can contact the surface of the transfer belt, and can store a flux;
A belt guide mechanism that changes a traveling direction of the transfer belt from a predetermined position to a side opposite to a side where the flux chamber exists;
A drive mechanism capable of moving the flux chamber along the surface of the transfer belt together with the blade,
During the transfer process, the flux chamber can be moved together with the blade to the downstream side of the transfer belt, and the distance from the predetermined position of the blade can be adjusted to supply flux between the blade and the transfer belt. A gap can be formed,
After completion of the transfer process, the flux chamber is moved to the upstream side of the transfer belt together with the blade, and the blade is brought into contact with the surface of the transfer belt by moving the blade away from the predetermined position. The flux supply / recovery device in the electronic component mounting device, wherein the remaining flux can be completely recovered from a recovery port formed on the upstream side of the flux chamber.

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