JP2007101246A - Workpiece inspection system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a workpiece inspection system that can inspect a workpiece, such as an electronic substrate in a noncontact manner, and that has high utilization efficiency of an inspection constitution. <P>SOLUTION: The workpiece inspection system inspects an inspected workpiece, moving in a manufacturing process having an electronic circuit mainly with an inspection control section of an inspection device. The inspected workpiece has an RFID tag, and the inspection device has an interrogation apparatus, capable of accessing the RFID tag under control by the inspection control section. The RFID tag has an analog interface section, capable of taking in level information of an analog signal at a predetermined part of the electronic circuit section. The inspection control section executes inspection, after fetching the level information of the analog signal. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a workpiece inspection system, and can be applied to an inspection in a manufacturing process of an electronic substrate such as a printed wiring board, for example.

  An inspection is performed at an appropriate manufacturing process stage on a workpiece that moves in a manufacturing process, such as an article in the middle of production or an article just after production. Since many electronic components are mounted on a printed wiring board, even if one component breaks down, it has a great adverse effect. Therefore, the entire number is often inspected, not a sampling inspection.

  A general characteristic inspection method for an electronic board such as a printed wiring board is to inspect the electrical characteristics of the board to be inspected after the board to be inspected and the inspection machine are connected with a cable or a connector. (See Patent Document 1 and Patent Document 2).

Recently, electronic components mounted on printed circuit boards are often used for recycling, and rare substances contained in electronic components are often used for recycling. Therefore, it has also been proposed to evaluate and inspect whether the printed wiring board is worth recycling. As an evaluation and inspection method related to such recycling, there is a method in which an IC tag on which information used for evaluation of recycling is written is provided on a printed circuit board, and information stored in the IC tag is read and evaluated and inspected. (See Patent Document 1 and Patent Document 2).
JP 2002-63077 A JP 2005-136067 A JP 2004-348348 A JP 2004-111518 A

  In the conventional characteristic inspection method, there is an inconvenience that an inspection cable and connector must be attached and detached before and after the inspection is performed, and a pin contact failure occurs at the time of these connections, and a correct inspection can be performed. There is no fear.

  Moreover, in the evaluation and inspection method related to recycling, non-contact inspection is performed. However, an expensive IC tag is simply used as a memory, and the cost performance is poor. It cannot be applied to inspections of various characteristic values.

  Therefore, there is a demand for a workpiece inspection system with high utilization efficiency of an inspection configuration that can inspect a workpiece such as an electronic substrate in a non-contact manner.

  The present invention provides a workpiece inspection system in which an inspection control unit of an inspection apparatus takes an initiative to inspect a workpiece to be inspected that moves in a manufacturing process having an electronic circuit unit, and the inspection target workpiece includes an RFID tag, The inspection apparatus includes an interrogator that can access the RFID tag under the control of the inspection control unit, and the RFID tag can capture analog signal level information at a predetermined location of the electronic circuit unit. The inspection control unit executes inspection performed by taking in level information of the analog signal.

  According to the present invention, since the workpiece is inspected using the RFID tag having the analog interface unit, it is possible to realize a workpiece inspection system with high use efficiency of the RFID tag that can inspect the workpiece without contact.

(A) First Embodiment Hereinafter, a first embodiment in which a workpiece inspection system according to the present invention is applied to an inspection of an electronic board such as a printed wiring board will be described with reference to the drawings.

(A-1) Configuration of the First Embodiment FIG. 1 is a block diagram showing the overall configuration of the substrate inspection system of the first embodiment.

  In FIG. 1, a substrate inspection system 1 according to the first embodiment includes a substrate 10 to be inspected and an inspection apparatus 20 that inspects the substrate 10 to be inspected.

  The inspected substrate 10 includes an inspected electronic circuit unit 12 to be inspected provided on the base substrate 11, a sensor-compatible RFID chip 13, and an RFID antenna 14. The sensor-compatible RFID chip 13 and the RFID antenna 14 constitute an RFID tag. On the other hand, the inspection apparatus 20 includes an interrogator 21, an interrogator antenna 22, and an inspection control unit 23.

  The base substrate 11 corresponds to a base substrate of an electronic substrate, and even if the electronic circuit unit 12 to be inspected is provided on one side, the electronic circuit unit 12 to be inspected is provided on both sides. It may be. The base substrate 11 may be a hard substrate or a flexible substrate.

  The inspected electronic circuit unit 12 is an electronic circuit unit to be inspected, and is connected to the sensor-compatible RFID chip 13. In the case of the first embodiment, it is assumed that the electronic circuit unit 12 to be inspected includes a storage unit that stores a program and a CPU that executes the program. The electronic circuit unit 12 to be inspected has a digital signal input / output configuration.

  The RFID chip 13 corresponding to the sensor captures a value of a predetermined characteristic in the electronic circuit unit 12 to be inspected and transmits it to the interrogator 21 side, or transmits and receives a digital signal between the electronic circuit unit 12 to be inspected and the inspection control unit 23. Or relay with the device 21.

  The RFID antenna 14 captures an interrogation radio wave from the interrogator 21 and applies it to the sensor-capable RFID chip 13 or radiates a signal from the sensor-capable RFID chip 13 to the interrogator 21 as a radio wave. The RFID antenna 14 is preferably formed at the same time as a wiring pattern (for example, a printed pattern) in the electronic circuit unit 12 to be inspected. As shown in FIG. 4, the loop area may be increased by providing the outer periphery of the base substrate 11.

  The interrogator 21 is a so-called RFID reader / writer. The interrogator 21 transmits / receives data to / from the sensor-compatible RFID chip 13 and confirms that the sensor-compatible RFID chip 13 is in the vicinity. Thus, an inspection request (for example, an inspection program or a characteristic measurement request) is transmitted to the sensor-compatible RFID chip 13 to acquire inspection result information from the sensor-compatible RFID chip 13.

  The interrogator antenna 22, for example, emits an interrogation radio wave including an inspection request under the control of the interrogator 21 and captures a response radio wave including a chip identification number and inspection result information from the sensor-compatible RFID chip 13. is there.

  The inspection control unit 23 controls the inspection of the inspected substrate 10 with initiative and obtains the inspection result. The inspection control unit 23 corresponds to, for example, a CPU and a program executed by the CPU, and stores and displays the inspection result. When the inspection result is a characteristic value or the like, the inspection control unit 23 compares the threshold value with an abnormal value. An error notification is performed.

  FIG. 3 is a block diagram showing an internal configuration of the sensor-compatible RFID chip 13 and a connection relationship with peripheral elements.

  In FIG. 3, the sensor-compatible RFID chip 13 includes an RFID transceiver unit 31, an analog interface unit 32, a digital input / output unit 33, and a nonvolatile memory 34.

  The RFID transceiver unit 31 is connected to the RFID antenna 14, and the RFID transceiver unit 31 performs communication with the interrogator 21 side. In the case of the first embodiment, the electronic circuit unit 12 to be inspected and the RFID chip 13 corresponding to the sensor transfer digital signals (information) through the digital input / output unit 33. A memory that stores a transfer program necessary for performing the transfer, a CPU that processes the transfer program, and the like are also mounted in the RFID transceiver unit 31.

  The analog interface unit 32 is connected to the electronic circuit unit 12 to be tested. The connection points may be, for example, two points on both ends of a variable resistor as a circuit component, or two points where the voltage between the two points is important. 12 may be two terminals for the output of the sensor provided at 12, which are two points to be inspected for taking in electrical characteristic values. The analog interface unit 32 includes, for example, a part that converts two corresponding characteristic values into a voltage (takes in the place where the voltage is a problem from the beginning), a comparator part that compares the voltage with a threshold voltage, A threshold data generation unit that outputs threshold data that is the source of the threshold voltage and that sequentially changes the threshold data, and reflects the characteristic value in the middle of the threshold data that precedes and follows the logic of the comparator portion changing Voltage value information. For example, by transmitting to the interrogator 21 a pair of threshold data and the output of the comparator part, or a time series of the output results of the comparator part (the order of each bit corresponds to the threshold data), the interrogator 21 or the inspection control unit 23 can recognize voltage value information (accordingly, a desired characteristic value location).

  The process for recognizing the characteristic value may be executed by the analog interface unit 32 or the RFID transceiver unit 31.

  FIG. 4 is an explanatory diagram of a connection method between the variable resistor 12a and the analog interface unit 32 of the sensor-compatible RFID chip 13 when the inspection target is the resistance value R of the variable resistor 12a. Shows a first connection example, and FIG. 4B shows a second connection example.

  In these connection examples, based on an instruction from the RFID transceiver unit 31, comparison is made with the input voltage Vin while sequentially changing the value of the threshold voltage Vref to the comparator. If the comparator outputs the logic level “1” when the voltage Vin is larger than the threshold voltage Vref, the logic level “1” → “if the value of the threshold voltage Vref is increased. When the change of “0” is changed in the direction of decreasing the value of the threshold voltage Vref, the change is detected by detecting the change of the logic level “0” → “1” by the interrogator 21 or the RFID transceiver unit 31. The value of the input voltage Vin can be determined based on the value of the threshold voltage Vref before and after.

  In the first connection example, a current is passed through the variable resistor 12a from the analog interface unit 32 via the resistor r1, and a voltage generated at both ends of the variable resistor 12a is measured, whereby the resistance of the variable resistor 12a is measured. The value R is obtained. When the first connection example is expressed by an equation, it can be seen that the equation (1) and the equation (2) are obtained, and the resistance value R is obtained.

Vin = (Vdd / (r1 + R)) xR (1)
R = (r1 × Vin) / (Vdd−Vin) (2)
In the second connection example, both ends of the variable resistor 12a are connected between the power source and the ground, and the movable terminal of the variable resistor 12a is connected to the analog interface unit 32. In this case, the resistance value R is obtained from the voltage Vin divided by the variable resistor 12a. When the second connection example is expressed by an equation, it can be seen that the equation (3) and the equation (4) are obtained, and the resistance value R (or the voltage dividing resistance rv) is obtained.

Vin = (Vdd / R) xrv (3)
R = rv / (Vin / Vdd) (4)
The digital input / output unit 33 is connected to the electronic circuit unit 12 to be inspected, applies the digital signal received by the RFID transceiver unit 31 to the electronic circuit unit 12 to be inspected, and applies the digital signal from the electronic circuit unit 12 to be inspected to the RFID. This is given to the transmission / reception unit 31. For example, when the electronic circuit unit 12 to be inspected is equipped with a CPU, an inspection program is supplied via the digital input / output unit 33, and the CPU uses a digital signal obtained by executing the inspection program. The inspection result is taken in by the digital input / output unit 33.

  The nonvolatile memory 34 stores a chip identification number (ID) unique to the sensor-compatible RFID chip 13. The chip identification number is used to determine whether or not the signal from the interrogator 21 is destined for the sensor-compatible RFID chip 13, and is included in the transmission signal from the sensor-compatible RFID chip 13 to be transmitted from Used to clarify. The non-volatile memory 34 is used for writing the inspection result and its history.

(A-2) Operation of First Embodiment Next, the operation (inspection method) of the substrate inspection system of the first embodiment will be described with reference to the drawings.

  For example, as shown in FIG. 5, the inspected substrate 10 on which the sensor-compatible RFID chip 13 is mounted is conveyed by the belt conveyor 40 and enters the communicable area of the interrogator 21 of the inspection apparatus 20 and is located in this area. Sometimes, the inspected substrate 10 is inspected by the inspection apparatus 20 via the RFID tag communication system (13, 14, 21, 22).

  In the case of the first embodiment, there are, for example, two types of methods for inspecting the inspected substrate 10 by the inspection apparatus 20.

  The first inspection method is an inspection in which a characteristic value of a predetermined characteristic of the electronic circuit unit 12 to be inspected is taken and determined. In this inspection method, the inspection control unit 23 of the inspection apparatus 20 requests characteristic measurement from the interrogator 21 to the substrate 10 to be inspected, and in response to this request, the analog interface unit of the sensor-compatible RFID chip 13 of the substrate 10 to be inspected. 32 operates, obtains information reflecting the characteristic value of a predetermined portion of the electronic circuit unit 12 to be inspected, returns the information to the interrogator 21, and the inspection control unit 23 determines normality / abnormality based on the information. .

  The second inspection method is an inspection using a CPU in the electronic circuit unit 12 to be inspected. FIG. 6 is an explanatory diagram of this inspection method. The inspection control unit 23 of the inspection apparatus 20 gives an inspection program to the interrogator 21 to request transmission (step S1), and the interrogator 21 transmits to the sensor corresponding RFID chip 13 of the substrate 10 to be inspected (step S2). . The sensor-compatible RFID chip 13 provides the received inspection program to the electronic circuit unit 12 to be inspected via the digital input / output unit 33 (step S3). The inspection program input to the electronic circuit unit 12 to be inspected is stored in a memory (not shown) in the electronic circuit unit 12 to be inspected that can be used by a CPU (not shown in FIG. The CPU inspects the inspected electronic circuit unit 12 according to the inspection program. The inspection result is input from the electronic circuit unit 12 to be inspected to the digital input / output unit 33 (step S4), whereby the sensor-compatible RFID chip 13 returns the inspection result to the interrogator 21 (step S5). The interrogator 21 gives the received inspection result to the inspection control unit 23 (step S6), and the inspection control unit 23 determines the quality of the inspection result.

  FIG. 7 is a sequence diagram illustrating an example of a processing flow of inspection of the substrate 10 to be inspected by the inspection apparatus 20. FIG. 7 shows a processing flow when the inspection result is normal.

  The board 10 to be inspected is mounted with a battery, for example, and the power is turned on before reaching the communicable area of the interrogator 21 (step S100).

  When the board 10 to be inspected enters the communicable area of the interrogator 21 by conveyance by the belt conveyor 40 (step S101), this is notified from the interrogator 21 to the inspection controller 23, and the inspection controller 23 The inspection program is transmitted from the device 22 to the substrate 10 to be inspected (step S102). Here, the inspection program may include data necessary for the inspection. For example, if inspection data is input to a certain circuit portion, and whether or not the data output from the circuit portion is predetermined data, and inspection is performed for a plurality of types of input data, In the inspection data, set data of correct output data is also included in the inspection program.

  In the substrate 10 to be inspected, the sensor-compatible RFID chip 13 receives the inspection program and applies it to the electronic circuit unit 12 to be inspected (step S103). When the reception of the inspection program is completed (step S104), the electronic circuit unit 12 to be inspected The CPU executes the inspection (step S105), and enters a standby state when the inspection is completed (step S106).

  The inspection control unit 23 of the inspection apparatus 20 sends a request for a program execution inspection result from the interrogator 21 when a predetermined time elapses after the inspection program is transmitted (for example, based on the timing of a built-in timer). (Step S107).

  When the sensor-compatible RFID chip 13 receives the request for the program execution inspection result in the inspected substrate 10, the program execution inspection result is fetched from the electronic circuit section 12 to be inspected and returned to the inspection apparatus 20 (step S 108). Note that a CPU (not shown) in the electronic circuit unit 12 to be inspected (or a CPU in the RFID transmission / reception unit 31) automatically turns off the power supply of the substrate 10 to be inspected when the return of the program execution inspection result is completed (step S109). ).

  The inspection control unit 23 of the inspection apparatus 20 fetches such a program execution inspection result from the interrogator 21 (step S110), and determines whether the program execution test result is acceptable (step S111). If the inspection by the inspection program is normal, the inspection control unit 23 terminates the inspection mode by the detection program and confirms from the interrogator 21 that the inspection result by the inspection program of the inspection process by the inspection device 20 is normal. The expressed first inspection process result code is transmitted to the inspected substrate 10 (step S112).

  In the substrate 10 to be inspected, the RFID transceiver 31 receives the first inspection process result code and writes the first inspection process result code in the nonvolatile memory 34 (step 113). Even if the power of the substrate 10 to be inspected is cut off, the RFID tag portion including the sensor-compatible RFID chip 13 and the RFID antenna 14 obtains the operating energy from the radio wave from the interrogator 21, so that the inspection process result code Can be written into the non-volatile memory 34.

  When the inspection by the inspection program is normally completed, the inspection control unit 23 of the inspection apparatus 20 transmits a characteristic inspection request from the interrogator 21 to the inspected substrate 10 (step S114).

  When receiving the characteristic inspection request, the RFID transceiver unit 31 of the substrate 10 to be inspected acquires the characteristic value information of the predetermined characteristic by controlling the analog interface unit 32, and enters a standby state when the acquisition is completed (step S115). . Note that the sensor-compatible RFID chip 13 also obtains operating energy in the characteristic inspection mode by radio waves from the interrogator 21.

  The inspection control unit 23 of the inspection apparatus 20 transmits a request for a characteristic inspection result from the interrogator 21 to the inspected substrate 10 when a predetermined time has elapsed after transmitting the characteristic inspection request (step S116).

  When the sensor-compatible RFID chip 13 of the inspected substrate 10 receives the request for the characteristic inspection result, the characteristic value information obtained by the processing of the analog interface unit 32 is returned to the inspection apparatus 20 (step S117).

  The inspection control unit 23 of the inspection apparatus 20 takes in the characteristic value information from the interrogator 21 (step S118), and determines whether or not the characteristic value is within a normal range (step S119). If the characteristic value is within the normal range, the inspection control unit 23 terminates the characteristic inspection mode and indicates from the interrogator 21 that the characteristic inspection result of the inspection process by the inspection device 20 is normal. The inspection process result code 2 is transmitted to the inspected substrate 10 (step S120).

  When receiving the second inspection process result code, the RFID transceiver unit 31 of the substrate 10 to be inspected writes the second inspection process result code in the nonvolatile memory 34 (step 121).

  The inspection of one substrate 10 to be inspected is performed in the above processing flow, and the time required for a series of inspections is that the substrate 10 to be inspected enters the communicable area of the interrogator 21 by the conveyance of the belt conveyor 40. Is selected shorter than the period from when the interrogator 21 goes out of the communicable area.

  In addition, when the result of the inspection by the inspection program or the result of the characteristic inspection is abnormal, the inspection control unit 23 of the inspection apparatus 20 performs the inspection process by the inspection program of the abnormal substrate notification process or the inspection process by the inspection apparatus 20. The third inspection process result code indicating that the characteristic inspection result is abnormal or the fourth inspection process result code is written into the nonvolatile memory 34 of the sensor-compatible RFID chip 13. If necessary, the inspection control unit 23 sends a stop request to the conveyance control unit of the belt conveyor 40 to stop the belt conveyor 40.

(A-3) Effect of First Embodiment According to the first embodiment, information exchange between the inspected substrate 10 and the inspection apparatus 20 is performed using the RFID tag communication system. In addition, it is not necessary to attach and detach inspection cables and connectors before and after inspection execution, and the inspection time can be shortened. Also, it is possible to prevent erroneous inspection results due to poor connection of cables and connectors. Can do.

  Further, according to the first embodiment, since the sensor-compatible RFID chip 13 is mounted on the substrate to be inspected 10, the RFID tag communication system not only intervenes in communication but can also function as a measurement device. That is, according to the first embodiment, not only digital values but also analog quantities can be measured and diagnosed, and the inspection function can be improved.

  Further, even when there are a plurality of inspection apparatuses 20 for inspecting one substrate 10 to be inspected, the inspection process result code is written in the nonvolatile memory 34 of the sensor-compatible RFID chip 13. As a result, it is possible to manage the progress of each inspection and confirm the quality and history of the substrate 10 to be inspected at a desired time. For example, even after completion of all inspections (for example, after shipment), the inspection of the substrate to be inspected can be confirmed.

(A-4) Modified Embodiments of the First Embodiment Although various modified embodiments have been mentioned in the above description, further modified embodiments as exemplified below can be given.

  In the above description, the inspection program downloaded to the substrate 10 to be inspected is described as being given to the electronic circuit unit 12 to be operated. However, depending on the size of the inspection program, the inspection program is set in the nonvolatile memory 14 on the RFID chip 13. You may make it.

  The sensor-compatible RFID chip 13 and the RFID antenna 14 are attached to the base substrate 11 by mounting the RFID chip 13 on the base substrate 11 by soldering or the like, and the antenna 14 is formed as a printed wiring on the base substrate 11. Alternatively, a module in which the antenna 14 and the RFID chip 13 are integrated may be soldered to the base substrate 11. Further, a separate connector may be provided on the base substrate 11 to connect the RFID modules (13 and 14) via the connector.

  If the sensor-compatible RFID chip 13 and the RFID antenna 14 are not integrated, the surface of the base substrate 11 on which the sensor-compatible RFID chip 13 is provided and the RFID antenna 14 are provided using a through hole or the like. The surface of the base substrate 11 that is formed may be different.

  In the above description, the sensor-compatible RFID chip 13 includes one analog interface unit 32 and obtains characteristic value information of characteristics at one location. However, the characteristic value information of characteristics at multiple locations may be obtained. good. For example, an analog switch that can be switched via the digital input / output unit 33 is provided outside the sensor-compatible RFID chip 13, and one analog interface unit 32 is connected to an arbitrary measurement location via the analog switch. Also good. Moreover, you may make it apply the thing provided with the several analog interface part 32 matched with each measurement location as the RFID chip | tip 13 corresponding to a sensor. Furthermore, a plurality of sensor-compatible RFID chips 13 themselves may be provided on the inspected substrate 10 in consideration of a plurality of measurement locations.

  The types of management information for history management and inspection management written in the nonvolatile memory 34 of the sensor-compatible RFID chip 13 on the substrate 10 to be inspected are not limited to those described above. For example, the inspection time and the ID of the inspection device (for example, when there are a plurality of inspection devices performing the same inspection) can be mentioned. The management information may also be stored in association with the chip identification number.

  In the above, the case where the inspection control unit 23 of the inspection apparatus 20 takes the initiative to perform the inspection is shown. In a case where the electronic circuit unit 12 to be inspected has a function of autonomously inspecting without receiving control from the inspection control unit 23 and holding the inspection result, the inspection control unit 23 of the inspection apparatus 20 Such inspection results may be collected using an RFID tag communication system (relayed by the digital input / output unit 33).

(B) Second Embodiment Next, a second embodiment in which the workpiece inspection system according to the present invention is applied to inspection of an electronic board such as a printed wiring board will be described with reference to the drawings.

  FIG. 8 is an explanatory diagram of a positional relationship at the time of inspection between the substrate to be inspected and the inspection apparatus in the substrate inspection system 1A of the second embodiment, and corresponds to FIG. 5 according to the first embodiment. In FIG. 8, the same and corresponding parts as those in the above-described drawings are indicated by the same and corresponding reference numerals.

  In the case of the substrate inspection system 1A of the second embodiment, a plurality of substrates to be inspected 10-1 to 10-3 (three cases are shown in FIG. 8) are included in the communicable area AR of the interrogator 21. It is allowed to be located.

  In general, the RFID chips 13-1 to 13-3 are each assigned a unique chip identification number regardless of whether the sensor is compatible or not, and the interrogator 21 has an anti-collision function. .

  For this reason, the board inspection system 1A of the second embodiment is intended to inspect a plurality of inspected boards 10-1 to 10-3 located in the communicable area AR of the interrogator 21 in parallel. is there.

  Also in the second embodiment, the processing flow for the inspection of one inspected substrate 10 (10-1 to 10-3) can be expressed in FIG. 7 described above. However, in the second embodiment, the inspection control unit 23 manages the inspection stage for each of the substrates to be inspected 10-1 to 10-3 to control the progress, and at the time of information exchange and information storage, the RFID chip A difference is that a destination, a transmission source, and a storage substrate are always clearly indicated by using the chip identification numbers 13-1 to 13-3 (this point may be adopted in the first embodiment).

  For example, in the case of FIG. 8, the inspection stage of the substrate to be inspected 10-1 has advanced considerably, the inspection substrate 10-3 has just started the inspection process, and the inspection stage of the substrate to be inspected 10-2. Is an intermediate step. If the belt conveyor 40 is intermittently driven, the progress of the inspection is substantially the same for the plurality of substrates to be inspected 10-1 to 10-3 stopped in the communicable area AR of the interrogator 21. You may make it do.

  According to the second embodiment, the same effect as that of the first embodiment can be obtained. Furthermore, according to the second embodiment, a plurality of substrates to be inspected can be inspected in parallel, and inspection efficiency can be increased.

(C) Third Embodiment Next, a third embodiment in which the workpiece inspection system according to the present invention is applied to inspection of an electronic board such as a printed wiring board will be described with reference to the drawings.

  FIG. 9 is a block diagram showing the internal configuration of the sensor-compatible RFID chip according to the third embodiment together with the peripheral configuration.

  In the substrate inspection system of the third embodiment, the configuration of the substrate to be inspected 10B is different from that of the first embodiment (10). In FIG. 9, the inspected substrate 10 </ b> B of the third embodiment includes an LED element 15 and an LED drive circuit 16 in addition to the configuration of the first embodiment.

  The LED element 15 is provided as a light emitting element, and blinking and / or lighting of the LED element 15 indicates that the inspection result is normal. For example, as described above, if two types of inspection, that is, inspection by the inspection program and characteristic inspection are sequentially performed, the LED element 15 is caused to blink when a result of normality is obtained by the inspection by the preceding inspection program. The LED element 15 may be turned on when a normal result is obtained in the subsequent characteristic inspection.

  The LED drive circuit 16 is connected to the digital input / output unit 33 of the sensor-compatible RFID chip 13 and controls the light emission of the LED element 15 by a signal given from the sensor-compatible RFID chip 13 side.

  The LED element 15 and the LED drive circuit 16 are provided outside the sensor-compatible RFID chip 13 and operate, for example, using radio wave energy from the interrogator 21 captured by the sensor-compatible RFID chip 13 as operating energy. . Note that the LED element 15 and the LED drive circuit 16 may be supplied with operating energy from a power supply unit provided in the electronic circuit unit 12 to be inspected.

  Instead of the LED element 15, another light emitting element may be applied. Moreover, you may make it provide a different LED element 15 for every kind of test | inspection (for example, test | inspection and characteristic test | inspection by a test | inspection program), or for every difference in an inspection apparatus or an inspection process. Moreover, you may make it provide the LED element 15 transmitted or blinked in the case of an abnormal test result.

  In the case of the substrate inspection system of the third embodiment, the configuration of the inspection apparatus is substantially the same as that of the above-described embodiment. The difference is that although the processing flow is omitted, the inspection control unit 23 transmits a signal for controlling the LED element 15 according to the inspection result from the interrogator 21 to the sensor-compatible RFID chip 13 of the inspected substrate 10B. It is a point to make.

  According to the third embodiment, the same effect as that of the first embodiment can be obtained. Furthermore, according to the third embodiment, there is an effect that an inspector in the vicinity of the inspection place can also recognize the inspection result. In the case of the first and second embodiments, since the inspection result is known only on the inspection apparatus 20 side, there is a possibility that a separate control system for separating the non-defective product from the defective product may be required. Since the inspection result can be confirmed by lighting or blinking of the LED element 15, the defective product can be reliably extracted by visual observation, and the control system can be simplified.

  In addition, you may make it provide an LED element in the test | inspection apparatus 20 side, or you may make it use the auditory alerting method using a buzzer etc. in addition to the visual alerting method using an LED element.

(D) Other Embodiments In the description of each of the above embodiments, various modified embodiments have been referred to, but modified embodiments as exemplified below can be given.

  In each of the above embodiments, the information can be read from the RFID tag even after the inspection in the final inspection process is completed. However, the inspected object may not be inadvertently read from the RFID tag after shipment. In order to prevent this in the substrate 10, before shipping, the antenna of the RFID tag is removed (the antenna is mounted on the substrate as a discrete component), or the antenna of the RFID tag is cut (covering the printed pattern of the antenna or the like). A part of the coating film covering the antenna is removed to facilitate cutting), or it may be rewritten with meaningless data so that the RFID tag does not function. In addition, the password of the read authorized person may be written so that only a specific read authorized person (for example, a maintenance person) can read the password on condition that the password is transmitted to the RFID tag.

  In the above embodiments, the inspection apparatus 20 is an independent apparatus. However, the inspection apparatus 20 may be connected to a higher-level apparatus. When the host apparatus is a host apparatus common to a plurality of upstream and downstream inspection apparatuses 20 having different inspection processes, the upper apparatus displays the inspection result of the inspected substrate 10 obtained by the upstream inspection apparatus. The inspection control unit of the downstream inspection device stores the inspection process result code including the inspection result in the nonvolatile memory 34 of the RFID chip 13 in place of the inspection control unit of the upstream inspection device. May be. In this case, the restriction from the inspection operation of the speed of the belt conveyor 40 can be relaxed.

  Further, in each of the above embodiments, the RFID tags (13 and 14) provided on the substrate 10 to be inspected function effectively in the inspection in the manufacturing process. However, the inspection is extended even after the shipment. In addition to quality assurance, it may be used for other functions. For example, it may be used as an RFID tag for inventory management. For example, if the substrate to be inspected is an electronic substrate of an electronic device in which the temperature in use is a problem (for example, a substrate provided inside a personal computer), an interrogator is built in the electronic device, and the temperature of the sensor-compatible RFID chip The inspection function (characteristic inspection function) may be periodically used by the control means of the electronic device to check the temperature.

  Further, in each of the above embodiments, the threshold data is gradually changed during the characteristic inspection. However, the threshold data is used so that the determination can be made if the inspection is for the non-defective product / defective product determination. The characteristic value itself may be omitted by changing.

  The workpiece to be inspected by the present invention is not limited to the electronic substrate, and the entire workpiece having an electronic circuit section such as an article in the process of moving through a manufacturing process or an article just after the manufacture is an object to be inspected. be able to.

1 is a block diagram illustrating an overall configuration of a substrate inspection system according to a first embodiment. It is explanatory drawing which shows the example of arrangement | positioning of the RFID antenna in the to-be-inspected board | substrate of 1st Embodiment. It is a block diagram which shows the internal structure of the RFID chip | tip corresponding to a sensor of 1st Embodiment. It is explanatory drawing of the example of the test | inspection method of the variable resistance value in the RFID chip | tip corresponding to the sensor of 1st Embodiment. It is explanatory drawing of the positional relationship at the time of the test | inspection with the to-be-inspected board | substrate and inspection apparatus in the board | substrate inspection system of 1st Embodiment. It is explanatory drawing of the inspection method by transfer of the inspection program in 1st Embodiment. It is a sequence diagram which shows the inspection process flow in the board | substrate inspection system of 1st Embodiment. It is explanatory drawing of the positional relationship at the time of the test | inspection with the to-be-inspected board | substrate and inspection apparatus in the board | substrate inspection system of 2nd Embodiment. It is a block diagram which shows the internal structure of the RFID chip | tip corresponding to a sensor of 3rd Embodiment with a periphery structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A ... Board | substrate inspection system 10, 10B ... Board | substrate to be inspected, 11 ... Base board | substrate, 12 ... Electronic circuit part to be inspected, 13 ... RFID chip corresponding to a sensor, 14 ... RFID antenna, 15 ... LED element, 16 ... LED drive Circuit 20, inspection device 21, interrogator 22, interrogator antenna 23, inspection control unit 31, RFID transceiver unit 32, analog interface unit 33 digital input / output unit 34 nonvolatile memory

Claims (5)

In the work inspection system in which the inspection control part of the inspection apparatus takes the initiative to inspect the work to be inspected that moves the manufacturing process having the electronic circuit part,
The workpiece to be inspected includes an RFID tag, and the inspection apparatus includes an interrogator that can access the RFID tag under the control of the inspection control unit,
The RFID tag is
Having an analog interface unit capable of capturing level information of an analog signal at a predetermined location of the electronic circuit unit;
The workpiece inspection system, wherein the inspection control unit performs an inspection performed by taking in the level information of the analog signal.   The work inspection system according to claim 1, wherein the inspection control unit stores inspection management information including information on an inspection result in a nonvolatile memory built in the RFID tag.   The inspection control unit of the inspection device inspects the plurality of inspection target workpieces in parallel when the plurality of inspection target workpieces exist in a communicable area of the interrogator. Item 3. The workpiece inspection system according to Item 1 or 2. The RFID tag includes a digital input / output unit that can exchange digital signals with the electronic circuit unit, and the inspection control unit of the inspection apparatus performs digital signals with the electronic circuit unit. We also perform inspections
The workpiece to be inspected includes a display unit to which display information is supplied from the digital input / output unit of the RFID tag, and the inspection control unit of the inspection apparatus sends at least one of normal and abnormal inspection results to the RFID tag. The workpiece inspection system according to any one of claims 1 to 3, wherein the workpiece inspection system is transmitted and displayed on the display means. The workpiece inspection system according to claim 1, wherein the workpiece to be inspected employs a structure that facilitates invalidation of the RFID tag.

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