JP2007096279A5 - - Google Patents
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- Publication number
- JP2007096279A5 JP2007096279A5 JP2006225479A JP2006225479A JP2007096279A5 JP 2007096279 A5 JP2007096279 A5 JP 2007096279A5 JP 2006225479 A JP2006225479 A JP 2006225479A JP 2006225479 A JP2006225479 A JP 2006225479A JP 2007096279 A5 JP2007096279 A5 JP 2007096279A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- substrate
- circuit device
- recess
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 18
- 239000000463 material Substances 0.000 claims 11
- 230000017525 heat dissipation Effects 0.000 claims 5
- 239000011521 glass Substances 0.000 claims 2
- 239000010453 quartz Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006225479A JP5137356B2 (ja) | 2005-09-02 | 2006-08-22 | 集積回路装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005254481 | 2005-09-02 | ||
| JP2005254481 | 2005-09-02 | ||
| JP2006225479A JP5137356B2 (ja) | 2005-09-02 | 2006-08-22 | 集積回路装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007096279A JP2007096279A (ja) | 2007-04-12 |
| JP2007096279A5 true JP2007096279A5 (https=) | 2009-09-10 |
| JP5137356B2 JP5137356B2 (ja) | 2013-02-06 |
Family
ID=37981542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006225479A Expired - Fee Related JP5137356B2 (ja) | 2005-09-02 | 2006-08-22 | 集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5137356B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4973328B2 (ja) * | 2007-06-14 | 2012-07-11 | 株式会社デンソー | 半導体装置 |
| CN102576735B (zh) | 2009-09-30 | 2016-01-20 | 大日本印刷株式会社 | 挠性装置用基板、挠性装置用薄膜晶体管基板、挠性装置、薄膜元件用基板、薄膜元件、薄膜晶体管、薄膜元件用基板的制造方法、薄膜元件的制造方法及薄膜晶体管的制造方法 |
| US20110186899A1 (en) * | 2010-02-03 | 2011-08-04 | Polymer Vision Limited | Semiconductor device with a variable integrated circuit chip bump pitch |
| JP2011233858A (ja) * | 2010-04-09 | 2011-11-17 | Dainippon Printing Co Ltd | 薄膜素子用基板の製造方法、薄膜素子の製造方法、薄膜トランジスタの製造方法、薄膜素子、および薄膜トランジスタ |
| JP2014082253A (ja) * | 2012-10-15 | 2014-05-08 | Nippon Hoso Kyokai <Nhk> | 積層型半導体装置、半導体チップならびに積層型半導体装置の製造方法 |
| WO2020137615A1 (ja) * | 2018-12-25 | 2020-07-02 | 東レ株式会社 | 無線通信装置の製造方法、無線通信装置および無線通信装置の集合体 |
| KR20220096469A (ko) | 2020-12-31 | 2022-07-07 | 엘지디스플레이 주식회사 | 중첩된 화소 구동부들을 포함하는 표시장치 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3506054B2 (ja) * | 1999-07-23 | 2004-03-15 | 日本電気株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2002246514A (ja) * | 2001-02-14 | 2002-08-30 | Fuji Electric Co Ltd | 半導体装置 |
| JP4483123B2 (ja) * | 2001-05-07 | 2010-06-16 | ソニー株式会社 | ３次元半導体チップ及びその製造方法 |
| JP3791459B2 (ja) * | 2002-05-27 | 2006-06-28 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP4238998B2 (ja) * | 2004-03-18 | 2009-03-18 | セイコーエプソン株式会社 | 電気デバイス |
-
2006
- 2006-08-22 JP JP2006225479A patent/JP5137356B2/ja not_active Expired - Fee Related
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