JP2007095864A - Wiring board with built-in component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board with built-in components and a manufacturing method thereof suitable for reducing the manufacturing burden, and also suitable for embedding small components. <P>SOLUTION: This wiring board with built-in components comprises a first insulating layer; a wiring pattern provided on one surface side of this first insulating layer; electric/electronic components mounted on/connected to this wiring pattern; a second insulating layer located oppositely to and spaced apart from the first insulating layer and having escape portions penetrating it in the layer-thickness direction corresponding to the locations, wherein the electric/electronic components are mounted and at least part of the surface thereof on the side opposite to the side facing the first insulating layer is opened; and a third insulating layer so provided that the clearance between the first insulating layer and the second insulating layer spaced apart therefrom is filled with the third insulating layer, and the electric/electronic components are surrounded by and the escape portions are also filled with the third insulating layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component built-in wiring board having an electric / electronic component embedded in an insulating layer and a method for manufacturing the same, and more particularly to a component built-in wiring board suitable for reducing the manufacturing burden and a method for manufacturing the same.

As a conventional example of a component built-in wiring board in which an insulating layer in which an electric / electronic component is embedded is a surface insulating layer, there is one described in Patent Document 1 below. In the production of this wiring board, the first insulating layer in which the component is embedded and another second insulating layer laminated on this insulating layer are laminated and integrated in advance before the component is built in. After the lamination, a space (concave portion) for incorporating the component is formed in the first insulating layer. For this reason, a special material (release film) is required, and it is difficult to think that it is suitable for forming a recessed part of a small area on the processing precision of recessed part formation. Further, since each process for component mounting performed after forming the recesses is performed by one point and one point at a time, it is difficult to improve productivity.
JP-A-8-37378

  The present invention has been made in consideration of the above circumstances, and is suitable for reducing the burden of manufacturing and for embedding small components in a component built-in wiring board having an electric / electronic component embedded in an insulating layer and a manufacturing method thereof. Another object of the present invention is to provide a component built-in wiring board and a method for manufacturing the same.

  In order to solve the above problems, a component built-in wiring board according to the present invention includes a first insulating layer, a wiring pattern provided on one surface side of the first insulating layer, and mounted on the wiring pattern. A connected electrical / electronic component and a layer facing the first insulating layer and spaced from the first insulating layer, and corresponding to a position where the electrical / electronic component is mounted A second insulating layer in which a relief portion penetrating in the thickness direction is formed, and at least a part of a surface opposite to the side facing the first insulating layer is open, and the first insulating layer; A third insulating layer provided so as to fill a gap between the second insulating layer and the second insulating layer so as to surround the electric / electronic component and also fill the relief portion of the second insulating layer; It is characterized by comprising.

  That is, the component built-in wiring board has a structure in which the escape portion for the built-in electric / electronic component is in the second insulating layer, and the electric / electronic component is mounted on the wiring pattern on the first insulating layer. ·It is connected. Further, the gap between the first insulating layer and the second insulating layer is filled with the third insulating layer, and this third insulating layer surrounds the built-in electric / electronic component and is formed on the second insulating layer. The escape part is buried. Thus, the third insulating layer has a very deformed shape. This is because in the manufacturing process, when the first, third, and second insulating layers are laminated and integrated, the third insulating layer has obtained fluidity and deformed to have such a desired shape.

  That is, in order to obtain the component built-in wiring board having such a structure, the first insulating layer is mounted with the electric / electronic component on the wiring pattern, and the third insulating layer is used for the electric / electronic component. The formation of the relief portions can be performed separately and efficiently. Here, even if the electric / electronic component is small, neither mounting nor escape portion formation is a particularly difficult process, and production efficiency can be maintained. Therefore, it is possible to provide a component built-in wiring board that is suitable for reducing the manufacturing burden and also suitable for embedding small components.

  In addition, the method for manufacturing a component built-in wiring board according to the present invention includes a step of mounting / connecting an electrical / electronic component on the surface of the first insulating plate on which the wiring pattern is formed, and mounting on the first wiring board. A plate thickness corresponding to the position of the mounted / connected electric / electronic component is provided with a second insulating plate having a relief portion penetrating in the plate thickness direction corresponding to the position of the connected electric / electronic component. Through the prepreg having the second relief portion penetrating in the direction, on the condition that no permanent laminated insulator is formed on the surface opposite to the side facing the first insulating plate. And laminating and integrating on the surface of the insulating plate on which the electrical / electronic components are mounted and connected.

  This manufacturing method is an example for manufacturing the component built-in wiring board.

  According to the present invention, in a component built-in wiring board having an electrical / electronic component embedded in an insulating layer and a method for manufacturing the same, the component built-in wiring board suitable for reducing the burden of manufacturing and also suitable for embedding small components and the manufacturing thereof A method can be provided.

  As an embodiment of the present invention, a second wiring pattern sandwiched between the second insulating layer and the third insulating layer, and a surface of the wiring pattern penetrating the third insulating layer Between the first wiring pattern and the surface of the second wiring pattern, and is made of a conductive composition and has an axis that coincides with the laminating direction and has a shape whose diameter changes in the direction of the axis It may be further provided with a connection body. This interlayer connection body is an example of an interlayer connection body that penetrates through the third insulating layer, and is an interlayer connection body derived from conductive bumps formed by screen printing of a conductive composition, for example.

  Further, as an embodiment, a second wiring pattern sandwiched between the second insulating layer and the third insulating layer, a surface of the wiring pattern penetrating the third insulating layer, An interlayer connection that is sandwiched between the surfaces of the second wiring pattern and is made of a conductive composition and has an axis that coincides with the laminating direction and has a diameter that does not change in the direction of the axis. And a body. This interlayer connection body is another example of an interlayer connection body that penetrates the third insulating layer. For example, the interlayer connection body is formed by filling a hole penetrating the third insulating layer with a conductive composition. is there.

  Further, as an embodiment, a second wiring pattern sandwiched between the second insulating layer and the third insulating layer, a surface of the wiring pattern penetrating the third insulating layer, An interlayer connector sandwiched between the surface of the second wiring pattern, made of metal, and having an axis coinciding with the stacking direction and having a diameter changing in the direction of the axis; It may be further provided. This interlayer connection body is still another example of an interlayer connection body penetrating the third insulating layer, and is an interlayer connection body derived from a conductor bump formed by etching a metal plate, for example.

  As an embodiment, a surface of the wiring pattern penetrating through the first insulating layer, a second wiring pattern provided on the opposite side of the first insulating layer from the side on which the wiring pattern is located, and Between the first wiring pattern and the surface of the second wiring pattern, and is made of a conductive composition and has an axis that coincides with the laminating direction and has a shape whose diameter changes in the direction of the axis It may be further provided with a connection body. This interlayer connection body is an example of an interlayer connection body penetrating the first insulating layer, and is an interlayer connection body derived from conductive bumps formed by screen printing of a conductive composition, for example.

  As an embodiment, a surface of the wiring pattern penetrating through the first insulating layer, a second wiring pattern provided on the opposite side of the first insulating layer from the side on which the wiring pattern is located, and And an interlayer connection body that is sandwiched between the surface of the second wiring pattern and is made of metal and has an axis that coincides with the lamination direction and has a diameter that changes in the direction of the axis; It is good also as comprising. This interlayer connection body is another example of an interlayer connection body that penetrates the first insulating layer. For example, the interlayer connection body is an interlayer connection body derived from a conductor bump formed by etching a metal plate.

  As an embodiment, a surface of the wiring pattern penetrating through the first insulating layer, a second wiring pattern provided on the opposite side of the first insulating layer from the side on which the wiring pattern is located, and Between the first wiring pattern and the surface of the second wiring pattern, and is made of a conductive composition and has an axis that coincides with the lamination direction and has a shape in which the diameter does not change in the direction of the axis It may be further provided with a connection body. This interlayer connector is yet another example of an interlayer connector that penetrates the first insulating layer. For example, an interlayer connector formed by filling a hole penetrating the first insulating layer with a conductive composition. It is.

  As an embodiment, a surface of the wiring pattern penetrating through the first insulating layer, a second wiring pattern provided on the opposite side of the first insulating layer from the side on which the wiring pattern is located, and An interlayer connection body that is sandwiched between the surface of the second wiring pattern and is made of metal and has an axis that coincides with the stacking direction and has a diameter that does not change in the direction of the axis; It is good also as comprising. This interlayer connection body is still another example of an interlayer connection body that penetrates the first insulating layer, and is an interlayer connection body derived from, for example, a conductor bump formed by metal plating.

  Further, as an embodiment, a through hole inner wall conductive layer provided through the first insulating layer, the third insulating layer, and the second insulating layer, and the through hole inner wall conductive layer electrically A second wiring pattern provided on a surface of the second insulating layer opposite to the side facing the first insulating layer so as to be conductive, and the second wiring It can be assumed that the pattern is not formed in contact with the third insulating layer filling the relief portion of the second insulating layer.

  This is a mode in which a through hole inner wall conductive layer is provided as an interlayer connector that penetrates the first, third, and second insulating layers. Since the through-hole inner wall conductive layer is usually formed by electroplating, it is also formed on the third insulating layer filling the escape portion of the second insulating layer in this process. The third insulating layer that fills the relief portion of the second insulating layer is very thin at this position and is considered to be defective as an insulating layer. Therefore, no wiring pattern is formed at this position.

  Further, as an embodiment, the relief portion of the second insulating layer can be substantially circular as a planar shape. When the relief portion formed in the second insulating layer is circular, the processing and formation thereof are facilitated by a known method. That is, the same applies to the manufacturing method.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to an embodiment of the present invention. As shown in FIG. 1, this component built-in wiring board includes an insulating layer 11 (first insulating layer), 12 (third insulating layer), 13 (second insulating layer), and wiring layer 21 (first insulating layer). 2 (wiring pattern), 22 (wiring pattern), 23 (another second wiring pattern), 24 (another second wiring pattern) (= four layers in total), interlayer connector 31, 32, a through-hole inner wall conductive layer 33, a chip part 41 (electric / electronic part), and a connection part 51 (solder part). The insulating layer 13 has an escape portion 13 a for escaping the position of the chip component 41.

  Here, the chip component 41 is, for example, a chip capacitor, and its planar size is, for example, 0.6 mm × 0.3 mm. Terminals (electrodes) are provided at both ends, and the lower side thereof is opposed to a land for mounting a built-in component by the wiring layer 22. The terminal of the chip component 41 and the mounting land are electrically (mechanically) connected (mounted) by the connecting portion 51.

  The wiring layers 22 and 23 different from the outer wiring layers 21 and 24 are inner wiring layers, respectively, and the insulating layer 11 is arranged between the wiring layer 21 and the wiring layer 22 in order. An insulating layer 12 is interposed therebetween, and an insulating layer 13 is positioned between the wiring layer 23 and the wiring layer 24, respectively, and separates these wiring layers 21 to 24. Each of the wiring layers 21 to 24 is made of, for example, a metal (copper) foil having a thickness of 18 μm. Note that the inner wiring layers 22 and 23 are located so as to sink into the insulating layer 12 side, and the wiring layer does not sink into the insulating layers 11 and 13 side. This is based on the manufacturing process, and the wiring layer 22 may be another sinking position due to a difference in the manufacturing process (described later).

  Each of the insulating layers 11 and 12 has a thickness of, for example, 100 μm, and the insulating layer 13 has a thickness of, for example, 300 μm. Each of the insulating layers 11 and 12 is a rigid material made of, for example, a glass epoxy resin. This is a typical illustration). In particular, the insulating layer 13 has a relief portion 13 a at a position corresponding to the built-in chip component 41, and provides a space for incorporating the chip component 41. The intermediate insulating layer 12 is deformed so as to fill the space around the built-in chip component 41 (including the escape portion 13 a of the insulating layer 13) and the space inside the through-hole inner wall conductive layer 33 of the insulating layer 13. Therefore, there is no space that becomes a void inside.

  The wiring layer 21 and the wiring layer 22 can be conducted by an interlayer connector 31 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 11. Similarly, the wiring layer 22 and the wiring layer 23 can be conducted by an interlayer connector 32 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 12. The wiring layer 23 and the wiring layer 24 can be conducted by a through-hole inner wall conductive layer 33 provided through the insulating layer 13.

  The interlayer connectors 31 and 32 are derived from conductive bumps formed by screen printing of a conductive composition, respectively, and depend on the manufacturing process in the axial direction (upper and lower laminations in the illustration of FIG. 1). Direction). The diameter is, for example, 200 μm on the thick side.

  FIG. 2 is a top view schematically showing the configuration of the component built-in wiring board shown in FIG. In FIG. 2, the same or equivalent parts as shown in FIG. As shown in FIG. 2, the relief portion 13a of the insulating layer 13 corresponding to the position of the built-in chip component 41 is, for example, substantially circular as a plan view. Excellent in the property and the arbitraryness of the formation position.

  Next, a manufacturing process of the component built-in wiring board shown in FIGS. 1 and 2 will be described with reference to FIGS. 3 to 5 are process views schematically showing a part of the manufacturing process of the component built-in wiring board shown in FIGS. In these drawings, the same or equivalent components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals.

  It demonstrates from FIG. FIG. 3 shows a manufacturing process of a portion centering on the insulating layer 11 in each configuration shown in FIG. First, as shown in FIG. 3 (a), a paste-like conductive composition to be an interlayer connection 31 is formed on a metal foil (electrolytic copper foil) 22A having a thickness of, for example, 18 μm by, for example, screen printing. It is formed in a bump shape (bottom diameter, for example, 200 μm, height, for example, 160 μm). This conductive composition is obtained by dispersing fine metal particles such as silver, gold and copper or fine carbon particles in a paste-like resin. For convenience of explanation, printing is performed on the lower surface of the metal foil 22A, but it may be printed on the upper surface (the following drawings are also the same). After the interlayer connector 31 is printed, it is dried and cured.

  Next, as shown in FIG. 3B, an FR-4 prepreg 11A having a thickness of, for example, 100 μm is laminated on the metal foil 22A to penetrate the interlayer connector 31 so that the head is exposed. To do. At the time of exposure or afterwards, the tip thereof may be crushed by plastic deformation (in any case, the shape of the interlayer connection body 31 is a shape having an axis coinciding with the stacking direction and the diameter changing in the axial direction). Subsequently, as shown in FIG. 3C, a metal foil (electrolytic copper foil) 21A is laminated on the prepreg 31A, and the whole is integrated by pressing and heating. At this time, the metal foil 21A is in electrical continuity with the interlayer connector 31, and the prepreg 11A is completely cured to become the insulating layer 11 (insulating plate).

  Next, as shown in FIG. 3D, patterning by, for example, well-known photolithography is performed on the metal foil 22A on one side, and this is processed into a wiring pattern 22 including mounting lands. Then, as shown in FIG. 3E, the cream solder 51A is printed on the mounting land obtained by processing, for example, by screen printing. The cream solder 51A can be easily printed in a predetermined pattern by using screen printing. A dispenser can be used instead of screen printing.

  Next, the chip component 41 is placed on the mounting land through the cream solder 51A, for example, with a mounter, and then the cream solder 51A is reflowed in, for example, a reflow furnace. Thereby, as shown in FIG. 3F, the wiring board material 1 in a state where the chip component 41 is connected to the mounting land of the wiring layer 22 through the connection portion 51 is obtained. The subsequent steps using this wiring board material 1 will be described later with reference to FIG.

  Next, a description will be given with reference to FIG. FIG. 4 shows a manufacturing process of a part centering on the insulating layer 13 and the same 12 in each configuration shown in FIG. First, as shown in FIG. 4A, for example, an FR-4 insulating layer 13 (insulating plate) having a thickness of 300 μm in which metal foils (electrolytic copper foils) 23A and 24A having a thickness of 18 μm are laminated on both surfaces, for example. A through hole 62 for forming a through hole inner wall conductive layer is formed at a predetermined position, and a relief portion 13a is formed in a portion corresponding to the chip component 41 incorporated therein. The escape portion 13a can be formed by using a well-known through-hole forming process such as drilling, and can be easily formed small or large depending on the size of a built-in component.

  Next, each step of electroless plating and electrolytic plating is performed to form a through-hole inner wall conductive layer 33 on the inner wall of the through hole 62 as shown in FIG. At this time, a conductor is also formed on the inner wall of the escape portion 13a. Further, as shown in FIG. 4C, the metal foils 23A and 24A are patterned in a predetermined manner using well-known photolithography to form wiring layers 23 and 24. By patterning the wiring layers 23 and 24, the conductive layer formed on the inner wall of the escape portion 13a is also removed.

  Next, as shown in FIG. 4 (d), conductive bumps (bottom diameter: 200 μm, height: 160 μm, for example) that will become interlayer connectors 32 are formed at predetermined positions on the wiring layer 23. It is formed by screen printing. Subsequently, as shown in FIG. 4E, an FR-4 prepreg 12A (nominal thickness, for example, 100 μm) to be the insulating layer 12 is laminated on the wiring layer 23 side using a press. The prepreg 12 </ b> A is previously provided with an opening corresponding to the built-in chip component 41, similar to the insulating layer 13.

  In this lamination process, the head of the interlayer connector 32 is passed through the prepreg 12A. In addition, the broken line of the head part of the interlayer connection body 32 in FIG. 4E indicates that there are both cases where the head part is plastically deformed and crushed at this stage, and when it is not plastically deformed. By this step, the wiring layer 23 is located by sinking to the prepreg 12A side. The wiring board material obtained as described above is referred to as a wiring board material 2.

  As can be seen from the comparison between FIG. 4 and FIG. 3, the layout position of the chip component 41 in the process shown in FIG. 3 can be freely set as long as the pattern formation of the wiring layer 22 permits. The formation position and size of the relief portion 13a provided in the insulating layer 13 are only in accordance with this, and the layout position of the chip component 41 is not limited by the formation position or size.

  Note that the steps shown in FIG. 4 may be performed as follows. In the stage of FIG. 4A, only the through hole 62 is formed, and the subsequent steps from FIG. 4B to FIG. 4D are performed without forming the escape portion 13a for the built-in component. Next, as a process corresponding to FIG. 4E, prepreg 12A (without opening) is stacked. And it is the process of forming simultaneously the escape part for components incorporation in the insulating layer 13 and the prepreg 12A.

  Next, a description will be given with reference to FIG. FIG. 5 is a diagram showing an arrangement relationship in which the wiring board materials 1 and 2 obtained above are stacked. In FIG. 5, the release sheet 141 is positioned at the upper position. As a result, a slight protrusion such as the wiring layer 24 is absorbed on the upper side surface so that the release sheet 141 adheres. In such an arrangement, the wiring board materials 1 and 2 are laminated and pressed and heated by a press. Thereby, the prepreg 12A is completely cured and the whole is laminated and integrated.

  At this time, due to the fluidity of the prepreg 12 </ b> A obtained by heating, the prepreg 12 </ b> A deforms and enters the space around the chip component 41 and the space inside the through-hole inner wall conductive layer 33, and no gap is generated. Further, the wiring layer 22 is electrically connected to the interlayer connector 32. After this laminating step, the metal foil 21A on the lower surface can be patterned in a predetermined manner using well-known photolithography to obtain a component built-in wiring board as shown in FIG.

  As described above, in this embodiment, the relief portion 13a of the insulating layer 13 can be easily formed corresponding to the position of the component 41 to be incorporated. The processing accuracy can be made high by applying an easy process such as drilling. Therefore, there is no restriction on the layout position of the built-in component 41 due to the processing of the insulating layer 13. For this reason, no extra wiring or layout space is generated due to the arrangement of the components 41. In addition, the screen soldering is used to apply the cream solder 51A for connecting the component 41 to make it more efficient, and a normal mounter can be used to arrange the component 41. Great contribution. These points are significant advantages that cannot be obtained by the method of forming the recesses for the components incorporated after the insulating layers are stacked.

  As a modification of the embodiment shown in FIG. 1, the through-hole inner wall conductive layer 33 provided in the intermediate insulating layer 13 naturally has a configuration similar to the interlayer connector 31 or 32. obtain. Further, the outer wiring layer 21 may be formed at the stage of the wiring board material 1 (for example, at the stage of FIG. 3D), in addition to being obtained by patterning after the last lamination step.

  Further, in the laminating process shown in FIG. 5, for the wiring board materials 1 and 2, the prepreg 12 </ b> A and the interlayer connector 32 are provided not on the wiring board material 2 side but on the wiring board material 1 side. May be. That is, the formation of the interlayer connector 32 and the lamination of the prepreg 12A are performed in advance on the wiring layer 22 (on the insulating layer 11) of the wiring board material 1. In this case, the mounted chip component 41 seems to be an interference factor when the interlayer connection body 32 is formed by screen printing at first glance. However, when the chip component 41 is a sufficiently thin component, what is actually an interference factor? Don't be. In the step of laminating the prepreg 12A, the prepreg 12A can be laminated uniformly in the in-plane direction by pressing and heating with a cushioning material capable of absorbing the thickness of the chip component 41 interposed therebetween.

  Next, a component built-in wiring board according to another embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to another embodiment of the present invention. Components identical or equivalent to those shown in the already described drawings are denoted by the same reference numerals. Is attached. The description of the part is omitted unless there is an additional matter.

  In this embodiment, it has the interlayer connection body 72 formed by metal plate etching instead of the interlayer connection body 32 by printing of the conductive composition. As shown in the drawing, an etching stopper layer remains on the wiring layer 22 side of these interlayer connection bodies 72. Further, the boundary between the insulating layer 11 and the insulating layer 12 is moved deeper by the thickness of the wiring layer 22 as compared with the embodiment shown in FIG. Hereinafter, the manufacturing process will be described including the reason for such a configuration.

  FIG. 7 is a process diagram schematically showing a part of the manufacturing process of the component built-in wiring board shown in FIG. 6 in an insulating layer 11, wiring layers 21 and 22 (including mounting lands) in FIG. The manufacturing process of the part of the interlayer connection bodies 31 and 72 is shown. Components identical or equivalent to those shown in FIG. 6 are given the same reference numerals.

  First, for example, a laminated film in which a layer (etching stopper layer ES) made of, for example, a nickel alloy having a very thin thickness, for example, 2 μm, is prepared on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm is prepared, and this etching stopper layer ES is prepared. A metal plate (copper plate) 72A having a thickness of, for example, 120 μm is laminated and integrated on the side to obtain a clad material having a three-layer structure as shown in FIG.

  Next, as shown in FIG. 7B, the metal foil 22A is patterned in a predetermined pattern with an etchant that can etch only copper using well-known photolithography. Thereby, the wiring layer 22 is formed. Further, as shown in FIG. 7C, an interlayer connection 31 is formed at a predetermined position on the wiring layer 22 by screen printing of a paste-like conductive composition. Subsequently, as shown in FIG. 7D, the prepreg 11A to be the insulating layer 11 is laminated on the wiring layer 22 side using a press machine. At this time, the head of the interlayer connector 31 is made to penetrate the prepreg 11A. By this lamination process, the wiring layer 22 sinks to the prepreg 11A side and is positioned. Note that the broken line at the head of the interlayer connector 31 in FIG. 7D indicates that there are both cases where the head of the interlayer connector 31 is plastically deformed and crushed at this stage and when it is not plastically deformed. .

  Next, a metal foil (electrolytic copper foil) 21A having a thickness of 18 μm, for example, is arranged on the laminated prepreg 11A, and is pressed and heated in the laminating direction by a press. Thereby, as shown in FIG.7 (e), the prepreg 11A is hardened | cured completely and becomes the insulating layer 11, and is laminated | stacked and integrated. At this time, the metal foil 21A is electrically connected to the interlayer connector 31.

  Next, an etching resist at a predetermined position is formed on the metal plate 72A. This etching resist is left where the interlayer connector 72 is to be formed by etching. Then, etching is performed using an etchant that can etch only copper, and an interlayer connector 72 is formed by etching a metal plate, as shown in FIG. The shape varies depending on the shape and size of the etching resist and the etching processing time. Generally, the shape has an axis that coincides with the stacking direction, and the diameter changes in the direction of the axis.

  Then, the wiring board material having a form as shown in FIG. 7G can be obtained by etching away the etching stopper layer ES using the formed interlayer connector 72 as a mask. The following steps include mounting of the chip components shown in FIG. 3E and subsequent steps, and stacking of the prepreg 12A shown in FIG. 4E (however, the prepreg 12A is on the wiring layer 22 side in FIG. 7G). To be laminated). The obtained wiring board material can be used in place of the lower wiring board material 1 in the laminating process shown in FIG. As the material corresponding to the upper wiring board material 2, a material without the formation of the interlayer connector 32 and the lamination of the prepreg 12A is used. Thus, the component built-in wiring board shown in FIG. 6 can be obtained.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. Components that are the same as or equivalent to the components shown in the drawings already described are denoted by the same reference numerals. The description of the part is omitted unless there is an additional matter. In this embodiment, instead of the interlayer connector 32 of the component built-in wiring board shown in FIG. 1, the interlayer connector is formed of the same conductive composition but has a shape whose diameter does not change in the direction of the axis that coincides with the stacking direction. 92 is used.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 8 will be described with reference to FIG. 9 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 8, and corresponds to the stacking process of FIG. 5 in the description of the embodiment shown in FIGS. To do. As shown in FIG. 9, in this embodiment, the prepreg 12A is not laminated in advance on the insulating layer 13 side (the embodiment shown in FIG. 4C is used as the wiring board material 2A). Instead, the interlayer connector 92 is formed in the prepreg 12A by filling a hole in a predetermined position with a conductive composition in advance. The through hole for the component 41 provided in the prepreg 12A is the same as in the case of FIG.

  In such an arrangement, the wiring board materials 1 and 2A and the prepreg 12A are laminated and pressed and heated by a press. As a result, the interlayer connector 92 is electrically connected to the wiring layers 22 and 23, and the prepreg 12A is completely cured so that the whole is laminated and integrated. At this time, due to the fluidity of the prepreg 12 </ b> A obtained by heating, the prepreg 12 </ b> A deforms and enters the space around the chip component 41 and the space inside the through-hole inner wall conductive layer 33, and no gap is generated. After this lamination process, the metal foil 21A on the lower surface is patterned in a predetermined manner using well-known photolithography to obtain a component built-in wiring board as shown in FIG.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 10 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. Components that are the same as or equivalent to the components shown in the drawings already described are denoted by the same reference numerals. The description of the part is omitted unless there is an additional matter. In this embodiment, instead of the interlayer connection body 31 of the component built-in wiring board shown in FIG. 1, the interlayer connection body 81 is made of metal and has an axis that coincides with the stacking direction and has a shape whose diameter changes in the axial direction. Is used.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 10 will be described with reference to FIG. FIG. 11 is a process diagram schematically showing a part of the manufacturing process of the component built-in wiring board shown in FIG. 10 in a cross-sectional view. The wiring layer 22 (more precisely, the metal foil 22A processed into the wiring layer 22) and the interlayer The manufacturing process of the part which consists of the connection body 81 is shown.

  First, for example, a laminated film in which a layer (etching stopper layer ES) made of, for example, a nickel alloy having a very thin thickness, for example, 2 μm, is prepared on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm is prepared, and this etching stopper layer ES is prepared. A metal plate (copper plate) 81A is laminated and integrated on the side to obtain a clad material having a three-layer structure as shown in FIG. Then, an etching mask 89 is formed at a predetermined position on the metal plate 81A.

  Next, the three-layer clad metal plate 81A on which the etching mask 89 is formed is etched with an etchant that can etch only copper. Thereby, as shown in FIG.11 (b), the interlayer connection body 81 can be obtained. Then, the etching stopper layer ES is removed by etching using the formed interlayer connector 81 as a mask. Thereby, the material shown in FIG. 11C is obtained. In the following steps, the material shown in FIG. 11C may be replaced with the material shown in FIG. 3A, and the steps shown in FIG.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 12 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 12, parts that are the same as or equivalent to those already described are given the same reference numerals, and descriptions thereof are omitted. In this embodiment, instead of the interlayer connection body 31 of the component built-in wiring board shown in FIG. 1, an interlayer made of a conductive composition and having an axis that coincides with the stacking direction and whose diameter does not change in the axial direction. A connection body 91 is used.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 12 will be described with reference to FIG. FIG. 13 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 12. The insulating layer 11, the wiring layers 21 and 22 on both sides thereof, and the layers penetrating the insulating layer 11 are shown in FIG. The manufacturing process of the part of the connection body 91 is shown.

  First, as shown in FIG. 13A, for example, a predetermined position of a prepreg 11 </ b> A having a nominal thickness of 100 μm is formed, and the inside of the hole is filled with a conductive composition to form an interlayer connector 91. Next, as shown in FIG. 13B, metal foils (electrolytic copper foils) 21A and 22A having a thickness of, for example, 18 μm are laminated on both surfaces of the prepreg 11A, and are integrated by pressing and heating. By this lamination and integration, the respective metal foils 21A and 22A establish electrical continuity with the interlayer connector 91, and the prepreg 11A is completely cured to become the insulating layer 11.

  Next, as shown in FIG. 13C, the metal foil 22A on one side is subjected to patterning by, for example, well-known photolithography, and processed into a wiring layer 22 (including mounting lands). The material shown in FIG. 13C is used instead of the material shown in FIG. 3D, and the subsequent steps are the same as those described in FIG.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 14 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 14, parts that are the same as or equivalent to those already described are given the same reference numerals, and descriptions thereof are omitted. In this embodiment, in place of the interlayer connection body 31 of the component built-in wiring board shown in FIG. Is used.

  Hereinafter, the manufacturing process of the component built-in wiring board shown in FIG. 14 will be described with reference to FIG. FIG. 15 is a process diagram schematically showing a partial manufacturing process of the component built-in wiring board shown in FIG. 14. In the above description, the wiring layer 22 (more precisely, the metal processed into the wiring layer 22) is shown. The manufacturing process of the part which consists of foil 22A) and the interlayer connection body 101 is shown.

  First, as shown in FIG. 15A, a plating prevention mask 109 having a mask removal portion 109A at a predetermined position is formed on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm, for example. The shape of the mask removal unit 109A is, for example, a substantially cylindrical shape. Next, an electrolytic plating process is performed on the plating prevention mask 109 side using the metal foil 22A as an electric supply path, and as shown in FIG. 15B, for example, a copper plating layer is grown in the mask removal portion 109A. This grown plating layer becomes the interlayer connection body 101. After the plating layer is grown, the plating blocking mask 109 is removed to obtain a material as shown in FIG. In the following steps, the material shown in FIG. 15C may be replaced with the material shown in FIG. 3A, and the steps shown in FIG.

  As described above, in FIGS. 10 to 15, various examples of the double-sided wiring board portion including the insulating layer 11 and the wiring layers 21 and 22 on both sides thereof are shown from the viewpoint of the configuration of the interlayer connector. Of course, a double-sided wiring board having an interlayer connection other than those described above may be used. For example, the interlayer connection body may be a well-known through-hole inner wall conductor formed by a drilling and plating process. Furthermore, a double-sided wiring board having various other configurations of the interlayer connector can be used.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 16 is a cross-sectional view schematically showing a configuration of a component built-in wiring board according to still another embodiment of the present invention. In FIG. 14, the same or equivalent parts as those already described are denoted by the same reference numerals. The explanation of that part is omitted unless there is an additional matter. In this embodiment, the interlayer connection is performed without using a connection body that is provided between the surfaces of the wiring pattern through the insulating layer, such as the interlayer connection bodies 31 and 32. The construction itself in which the interlayer connectors 31 and 32 are omitted can be achieved by referring to the manufacturing process already described.

  The through-hole inner wall conductive layer 34 as a new component can be formed as follows. That is, for example, after the lamination process as shown in FIG. 5 is completed, holes penetrating the insulating layers 11, 12, and 13 are formed at predetermined positions of the insulating layers by drilling, for example. Then, each step of electroless plating and electrolytic plating is performed to form a conductive layer 34 on the inner wall of the through hole. By this plating step, a whole plating layer is formed on the upper surface of the insulating layer 13.

  Therefore, this upper surface is subjected to patterning again by applying a well-known photolithography process to form a wiring layer 24 having a predetermined pattern. In this patterning, it is preferable to remove all the plating layer formed on the insulating layer 12 filling and entering the escape portion 13a of the insulating layer 13. This is because the insulating layer 13 is thin on the built-in component 41 in this part, and insulation with the component 41 may not be guaranteed.

Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on one Embodiment of this invention. The top view which shows typically the structure of the component built-in wiring board shown in FIG. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. 1, FIG. 2 with a typical cross section. FIG. 3 is a process view schematically showing another part of the manufacturing process of the component built-in wiring board shown in FIG. 1 and FIG. FIG. 5 is a process diagram schematically showing still another part of the manufacturing process of the component built-in wiring board shown in FIGS. 1 and 2. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another embodiment of this invention. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another embodiment of this invention. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another embodiment of this invention. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another embodiment of this invention. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another embodiment of this invention. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. 14 with a typical cross section. Sectional drawing which shows typically the structure of the component built-in wiring board which concerns on another embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board material, 2, 2A ... Wiring board material, 11 ... Insulating layer, 11A ... Prepreg, 12 ... Insulating layer, 12A ... Prepreg, 13 ... Insulating layer, 13a ... Escape part for electrical / electronic parts, 21 ... wiring layer (metal wiring pattern), 21A ... metal foil (copper foil), 22 ... wiring layer (metal wiring pattern), 22A ... metal foil (copper foil), 23 ... wiring layer (metal wiring pattern), 23A ... metal Foil (copper foil), 24 ... wiring layer (metal wiring pattern), 24A ... metal foil (copper foil), 31 ... interlayer connection body (conductive bump by conductive composition printing), 32 ... interlayer connection body (conductivity) Conductive bumps by composition printing), 33 ... through hole inner wall conductive layer, 34 ... through hole inner wall conductive layer, 41 ... chip component (electric / electronic component), 51 ... solder, 51a ... cream solder, 62 ... through hole, 72 ... interlayer connection (gold Metal bumps formed by plate etching), 72A ... Metal plate (copper plate), 81 ... Interlayer connection (metal bumps formed by metal plate etching), 81A ... Metal plate (copper plate), 89 ... Etching mask, 91, 92 ... interlayer connection (filled with conductive composition), 101 ... interlayer connection (conductor bump formed by plating), 109 ... plating prevention mask, 109A ... mask removal part, 141 ... release sheet, ES ... etching stopper .

Claims (12)

A first insulating layer;
A wiring pattern provided on one surface side of the first insulating layer;
Electrical / electronic components mounted and connected to the wiring pattern;
A relief portion is formed facing the first insulating layer and spaced from the first insulating layer and penetrating in the layer thickness direction corresponding to the position where the electric / electronic component is mounted. And a second insulating layer whose surface opposite to the side facing the first insulating layer is at least partially open,
Provided to fill a gap between the first insulating layer and the second insulating layer, and to surround the electrical / electronic component and also to fill the relief portion of the second insulating layer. A component built-in wiring board, comprising: a third insulating layer. A second wiring pattern provided between the second insulating layer and the third insulating layer;
An axis that penetrates the third insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the second wiring pattern, is made of a conductive composition, and coincides with the stacking direction. 2. The component built-in wiring board according to claim 1, further comprising an interlayer connection body having a shape whose diameter changes in a direction of the axis. A second wiring pattern provided between the second insulating layer and the third insulating layer;
An axis that penetrates the third insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the second wiring pattern, is made of a conductive composition, and coincides with the stacking direction. 2. The component built-in wiring board according to claim 1, further comprising an interlayer connection body having a shape whose diameter does not change in the direction of the axis. A second wiring pattern provided between the second insulating layer and the third insulating layer;
An axis that penetrates the third insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the second wiring pattern, is made of metal, and coincides with the stacking direction. The component built-in wiring board according to claim 1, further comprising an interlayer connection body having a shape whose diameter changes in the direction. A second wiring pattern provided on the side of the first insulating layer opposite to the side on which the wiring pattern is located;
An axis that penetrates the first insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the second wiring pattern, is made of a conductive composition, and coincides with the stacking direction. 2. The component built-in wiring board according to claim 1, further comprising an interlayer connection body having a shape whose diameter changes in a direction of the axis. A second wiring pattern provided on the side of the first insulating layer opposite to the side on which the wiring pattern is located;
An axis that penetrates the first insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the second wiring pattern, is made of metal, and has an axis that coincides with the stacking direction. The component built-in wiring board according to claim 1, further comprising an interlayer connection body having a shape whose diameter changes in the direction. A second wiring pattern provided on the side of the first insulating layer opposite to the side on which the wiring pattern is located;
An axis that penetrates the first insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the second wiring pattern, is made of a conductive composition, and coincides with the stacking direction. 2. The component built-in wiring board according to claim 1, further comprising an interlayer connection body having a shape whose diameter does not change in the direction of the axis. A second wiring pattern provided on the side of the first insulating layer opposite to the side on which the wiring pattern is located;
An axis that penetrates the first insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the second wiring pattern, is made of metal, and has an axis that coincides with the stacking direction. The component built-in wiring board according to claim 1, further comprising an interlayer connection body having a shape whose diameter does not change in the direction. A through hole inner wall conductive layer provided through the first insulating layer, the third insulating layer, and the second insulating layer;
A second wiring pattern provided on a surface of the second insulating layer opposite to the side facing the first insulating layer so as to be electrically connected to the inner wall conductive layer of the through hole. In addition,
The component built-in wiring board according to claim 1, wherein the second wiring pattern is not formed in contact with the third insulating layer filling the relief portion of the second insulating layer.   The component built-in wiring board according to claim 1, wherein the relief portion of the second insulating layer is substantially circular as a planar shape. Mounting and connecting electrical / electronic components on the surface of the first insulating plate on which the wiring pattern is formed;
The second insulating plate having an escape portion penetrating in the thickness direction corresponding to the position of the electric / electronic component mounted / connected to the first wiring board is mounted / connected to the electric / electronic component A permanent laminated insulator is provided on the surface opposite to the side facing the first insulating plate via a prepreg having a second relief portion penetrating in the thickness direction corresponding to the position of And a step of laminating and integrating on the surface of the first insulating plate on which the electrical / electronic components are mounted and connected under conditions that do not occur.   12. The method of manufacturing a component built-in wiring board according to claim 11, wherein the relief portion of the second insulating plate is substantially circular as a planar shape.

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