JP2007083713A - Production method and transport method for very thin copper foil laminated film - Google Patents
Production method and transport method for very thin copper foil laminated film Download PDFInfo
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Abstract
Description
本発明は、長期保管が可能で、軽量で搬送が容易な極薄銅箔積層フィルムの製造方法及びこれらの移送方法に関する。 The present invention relates to a method for manufacturing an ultrathin copper foil laminated film that can be stored for a long period of time, is light and easy to transport, and a method for transferring these.
ＩＣ或いはＬＳＩなどの電子部品を実装する目的で、キャリア箔付き銅箔積層フィルムが製造されている。
キャリア箔箔付き銅箔積層フィルムは、耐熱性フィルムの製造メーカーがキャリア箔付き銅箔と耐熱性フィルムとを積層して製造し、耐熱性フィルムの製造メーカーより配線加工メーカーに輸送され、配線加工メーカーにてキャリア箔を剥がして、銅箔を配線加工して、キャリア箔テープが製造されている。
For the purpose of mounting electronic components such as IC or LSI, a copper foil laminated film with a carrier foil is manufactured.
Copper foil laminated film with carrier foil foil is manufactured by laminating copper foil with carrier foil and heat resistant film, and transported from the heat resistant film manufacturer to the wiring processing manufacturer for wiring processing. The carrier foil tape is manufactured by peeling the carrier foil at the manufacturer and wiring the copper foil.
キャリア箔を剥がしたフレキシブル積層板としては、特許文献１として、耐熱性接着フィルムの少なくとも一面に金属箔を貼り合わせてなるフレキシブル積層板の製造方法であって、前記耐熱性接着フィルムと、金属箔および離型層を有する積層体とを、金属箔と耐熱性接着性フィルムとが接するように、少なくとも一対の金属ロールの間において保護フィルムを介して熱ラミネートする工程と、前記保護フィルムを分離する工程と、前記離型層を金属箔から分離する工程とを少なくとも含む、フレキシブル積層板の製造方法が開示されている。
キャリア箔付き銅箔積層フィルムは、キャリア箔付きの薄い銅箔が銅箔メーカーにて製造され、耐熱性フィルムの製造メーカーで、キャリア箔付きの薄い銅箔と耐熱性フィルムとをはりあわせて製造、保管され、配線加工メーカーに輸送、保管され、配線加工メーカーで配線加工されている。
キャリア箔付き銅箔積層フィルムは、キャリア箔を剥がすと銅箔表面が変色などの影響を受けるため、長期保管が困難であり、耐熱性フィルムの製造メーカーより、キャリア箔を剥がすことなくキャリア箔付き銅箔積層フィルムを配線加工メーカーに移送、保管され、使用されている。そのため、配線加工に不要なキャリア箔により、輸送コストが高くなり、また重量物を取り扱うため搬送作業が困難で、作業者に危険が及ぶことが考えられる。
本発明は、キャリア箔付き銅箔積層フィルムで、長期保管が可能で、軽量で搬送が容易な極薄銅箔積層フィルムの製造方法及びこれらの移送方法を提供することを目的とする。
Copper foil laminated film with carrier foil is manufactured by bonding a thin copper foil with a carrier foil to a thin copper foil with a carrier foil and a heat-resistant film manufacturer. , Stored, transported and stored in a wiring processing manufacturer, and processed by a wiring processing manufacturer.
Copper foil laminated film with carrier foil is difficult to store for a long time because the surface of the copper foil is affected by discoloration when the carrier foil is peeled off, and the carrier foil is attached without removing the carrier foil from the heat-resistant film manufacturer. Copper foil laminated film is transported, stored and used by wiring manufacturers. For this reason, it is considered that the carrier foil unnecessary for wiring processing increases the transportation cost, and the handling work is difficult because a heavy object is handled, resulting in danger to the worker.
It is an object of the present invention to provide a method for producing an ultrathin copper foil laminated film which is a copper foil laminated film with a carrier foil, can be stored for a long period of time, is light and easy to carry, and a method for transferring these.
本発明の第一は、極薄銅箔積層フィルムの製造方法であり、下記の工程（Ａ）又は工程（Ｂ）により製造されることを特徴とする極薄銅箔積層フィルムの製造方法である。
・工程（Ａ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第二工程（Ａ）とを行う。
・工程（Ｂ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されている場合、銅表面の酸化部分を除去する第二工程（Ｂ）、
（３）上記第ニ工程（Ｂ）の酸化部分を除去することによりさらに銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第三工程（Ｂ）とを行う。
1st of this invention is a manufacturing method of an ultra-thin copper foil laminated film, and is a manufacturing method of an ultra-thin copper foil laminated film characterized by being manufactured by the following process (A) or process (B). .
・ Process (A)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) The second step (A) is performed in which the copper surface is not oxidized by removing the carrier foil in the first step, and the copper surface is subjected to a rust prevention treatment.
・ Process (B)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) When the copper surface is oxidized by removing the carrier foil in the first step, the second step (B) for removing the oxidized portion of the copper surface,
(3) The third step (B) is performed in which the copper surface is not oxidized by removing the oxidized portion in the second step (B) and the rust prevention treatment is performed on the copper surface.
本発明の第二は、極薄銅箔積層フィルムを出荷するに際し、下記の工程（Ａ）又は工程（Ｂ）を行い、
その後、梱包用袋体内に極薄銅箔積層フィルムを封入して梱包し、移送する、
ことを特徴とする極薄銅箔積層フィルムの移送方法である。
好ましくは本発明の第二は、極薄銅箔積層フィルムを出荷するに際し、下記の工程（Ａ）又は工程（Ｂ）を行い、
その後、梱包用袋体内に極薄銅箔積層フィルムを封入して梱包し、前期極薄銅箔積層フィルムの梱包体を移送する、
ことを特徴とする極薄銅箔積層フィルムの移送方法である。
・工程（Ａ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第二工程（Ａ）とを行う。
・工程（Ｂ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されている場合、銅表面の酸化部分を除去する第二工程（Ｂ）、
（３）上記第ニ工程（Ｂ）の酸化部分を除去することによりさらに銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第三工程（Ｂ）とを行う。
In the second aspect of the present invention, when shipping an ultra-thin copper foil laminated film, the following step (A) or step (B) is performed,
After that, the ultrathin copper foil laminated film is enclosed in the packing bag body, packed, and transferred.
It is the transfer method of the ultra-thin copper foil laminated film characterized by the above-mentioned.
Preferably, in the second aspect of the present invention, when shipping an ultrathin copper foil laminated film, the following step (A) or step (B) is performed,
Then, encapsulate and pack the ultrathin copper foil laminated film in the packaging bag, and transfer the packaging body of the previous ultrathin copper foil laminated film,
It is the transfer method of the ultra-thin copper foil laminated film characterized by the above-mentioned.
・ Process (A)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) The second step (A) is performed in which the copper surface is not oxidized by removing the carrier foil in the first step, and the copper surface is subjected to a rust prevention treatment.
・ Process (B)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) When the copper surface is oxidized by removing the carrier foil in the first step, the second step (B) for removing the oxidized portion of the copper surface,
(3) The third step (B) is performed in which the copper surface is not oxidized by removing the oxidized portion in the second step (B) and the rust prevention treatment is performed on the copper surface.
本発明の第三は、本発明の第一で製造される極薄銅箔積層フィルムを受け入れる工程と、前記極薄銅箔積層フィルムの銅箔面から防錆皮膜を除去する工程と、を有する電気回路基板の製造方法である。
本発明の第四は、本発明の第二で移送される極薄銅箔積層フィルムの梱包体を受け入れる工程と、前記極薄銅箔積層フィルムの銅箔面から防錆皮膜を除去する工程と、を有する電気回路基板の製造方法である。
好ましくは本発明の第四は、本発明の第二で移送される梱包用袋体内に梱包の極薄銅箔積層フィルムを受け入れる工程と、前記極薄銅箔積層フィルムの銅箔面から防錆皮膜を除去する工程と、を有する電気回路基板の製造方法である。
3rd of this invention has the process of accepting the ultra-thin copper foil laminated film manufactured by 1st of this invention, and the process of removing a rust preventive film from the copper foil surface of the said ultra-thin copper foil laminated film It is a manufacturing method of an electric circuit board.
The fourth of the present invention is a process of accepting a package of ultrathin copper foil laminated film transferred in the second of the present invention, and a process of removing a rust preventive film from the copper foil surface of the ultrathin copper foil laminated film, The manufacturing method of the electric circuit board | substrate which has these.
Preferably, the fourth aspect of the present invention is a rust-proofing from the copper foil surface of the ultrathin copper foil laminate film, the step of receiving the ultrathin copper foil laminate film of the packaging into the packaging bag transported in the second of the present invention. And a step of removing the film.
本発明は、キャリア箔を予め取り除いて、銅箔表面に防錆処理を行っているため、
１）軽量で搬送が容易で、作業者に危険が及ぶ可能性を低減し、
２）同じ巻き幅に加工した場合では、より長い極薄銅箔積層フィルムを取り扱うことができ、
３）長期保管が可能な、
長尺の極薄銅箔を耐熱性フィルムと積層した極薄銅箔積層フィルムを製造することができる。
Since the present invention removes the carrier foil in advance and performs rust prevention treatment on the copper foil surface,
1) Lightweight and easy to transport, reducing the possibility of danger to workers,
2) When processed to the same winding width, longer ultrathin copper foil laminated film can be handled,
3) Long-term storage is possible.
An ultrathin copper foil laminated film obtained by laminating a long ultrathin copper foil with a heat resistant film can be produced.
極薄銅箔積層フィルムの製造方法の一例を工程（Ａ）或いは工程（Ｂ）として示す。
・工程（Ａ）を以下に示す。
（１）キャリア箔付き極薄銅張積層フィルムからキャリア箔を除去し、さらに必要に応じて酸洗し、水洗し、乾燥する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行い、さらに必要に応じて水洗し、乾燥する第二工程（Ａ）、
・工程（Ｂ）
（１）キャリア箔付き極薄銅張積層フィルムからキャリア箔を除去し、さらに必要に応じて酸洗し、水洗し、乾燥する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されている場合、銅表面の酸化部分を除去し、さらに必要に応じて水洗し、乾燥する第二工程（Ｂ）、
（３）上記第ニ工程（Ｂ）の酸化部分を除去することによりさらに銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行い、さらに必要に応じて水洗し、乾燥する第三工程（Ｂ）とを行う。
An example of the manufacturing method of an ultra-thin copper foil laminated film is shown as a process (A) or a process (B).
-Process (A) is shown below.
(1) A first step in which the carrier foil is removed from the ultrathin copper-clad laminated film with a carrier foil, and further pickled, washed with water, and dried as necessary.
(2) The second step (A) in which the copper surface is not oxidized by removing the carrier foil in the first step, and the copper surface is subjected to a rust prevention treatment, further washed with water as necessary, and dried. ),
・ Process (B)
(1) A first step in which the carrier foil is removed from the ultrathin copper-clad laminated film with a carrier foil, and further pickled, washed with water, and dried as necessary.
(2) If the copper surface is oxidized by removing the carrier foil in the first step, the oxidized portion on the copper surface is removed, and further washed with water if necessary and dried (B),
(3) Rust prevention treatment is performed on the copper surface within a short period of time during which the copper surface is not oxidized by removing the oxidized portion in the second step (B), followed by washing with water and drying if necessary. Three steps (B) are performed.
極薄銅箔積層フィルムの製造方法において、工程（Ａ）が工程（Ｂ）よりも工程が少なく、簡便な方法であるために好まく、さらに積層された銅箔の酸化物などの除去工程がなく、銅箔に影響を及ぼすことがない。しかしながら、第一工程によってキャリア箔を除去する結果、銅表面が酸化されている場合には工程（Ｂ）を採用することが好ましい。銅表面の酸化が起こりうる例としては、キャリア箔の除去後に迅速に防錆処理ができない場合、キャリア箔の除去の際に採用される工程で酸化が避けられない場合、極薄銅箔積層フィルムの処理のために銅表面の酸化が避けられない場合、受け入れたキャリア箔付き極薄銅箔が最初から酸化されている場合等があり、これらの場合は工程（Ｂ）を採用することが好ましい。 In the manufacturing method of an ultra-thin copper foil laminated film, the step (A) is preferable because it is a simple method with fewer steps than the step (B), and further, there is a step of removing oxides and the like of the laminated copper foil. And does not affect the copper foil. However, if the copper surface is oxidized as a result of removing the carrier foil in the first step, it is preferable to adopt the step (B). Examples of copper surface oxidation that can occur are cases where rust preventive treatment cannot be performed quickly after removal of the carrier foil, and oxidation is inevitable in the process employed when removing the carrier foil. When the copper surface oxidation is unavoidable due to the treatment, the received ultrathin copper foil with carrier foil may be oxidized from the beginning, and in these cases, it is preferable to employ the step (B). .
極薄銅箔積層フィルムの製造方法について説明する。
工程（Ａ）及び工程（Ｂ）の第一工程において、
キャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する方法としては、公知の方法を用いることができ、キャリア箔付き極薄銅張積層フィルムからキャリア箔を引き剥がす方法、キャリア箔付き極薄銅張積層フィルムからキャリア箔をエッチングにより除去する方法などである。
The manufacturing method of an ultra-thin copper foil laminated film is demonstrated.
In the first step of step (A) and step (B),
As a method of removing the carrier foil from the ultra-thin copper-clad laminate film with carrier foil, a known method can be used, a method of peeling the carrier foil from the ultra-thin copper-clad laminate film with carrier foil, For example, the carrier foil is removed from the copper-clad laminated film by etching.
工程（Ａ）及び工程（Ｂ）の第一工程のキャリア箔をエッチングで除去するエッチング方法としては、公知のエッチング方法を用いることができ、キャリア箔の面からキャリア箔の厚みまでを塩化鉄水溶液、過硫酸アンモニウム水溶液などでエッチングして、キャリア箔を除去することができる。 As an etching method for removing the carrier foil in the first step of the step (A) and the step (B) by etching, a known etching method can be used, and an iron chloride aqueous solution from the surface of the carrier foil to the thickness of the carrier foil is used. The carrier foil can be removed by etching with an aqueous ammonium persulfate solution or the like.
第二工程（Ａ）及び第三工程（Ｂ）において、銅表面に防錆処理を行う方法としては、公知の方法を用いることができ、例えばベンゾトリアゾール、ベンゾチアゾール、トリルトリアゾール、アルキルイミダゾール、ベンジルイミダゾール等を用いる有機防錆、亜鉛、クロメート、亜鉛合金等を用いる無機防錆などを用いることができる。 In the second step (A) and the third step (B), a known method can be used as a method for subjecting the copper surface to rust prevention, such as benzotriazole, benzothiazole, tolyltriazole, alkylimidazole, and benzyl. Organic rust prevention using imidazole or the like, inorganic rust prevention using zinc, chromate, zinc alloy, or the like can be used.
第ニ工程（Ｂ）において、第一工程のキャリア箔を除去することにより銅表面が酸化されている場合、銅表面の酸化部分を除去する必要がある。銅表面の酸化部分の除去方法としては、公知の方法を用いることができ、例えば、塩酸系溶液、硫酸系溶液、硫酸−過酸化水素系溶液等の溶液で酸洗する方法、酸性キレート水溶液などで洗浄する方法などを用いることができる。 In the second step (B), when the copper surface is oxidized by removing the carrier foil in the first step, it is necessary to remove the oxidized portion of the copper surface. As a method for removing the oxidized portion on the copper surface, a known method can be used, such as a method of pickling with a solution such as a hydrochloric acid solution, a sulfuric acid solution, a sulfuric acid-hydrogen peroxide solution, an acidic chelate aqueous solution, etc. The method of washing with can be used.
上記の各工程で水洗、或いは水洗し、乾燥する方法としては、公知の方法で行うことができる。 As a method of washing with water in each of the above steps, or washing with water and drying, a known method can be used.
キャリア付き銅箔と耐熱性フィルムから、連続して極薄銅箔積層フィルムを製造する方法の一例を示す。
キャリア付き銅箔と耐熱性フィルムとを加圧部材、例えば金属ロール、好適にはダブルベルトプレスなどを使用し、
（１）長尺状のキャリア付き銅箔と、片面或いは両面に熱圧着性ポリイミド層を有する長尺状のポリイミドフィルム、必要応じて補強材とを重ね合わせて（両面に熱圧着性ポリイミド層を有するポリイミドを用いる場合は、両面にキャリア付き銅箔を用いる）、
好ましくは導入する直前のインラインで１５０〜２５０℃程度、特に１５０℃より高く２５０℃以下の温度で２〜１２０秒間程度予熱できるように熱風供給装置や赤外線加熱機などの予熱器を用いて予熱して、
一対の圧着ロール又はダブルベルトプレスを用いて、一対の圧着ロール又はダブルベルトプレスの加熱圧着ゾーンの温度が熱圧着性ポリイミドのガラス転移温度より２０℃以上高い温度から４００℃の温度範囲で、特にガラス転移温度より３０℃以上高い温度から４００℃の温度範囲で、加圧下に熱圧着し、特にダブルベルトプレスの場合には引き続いて冷却ゾ−ンで加圧下に冷却して、好適には熱圧着性ポリイミドのガラス転移温度より２０℃以上低い温度、特に３０℃以上低い温度まで冷却して、積層させ、ロール状に巻き取ることにより、ロール状の片面或いは両面にキャリア箔付き銅張積層ポリイミドフィルムを製造する工程、
（２）キャリア箔付き銅張積層ポリイミドフィルムからキャリア箔を除去し、さらに必要に応じて酸洗し、水洗し、乾燥する工程、
（３）上記第一工程のキャリア箔を除去することにより銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行い、さらに必要に応じて水洗し、乾燥する工程、とを連続して行う。
An example of a method for continuously producing an ultrathin copper foil laminated film from a copper foil with a carrier and a heat resistant film is shown.
Using a copper foil with a carrier and a heat resistant film using a pressure member such as a metal roll, preferably a double belt press,
(1) A long copper foil with a carrier, a long polyimide film having a thermocompression bonding polyimide layer on one side or both sides, and a reinforcing material as necessary (with a thermocompression bonding polyimide layer on both sides) When using polyimide having, use copper foil with carrier on both sides),
Preferably, preheating using a preheater such as a hot air supply device or an infrared heater so that it can be preheated at about 150 to 250 ° C., particularly at a temperature higher than 150 ° C. and lower than 250 ° C. for about 2 to 120 seconds, just before introduction. And
Using a pair of crimping rolls or a double belt press, the temperature of the thermocompression bonding zone of the pair of crimping rolls or double belt press is in a temperature range from a temperature 20 ° C. higher than the glass transition temperature of the thermocompression bonding polyimide to 400 ° C., particularly Thermocompression bonding is performed under pressure in a temperature range of 30 ° C or higher than the glass transition temperature to 400 ° C. Especially in the case of a double belt press, cooling is performed under pressure with a cooling zone, and preferably heat is applied. A copper-clad laminated polyimide with a carrier foil on one or both sides of the roll by cooling and laminating to a temperature lower than the glass transition temperature of the pressure-bonding polyimide by 20 ° C. A process for producing a film,
(2) A step of removing the carrier foil from the copper-clad laminated polyimide film with a carrier foil, further pickling, washing with water, and drying, if necessary.
(3) In a short time when the copper surface is not oxidized by removing the carrier foil in the first step, the copper surface is subjected to a rust prevention treatment, further washed with water if necessary, and dried. And do it.
キャリア箔は、特に材質は限定していないが、極薄銅箔とはり合わすことができ、極薄銅箔を補強し、保護する役割を有するものであればよく、例えばアルミニウム箔、銅箔、表面をメタルコーティングした樹脂箔などを用いることができる。
キャリア箔の厚さは、特に限定されないが、一般的には１〜２００μｍ厚のものが好ましく、さらに５〜１００μｍが好ましく、特に７〜５０μｍが好ましい。
またキャリア箔の厚さは、極薄銅箔より厚い物が好ましい。
キャリア箔は、極薄銅箔と平面的に貼り合わされたような形態で用いられるものであればよい。キャリア箔付電解銅箔の場合では、キャリア箔の表面上に電解銅箔となる銅成分を電析させるので、キャリア箔には少なくとも導電性を有することが必要となる。
そして、このキャリア箔付電解銅箔は、連続した製造工程を流れ、少なくとも銅張積層板の製造終了時までは、電解銅箔層と接合した状態を維持し、ハンドリングを容易にし、電解銅箔をあらゆる意味で補強し、保護する役割を持つものであるので、キャリア箔は所定の強度を有する必要がある。これらのことを満足するものであれば、「キャリア箔」としての使用が可能であり、一般的には金属箔が想定されるが、導電性フィルム等も広く含む概念として用いているのである。
キャリア箔付電解銅箔などのキャリア箔付銅箔は、一般にピーラブルタイプとエッチャブルタイプに大別することが可能である。違いを一言で言えば、ピーラブルタイプはプレス成形後にキャリア箔を引き剥がして除去するタイプのものであり、エッチャブルタイプとは、プレス成形後にキャリア箔をエッチング法にて除去するタイプのものである。
The carrier foil is not particularly limited in material, but can be bonded to the ultrathin copper foil, and may be any material that can reinforce and protect the ultrathin copper foil, such as aluminum foil, copper foil, A resin foil whose surface is metal-coated can be used.
The thickness of the carrier foil is not particularly limited, but is generally preferably 1 to 200 μm, more preferably 5 to 100 μm, and particularly preferably 7 to 50 μm.
The carrier foil is preferably thicker than the ultrathin copper foil.
The carrier foil only needs to be used in such a form that it is planarly bonded to the ultrathin copper foil. In the case of an electrolytic copper foil with a carrier foil, the copper component that becomes the electrolytic copper foil is electrodeposited on the surface of the carrier foil, so that the carrier foil needs to have at least conductivity.
And this electrolytic copper foil with carrier foil flows through a continuous manufacturing process, and at least until the end of the production of the copper clad laminate, maintains the state of being joined to the electrolytic copper foil layer, facilitating the handling, The carrier foil needs to have a predetermined strength because it has a role to reinforce and protect the substrate in every sense. As long as these conditions are satisfied, it can be used as a “carrier foil”. Generally, a metal foil is assumed, but it is used as a concept including a conductive film and the like.
Generally, copper foil with carrier foil such as electrolytic copper foil with carrier foil can be roughly divided into peelable type and etchable type. In short, the peelable type is a type that peels and removes the carrier foil after press molding, and the etchable type is a type that removes the carrier foil by etching after press molding. It is.
極薄銅箔としては、キャリア箔と積層して用いることができる薄い銅箔が用いられ、この銅箔は上述のように電解法のほか、公知の方法で作成できる。
極薄銅箔の厚みは、キャリア箔付きの銅箔であればどのような厚みでもよいが、好ましくは０．１μｍ〜８μｍの範囲が好ましい。
As the ultrathin copper foil, a thin copper foil that can be used by being laminated with a carrier foil is used. This copper foil can be prepared by a known method in addition to the electrolytic method as described above.
The thickness of the ultrathin copper foil may be any thickness as long as it is a copper foil with a carrier foil, but is preferably in the range of 0.1 μm to 8 μm.
キャリア箔付き極薄銅張積層フィルムは、
１）熱圧着性或いは接着性を有する耐熱性フィルムと、キャリア箔付き銅箔とを加圧状態或いは加圧加熱状態で、はりあわせたもの、
２）銅箔表面に熱圧着性或いは接着性を有するキャリア箔付き銅箔と、耐熱性フィルムとを加圧状態或いは加圧加熱状態で、はりあわせたもの、など、公知のキャリア箔付き銅箔と耐熱性フィルムとを積層したものを用いることができる。
Ultra-thin copper-clad laminated film with carrier foil
1) A heat-resistant film having thermocompression bonding property or adhesive property and a copper foil with a carrier foil bonded in a pressurized state or a pressurized heating state,
2) A known copper foil with a carrier foil, such as a laminate of a copper foil with a carrier foil having thermocompression bonding or adhesion on the surface of the copper foil and a heat-resistant film in a pressurized state or a pressurized heating state. And a laminate of a heat resistant film can be used.
耐熱性フィルムとしては、ポリイミド、アラミド、ポリフェニレンオキサイド、全芳香族ポリエステル、エポキシ樹脂、シアネートエステル樹脂、フェノールレゾール樹脂、全芳香族ポリエステル樹脂、ＰＰＥ（ポリフェニレンエーテル）樹脂、ビスマレイミドトリアジン樹脂及びフッ素樹脂など、さらにこれらとガラス繊維、ポリイミド繊維、アラミド繊維などの繊維の不織布との複合フィルムを用いることができる。
フィルムの厚みは、用いる目的に応じて設計すればよい。
Examples of heat resistant films include polyimide, aramid, polyphenylene oxide, wholly aromatic polyester, epoxy resin, cyanate ester resin, phenol resole resin, wholly aromatic polyester resin, PPE (polyphenylene ether) resin, bismaleimide triazine resin and fluorine resin. Furthermore, a composite film of these and a nonwoven fabric of fibers such as glass fiber, polyimide fiber, and aramid fiber can be used.
What is necessary is just to design the thickness of a film according to the objective to be used.
本発明で製造される極薄銅箔積層フィルムは、極薄銅箔積層フィルムを出荷するに際し、梱包用袋体内に極薄銅箔積層フィルムを封入して、必要に応じて窒素、アルゴン、ヘリウムなどの不活性ガスを充填して封入して、或いは窒素、アルゴン、ヘリウムなどの除湿の不活性ガスを充填して封入して、極薄銅箔積層フィルムを梱包し、搬送、出荷することができる。 The ultra-thin copper foil laminated film produced in the present invention is prepared by enclosing the ultra-thin copper foil laminated film in a packaging bag when shipping the ultra-thin copper foil laminated film, and if necessary, nitrogen, argon, helium Filled with an inert gas such as nitrogen, argon, helium, etc. it can.
本発明で製造される極薄銅箔積層フィルムは、回路基板などの製造に好適に用いることができる。回路基板の製造方法では、本発明で製造される極薄銅箔積層フィルムを受け入れ、極薄銅箔積層フィルムの銅箔面から、防錆処理により銅表面を覆っている防錆皮膜を除去する。
防錆皮膜の除去は、防錆処理の方法に依存する公知の方法で行うことができるが、有機防錆の場合は酸性溶液(例えば硫酸、塩酸等)による洗浄、無機防錆の場合は機械整面、電解脱脂、マイクロエッチングによる洗浄等が用いられる。
防錆皮膜を除去している極薄銅箔積層フィルムは、その後は、キャリア箔付きの状態で極薄銅張積層フィルムを受け入れる場合と同様に処理して（例えばセミアディティブ法など）、フレキシブル基板（ＦＰＣ基板）、プリント基板、ＣＯＦ基板、ＣＯＢ基板、ＴＡＢ基板などの電子部品や電子機器類などの基板として用いることができる。
The ultrathin copper foil laminated film manufactured by this invention can be used suitably for manufacture of a circuit board etc. In the method of manufacturing a circuit board, the ultrathin copper foil laminated film produced in the present invention is accepted, and the rust preventive film covering the copper surface is removed from the copper foil surface of the ultrathin copper foil laminated film by rust prevention treatment. .
The removal of the rust preventive film can be performed by a known method depending on the method of the rust preventive treatment, but in the case of organic rust prevention, washing with an acidic solution (for example, sulfuric acid, hydrochloric acid, etc.) Surface cleaning, electrolytic degreasing, cleaning by microetching, or the like is used.
The ultra-thin copper foil laminated film from which the rust preventive film has been removed is then processed in the same manner as when an ultra-thin copper-clad laminated film is received with a carrier foil (for example, a semi-additive method) to form a flexible substrate. (FPC board), printed boards, COF boards, COB boards, TAB boards, and other electronic components and boards for electronic devices.
本発明で移送される不活性ガスなどが充填している梱包用袋体内に梱包の極薄銅箔積層フィルムは、回路基板などの製造に好適に用いることができる。回路基板の製造方法では、本発明の不活性ガスなどが充填している袋体内に極薄銅箔積層フィルムを梱包している梱包体を受け入れ、梱包体の袋より極薄銅箔積層フィルムを取り出し、極薄銅箔積層フィルムの銅箔面から、防錆処理により銅表面を覆っている防錆皮膜を除去する。
防錆皮膜の除去は、防錆処理の方法に依存する公知の方法で行うことができるが、有機防錆の場合は酸性溶液(例えば硫酸、塩酸等)による洗浄、無機防錆の場合は機械整面、電解脱脂、マイクロエッチングによる洗浄等が用いられる。
防錆皮膜を除去している極薄銅箔積層フィルムは、その後は、キャリア箔付きの状態で極薄銅張積層フィルムを受け入れる場合と同様に処理して（例えばセミアディティブ法など）、フレキシブル基板（ＦＰＣ基板）、プリント基板、ＣＯＦ基板、ＣＯＢ基板、ＴＡＢ基板などの電子部品や電子機器類などの基板として用いることができる。
梱包は、極薄銅箔積層フィルムのシートやロールを包装できる樹脂製の袋や樹脂製のフィルムなどを用いることができる。
梱包用の樹脂としては、公知のものを用いることが出来、例えば、極薄銅箔積層フィルムを傷つけないこと、極薄銅箔積層フィルムの酸化など基板としての特性を悪化させないことなどの特性を有していることが好ましい。
The ultra-thin copper foil laminated film packed in the packing bag filled with the inert gas transferred in the present invention can be suitably used for the production of circuit boards and the like. In the method of manufacturing a circuit board, a packaging body in which an ultrathin copper foil laminated film is packed in a bag filled with the inert gas of the present invention is received, and the ultrathin copper foil laminated film is received from the bag of the packaging body. The rust preventive film covering the copper surface is removed from the copper foil surface of the ultrathin copper foil laminated film by rust prevention treatment.
The removal of the rust preventive film can be performed by a known method depending on the method of the rust preventive treatment, but in the case of organic rust prevention, washing with an acidic solution (for example, sulfuric acid, hydrochloric acid, etc.) Surface cleaning, electrolytic degreasing, cleaning by microetching, or the like is used.
The ultra-thin copper foil laminated film from which the rust preventive film has been removed is then processed in the same manner as when an ultra-thin copper-clad laminated film is received with a carrier foil (for example, a semi-additive method) to form a flexible substrate. (FPC board), printed boards, COF boards, COB boards, TAB boards, and other electronic components and boards for electronic devices.
For packaging, a resin bag or a resin film capable of packaging a sheet or roll of an ultrathin copper foil laminated film can be used.
As the resin for packing, known ones can be used, for example, characteristics such as not damaging the ultrathin copper foil laminated film and not deteriorating the characteristics as a substrate such as oxidation of the ultrathin copper foil laminated film. It is preferable to have.
極薄銅箔積層フィルムの製造方法において、外径１７６ｍｍ、重量３．２ｋｇの芯を用い、キャリア付き銅箔として日本電解社製ＹＳＮＡＰ−３Ｂ又はＹＳＮＡＰ−５Ｂを用い、両面に熱圧着性ポリイミド層を有する耐熱性ポリイミドフィルムである宇部興産社製ユーピレックス２５ＶＴ或いはユーピレックス５０ＶＴとを用いて、ロールやダブルベルトプレスなどの熱圧着装置を使用して、極薄銅箔積層フィルムを製造する場合において、キャリア箔を取り除いた場合の重量低減率及び巻径の低減率を算出し、その結果を表１に示す。
表１より、キャリア箔付き銅箔積層フィルムより、キャリア箔を取り除くことにより、重量で５０〜８０％程度、巻径で８〜２５％程度の低減効果が認められる。
In the method for producing an ultra-thin copper foil laminated film, a core having an outer diameter of 176 mm and a weight of 3.2 kg is used, and YSNAP-3B or YSNAP-5B manufactured by Nihon Electrolytic Co., Ltd. is used as a copper foil with a carrier. In the case of manufacturing an ultra-thin copper foil laminated film using a thermocompression bonding device such as a roll or a double belt press using Upyorx 25VT or Iupirex 50VT manufactured by Ube Industries, Ltd., which is a heat-resistant polyimide film having The weight reduction rate and the winding diameter reduction rate when the foil was removed were calculated, and the results are shown in Table 1.
From Table 1, by removing the carrier foil from the copper foil laminated film with carrier foil, a reduction effect of about 50 to 80% by weight and about 8 to 25% by winding diameter is recognized.
（実験例）
極薄銅箔積層フィルムとして、キャリア付き銅箔として日本電解社製ＹＳＮＡＰ−３Ｂを用い、両面に熱圧着性ポリイミド層を有する耐熱性ポリイミドフィルムである宇部興産社製ユーピレックス５０ＶＴとを用いて、圧着温度：３３０℃、圧着圧力：４０ｋｇ／ｃｍ２、圧着時間：２分の条件でダブルベルトプレスを用いて製造した、キャリア付き銅箔積層耐熱フィルムを用い、キャリア箔取り除き、防錆処理の有無による長期保存による銅箔の変色を調べた。
キャリア付き銅箔積層耐熱フィルムよりキャリア箔を引き剥がして直ぐに（銅箔表面が酸化されない短時間のうちに）、銅表面にクロメート処理を行い、防錆処理した極薄銅箔積層フィルム（Ａ）を得た。
キャリア付き銅箔積層耐熱フィルムよりキャリア箔を引き剥がして直ぐに（銅箔表面が酸化されない短時間のうちに）、銅表面にベンゾトリアゾール処理を行い、防錆処理した極薄銅箔積層フィルム（Ｂ）を得た。
キャリア付き銅箔積層耐熱フィルムよりキャリア箔を引き剥がして、銅表面に防錆処理を行うことなく、極薄銅箔積層フィルム（Ｃ）を得た。
極薄銅箔積層フィルム（Ａ）、極薄銅箔積層フィルム（Ｂ）及び極薄銅箔積層フィルム（Ｃ）を温度２５℃、湿度６０％の大気下に１か月放置し、銅箔表面の変色を目視で観察した。
極薄銅箔積層フィルム（Ａ）及び極薄銅箔積層フィルム（Ｂ）は、銅箔の変色は認められないが、極薄銅箔積層フィルム（Ｃ）は銅箔が変色していた。
保存後の極薄銅箔積層フィルム（Ａ）及び極薄銅箔積層フィルム（Ｂ）を用い、これらの極薄銅箔積層フィルムより防錆剤を除去、水洗、乾燥させ、銅厚みが１８μｍになるように銅メッキを行った銅メッキ銅箔積層フィルムを製造した。尚、防錆剤の除去は、極薄銅箔積層フィルム（Ａ）については、マイクロエッチングによる洗浄によって、極薄銅箔積層フィルム（Ｂ）については、硫酸による洗浄にて行った。
得られた銅メッキ銅箔積層フィルムの銅箔とフィルム間のピール強度（張り速度５０ｍｍ、９０°ピール（ＪＩＳ・Ｃ６４７１に準拠）を測定したところ、ピール強度１．３〜１．４Ｎ／ｍｍであった。
キャリア付き銅箔積層耐熱フィルムよりキャリア箔を引き剥がして直ぐに銅厚みが１８μｍになるように銅メッキを行った銅メッキ銅箔積層フィルム（Ｄ）を製造し、銅箔とフィルム間のピール強度（張り速度５０ｍｍ、９０°ピール（ＪＩＳ・Ｃ６４７１に準拠）を測定したところ、ピール強度１．３〜１．４Ｎ／ｍｍであった。
(Experimental example)
Using ultra-thin copper foil laminated film, YSNAP-3B made by Nippon Electrolytic Co., Ltd. as a copper foil with carrier, and using Ube Industries Co., Ltd. Upilex 50VT, which is a heat-resistant polyimide film having thermocompression-bonding polyimide layers on both sides, Temperature: 330 ° C., pressure bonding pressure: 40 kg / cm 2 , pressure bonding time: using a double-belt press and a copper foil laminated heat-resistant film with carrier manufactured under conditions of 2 minutes, removing carrier foil and depending on presence or absence of rust prevention treatment The discoloration of the copper foil by long-term storage was investigated.
Immediately after the carrier foil is peeled off from the copper foil laminated heat-resistant film with a carrier (within a short time when the copper foil surface is not oxidized), the copper surface is subjected to chromate treatment and rust-proof ultrathin copper foil laminated film (A) Got.
Immediately after the carrier foil is peeled off from the copper foil laminated heat-resistant film with a carrier (within a short time when the copper foil surface is not oxidized), the copper surface is treated with benzotriazole and the anti-rust copper foil laminated film (B )
The carrier foil was peeled off from the copper foil laminated heat-resistant film with a carrier, and an ultrathin copper foil laminated film (C) was obtained without subjecting the copper surface to rust prevention treatment.
The ultrathin copper foil laminated film (A), the ultrathin copper foil laminated film (B) and the ultrathin copper foil laminated film (C) are allowed to stand in the atmosphere at a temperature of 25 ° C. and a humidity of 60% for one month, and the copper foil surface The discoloration of was visually observed.
In the ultrathin copper foil laminated film (A) and the ultrathin copper foil laminated film (B), discoloration of the copper foil was not recognized, but in the ultrathin copper foil laminated film (C), the copper foil was discolored.
Using the ultra-thin copper foil laminated film (A) and the ultra-thin copper foil laminated film (B) after storage, the rust inhibitor is removed from these ultra-thin copper foil laminated films, washed with water, and dried to a copper thickness of 18 μm. The copper plating copper foil laminated | multilayer film which performed copper plating so that it may become were manufactured. The antirust agent was removed by washing by microetching for the ultrathin copper foil laminated film (A) and by washing with sulfuric acid for the ultrathin copper foil laminated film (B).
When the peel strength between the copper foil and the film of the obtained copper-plated copper foil laminated film (tension speed 50 mm, 90 ° peel (based on JIS C6471) was measured, the peel strength was 1.3 to 1.4 N / mm. there were.
The copper foil laminated heat-resistant film with a carrier is peeled off from the carrier heat-resistant film to produce a copper-plated copper foil laminated film (D) which is copper-plated so that the copper thickness becomes 18 μm immediately, and the peel strength between the copper foil and the film ( When the tension rate was 50 mm and 90 ° peel (based on JIS C6471) was measured, the peel strength was 1.3 to 1.4 N / mm.
Claims (6)
・工程（Ａ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第二工程（Ａ）とを行う。
・工程（Ｂ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されている場合、銅表面の酸化部分を除去する第二工程（Ｂ）、
（３）上記第ニ工程（Ｂ）の酸化部分を除去することによりさらに銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第三工程（Ｂ）とを行う。 It is a manufacturing method of an ultra-thin copper foil laminated film, and is manufactured by the following process (A) or process (B), The manufacturing method of the ultra-thin copper foil laminated film characterized by the above-mentioned.
・ Process (A)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) The second step (A) is performed in which the copper surface is not oxidized by removing the carrier foil in the first step, and the copper surface is subjected to a rust prevention treatment.
・ Process (B)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) When the copper surface is oxidized by removing the carrier foil in the first step, the second step (B) for removing the oxidized portion of the copper surface,
(3) The third step (B) is performed in which the copper surface is not oxidized by removing the oxidized portion in the second step (B) and the rust prevention treatment is performed on the copper surface.
その後、梱包用袋体内に極薄銅箔積層フィルムを封入して梱包し、移送する、
ことを特徴とする極薄銅箔積層フィルムの移送方法。
・工程（Ａ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第二工程（Ａ）とを行う。
・工程（Ｂ）
（１）キャリア箔付き極薄銅箔とフィルムとを積層して得られるキャリア箔付き極薄銅張積層フィルムからキャリア箔を除去する第一工程、
（２）上記第一工程のキャリア箔を除去することにより銅表面が酸化されている場合、銅表面の酸化部分を除去する第二工程（Ｂ）、
（３）上記第ニ工程（Ｂ）の酸化部分を除去することによりさらに銅表面が酸化されない短時間のうちに、銅表面に防錆処理を行う第三工程（Ｂ）とを行う。 When shipping and transferring an ultra-thin copper foil laminated film, the following process (A) or process (B) is performed,
After that, the ultrathin copper foil laminated film is enclosed in the packing bag body, packed, and transferred.
A method for transferring an ultra-thin copper foil laminated film.
・ Process (A)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) The second step (A) is performed in which the copper surface is not oxidized by removing the carrier foil in the first step, and the copper surface is subjected to a rust prevention treatment.
・ Process (B)
(1) The first step of removing the carrier foil from the ultrathin copper-clad laminate film with carrier foil obtained by laminating the ultrathin copper foil with carrier foil and the film,
(2) When the copper surface is oxidized by removing the carrier foil in the first step, the second step (B) for removing the oxidized portion of the copper surface,
(3) The third step (B) is performed in which the copper surface is not oxidized by removing the oxidized portion in the second step (B) and the rust prevention treatment is performed on the copper surface.
An electric circuit comprising: a step of receiving a package of the ultrathin copper foil laminated film transferred in claim 3 or 4; and a step of removing a rust preventive film from the copper foil surface of the ultrathin copper foil laminated film. A method for manufacturing a substrate.
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| JP2006224456A JP4715681B2 (en) | 2005-08-23 | 2006-08-21 | Manufacturing method and transfer method of ultra-thin copper foil laminated film |
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| JP2006224456A JP4715681B2 (en) | 2005-08-23 | 2006-08-21 | Manufacturing method and transfer method of ultra-thin copper foil laminated film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009233874A (en) * | 2008-03-26 | 2009-10-15 | Ube Ind Ltd | Manufacturing method and transferring method of very thin copper foil laminated-film |
| KR101574833B1 (en) | 2012-10-04 | 2015-12-07 | (주)엘지하우시스 | Functional film for well-impregnated composites and method of manufacturing composites using the same |
| JP2017106118A (en) * | 2017-01-05 | 2017-06-15 | Ｊｘ金属株式会社 | Carrier-fitted copper foil, method for producing the carrier-fitted copper foil, method for producing printed circuit board, method for producing copper-clad laminated board, and method for producing print wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045588A (en) * | 1990-04-20 | 1992-01-09 | Seiko Instr Inc | Squid fluxmeter provided with coil for calibration |
| JP2002316386A (en) * | 2001-04-20 | 2002-10-29 | Kanegafuchi Chem Ind Co Ltd | Copper-clad laminate and its production method |
-
2006
- 2006-08-21 JP JP2006224456A patent/JP4715681B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045588A (en) * | 1990-04-20 | 1992-01-09 | Seiko Instr Inc | Squid fluxmeter provided with coil for calibration |
| JP2002316386A (en) * | 2001-04-20 | 2002-10-29 | Kanegafuchi Chem Ind Co Ltd | Copper-clad laminate and its production method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009233874A (en) * | 2008-03-26 | 2009-10-15 | Ube Ind Ltd | Manufacturing method and transferring method of very thin copper foil laminated-film |
| KR101574833B1 (en) | 2012-10-04 | 2015-12-07 | (주)엘지하우시스 | Functional film for well-impregnated composites and method of manufacturing composites using the same |
| US10093080B2 (en) | 2012-10-04 | 2018-10-09 | Lg Hausys, Ltd. | Functional film for improving impregnation properties of composite material and method for manufacturing composite material using same |
| JP2017106118A (en) * | 2017-01-05 | 2017-06-15 | Ｊｘ金属株式会社 | Carrier-fitted copper foil, method for producing the carrier-fitted copper foil, method for producing printed circuit board, method for producing copper-clad laminated board, and method for producing print wiring board |
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| JP4715681B2 (en) | 2011-07-06 |
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