JP2007081268A - Signal conduction component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To materialize a signal conduction component by a single component. <P>SOLUTION: This invention relates to a signal conduction component that conducts signals on an electronics' substrate to outside the substrate, which has a first contact section that makes contacts with a signal on the substrate, a second contact section that makes contacts with a part outside the substrate, a conduction section that conducts the signal between the first contact section and the second contact section, and a stress relaxation section that is prepared at the conduction section to inhibit inflection of the conduction section between the first contact section and the second contact section. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a signal conducting member that conducts a signal on a substrate of an electronic device to the outside of the substrate.

In an electronic device, particularly an electronic device using an insulating material for a housing, a mechanism for conducting a ground (frame ground) signal on a substrate to a reference point (stable potential) is required.
By conducting a ground signal on the substrate to a stable potential, it is used as a reference potential for electronic devices, and noise countermeasures such as prevention of static electricity are taken.

FIG. 4 is a configuration diagram of a conventional signal conducting member.
The signal conducting member 10 is configured by fastening a sheet metal 11 and a sheet metal 12 with screws 13.
The component 11a of the sheet metal 11 is in contact with a portion (such as a conduction hole in the wiring pattern) that transmits a signal on the substrate, and the component 12a of the sheet metal 12 is brought into contact with a metal portion outside the substrate to conduct the signal.

FIG. 5 is a view showing an example of attaching a conventional signal conducting member to a substrate.
An example in which the ground signal 21 of the substrate 20 is conducted outside the substrate is shown.
The component part 11a of the sheet metal 11 is inserted into a conduction hole (through hole) part 21a of the ground signal pattern 21 and fixed by soldering. Further, the metal plate 11 is fixed to the substrate 20 by fitting the component portion 11 b of the metal plate 11 into the notch portion 20 a of the substrate 20.

FIG. 6 is a view showing an example of mounting an electronic device with a conventional signal conducting member mounted on a device mounting base.
The device mounting base 30 is composed of a substrate 31 that is connected to the electronic devices 41 and 42 with connectors to form a signal path between the electronic devices, and a metal base (metal portion) 32 that serves as a reference point between the electronic devices. The electronic devices 41 and 42 are mounted on the device mounting base 30. The sheet metal 12 of the signal conducting member 10 comes into contact with the metal portion 32 of the equipment mounting base 30, and the ground signal of the substrate becomes the stable potential of the equipment mounting base 30.

Japanese Patent Laid-Open No. 11-346075

The conventional examples of FIGS. 4, 5, and 6 have the following problems.
Since the number of parts is large, there is a problem in that many parts management man-hours and assembly man-hours are generated, which increases costs.
In addition, when the assembly accuracy of the parts is poor, there is a problem in that the electrical characteristics are affected at the same time that a failure occurs in the mounting to the electronic device mounting base (stable potential).

  The present invention has been made to solve the above-described problems, and an object thereof is to realize a signal conducting member with a single component.

In order to achieve such a subject, the present invention is configured as follows.
(1) In a signal conducting member that conducts a signal on a substrate to the outside of the substrate,
A first contact portion that contacts a signal transmitting portion on the substrate;
A second contact portion that contacts a portion outside the substrate;
A conductive portion for conducting a signal between the first contact portion and the second contact portion;
Between the first contact portion and the second contact portion, provided in the conduction portion, a stress relaxation portion that suppresses the bending of the conduction portion;
A signal conducting member comprising:

(2) The signal conducting member according to (1), wherein the first contact part, the second contact part, the conduction part, and the stress relaxation part are made of one plate material.

(3) The signal conducting member according to (1) or (2), wherein the signal on the substrate is a ground signal.

(4) The signal conducting member according to any one of (1) to (3), wherein the first contact portion is in surface contact with a substrate and soldered.

(5) The signal conducting member according to any one of (1) to (4), wherein the stress relaxation portion is formed so as to be inserted into a hole of the substrate.

(6) The second contact portion has a structure having a protrusion bent into a square shape, and the portion of the protrusion is in contact with a portion outside the substrate. A signal conducting member according to claim 1.

(7) The second contact portion is a leaf spring structure bent into a dogleg shape, and contacts the portion outside the substrate by the elastic force of the leaf spring. The signal conducting member according to any one of the above.

The present invention has the following effects.
Conventionally, what has been composed of a plurality of parts is realized by one part, so that the number of assembling steps can be reduced, and there are no fastening points by screws, so that the signal transmission efficiency is improved.
Moreover, since the stress relaxation part is provided, it can be surface-mounted on the substrate, and the number of manufacturing steps can be reduced.

Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a block diagram showing an embodiment of the present invention.
The signal conducting member 50 includes a first contact portion 51 that contacts a signal on the substrate, a second contact portion 52 that contacts a portion outside the substrate, and a portion between the first contact portion and the second contact portion. It consists of a conductive part 53 that conducts signals and a stress relaxation part 54 that suppresses the bending of the conductive part.

The signal conducting member 50 is formed by punching and bending a single plate material.
As the plate material, for example, copper or aluminum is used.

FIG. 2 is a view showing an example of attaching the signal conducting member of the present invention to a substrate.
An example in which the ground signal 61 of the substrate 60 is conducted outside the substrate is shown.
The first contact portion 51 is in surface contact with a portion that transmits a signal on the substrate, for example, the pad 61a of the ground signal pattern 61, and is fixed by soldering. Further, the signal conducting member 50 is fixed to the substrate 60 by fitting the constituent portion 52 a of the second contact portion 52 into the notched portion 60 a of the substrate 60.

  The second contact portion 52 has a leaf spring structure in which a plate material is bent into a dogleg shape. The contact resistance can be reduced by bringing the U-shaped protruding portion 52b into contact with each other or by bringing the component portion 52c into contact using the elastic force of the leaf spring.

  The stress relaxation part 54 is formed in a rod shape and is inserted into a non-conduction hole (non-through hole) 60b of the substrate. Two stress relaxation portions 54 are provided in the middle of the conductive portion 53. When the conductive portion 53 is curved, the stress relaxation portion 54 comes into contact with the non-through hole 60b of the substrate, whereby the first contact portion 51 is provided. The stress applied to the first contact portion 51 is relieved, and cracks can be prevented from entering the soldering portion of the first contact portion 51. As a result, the signal conductive member 50 can be surface-mounted, leading to a reduction in manufacturing steps and an increase in the mounting density of the substrate.

FIG. 3 is a view showing an example of mounting an electronic device to which the signal conducting member of the present invention is mounted on a device mounting base. The same parts as those in the previous figure are given the same reference numerals.
The device mounting base 30 is composed of a substrate 31 that is connected to the electronic devices 41 and 42 with connectors to form a signal path between the electronic devices, and a metal base (metal portion) 32 that serves as a reference point between the electronic devices. The electronic devices 41 and 42 are mounted on the device mounting base 30. The second contact portion 52 of the signal conducting member 50 comes into contact with the metal portion 32 of the device mounting base 30, and the ground signal of the substrate becomes the stable potential of the device mounting base 30.

As described above, since the signal conducting member 50 is realized by a single component that has conventionally been composed of a plurality of components, the management of the components can be facilitated, and the number of assembly steps can be reduced. This leads to cost reduction.
In addition, since there are no fastening portions by screws, signal transmission efficiency can be improved.

The first contact portion 51 is configured to be in surface contact with the pad of the substrate and can be surface-mounted. However, when there is no need for surface mounting, the first contact portion is made into a rod shape and inserted into the through hole of the substrate. Then, it may be configured to be soldered.
Although the stress relaxation part 54 illustrated the case where two things formed in the shape of a rod are provided in the middle of the conduction part 53, the position, shape, and number may be changed according to the size of the substrate and the signal conducting member. It only needs to be formed so as to be inserted into the hole of the substrate.

As an example of use of the signal conducting member 50, an example used for conducting a ground signal is shown, but it may be used for conducting a power supply. Normally, a large amount of current flows through the power supply line, and when a printed pattern is configured on the board, it is necessary to use a thick pattern that matches the current capacity. There are cases where it cannot be secured. In such a case, by using the signal conducting member 50, a power supply pattern having a sufficient current capacity can be provided outside the substrate, and it is advantageous in terms of component mounting.
In addition, when a large current is passed through the printed pattern on the substrate, the temperature rise of the substrate becomes a problem, but by using the signal conducting member 50, a heat radiation effect can be expected, and it can be used as a heat conducting member and a heat radiating member. is there.

It is a block diagram which shows one Example of this invention. It is a figure which shows the example of attachment to the board | substrate of the signal-conduction member of this invention. It is a figure which shows the example of mounting to the apparatus attachment base of the electronic device which attached the signal-conduction member of this invention. It is a block diagram of the conventional signal-conduction member. It is a figure which shows the example of attachment to the board | substrate of the conventional signal-conduction member. It is a figure which shows the example of mounting to the apparatus mounting base of the electronic device which attached the conventional signal-conduction member.

Explanation of symbols

50 Signal Conducting Member 51 First Contact Portion 52 Second Contact Portion 53 Conducting Portion 54 Stress Relieving Portion

Claims (7)

In the signal conducting member that conducts the signal on the substrate to the outside of the substrate,
A first contact portion that contacts a signal transmitting portion on the substrate;
A second contact portion that contacts a portion outside the substrate;
A conductive portion for conducting a signal between the first contact portion and the second contact portion;
Between the first contact portion and the second contact portion, provided in the conduction portion, a stress relaxation portion that suppresses the bending of the conduction portion;
A signal conducting member comprising:   The signal conducting member according to claim 1, wherein the first contact portion, the second contact portion, the conduction portion, and the stress relaxation portion are made of one plate material.   3. The signal conducting member according to claim 1, wherein the signal on the substrate is a ground signal.   The signal conducting member according to claim 1, wherein the first contact portion is in surface contact with the substrate and soldered.   The signal conducting member according to claim 1, wherein the stress relaxation portion is formed so as to be inserted into a hole of the substrate.   6. The signal according to claim 1, wherein the second contact portion has a structure having a protrusion bent into a square shape, and the portion of the protrusion is in contact with a portion outside the substrate. Conductive member. The said 2nd contact part is a leaf | plate spring structure bent in the shape of a letter, and contacts the part outside a board | substrate with the elastic force of this leaf | plate spring, The one of Claim 1 thru | or 6 characterized by the above-mentioned. Signal conducting member.

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