JP2013038119A - Attachment structure of module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an attachment structure of a module which is formed for solving problems, achieves the downsizing, the improvement of the heat radiation performance, and shield effect, and improves the efficiency of installation work.SOLUTION: An attachment structure of a module of this invention comprises: a control board 5 having an opening 6 and in which an electronic circuit is formed; a module 1 disposed at a position of the opening 6 on one main surface side of the control board 5 and forming a part of the electronic circuit; a heat radiation substrate 3 formed so as to cover an entire surface of the module 1 or formed on several surfaces of the surface of the module 1; and a heat radiation block 2 which is disposed on the other main surface side of the control board 5 so as to contact with the heat radiation substrate 3 on the surface of the module 1 through the opening 6.

Description

  The present invention relates to a mounting structure for a module such as a semiconductor module or an electronic component module, and more particularly to a mounting structure for a module characterized by mounting on a control board.

  2. Description of the Related Art Conventionally, a module mounting structure includes a lead terminal that protrudes from a module to electrically connect the module and a control board. The lead terminal holds a predetermined space between the module and the control board. Thus, it was inserted and attached to the through hole provided in the control board. Further, a heat radiating plate is provided in contact with the side opposite to the control board of the module, and heat generated in the module is radiated by the heat radiating plate (see, for example, Patent Document 1).

JP-A-2005-252198

  However, in the above conventional module mounting structure, it is necessary to secure a certain amount of space between the control board and the module, and it is difficult to downsize the entire mounting structure. Other components attached to the control board were soldered to the wiring pattern formed on the control board, but only the module was soldered by inserting the lead terminals into the through holes in the control board. Since the attachment method to the control board is different from other parts, the efficiency of the attachment work is poor. In addition, since the heat dissipation plate is provided only on one side of the module, there is a limit to the heat dissipation of the module, the overall heat capacity of the mounting structure is limited, and the current withstand capability of the semiconductor chip provided in the module, for example It was difficult to raise. Further, since the module itself has no shielding effect, if a component that causes noise or the like is mounted around the module, the module may malfunction due to the influence of noise generated from the component.

  The present invention has been made to solve these problems, and provides a mounting structure for a module that has a reduction in size, an improvement in heat dissipation, and a shielding effect, and can improve the efficiency of mounting work. The purpose is to do.

  In order to solve the above problems, a module mounting structure according to the present invention includes a control board having an opening and an electronic circuit formed thereon, and is disposed at the position of the opening on one main surface side of the control board. A module constituting a part of the circuit, a heat dissipation board formed so as to cover the entire surface of the module, and arranged on the other main surface side of the control board so as to be in contact with the heat dissipation board on the module surface through the opening. And a first heat dissipation block.

  According to the present invention, a control board having an opening and an electronic circuit is formed, a module disposed at the position of the opening on one main surface side of the control board and constituting a part of the electronic circuit, and a surface of the module Since it includes a heat dissipation board formed so as to cover the whole and a first heat dissipation block disposed on the other main surface side of the control board so as to be in contact with the heat dissipation board on the surface of the module through the opening, it is miniaturized. In addition, the heat dissipation is improved and the shielding effect is obtained, and the efficiency of the mounting work can be improved.

It is a figure which shows an example of a structure of the attachment structure of the module by Embodiment 1 of this invention. It is a figure which shows an example of a structure of the attachment structure of the module by Embodiment 1 of this invention. It is a figure which shows an example of a structure of the attachment structure of the module by Embodiment 2 of this invention. It is a figure which shows an example of a structure of the attachment structure of the module by Embodiment 3 of this invention. It is a figure which shows an example of a structure of the attachment structure of the module by a prerequisite technique.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, a technique (a prerequisite technique) which is a premise of the present invention will be described.

<Prerequisite technology>
FIG. 5 is a diagram showing an example of the configuration of the module 1 mounting structure according to the base technology. As shown in FIG. 5, the lead terminal 4 of the module 1 is attached by being inserted into a through hole of the control board 5, and a predetermined space capacity is secured between the module 1 and the control board 5. . Further, on the opposite side of the module 1 to the control board 5, a heat radiating board 3 and a heat radiating block 2 are provided. However, the mounting structure of the module 1 as shown in FIG. 5 has the above-described problem (see the problem to be solved by the invention). The present invention has been made to solve such a problem, and will be described in detail below.

<Embodiment 1>
FIG. 1 is a diagram showing an example of the structure of the module 1 mounting structure according to the first embodiment. As shown in FIG. 1, the mounting structure of the module 1 according to the first embodiment includes a control board 5 having an opening 6 and an electronic circuit is formed, and the position of the opening 6 on one main surface side of the control board 5. The module 1 that constitutes a part of the electronic circuit, the heat dissipation board 3 formed on the surface of the module 1 on the control board 5 side, and the other main surface side of the control board 5 through the opening 6 A heat dissipation block 2 (first heat dissipation block) is provided so as to be in contact with the heat dissipation substrate 3 formed on the surface of the module 1. Further, the lead terminals 4 of the module 1 are inserted into through holes (holes) of the control board 5 and attached by soldering.

  By adopting the mounting structure of the module 1 as shown in FIG. 1, the space capacity between the module 1 and the control board 5 can be eliminated, so that the entire mounting structure can be reduced in size. Further, the heat dissipation block 2 and the control board 5 can be integrated. Further, by providing the opening 6 in the control board 5, the module 1 can be fixed to the control board 5 in advance before the lead terminal 4 is soldered to the control board 5, and the mounting position of the lead terminal 4 is shifted. It is possible to prevent a decrease in mounting accuracy.

  Moreover, FIG. 2 is a figure which shows the other example of a structure of the attachment structure of the module 1 by this Embodiment 1. FIG. The module mounting structure shown in FIG. 2 is characterized in that the tip of the lead terminal 4 of the module 1 is bent and mounted on the control board 5 by soldering. The other configuration is the same as that of the module mounting structure shown in FIG.

  By adopting the mounting structure of the module 1 as shown in FIG. 2, conventionally, only the lead terminal of the module has been inserted into the through hole of the control board and soldered (for example, see FIG. 5). Similarly to the above, it can be soldered to the wiring pattern formed on the control board 5. That is, since the attachment method to the control board 5 with other components is the same (common), the efficiency of the attachment work can be improved.

<Embodiment 2>
FIG. 3 is a diagram showing an example of the structure of the module 1 mounting structure according to the second embodiment of the present invention. As shown in FIG. 3, the mounting structure of the module 1 according to the second embodiment is characterized in that the heat dissipation board 3 is formed so as to cover the entire surface of the module 1. The other configuration is the same as the configuration shown in FIG. 2 of the first embodiment, and a description thereof will be omitted here.

  With the mounting structure of the module 1 as shown in FIG. 3, the heat generated in the module 1 is radiated not only from the heat radiating block 2 as shown in FIGS. Can do. Further, the module 1 can be provided with a shielding effect, and the module 1 can be protected from noise even if components that cause noise or the like are arranged around the module 1.

  In the second embodiment, the heat radiating substrate 3 is formed so as to cover the entire surface of the module 1, but includes a surface that contacts the heat radiating block 2 in accordance with the wiring and configuration drawn from the inside of the module 1 to the outside 4. A square shape formed on the surface, a U shape formed on three surfaces including the surface in contact with the heat dissipation block 2, and a double shape formed on the surface in contact with the heat dissipation block 2 and the surface facing the surface. It is good also as a slit structure. In addition, a shielding effect can be provided, and the heat dissipation substrate 3 can be connected to the ground.

<Embodiment 3>
FIG. 4 is a diagram showing an example of the structure of the module 1 mounting structure according to Embodiment 3 of the present invention. As shown in FIG. 4, the module mounting structure according to the third embodiment is on the heat dissipation substrate 3 formed on the surface of the module 1, and the heat dissipation block 2 (first heat dissipation block) is interposed between the modules 1. ) And a heat dissipating block 8 (second heat dissipating block) disposed at a position opposite to the head. The module 1 is a semiconductor module, and the lead terminals 4 of the module 1 are directly connected to the electrodes on the upper and lower surfaces of the semiconductor chip 7 provided in the module 1. The other configuration is the same as the configuration shown in FIG. 3 of the second embodiment, and a description thereof will be omitted here.

  As shown in FIG. 4, a semiconductor chip 7 that generates heat during operation is provided inside the module 1. The heat generated in the semiconductor chip 7 is conducted to the heat radiating substrate 3 through the lead terminals 4 directly connected to the upper surface and the lower surface of the semiconductor chip 7 to be radiated, and is arranged so as to be in contact with the heat radiating substrate 3. The heat radiation block 2 and the heat radiation block 8 also radiate heat.

  With the mounting structure of the module 1 as shown in FIG. 4, the heat generated in the semiconductor chip 7 is dissipated from the heat dissipation board 3 via the lead terminals 4 directly connected to the upper and lower surfaces of the semiconductor chip 7, Furthermore, since heat is radiated from the heat radiating block 2 and the heat radiating block 8 via the heat radiating substrate 3, the heat dissipation of the entire module 1 can be improved, and the current resistance of the semiconductor chip 7 can be increased.

  In the third embodiment, the lead terminals 4 are directly connected to the upper surface and the lower surface of the semiconductor chip 7. For example, when the lead terminals 4 are directly connected only to the lower surface of the semiconductor chip 7, the semiconductor chip 7. It is assumed that heat is radiated by heat conduction with a resin or the like covering the upper surface side of the substrate. Further, the heat radiating block 2 and the heat radiating block 8 are fixed to the control substrate 5 with fixing screws, and the fixed heat radiating block 2 and the heat radiating block 8 can have a shielding effect.

  1 module, 2 heat dissipation block, 3 heat dissipation board, 4 lead terminal, 5 control board, 6 opening, 7 semiconductor chip, 8 heat dissipation block.

Claims (5)

A control board having an opening and an electronic circuit formed thereon;
A module which is disposed at the position of the opening on one main surface side of the control board and forms a part of the electronic circuit;
A heat dissipation board formed so as to cover the entire surface of the module or on a plurality of the surfaces;
A first heat dissipating block disposed on the other main surface side of the control board so as to be in contact with the heat dissipating board of the module surface through the opening;
A module mounting structure comprising:   The heat radiation board on the module surface further includes a second heat radiation block disposed at a position facing the first heat radiation block with the module interposed therebetween. Mounting structure of the module described in 1.   3. The module mounting structure according to claim 1, wherein the module lead terminals are mounted by being inserted into holes of the control board. 4.   The module mounting structure according to claim 1 or 2, wherein the lead terminal of the module is mounted on the one main surface of the control board by bending a tip of the lead terminal.   5. The module mounting structure according to claim 1, wherein lead terminals of the module are directly connected to an upper surface and a lower surface of a semiconductor chip provided in the module. 6.

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