JP2007080884A5 - - Google Patents

Download PDF

Info

Publication number
JP2007080884A5
JP2007080884A5 JP2005263052A JP2005263052A JP2007080884A5 JP 2007080884 A5 JP2007080884 A5 JP 2007080884A5 JP 2005263052 A JP2005263052 A JP 2005263052A JP 2005263052 A JP2005263052 A JP 2005263052A JP 2007080884 A5 JP2007080884 A5 JP 2007080884A5
Authority
JP
Japan
Prior art keywords
sealing glass
light emitting
wiring
manufacturing
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005263052A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007080884A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005263052A priority Critical patent/JP2007080884A/ja
Priority claimed from JP2005263052A external-priority patent/JP2007080884A/ja
Publication of JP2007080884A publication Critical patent/JP2007080884A/ja
Publication of JP2007080884A5 publication Critical patent/JP2007080884A5/ja
Withdrawn legal-status Critical Current

Links

JP2005263052A 2005-09-09 2005-09-09 発光装置の製造方法、発光装置および発光装置の中間部品 Withdrawn JP2007080884A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005263052A JP2007080884A (ja) 2005-09-09 2005-09-09 発光装置の製造方法、発光装置および発光装置の中間部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005263052A JP2007080884A (ja) 2005-09-09 2005-09-09 発光装置の製造方法、発光装置および発光装置の中間部品

Publications (2)

Publication Number Publication Date
JP2007080884A JP2007080884A (ja) 2007-03-29
JP2007080884A5 true JP2007080884A5 (enExample) 2008-09-04

Family

ID=37940916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005263052A Withdrawn JP2007080884A (ja) 2005-09-09 2005-09-09 発光装置の製造方法、発光装置および発光装置の中間部品

Country Status (1)

Country Link
JP (1) JP2007080884A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5298987B2 (ja) * 2009-03-17 2013-09-25 豊田合成株式会社 発光装置および発光装置の製造方法
JP6318495B2 (ja) 2013-08-07 2018-05-09 日亜化学工業株式会社 発光装置
DE102015119343B4 (de) 2015-11-10 2024-05-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anordnung mit einem Träger aus einem Glasmaterial und einem optoelektronischen Halbleiterbauteil und Verfahren zum Herstellen einer solchen Anordnung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3150025B2 (ja) * 1993-12-16 2001-03-26 シャープ株式会社 発光ダイオードの製造方法
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
DE10101554A1 (de) * 2001-01-15 2002-08-01 Osram Opto Semiconductors Gmbh Lumineszenzdiode
JP3719431B2 (ja) * 2002-09-25 2005-11-24 セイコーエプソン株式会社 光学部品およびその製造方法、表示装置および撮像素子
JP2004207367A (ja) * 2002-12-24 2004-07-22 Toyoda Gosei Co Ltd 発光ダイオード及び発光ダイオード配列板
EP1603170B1 (en) * 2003-03-10 2018-08-01 Toyoda Gosei Co., Ltd. Method for manufacturing a solid-state optical element device
JP4465989B2 (ja) * 2003-06-18 2010-05-26 旭硝子株式会社 発光ダイオード素子
JP2007067300A (ja) * 2005-09-01 2007-03-15 Asahi Glass Co Ltd 発光装置およびその製造方法

Similar Documents

Publication Publication Date Title
JP2007189225A5 (enExample)
US8212274B2 (en) Light-emitting diode package and manufacturing method thereof
US8492181B2 (en) Embedded wafer level optical package structure and manufacturing method
JP2009188201A5 (enExample)
JP2007267113A5 (enExample)
JP2005311314A5 (enExample)
TWI256737B (en) One-block light-emitting device and manufacturing method thereof
JP2006505126A5 (enExample)
JP2012074753A (ja) 発光ダイオードパッケージ
JP2012109566A5 (enExample)
WO2008112128A3 (en) Light emitting diode for harsh environments
JP2005123477A5 (enExample)
CN105895625A (zh) 用于邻近传感器的晶片级封装
JP2007288050A5 (enExample)
TW201037813A (en) Light emitting apparatus
JP2010500779A5 (enExample)
TWI536617B (zh) 發光二極體燈條及其製造方法
JP2008124153A5 (enExample)
JP2012182357A (ja) Ｌｅｄ発光素子用リードフレーム基板、ｌｅｄ発光素子装置、およびｌｅｄ発光素子用リードフレーム
CN204461449U (zh) 电子装置
WO2006132794A3 (en) A light-emitting device module with flip-chip configuration on a heat-dissipating substrate
WO2006132795A3 (en) A light-emitting device module with a substrate and methods of forming it
TW201344983A (zh) 發光二極體封裝結構
CN204461448U (zh) 电子装置
JP2008117900A5 (enExample)