JP2007070657A - Apparatus for manufacturing antifouling optical article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing antifouling optical articles by which antifouling films almost free from variation of film thickness can be formed on optical articles by a vacuum deposition method. <P>SOLUTION: A plurality of exhaust ports 111 are provided in such an arrangement that the exhaust ports 111 become rotational symmetry with respect to the rotation axis of a support unit 20 having a circular doom shape. Thereby, the flow of an exhaust gas is made isotropic to the rotation axis of the support unit 20. As the exhausting is performed isotropically, the concentration distribution of a substance being vapor deposited on the different positions of the support unit 20, on which substrates 15 subjected to surface treatments such as an antireflection film 12 forming treatment are supported, is made isotropic and uniform. Accordingly, the variation of the film thickness of the antifouling films 13 each formed on the surface of each plastic lens 1 can be reduced. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an apparatus for manufacturing an antifouling optical article.

On the substrate of the optical article, an optical multilayer film such as an antireflection film, various filters, a mirror or the like is provided depending on the application. The optical multilayer film is formed by a dry manufacturing method such as a vacuum deposition method or a sputtering method in which the thickness of each layer can be easily controlled. In order to increase added value, an antifouling film is formed on the surface of these optical multilayer films so that dirt such as sebum hardly adheres and the dirt is easily wiped off.
In order to simplify the manufacturing process, the antifouling film is formed by a dry vacuum deposition method in the same manner as the optical multilayer film. As a material for forming the antifouling film, a polymer compound such as a fluorine-containing organosilicon compound is used. An antifouling film is formed on the surface of the optical multilayer film by vacuum-depositing these polymer compounds.

Here, when the antifouling film is formed by the vacuum vapor deposition method, the film thickness of the antifouling film varies depending on the difference in distance between the evaporation source of the vacuum vapor deposition and the optical article and the vapor deposition angle. In addition, depending on the arrangement of the exhaust ports of the chamber in which the vapor deposition is performed, the concentration distribution of the vapor deposition substance in the chamber is biased, and the film thickness of the antifouling film formed on the optical article becomes non-uniform.
The variation in the film thickness of the antifouling film due to the difference in the distance between the evaporation source and the optical article can be reduced to some extent by using a correction plate, but the film thickness variation due to the uneven concentration distribution of the vapor deposition material in the chamber Cannot be reduced with a correction plate.
As a method for controlling the gas concentration distribution in the chamber, a method is known in which an exhaust port is arranged on the center of a sample (substrate) to make the gas flow around the sample uniform (for example, Patent Document 1).

JP-A-5-269362 (pages 5 to 10 and FIGS. 3 to 5)

Patent document 1 is a method of equalizing the gas flow of the introduced gas. Therefore, there is no suggestion of a method for controlling the concentration distribution of the vapor deposition material in the chamber by determining the arrangement of the exhaust port of the chamber in the vacuum vapor deposition method without introducing gas.
An object of the present invention is to provide an apparatus for producing an antifouling optical article capable of forming an antifouling film with little variation in film thickness on the optical article by a vacuum deposition method.

The antifouling optical article manufacturing apparatus of the present invention is an antifouling optical article manufacturing apparatus provided with a chamber for forming an antifouling film containing a fluorine-containing organosilicon compound on the surface of an optical article by vacuum deposition. A support device having a rotating shaft that supports the optical article and is rotatable in the chamber, and a plurality of exhaust ports for exhausting the chamber are arranged rotationally symmetrically with respect to the rotating shaft. It is characterized by that.
Here, “arrangement rotationally symmetrically with respect to the rotation axis” means that even if n exhaust ports are rotated (360 / n) degrees with respect to the rotation axis, the exhaust ports are arranged in the same manner as the original exhaust port arrangement. Is to arrange.

  According to the present invention, since the plurality of exhaust ports are provided in a rotationally symmetric arrangement with respect to the rotation shaft of the support device with respect to the support device, the exhaust flow is isotropic with respect to the rotation shaft of the support device. Become. By exhausting isotropically, the concentration distribution of the vapor deposition material is isotropic and uniform with respect to the rotation axis at different positions of the support device on which the optical article is supported. Therefore, the variation in the film thickness of the antifouling film formed on the surface of the optical article is reduced.

  The antifouling optical article manufacturing apparatus of the present invention is an antifouling optical article manufacturing apparatus provided with a chamber for forming an antifouling film containing a fluorine-containing organosilicon compound on the surface of an optical article by vacuum deposition. A support device having a rotating shaft that supports the optical article and is rotatable in the chamber, and at least one of upper and lower surfaces constituting the chamber has a shape that is rotationally symmetric with respect to the rotating shaft. An exhaust port is provided.

  According to the present invention, exhaust is performed at the exhaust port having a rotational symmetry with respect to the rotation shaft of the support device, so that the flow of exhaust gas is isotropic with respect to the rotation shaft of the support device. By exhausting isotropically, the concentration distribution of the vapor deposition material is isotropic and uniform with respect to the rotation axis at different positions of the support device on which the optical article is supported. Therefore, the variation in the film thickness of the antifouling film formed on the surface of the optical article is reduced.

  The antifouling optical article manufacturing apparatus of the present invention is an antifouling optical article manufacturing apparatus provided with a chamber for forming an antifouling film containing a fluorine-containing organosilicon compound on the surface of an optical article by vacuum deposition. A support device having a rotating shaft that supports the optical article and is rotatable in the chamber, and an exhaust port having a shape that is rotationally symmetric with respect to the rotating shaft is a side wall that constitutes the chamber It is provided over the entire circumference.

  According to the present invention, since the exhaust port is provided over the entire circumference of the side wall in the outer peripheral direction of the support device, the flow of exhaust gas is isotropic with respect to the rotation shaft of the support device. By exhausting isotropically, the concentration distribution of the vapor deposition material is isotropic and uniform with respect to the rotation axis at different positions of the support device on which the optical article is supported. Therefore, the variation in the film thickness of the antifouling film formed on the surface of the optical article is reduced.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows a cross-sectional view of a plastic lens 1 which is an antifouling optical article of this embodiment. FIG. 2 is a schematic view of a vacuum vapor deposition apparatus 100 that is an apparatus for manufacturing an antifouling optical article according to this embodiment.
In FIG. 1, hard coat layers 11 for improving scratch resistance are provided on both surfaces of a substrate 10 of a plastic lens 1. An antireflection film 12 is provided on the hard coat layer 11, and an antifouling film 13 that is a film containing a fluorine-containing organosilicon compound is provided on the surface thereof.

  In FIG. 2, a vacuum vapor deposition apparatus 100 is a manufacturing apparatus that performs a dry surface treatment on a substrate 10. Here, the hard coat layer 11 may be formed by the vacuum vapor deposition apparatus 100, or may be formed in advance by another method such as a wet sol-gel method. In the present embodiment, the substrate 10 provided up to the hard coat layer 11 by a wet method in advance will be described as the substrate 15 (see FIG. 1). A plurality of substrates 15 are supported by the support device 20.

Below, the vacuum evaporation apparatus 100 is demonstrated more concretely based on drawing, and the surface treatment process to the board | substrate 15 is demonstrated continuously.
The vacuum deposition apparatus 100 includes three chambers 30, 40 and 50 through which the support device 20 can pass. These chambers 30, 40, and 50 are connected to each other, and the support device 20 can pass through the inside thereof. That is, the support device 20 moves inside the vacuum deposition apparatus 100 for each process, and the surface treatment to the substrate 15 is performed. Further, the support device 20 is rotated by a rotation mechanism (not shown) so that the surface treatment can be uniformly performed on each substrate 15.

  The chambers 30, 40 and 50 are sealed with each other by a shutter (not shown) provided between the chambers. The internal pressures of the chambers 30, 40 and 50 are controlled by the vacuum generators 31, 41 and 51, respectively.

  The chamber 30 is an entrance or a gate chamber. The support device 20 is introduced from the outside into the chamber 30 and heated under a certain pressure for a certain time. At this time, the gas adsorbed on the substrate 15 and the support device 20 is degassed. The vacuum generation device 31 of the chamber 30 includes a rotary pump 32, a roots pump 33, and a cryopump 34.

  The chamber 40 is a chamber that performs thin film formation by vacuum deposition and surface treatment by plasma or the like. Similarly to the vacuum generator 31 of the chamber 30, the vacuum generator 41 of the chamber 40 includes a rotary pump 42, a roots pump 43, and a cryopump 44.

An evaporation source 61 and an evaporation source 62 are provided inside the chamber 40 in order to efficiently form the antireflection film 12 by combining vapor deposition materials having different refractive indexes. And the electron guns 65 and 66 which evaporate the vapor deposition substances 63 and 64 arrange | positioned at these evaporation sources 61 and 62, and the shutters 67 and 68 which adjust vapor deposition amount are provided.
Examples of vapor deposition materials having different refractive indexes include silicon oxide as a low refractive index material, and titanium oxide, niobium oxide, tantalum oxide, and zirconium oxide as high refractive index materials.

The chamber 40 is provided with a high-frequency plasma generator 70 for performing plasma processing. The high-frequency plasma generator 70 includes an RF coil 71 installed inside the chamber 40, a matching box 72 connected to the outside of the chamber 40, and a high-frequency transmitter 73.
Oxygen and argon, which are gases used for the plasma processing, are introduced from the oxygen supply means 74 and the argon supply means 75 with the flow rate controlled by the mass flow controller 78. The flow rate is controlled by the auto pressure controller 77 so that the inside of the chamber 40 has a predetermined pressure.

Further, the chamber 40 is provided with an ion gun 80 for performing ion-assisted deposition and surface treatment. The ion gun 80 is connected to an RF power source 81 for converting the introduced gas into plasma and generating positive ions, and a DC power source 82 for accelerating the positive ions.
Oxygen and argon used for the ion gun 80 are introduced from the oxygen supply means 74 and the argon supply means 75 with the flow rate controlled by the mass flow controller 83.

The chamber 50 is a chamber in which the antifouling film 13 is formed by vapor deposition on the surface subjected to surface treatment such as the antireflection film 12. The substrate 15 on which the surface treatment such as the antireflection film 12 has been performed moves from the chamber 40 to the chamber 50 together with the support device 20.
Inside the chamber 50, an evaporation source 90 containing a fluorine-containing organosilicon compound, a heater 91, and a correction plate 92 are installed. The correction plate 92 is fixed to the heater 91 by a correction plate support member 93. The amount of vapor deposition on the substrate 15 supported at different positions of the support device 20 can be adjusted by adjusting the opening of the correction plate 92.
The inside of the chamber 50 is exhausted by the vacuum generating device 51 from the exhaust port 111 through the exhaust pipe 110. Here, in order to make the concentration of the fluorine-containing organosilicon compound at the position of each substrate 15 supported by the support device 20 more uniform, a plurality of exhaust ports 111 are provided at predetermined positions. The vacuum generator 51 includes a rotary pump 52, a roots pump 53, and a turbo molecular pump 54.

Hereinafter, the arrangement and the like of the correction plate 92 will be described in detail.
FIG. 3 shows a schematic cross-sectional view of the support device 20 and the evaporation source 90. 4 shows a top view of the support device 20, the evaporation source 90, the heater 91, and the correction plate 92. The support device 20 has a circular dome shape.
In FIG. 3, the substrate 15 that has been subjected to the surface treatment such as the antireflection film 12 is supported by the support device 20 concentrically over four steps. The names of each level are 1st level, 2nd level, 3rd level, and 4th level on the outer peripheral side in order from the center. Further, the support device 20 is rotated around a rotation axis indicated by a one-dot chain line in FIG. 3 while vapor deposition is performed.
In order to make the film thickness of the antifouling film 13 formed on each substrate 15 uniform, the evaporation source 90 should be installed at a position where the distance to each substrate 15 is as equal as possible and the vapor deposition angle is as narrow as possible. preferable. However, as indicated by the arrows in the figure, the deposition distance and the deposition angle vary greatly depending on the position of each stage of the support device 20. Therefore, the deposition amount at different positions of the support device 20 varies greatly, but the deposition amount can be adjusted by the correction plate 92.

In FIG. 4, the heater 91 and the correction plate 92 are disposed between the center and the outer periphery of the support device 20. Further, the two correction plates 92 are disposed so as to sandwich the evaporation source 90, and are disposed between the evaporation source 90 and the support device 20 (see FIG. 2).
Although the support device 20 is rotating, the moving speed with respect to the evaporation source 90 is different between the central portion and the outer peripheral portion. The central part has a slow moving speed and the outer peripheral part is fast. Accordingly, a larger amount of vapor deposition material is deposited toward the center.
Therefore, the two correction plates 92 are arranged and fixed in a square shape so that the distance between them is narrow toward the center and wide toward the outer periphery.

Next, the position where the exhaust port 111 is provided will be described more specifically.
FIG. 5 shows the arrangement of the exhaust ports 111 shown in FIG. 2 in detail.
FIG. 5A shows a layout of the exhaust port 111 as viewed from the wall 55 on the upper surface of the chamber 50. FIG. 5B is a schematic perspective view of the vacuum vapor deposition apparatus 100.
In the present embodiment, the chamber 50 is a rectangular parallelepiped in which the upper wall 55 and the lower wall 56 facing each other are square. The upper wall 55 and the lower wall 56 have a rotational symmetry point 112. The line indicated by the two-dot chain line passing through these two rotational symmetry points 112 is the rotational symmetry axis of the chamber 50, and the chamber 50 is rotationally symmetric with respect to the rotational symmetry axis indicated by the two-dot chain line. It has a shape.
The support device 20 is rotated at a position where the rotational symmetry axis of the chamber 50 coincides with the rotation axis of the support device 20 (see FIG. 2). Therefore, the rotational symmetry point 112 exists on the rotation axis of the support device 20.

  The exhaust port 111 is provided near the center of the four sides of the wall 55 on the upper surface. That is, the four exhaust ports 111 are rotationally symmetric with respect to the rotational symmetry point 112 on the wall 55 on the upper surface of the chamber 50. These exhaust ports 111 may be provided in at least one of the upper wall 55 or the lower wall 56 of the chamber 50.

Other arrangement examples of the exhaust port 111 are shown in FIGS.
6 and 7 are diagrams showing a case where the exhaust port 111 having a rotationally symmetric point 112, that is, a rotationally symmetric shape with respect to the rotational axis, is provided.
FIG. 6 shows an example in which the exhaust ports 111 are arranged on the upper wall 55 and the lower wall 56 of the chamber 50.
FIG. 6A shows a layout of the exhaust port 111 as viewed from the upper surface of the chamber 50. FIG. 6B is a schematic perspective view of the chamber 50.
The exhaust port 111 has a circular shape that is rotationally symmetric with respect to the rotational symmetry point 112, and is provided at the rotational symmetry point 112 of the upper wall 55 and the lower wall 56 of the chamber 50. The exhaust port 111 only needs to be provided on at least one of the walls.

FIG. 7 shows an example in which the exhaust port 111 is arranged on the wall 55 on the upper surface of the chamber 50.
FIG. 7A shows a layout of the exhaust port 111 viewed from the wall 55 on the upper surface of the chamber 50. FIG. 7B shows a schematic perspective view of the chamber 50, and FIG. 7C shows a schematic cross-sectional view of the chamber 50.
In FIG. 7A, the shape of the exhaust port 111 is a ring shape with the rotational symmetry point 112 as the center. In FIG. 7A, the exhaust port 111 is provided up to the edge of the upper wall 55, but the exhaust port 111 may have any size.
7B and 7C, the shape of the exhaust pipe 110 is a funnel shape in which the opening on one side is widened and the other opening is narrowed. The wide opening of the exhaust pipe 110 is joined to the upper wall 55 so as to cover the exhaust port 111. The upper wall 55 corresponding to the inside of the ring is supported by a support member 113 provided inside the chamber 50.

8 to 12 show an example in which the exhaust port 111 is disposed in the side wall 57 of the chamber 50 or inside the chamber 50.
FIG. 8 shows an example in which four exhaust ports 111 are arranged above the side wall 57 of the chamber 50.
FIG. 8A shows a layout of the exhaust port 111 as viewed from the wall 55 on the upper surface of the chamber 50. FIG. 8B shows a schematic perspective view of the vacuum vapor deposition apparatus 100.
The exhaust ports 111 are arranged at four upper portions of the side wall 57 near the center of each side of the wall 55 when viewed from the wall 55 on the upper surface of the chamber 50. That is, the plurality of exhaust ports 111 are arranged rotationally symmetrically with respect to the rotation axis of the support device 20.
As shown in FIG. 8B, when the exhaust port 111 is provided on the side wall 57 of the chamber 50, a step is provided between the chamber 50 and the chamber 40. In particular, when the exhaust port 111 is provided in the side wall 57 of the chamber 50 on the chamber 40 side, a step is necessary.

9 and 10 show examples in which the exhaust port 111 is provided in the chamber 50 at three places and five places.
FIG. 9 is a layout view in which the exhaust ports 111 are provided at three locations. When the exhaust ports 111 are provided at three locations, when one location is provided on the side wall 57, the other two exhaust ports 111 that are rotationally symmetric with respect to the rotation axis of the support device 20 are arranged inside the chamber 50.
Therefore, the other two exhaust ports 111 are provided by extending the exhaust pipe 110 to the inside of the chamber 50.
FIG. 10 is a layout view in which the exhaust ports 111 are provided in five places in the chamber 50. Similarly to the case of providing three locations, when one location is provided on the side wall 57, the other four exhaust ports 111 that are rotationally symmetric with respect to the rotation axis are located inside the chamber 50. The other four exhaust ports 111 are provided by extending the exhaust pipe 110 to the inside of the chamber 50.

FIG. 11 shows an example in which an exhaust port 111 is provided on the entire upper periphery of the side wall 57 of the chamber 50.
FIG. 11A is a layout view of the exhaust port 111 viewed from the wall 55 on the upper surface of the chamber 50. FIG. 11B is a schematic perspective view of the chamber 50, and FIG. 11C is a schematic cross-sectional view of the chamber 50.
In FIGS. 11A and 11B, the exhaust port 111 is provided on the entire circumference of the side wall of the chamber 50. The shape of the exhaust port 111 is a band shape when viewed from the side wall 57, and is a rotationally symmetric shape with respect to the rotation axis of the support device 20.
As shown in FIGS. 11B and 11C, the exhaust port 111 is provided on the entire circumference above the side wall 57 of the chamber 50. The chamber 50 divided into two is coupled at four points by a support member 113.
The exhaust pipe 110 has a substantially funnel shape, and is arranged so that the wide side of the opening wraps around the exhaust port 111, and the edge of the opening is joined to the side wall 57 of the chamber 50. The other narrowed opening is connected to the vacuum generator 51.

FIG. 12 shows an example in which the exhaust port 111 is provided at the rotational symmetry point 112 of the lower wall 56 in addition to the exhaust port 111 shown in FIG.
FIG. 12A is a layout view of the exhaust port 111 viewed from the wall 55 on the upper surface of the chamber 50. FIG. 12B is a schematic perspective view of the chamber 50.

FIG. 13 shows an arrangement example of the conventional exhaust port 111.
FIG. 13A is a layout view of the exhaust port 111 as viewed from the wall 55 on the upper surface of the chamber 50. FIG. 13B is a schematic perspective view of the chamber 50.
One exhaust port 111 is provided in the upper corner of the side wall 57.

  The upper wall 55 and the lower wall 56 of the chamber 50 may be rectangular. Even in this case, the exhaust port 111 may be disposed rotationally symmetrically with respect to the rotation axis of the support device 20. Further, as the number of exhaust ports 111 increases, the flow of exhaust gas in the chamber 50 becomes isotropic. However, since the configuration of the apparatus becomes complicated, the number of exhaust ports 111 is preferably 1 to 5.

  One side of the exhaust port 111 is connected to the vacuum generator 51. Each exhaust port 111 may be connected to the vacuum generation device 51 having the same exhaust amount. That is, it is only necessary that the conductances are made equal so that the exhaust amounts of the exhaust ports 111 are all equal.

Below, the surface treatment process by the vacuum evaporation apparatus 100 is demonstrated.
A hard coat layer 11 is formed on the substrate 10. The hard coat layer 11 can be obtained by a wet method for curing a sol-gel having inorganic fine particles. According to this method, the inorganic fine particles can be selected in accordance with the refractive index of the substrate 10, and reflection at the interface between the substrate 10 and the hard coat layer 11 can be suppressed. The hard coat layer 11 is formed on one side and both sides as necessary. In the case of the substrate 10, it is formed on both sides.

  Next, the antireflection film 12 is formed. The substrate 15 supported by the support device 20 is introduced into the chamber 30 and degassed. Next, the support device 20 is moved to the chamber 40, and the antireflection film 12 is formed on the surface of the hard coat layer 11. In this step, a plurality of thin films having a high refractive index and a low refractive index are alternately stacked, and a thin film containing silicon dioxide as a main component is formed on the uppermost layer of the antireflection film 12.

Next, in order to increase the reactivity between the thin film containing silicon dioxide which is the uppermost layer of the antireflection film 12 and the fluorine-containing organosilicon compound, a treatment for generating silanol groups on the surface is performed.
Oxygen or argon is introduced into the chamber 40, and the inside of the chamber 40 is controlled to a constant pressure by the auto pressure controller 77 and the mass flow controller 78. The high-frequency plasma can be generated at about 10 ⁻³ to 10 ³ Pa, but 1 × 10 ⁻² Pa to ¹ × 10 ⁻¹ Pa is preferable. The high frequency is 13.56 MHz. The treatment time is 0.5 to 3 minutes, and silanol groups are generated on the surface of silicon dioxide in this step.

In addition, as a treatment for generating a silanol group, the ion gun 80 can be used.
Oxygen or argon is introduced into the ion gun 80 at a constant flow rate by the mass flow controller 83. The introduced gas is turned into plasma inside the ion gun 80. The plasma is a high-frequency plasma, and the frequency of the RF power source 81 is normally 13.56 MHZ. The generated positive ions are extracted by an accelerating electrode to which a voltage is applied by a DC power source 82 and irradiated on the surface of silicon dioxide. In order to prevent dielectric breakdown from occurring on the substrate 10 and the occurrence of abnormal discharge, electrons are supplied from a built-in neutralizer and neutralized. The treatment time is 0.5 to 3 minutes, and silanol groups are generated on the surface of silicon dioxide in this step.

  Next, the antifouling film 13 is formed on the surface of the antireflection film 12 by vapor deposition. After the antifouling film 13 is formed, the chamber 50 is gradually returned to atmospheric pressure, and the substrate 15 having been subjected to the single-sided surface treatment is taken out together with the support device 20.

Thereafter, the substrate 15 that has undergone the surface treatment on one side is turned upside down and set on the support device 20 again, and the same processing is performed. Through the above steps, the antireflection film 12 and the antifouling film 13 are formed on both surfaces of the substrate 15.
After the substrate 15 having been subjected to the surface treatment on both sides is taken out from the chamber 50, it is put into a constant temperature and humidity chamber (not shown) and annealed in an atmosphere of appropriate humidity and temperature. Or, it is left in the room for a predetermined time to perform aging. Thereafter, if it is necessary to adjust the thickness of the antifouling film 13, a removal operation such as wiping off the excess is performed.
The plastic lens 1 is obtained by the above process.

According to this embodiment, there are the following effects.
(1) Since the plurality of exhaust ports 111 are provided in a rotationally symmetric arrangement with respect to the rotation axis of the support device 20 with respect to the circular dome-shaped support device 20, the flow of exhaust gas is directed to the rotation shaft of the support device 20. On the other hand, it can be isotropic. By performing isotropic exhaust, the concentration distribution of the vapor deposition material is isotropic with respect to the rotation axis at different positions of the support device 20 on which the substrate 15 having been subjected to surface treatment such as the antireflection film 12 is supported. Can be made uniform and uniform. Therefore, variation in the film thickness of the antifouling film 13 formed on the surface of each plastic lens 1 can be reduced.

  (2) Since the chamber 50 for performing vacuum deposition has a rotationally symmetric shape with respect to the rotation axis of the circular dome-shaped support device 20, the flow of exhaust through the exhaust port 111 is directed to the inside of the chamber 50, etc. Can do it. Since the exhaust flow is isotropic with respect to the inside of the support device 20 and the chamber 50, vapor deposition is performed at different positions of the support device 20 on which the substrate 15 on which the surface treatment such as the antireflection film 12 has been supported is supported. The concentration distribution of the substance can be made more isotropic and more uniform with respect to the rotation axis. Therefore, the variation in the film thickness of the antifouling film 13 formed on the surface of each plastic lens 1 can be reduced.

  (3) Since the exhaust port 111 is provided in the upper wall 55, the lower wall 56, and the side wall 57, it is not necessary to provide an exhaust port in the chamber, and the structure of the chamber can be simplified. Therefore, the effects described above can be easily achieved.

  (4) To evacuate through the exhaust port 111 having a shape in which the rotational axis of the chamber 50 for vacuum deposition coincides with the rotational axis of the support device 20 having a circular dome shape and is rotationally symmetric with respect to the rotation axis of the support device 20. The exhaust flow can be made isotropic with respect to the rotating shaft of the support device 20. By performing isotropic exhaust, the concentration distribution of the vapor deposition material is isotropic with respect to the rotation axis at different positions of the support device 20 on which the substrate 15 having been subjected to surface treatment such as the antireflection film 12 is supported. Can be made uniform and uniform. Therefore, variation in the film thickness of the antifouling film 13 formed on the surface of each plastic lens 1 can be reduced.

  (5) Since the exhaust port 111 is provided over the entire circumference of the side wall 57 corresponding to the outer peripheral direction of the support device 20, the exhaust flow can be made isotropic with respect to the rotation shaft of the support device 20. By performing isotropic exhaust, the concentration distribution of the vapor deposition material is isotropic with respect to the rotation axis at different positions of the support device 20 on which the substrate 15 having been subjected to surface treatment such as the antireflection film 12 is supported. Can be made uniform and uniform. Therefore, variation in the film thickness of the antifouling film 13 formed on the surface of each plastic lens 1 can be reduced.

(6) In the conventional vacuum vapor deposition apparatus, the exhaust port 111 of the chamber 50 is only at one corner at the upper corner of the side wall 57, so that the flow of exhaust gas is biased with respect to the rotation axis of the support device 20, and the correction plate The film thickness adjustment by 92 was difficult.
By providing the exhaust port 111 so that the flow of exhaust gas in the chamber 50 is isotropic with respect to the rotation axis of the support device 20, the concentration distribution of the vapor deposition material can be isotropic with respect to the rotation axis. Therefore, the correction plate 92 can be adjusted with respect to the concentration distribution from the center (rotary axis) to the outer periphery of the support device 20, and variations in the film thickness of the antifouling film 13 can be reduced.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, this invention is not limited to these Examples.

[Example 1]
A plastic lens for spectacles (manufactured by Seiko Epson Corporation: Seiko Super Sovereign) having a hard coat layer 11 formed on a plastic substrate 10 was set on each stage of the support device 20 with the convex surface down.
Next, after degassing in the chamber 30, it moved to the chamber 40, the layers of SiO ₂ and ZrO ₂ were alternately deposited, and the antireflection film 12 composed of these layers was formed. The uppermost layer of the antireflection film 12 is a SiO ₂ layer.
Thereafter, the support device 20 was moved to the chamber 50, and the antifouling film 13 was formed by vacuum deposition. For vacuum deposition, a vacuum deposition apparatus 100 was used in which an exhaust port 111 was provided in the vicinity of the center of each of the four sides on the wall on the upper surface of the chamber 50 (see FIG. 5). The four exhaust ports 111 are connected so as to have equal conductances and are connected to the vacuum generator 51.
As the fluorine-containing organosilicon compound, a compound (product name KY-130, general formula (1)) manufactured by Shin-Etsu Chemical Co., Ltd. was used.

ここで、ＫＹ−１３０を、フッ素系溶剤（住友スリーエム株式会社製：ノベックＨＦＥ−７２００）に希釈して固形分濃度３％溶液を調製し、これを多孔質セラミックス製のペレットに１ｇ含浸させ乾燥させたものを蒸発源９０としてチャンバ５０にセットした。
防汚膜１３形成中は、ハロゲンランプを加熱ヒータ９１として使用し、蒸発源９０のペレットを６００℃に加熱して、フッ素含有有機ケイ素化合物を蒸発させた。蒸着時間は３分であった。
蒸着中は、四つの排気口１１１から絶えず排気を行った。防汚膜１３形成後、支持装置２０をチャンバ５０から取り出し、凹面にも同様の処理を施してプラスチックレンズ１を得た。

Here, KY-130 is diluted with a fluorine-based solvent (Sumitomo 3M Co., Ltd .: Novec HFE-7200) to prepare a 3% solid content solution, and 1 g of this is impregnated into a porous ceramic pellet and dried. This was set in the chamber 50 as an evaporation source 90.
During the formation of the antifouling film 13, a halogen lamp was used as the heater 91, and the pellet of the evaporation source 90 was heated to 600 ° C. to evaporate the fluorine-containing organosilicon compound. The deposition time was 3 minutes.
During vapor deposition, exhaust was continuously performed from the four exhaust ports 111. After the antifouling film 13 was formed, the support device 20 was taken out from the chamber 50, and the concave surface was subjected to the same treatment to obtain the plastic lens 1.

[Example 2]
As the fluorine-containing organosilicon compound, a compound (OPTOOL DSX, general formula (2)) manufactured by Daikin Industries, Ltd. was used.

オプツールＤＳＸを、フッ素系溶剤（ダイキン工業株式会社製：デムナムソルベント）に希釈して固形分濃度３％溶液を調製し、これを多孔質セラミックス製のペレットに１ｇ含浸させ乾燥させたものを蒸発源９０としてチャンバ５０にセットした。その他は、実施例１と同様であった。

Optool DSX is diluted in a fluorine-based solvent (Daikin Kogyo Co., Ltd .: demnum solvent) to prepare a 3% solids concentration solution, and 1 g of this is impregnated into a porous ceramic pellet and dried to evaporate The chamber 90 was set as the source 90. Others were the same as in Example 1.

[Example 3]
As the vacuum deposition apparatus 100, an apparatus in which one circular exhaust port 111 is provided at the center of the wall 55 on the upper surface of the chamber 50 was used. In the schematic perspective view shown in FIG. 6B, this corresponds to a device in which the exhaust port 111 of the lower wall 56 is not provided. Others were the same as in Example 1.

[Example 4]
As the vacuum deposition apparatus 100, an apparatus in which one exhaust port 111 is provided at each of the rotational symmetry point 112 of the upper wall 55 of the chamber 50 and the rotational symmetry point 112 of the lower wall 56 is used (see FIG. 6). . Others were the same as in Example 1.

[Example 5]
As the vacuum evaporation apparatus 100, an apparatus in which an exhaust port 111 is provided around the periphery of the wall 55 on the upper surface of the chamber 50 (see FIG. 7). Others were the same as in Example 1.

[Example 6]
As the vacuum deposition apparatus 100, an apparatus was used in which one exhaust port was provided in each upper part of the opposing side wall 57 of the chamber 50 (see FIG. 8). Others were the same as in Example 1.

[Example 7]
As the vacuum deposition apparatus 100, an apparatus in which three exhaust ports 111 were provided in the chamber 50 was used (see FIG. 9). Others were the same as in Example 1.

[Example 8]
As the vacuum deposition apparatus 100, an apparatus in which five exhaust ports 111 were provided in the chamber 50 was used (see FIG. 10). Others were the same as in Example 1.

[Example 9]
As the vacuum deposition apparatus 100, an apparatus in which an exhaust port 111 is provided over the entire circumference of the side wall 57 of the chamber 50 (see FIG. 11). Others were the same as in Example 1.

[Example 10]
As the vacuum evaporation apparatus 100, an apparatus in which an exhaust port 111 is provided over the entire upper periphery of the side wall 57 of the chamber 50, and one exhaust port 111 is provided at the rotational symmetry point 112 of the lower wall 56 (FIG. 12). reference). Others were the same as in Example 1.

[Comparative example]
As the vacuum deposition apparatus 100, an apparatus in which the exhaust port 111 is provided at only one location at the upper end of the side wall 57 of the chamber 50 was used (see FIG. 13). Others were the same as in Example 1.

The plastic lens 1 obtained in each example and comparative example was evaluated as follows.
(1) Measurement of contact angle The contact angle of the surface of the plastic lens 1 obtained in each stage of the support device 20 is measured by a liquid angle method using a contact angle meter (“CA-D type”) manufactured by Kyowa Co., Ltd. The contact angle of pure water was measured.
(2) Ink wiping property A straight line of about 4 cm was drawn on the convex surface of the plastic lens 1 with a black oil marker (manufactured by “HIMACKY CARE” Zebra Co., Ltd.) and left for 5 minutes. Thereafter, wiping was performed with wipe paper, and the number of reciprocal wipings required until the ink was completely wiped was examined.

The measurement of the contact angle and the evaluation of the ink wiping property were performed in the initial stage and after wiping 3000, 5000, and 10,000 times with a cotton cloth to which a pressure of 1 kg / cm ² was applied.
The results of the contact angle and the ink wiping property in the plastic lens 1 obtained in each example and comparative example are shown as a table in FIG.
If the antifouling film 13 has little variation in film thickness, the contact angle and the ink wiping performance are reduced at the same rate as the number of wiping operations increases. Therefore, the contact angle after 10000 wiping was normalized based on the initial contact angle, and the relative film thickness was determined. As the initial contact angle, 108 ° was used in the case of KY-130, and 112 ° was used in the case of OPTOOL DSX.
FIG. 15 is a graph showing the obtained relative film thickness for each stage of the support device 20.
15 (a) is Example 1, (b) is Example 2, (c) is Example 3, (d) is Example 4, (e) is Example 5, (f) is Example 6, (G) shows Example 7, (h) shows Example 8, (i) shows Example 9, (j) shows Example 10, and (k) shows the result of Comparative Example.
From these evaluation results, in each Example in which the exhaust port 111 is arranged so that the flow of exhaust gas through the exhaust port 111 is isotropic with respect to the rotation shaft of the support device 20, it is It was confirmed that there was less variation in film thickness.

The best method for carrying out the present invention has been disclosed in the above description, but the present invention is not limited to this. That is, the present invention has been described mainly with respect to specific embodiments, but the number of exhaust ports, exhaust ports, and the like can be compared with the above-described embodiments without departing from the scope of the technical idea and object of the present invention. Various modifications can be made by those skilled in the art in terms of the shape, the position where the exhaust port is provided, the material used, the processing time, the concentration, and other details.
Therefore, the description of limiting the number of exhaust ports, the shape of the exhaust ports, the positions where the exhaust ports are provided, the materials to be used, the processing time, the concentration, and the like disclosed above is exemplary for facilitating the understanding of the present invention. Since the present invention is not limited to the present invention, some or all of the limitations on the number of exhaust ports, the shape of the exhaust ports, the positions where the exhaust ports are provided, their materials, processing time, concentration, etc. The description excluding the limitation is included in the present invention.

Sectional drawing of the plastic lens concerning embodiment of this invention. Schematic of the vacuum evaporation system concerning embodiment of this invention. 1 is a schematic cross-sectional view of a support device and an evaporation source according to an embodiment of the present invention. FIG. 3 is a top view of a support device, an evaporation source, a heater, and a correction plate according to an embodiment of the present invention. (A) is the figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. (B) is the schematic perspective view which showed an example of the vacuum evaporation system of this embodiment. (A) is the figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. (B) is the schematic perspective view which showed an example of the chamber of this embodiment. (A) is the figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. (B) is the schematic perspective view which showed an example of the chamber of this embodiment. (C) is the schematic sectional drawing which showed an example of the chamber. (A) is the figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. (B) is the schematic perspective view which showed an example of the vacuum evaporation system of this embodiment. The figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. The figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. (A) is the figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. (B) is the schematic perspective view which showed an example of the chamber of this embodiment. (C) is the schematic sectional drawing which showed an example of the chamber. (A) is the figure which showed the example of arrangement | positioning of the exhaust port of this embodiment. (B) is the schematic perspective view which showed an example of the chamber of this embodiment. (A) is the figure which showed arrangement | positioning of the exhaust port of a comparative example. (B) is the schematic perspective view which showed the chamber of the comparative example. The graph showing the evaluation result of the Example and comparative example of this invention. The graph showing the evaluation result of the Example and comparative example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Plastic lens which is antifouling optical article, 13 ... Antifouling film, 20 ... Supporting device, 30, 40, 50 ... Chamber, 55 ... Upper wall, 56 ... Lower wall, 57 ... Side wall, 100 ... Antifouling Vacuum deposition apparatus, 111 ... exhaust port, which is a manufacturing apparatus for dirty optical articles.

Claims (3)

An apparatus for producing an antifouling optical article comprising a chamber for forming an antifouling film containing a fluorine-containing organosilicon compound by a vacuum deposition method on the surface of the optical article,
A support device for supporting the optical article and having a rotation shaft rotatable in the chamber;
The apparatus for producing an antifouling optical article, wherein a plurality of exhaust ports for exhausting the inside of the chamber are arranged rotationally symmetrically with respect to the rotation axis. An apparatus for producing an antifouling optical article comprising a chamber for forming an antifouling film containing a fluorine-containing organosilicon compound by a vacuum deposition method on the surface of the optical article,
A support device for supporting the optical article and having a rotation shaft rotatable in the chamber;
On at least one of the upper and lower surfaces constituting the chamber,
An apparatus for producing an antifouling optical article, wherein an exhaust port having a shape that is rotationally symmetric with respect to the rotation axis is provided. An apparatus for producing an antifouling optical article comprising a chamber for forming an antifouling film containing a fluorine-containing organosilicon compound by a vacuum deposition method on the surface of the optical article,
A support device for supporting the optical article and having a rotation shaft rotatable in the chamber;
An apparatus for producing an antifouling optical article, wherein an exhaust port having a rotationally symmetric shape with respect to the rotation axis is provided over the entire circumference of the chamber side wall.

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