JP2007067056A - Method of manufacturing wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board along with its manufacturing method, in which a conductive pattern layer is efficiently formed in a precision pattern in a simple manufacturing process. <P>SOLUTION: The method of manufacturing a wiring board includes an adhesion process where a base material 1, a photosensitive adhesive layer 2 which is formed on the base material and whose adhesive force degrades under exposure, a base body 4, and a conductive material layer 5 are tightly contacted together; and an exposure process for exposing the photosensitive adhesive layer 2 in pattern, in a specified direction. It also includes a pealing process for separation into a photosensitive adhesive sheet side wiring substrate 8 having a first conductive pattern layer 7 formed on such adhesive region in the photosensitive adhesive layer as not exposed, the base body 4, and a conductive sheet side wiring substrate 10 that contains the conductive material layer 5 and has a second conductive pattern layer 9 formed in such exposure region in the base body as exposed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wiring board having a high-definition conductive pattern layer used for organic semiconductors and the like, and a method for manufacturing the same.

Conventionally, a photolithography method or the like is generally used to form a conductive pattern layer of a wiring board used for an organic semiconductor or the like. However, in the photolithography method, a step of forming a conductive material layer on the entire surface of the substrate, a step of forming a photoresist layer on the conductive material layer, a step of exposing the photoresist layer, Various processes such as a step of developing the resist layer and a step of etching the conductive material layer need to be performed, and there is a problem that the manufacturing method is complicated. Further, a large amount of waste liquid generated during development is harmful, and there has been a problem in terms of the environment, such as the need to perform processing in order to discharge it to the outside.
In addition, the prior art regarding this invention has not been found.

  Therefore, it is desired to provide a wiring board on which a conductive pattern layer is efficiently formed in a high-definition pattern with a simple manufacturing process, and a manufacturing method therefor.

  The present invention provides a photosensitive adhesive sheet of a photosensitive adhesive sheet having a substrate and a photosensitive adhesive layer formed on the substrate, the adhesive strength of which decreases upon exposure, the substrate, and the substrate. An adhesion step of closely contacting the conductive material layer of the conductive sheet formed and having a conductive material layer containing a conductive material, and an exposure step of exposing the photosensitive adhesive layer in a pattern from a predetermined direction And the substrate, the photosensitive adhesive layer formed on the substrate, and the conductive material, the first formed on the unexposed adhesive region of the photosensitive adhesive layer A photosensitive adhesive sheet-side wiring board having one conductive pattern layer, the base, and the conductive material layer, and a second conductive pattern layer formed on the exposed exposed area of the base. Conductive sheet side wiring base To provide a method of manufacturing a wiring substrate characterized by having a peeling step of peeling and.

In this invention, it exposes in a pattern shape in the state which contact | adhered the said photosensitive adhesive layer and the electroconductive material layer. Thereby, in the area | region where the photosensitive adhesive layer is not exposed, the photosensitive adhesive layer has adhesiveness, and it peels in the state which the electroconductive material layer adhered to the photosensitive adhesive sheet side in the peeling process. Is done. On the other hand, in the area where the photosensitive pressure-sensitive adhesive layer is exposed, the adhesive strength of the photosensitive pressure-sensitive adhesive layer is reduced, and in the peeling step, the conductive material layer does not adhere to the photosensitive pressure-sensitive adhesive layer side, It can remain on the substrate side. Therefore, according to the present invention, the photosensitive adhesive sheet-side wiring board having the first conductive pattern layer formed in a pattern reverse to the exposure pattern, and the second conductive formed in the same pattern as the exposure pattern. Two types of wiring boards, that is, the pressure-sensitive adhesive sheet-side wiring board having a conductive pattern layer, can be manufactured at the same time.
Further, according to the present invention, when forming the first conductive pattern layer and the second conductive pattern layer, there is no need for a special apparatus or a complicated process, and an efficient and simple manufacturing process. It has the advantage that a wiring board can be manufactured.

  The present invention also includes a substrate, a photosensitive adhesive layer formed on the substrate and having reduced adhesive strength upon exposure, and a conductive pattern layer formed in a pattern on the photosensitive adhesive layer. The photosensitive pressure-sensitive adhesive layer has an adhesive strength-decreasing region where the adhesive strength is reduced by exposure and an unexposed adhesive region, and the conductive pattern layer is the adhesive substrate. Provided is a wiring board which is formed on a region.

  According to the present invention, since the photosensitive pressure-sensitive adhesive layer has a pressure-sensitive adhesive region and a pressure-sensitive adhesive strength reduced region, the adhesive property of this photosensitive pressure-sensitive adhesive layer is utilized. Thus, a conductive pattern layer can be formed. Therefore, when forming the conductive pattern layer, a complicated process, a special apparatus, or the like is not required, and a wiring board that is preferable in terms of manufacturing efficiency, cost, and the like can be obtained.

  According to the present invention, when forming a conductive pattern layer, two kinds of wiring boards can be simultaneously manufactured efficiently and with a simple manufacturing process without requiring a special apparatus or a complicated process. It has the effect of being able to do it.

  The present invention relates to a wiring board having a high-definition conductive pattern layer used for organic semiconductors and the like, and a method for manufacturing the same. Each will be described below.

A. First, a method for manufacturing a wiring board according to the present invention will be described. The method for producing a wiring board according to the present invention includes a substrate, the photosensitive adhesive layer of the photosensitive adhesive sheet formed on the substrate and having a photosensitive adhesive layer whose adhesive strength is reduced by exposure, and the substrate. And a step of closely contacting the conductive material layer of the conductive sheet formed on the substrate and having a conductive material layer containing a conductive material, and patterning the photosensitive adhesive layer from a predetermined direction. An exposure step that is exposed to the surface, the substrate, the photosensitive adhesive layer formed on the substrate, and the conductive material, and an adhesive region that is not exposed in the photosensitive adhesive layer A photosensitive adhesive sheet-side wiring board having a first conductive pattern layer formed thereon, the base, and the conductive material layer, the first formed on the exposed exposure area of the base Has two conductive pattern layers A method characterized in that it comprises a peeling step of peeling the conductive sheet side wiring board.

  An example of a method for manufacturing a wiring board according to the present invention will be described with reference to FIG. The method for producing a wiring board according to the present invention includes a substrate 1 and a photosensitive adhesive sheet 3 having the photosensitive adhesive layer 2 formed on the substrate 1, a substrate 4, and the substrate 4. A conductive sheet 6 having the formed conductive material layer 5 is prepared (FIG. 1A), and the photosensitive adhesive layer 2 of the photosensitive adhesive sheet 3 and the conductive material layer of the conductive sheet 6 are prepared. 5 is performed (FIG. 1B). Subsequently, an exposure process (FIG. 1C) is performed in which the photosensitive adhesive layer 2 is irradiated with light 12 in a pattern using a photomask 11 or the like from a predetermined direction. Next, the base material 1, the photosensitive adhesive layer 2 formed on the base material 1, and an unexposed adhesive region (region indicated by a in the figure) of the photosensitive adhesive layer 2 were formed. The photosensitive adhesive sheet side wiring board 8 having the first conductive pattern layer 7, the base 4, and the exposed area of the base 4 where the photosensitive adhesive layer 2 is exposed (area indicated by b in the figure) The peeling process (FIG.1 (d)) which peels to the conductive sheet side wiring board 10 which has the 2nd conductive pattern layer 9 formed in FIG.

  In this invention, after making the electroconductive material layer of the said electroconductive sheet and the photosensitive adhesive layer of the photosensitive adhesive sheet of a photosensitive adhesive sheet closely_contact | adhere, it is pattern-shaped with respect to the said photosensitive adhesive layer Since the exposure is performed, the photosensitive adhesive layer has a high adhesive strength of the photosensitive adhesive layer, the adhesive area bonded to the conductive material layer, and the adhesive strength of the photosensitive adhesive layer is reduced by the exposure. As a result, an exposure region having a weak adhesive force with the conductive material layer is formed. Therefore, when peeling to the photosensitive adhesive sheet side and the conductive sheet side, the conductive material layer peels off from the substrate in the adhesive region and adheres to the photosensitive adhesive sheet side. The conductive material layer does not peel and the conductive material layer remains on the substrate.

  Therefore, according to the present invention, the photosensitive adhesive sheet-side wiring board having the first conductive pattern layer formed in a pattern reverse to the exposure pattern, and the second conductive formed in the same pattern as the exposure pattern. Two types of wiring boards, that is, the pressure-sensitive adhesive sheet-side wiring board having a conductive pattern layer, can be manufactured at the same time.

Further, in the present invention, when the conductive material layer is patterned into the first conductive pattern layer and the second conductive pattern layer, no special apparatus, chemicals, complicated processes, etc. are required. Therefore, according to this invention, it can be set as the preferable manufacturing method of a wiring board also from surfaces, such as manufacturing efficiency and cost. Furthermore, according to the present invention, since it is not necessary to perform an etching process or the like, the conductive material is not required to have resistance to chemicals and the like, and various materials can be selected as the conductive material. Also have.
Hereinafter, each step in the present invention will be described in detail.

1. First, the adhesion process in the present invention will be described. The adhesion step of the present invention includes a substrate, and the photosensitive pressure-sensitive adhesive layer of the photosensitive pressure-sensitive adhesive sheet having a photosensitive pressure-sensitive adhesive layer formed on the substrate and having reduced adhesive strength upon exposure, the substrate, and the above-mentioned This is a step of closely contacting the conductive material layer of a conductive sheet formed on a substrate and having a conductive material layer containing a conductive material.

This step can be performed by preparing a photosensitive pressure-sensitive adhesive sheet and a conductive sheet, respectively, and bringing the photosensitive pressure-sensitive adhesive layer and the conductive material layer into contact with each other and closely contacting each other. In the present invention, as long as the photosensitive adhesive layer and the conductive material layer can be adhered to each other, the adhesion method and the like are not particularly limited. For example, a method of laminating a photosensitive adhesive sheet and a conductive sheet in a vacuum state, a method of simply stacking a photosensitive adhesive sheet and a conductive sheet, or a method of superposing a photosensitive adhesive sheet and a conductive sheet and applying pressure. The method of applying etc. is mentioned. Such an adhesion method is appropriately selected according to the shape of the photosensitive pressure-sensitive adhesive sheet, the shape of the conductive sheet, the type of the photosensitive pressure-sensitive adhesive layer, and the like. When forming the pattern layer or the second conductive pattern layer, a method in which the photosensitive adhesive sheet and the conductive sheet are overlapped and pressure-bonded, or the photosensitive adhesive sheet and the conductive sheet are bonded in a vacuum state. Preferably there is. Thereby, the adhesiveness between the photosensitive pressure-sensitive adhesive layer and the conductive material layer can be improved, and even when the peeling process is performed by exposing to a fine pattern in the exposure process described later. This is because the first conductive pattern formed on the photosensitive adhesive sheet side wiring substrate can be free from chipping or the like.
Hereinafter, the photosensitive adhesive sheet and conductive sheet used in this step will be described.

(Photosensitive adhesive sheet)
First, the photosensitive adhesive sheet used for this invention is demonstrated. The photosensitive pressure-sensitive adhesive sheet used in the present invention has a base material and a photosensitive pressure-sensitive adhesive layer which is formed on the base material and whose adhesive strength is reduced by exposure. Such a photosensitive adhesive sheet may be, for example, a roll or a flat plate. Further, in the present invention, in addition to the base material and the photosensitive pressure-sensitive adhesive layer, other layers such as an adhesion improving layer for improving the adhesion between the base material and the photosensitive pressure-sensitive adhesive layer are appropriately provided. May be. The base material used for such a photosensitive adhesive sheet and a photosensitive adhesive layer are demonstrated below.

a. Photosensitive pressure-sensitive adhesive layer The photosensitive pressure-sensitive adhesive layer used in the present invention may be any layer that has a pressure-sensitive adhesive force to the conductive material layer and whose adhesive strength is reduced by exposure in an exposure step described later. In particular, the layer can be used as a photosensitive adhesive layer.

  As materials used for such a photosensitive pressure-sensitive adhesive layer, conventionally known materials can be widely used. In the present invention, it is particularly preferable to use an acrylic pressure-sensitive adhesive. Specifically, an acrylic polymer selected from a homopolymer and a copolymer having an acrylate ester as a main constituent monomer unit, or a copolymer of an acrylate ester with another functional monomer , And a mixture of these polymers. Examples of the acrylic ester include ethyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, glycidyl methacrylate, 2-hydroxyethyl methacrylate, and the like. Moreover, what replaced said methacrylic acid with acrylic acid can be used preferably. Furthermore, monomers such as acrylic acid, methacrylic acid, acrylonitrile, and vinyl acetate may be copolymerized in order to enhance compatibility with the oligomers described later. Moreover, in this invention, by including a radiation polymerizable compound in the said photosensitive adhesive layer, the adhesive force of the photosensitive adhesive layer of the exposed area | region is reduced by exposing in the exposure process mentioned later. be able to. As such a radiation polymerizable compound, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds that can be three-dimensionally reticulated by light irradiation in the molecule is widely used. Specifically, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, or 1,4-butylene glycol diacrylate 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and the like are used. Further, as the radiation polymerizable compound, a urethane acrylate oligomer can be used in addition to the acrylate compound as described above. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1, A terminal isocyanate urethane prepolymer obtained by reacting 4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc. with an acrylate or methacrylate having a hydroxyl group, such as 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate, 2- By reacting hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc. It is as it is. This urethane acrylate oligomer is a radiation-polymerizable compound having at least two carbon-carbon double bonds. In addition, when the urethane acrylate oligomer is used as a radiation-polymerizable compound, it is more sensitive than a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in the molecule. An extremely excellent agent layer is obtained. That is, the adhesive strength of the photosensitive adhesive layer before exposure is sufficiently large, and after the exposure, the adhesive strength is sufficiently reduced and peeled off from the conductive material layer, and then the photosensitive adhesive layer is formed on the conductive material layer. It can be assumed that there is no remaining.

  The material is appropriately selected depending on the adhesive force between the base of the conductive sheet described later and the conductive material layer, and the photosensitive adhesive layer and the conductive material are determined based on the adhesive force between the base and the conductive material layer. A material that has high adhesion to the layer is selected and used.

  In addition, as a method for forming the photosensitive adhesive layer, a composition containing the above materials will be described later with a comma coater, a gravure coater, a gravure reverse coater, a three reverse coater, a slit reverse coater, a die coater, or the like. A method of applying on a substrate and drying can be used.

  The film thickness of such a photosensitive pressure-sensitive adhesive layer is appropriately selected according to the use of the photosensitive pressure-sensitive adhesive sheet-side wiring board produced according to the present invention, and is usually about 1 μm to 100 μm, especially 3 μm. It can be set to about ˜20 μm.

b. Base material The base material used in the present invention is not particularly limited as long as it can form the photosensitive adhesive layer, and those used as a base material for a general wiring board are used. be able to. For example, a resin laminate of a paper substrate, a resin laminate of a glass cloth / glass nonwoven fabric substrate, ceramic, metal and the like can be mentioned.

  In the present invention, when exposure in an exposure step described later is performed from the substrate side, it is necessary to have a certain level of transparency to the light irradiated during the exposure. In addition, about the flexibility etc. of a base material, it selects suitably according to the use etc. of the photosensitive adhesive sheet side wiring board.

  The film thickness of such a substrate is appropriately selected according to the use of the photosensitive adhesive sheet-side wiring substrate produced according to the present invention, and is usually about 10 μm to 300 μm, and particularly about 50 μm to 150 μm. It can be.

(Conductive sheet)
Next, the conductive sheet used in the present invention will be described. The conductive sheet used in the present invention is not particularly limited as long as it has a base and a conductive material layer containing the base conductive material. Such a conductive sheet may be, for example, a roll or a flat plate.

  The conductive sheet used in the present invention may have necessary layers as needed in addition to the base and the conductive material layer. As such a layer, for example, a peeling layer formed in a portion to be an adhesive region in a peeling step to be described later can be cited. When such a release layer is formed, only the conductive material layer in the adhesive region can be easily peeled from the substrate in the release step, and the first conductive pattern and the second conductive layer can be precisely separated. This is because a conductive pattern can be formed. Moreover, in order to improve the adhesiveness of a base | substrate and an electroconductive material layer, the adhesive improvement layer etc. which are formed in the part used as an exposure area | region are mentioned, for example. In this case, in the peeling step, the conductive material layer in the exposed region can be made difficult to peel off from the substrate, and the first conductive pattern and the second conductive pattern can be formed with high definition. is there. Hereinafter, the base | substrate and electroconductive material layer which are used for such an electroconductive sheet are demonstrated.

a. Conductive material layer The conductive material layer used in the present invention is a layer containing a conductive material, and is easily cut at the boundary between the adhesive region and the exposed region in the peeling step described later. Is done.

  Examples of the conductive material contained in such a conductive material layer include noble metals such as gold, silver and platinum, metal materials having high conductivity such as nickel, copper and aluminum, and carbon and conductive polymer materials. , Charge transfer complexes, ionic conductors, and the like can be used, and in the present invention, among these, carbon or a conductive polymer material is preferably used from the viewpoint of the cutting ability of the conductive material layer in the peeling step.

  Further, the method for forming the conductive material layer is not particularly limited as long as it is a method capable of forming the conductive material layer, and the conductive material layer used in a general method for manufacturing a wiring board is not limited. It can be the same as the formation method. In the present invention, in particular, a method of forming a conductive material layer by applying a composition obtained by adding a solvent, an additive, or the like to the above-described fine particles of the conductive material on a substrate to be described later, or the above It is preferable to use a method of forming a conductive material layer by a vacuum vapor deposition method using a conductive material. This is because by using such a method, the conductive material layer can be easily cut at the boundary between the adhesive region and the exposure region in the peeling step described later.

  In addition, as the film thickness of the conductive material layer as described above, depending on the photosensitive adhesive sheet side wiring substrate manufactured according to the present invention, the use of the conductive sheet side wiring substrate, the resistivity of the conductive material, and the like. It is selected appropriately.

b. Substrate Next, the substrate used in the present invention will be described. The substrate used in the present invention is not particularly limited as long as the conductive material layer can be formed. Such a substrate can be the same as the substrate used for the photosensitive adhesive sheet described above. Further, the light transmittance and flexibility of the substrate are appropriately selected depending on the exposure direction in the exposure process described later, the use of the conductive sheet side wiring board, and the like.

2. Exposure Step Next, the exposure step in the present invention will be described. The exposure process in this invention is a process of exposing the said photosensitive adhesive layer in a pattern form from a predetermined direction. The exposure method of the photosensitive adhesive layer in this step is not particularly limited as long as it is a method capable of exposing the photosensitive adhesive layer in a pattern. As such an exposure method, for example, a method of irradiating light using a photomask or the like, a method of drawing and irradiating light using a laser or the like can be used.

  Further, the light irradiation direction may be any direction in which the photosensitive adhesive layer is exposed in a pattern and the adhesiveness of the photosensitive adhesive layer can be reduced in a pattern. Such light irradiation direction is appropriately selected according to the light transmittance of the photosensitive adhesive sheet, the light transmittance of the conductive sheet, and the like.

  The light used for the exposure in this step is not particularly limited as long as it can reduce the adhesive strength of the photosensitive pressure-sensitive adhesive layer, and depends on the type of the photosensitive pressure-sensitive adhesive. Are appropriately selected. Usually, ultraviolet light having a wavelength of about 280 nm to 400 nm can be used.

  In addition, as exposure time in this process, it is set as time required in order to reduce the adhesiveness of the said photosensitive adhesive layer. In addition, the exposure pattern in this step is appropriately selected according to the use of the photosensitive adhesive sheet side wiring substrate and the conductive sheet side wiring substrate.

3. Next, the peeling process in the present invention will be described. The peeling step in the present invention includes the above-mentioned base material, the above-mentioned photosensitive pressure-sensitive adhesive layer formed on the above-mentioned base material, and the above-mentioned conductive material, and on the unexposed pressure-sensitive adhesive layer of the above-mentioned photosensitive pressure-sensitive adhesive layer. A photosensitive adhesive sheet-side wiring board having a first conductive pattern layer formed on the substrate, the substrate, and the conductive material layer, and a second layer formed on the exposed exposed region of the substrate. This is a step of peeling off the conductive sheet side wiring substrate having the conductive pattern layer.

  By this step, the conductive material layer is a region where the photosensitive adhesive layer is not exposed, and the photosensitive adhesive layer is formed in an adhesive region having adhesive force, and the photosensitive property layer. The pressure-sensitive adhesive layer is exposed, and the photosensitive pressure-sensitive adhesive layer is cut into portions that are formed in an exposed region that does not have adhesiveness.

  Here, as a method of peeling the photosensitive adhesive sheet side wiring substrate and the conductive sheet side wiring substrate, for example, a part of the photosensitive adhesive sheet side wiring substrate and the conductive sheet side wiring substrate A method of grasping a part and pulling in the opposite direction, a method of grasping the entire surface of the photosensitive adhesive sheet side wiring substrate and the entire surface of the conductive sheet side wiring substrate, and pulling in the opposite direction, etc. it can. Moreover, it can be set as the method of pulling any one of the said photosensitive adhesive sheet side wiring board and a conductive sheet side wiring board in a predetermined direction.

4). Other In the present invention, in addition to the adhesion step, the exposure step, and the peeling step, if necessary, for example, a step of forming a photosensitive adhesive sheet, a step of forming a conductive sheet, etc. You may do it.

  In the present invention, the photosensitive adhesive sheet side wiring board and the conductive sheet side wiring board can each be used as a wiring board. Moreover, the photosensitive adhesive sheet side wiring board manufactured by this invention and the electroconductive sheet side wiring board can be used for various uses, such as an organic semiconductor and a transistor, for example.

B. Next, a method for manufacturing a wiring board according to the present invention will be described. The wiring board of the present invention includes a base material, a photosensitive adhesive layer formed on the base material, the adhesive strength of which is reduced by exposure, and a conductive pattern formed in a pattern on the photosensitive adhesive layer. The photosensitive adhesive layer has an adhesive strength-reduced region where the adhesive strength is reduced by exposure, and an unexposed adhesive region, and the conductive pattern layer is It is formed on the adhesive region.

  For example, as shown in FIG. 2, the wiring board of the present invention includes a base material 1, a photosensitive adhesive layer 2 formed on the base material 1, and a conductive material formed on the photosensitive adhesive layer 2. The photosensitive adhesive layer 2 is exposed to a reduced adhesive strength region 22 where the adhesive strength is reduced, and is not exposed to an adhesive region 23 having an adhesive strength. The conductive pattern layer 21 is formed on the adhesive region 23.

  According to the present invention, since the photosensitive pressure-sensitive adhesive layer has a pressure-sensitive adhesive region and a pressure-sensitive adhesive strength reduced region, the adhesive property of this photosensitive pressure-sensitive adhesive layer is utilized. Thus, a conductive pattern layer can be formed. Therefore, when forming the conductive pattern layer, a complicated process, a special apparatus, or the like is not required, and a wiring board that is preferable in terms of manufacturing efficiency, cost, and the like can be obtained. Furthermore, according to the present invention, when the conductive pattern layer is formed, the etching process or the like is not performed. Therefore, the conductive material does not need chemical resistance or the like, and includes various conductive materials. There is also an advantage that it can be a wiring board having a conductive pattern. Hereinafter, each configuration of the present invention will be described in detail.

1. Photosensitive adhesive layer First, the photosensitive adhesive layer used in the present invention will be described. The photosensitive adhesive layer used in the present invention has an adhesive strength that is reduced by exposure, and has an adhesive strength reduced region in which the adhesive strength has been reduced by exposure, and an unexposed adhesive region. Here, the adhesive strength-decreasing region is a region where the adhesiveness is reduced by exposure in the photosensitive adhesive layer, and does not have adhesiveness with the conductive material forming the conductive pattern layer described later. The area where the degree of adhesiveness is reduced is said. Moreover, the said adhesion area | region shall say the area | region which is not exposed in the photosensitive adhesive layer and has adhesiveness.

  As such a photosensitive adhesive layer, an adhesive layer whose adhesive strength is reduced by exposure can be used, and it can be the same as a layer generally used as a photosensitive adhesive layer. Specifically, it may be the same as that described in the section of “A. Manufacturing method of wiring board”.

  In addition, the above-mentioned adhesive region and the adhesive strength-decreasing region are formed by exposing the photosensitive adhesive layer to light using a photomask or the like, or irradiating the photosensitive adhesive layer with light using a laser or the like. Methods and the like. The light and the like used for such exposure can be the same as that described in the above-mentioned section “A. Method of manufacturing a wiring board”, and thus detailed description thereof is omitted here.

  The film thickness of such a photosensitive pressure-sensitive adhesive layer is appropriately selected according to the use of the photosensitive pressure-sensitive adhesive sheet-side wiring board produced according to the present invention, and is usually about 1 μm to 100 μm, and more preferably 1 μm. It can be set to about 30 μm.

2. Next, the conductive pattern layer used in the present invention will be described. The conductive pattern layer used in the present invention is a layer containing a conductive material, and is formed on the adhesive pattern of the photosensitive adhesive layer.

  In the present invention, the conductive pattern layer is not particularly limited as long as it contains a conductive material and has conductivity. For example, the conductive pattern layer has a conductive property of “A. Method of manufacturing a wiring board”. The same material as that described in the section of the material layer can be contained.

  The method for forming such a conductive pattern layer is not particularly limited. For example, a conductive material containing the conductive material is formed on the photosensitive pressure-sensitive adhesive layer in which the adhesive region and the adhesive strength-decreasing region are formed. The conductive material layer may be formed by attaching the conductive material layer only on the adhesive region by peeling the conductive material layer after the adhesive material layer is adhered. In the present invention, as described in “A. Method for producing wiring board”, in particular, a photosensitive adhesive layer having adhesiveness on the entire surface, and a conductive material layer of a conductive sheet having a substrate and a conductive material layer. It is preferable to use a method of forming a conductive pattern layer by exposing the photosensitive pressure-sensitive adhesive layer to form a pressure-sensitive adhesive region and a pressure-sensitive adhesive strength-reduced region and peeling the conductive sheet. As a result, the conductive pattern layer can be formed not only on the photosensitive adhesive layer side but also on the peeled conductive sheet side, and the conductive sheet side can also be used as a wiring board. Because it becomes.

3. Substrate Next, the substrate used in the present invention is not particularly limited as long as the above-mentioned photosensitive adhesive layer can be formed, and is used as a substrate for a general wiring board. The same can be said.

  Such a base material can be the same as that described in the section of “A. Manufacturing method of wiring board”, and therefore detailed description thereof is omitted here.

4). Wiring board The wiring board of the present invention is not particularly limited as long as it has the base material, the photosensitive adhesive layer, and the conductive pattern layer. It may have a layer.
The wiring board of the present invention can be used for various applications such as organic semiconductors and transistors.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

The following examples illustrate the present invention more specifically.
(Adhesion process)
As a base material, an A4 size polyethylene terephthalate film (containing 30% plasticizer, thickness 80 μm) was used. An acrylic resin containing 3 parts by weight of 2,4-dihydroxybenzophenone was printed on one surface of the substrate surface by screen printing.
Next, from 100 parts by weight of an acrylic polymer (copolymer of n-butyl acrylate and acrylic acid), 100 parts by weight of a urethane acrylate oligomer having a molecular weight of 8000, and 10 parts by weight of a curing agent (aromatic isocyanate type). The resulting composition (photosensitive adhesive) was cast on a release material comprising a silicone-treated polyethylene terephthalate film (38 μm), and then bonded to the substrate to produce a photosensitive adhesive sheet having a photosensitive adhesive layer. did.
Subsequently, a conductive material layer having a thickness of 0.5 μm containing 10 parts by weight of a modified polyester resin and 7 parts by weight of carbon black was formed on a polyethylene terephthalate film having a thickness of 25 μm (trade name; Lumirror manufactured by Toray Industries, Inc.). A conductive sheet was prepared. Then, the photosensitive adhesive layer of the said photosensitive adhesive sheet and the electroconductive material layer of the said electroconductive sheet were stuck.

(Exposure process)
A photomask (substrate SiO ₂ , manufactured by Tokyo Process Service Co., Ltd.) having a light-shielding pattern of 100 μm lines and spaces was brought into close contact with the photosensitive adhesive sheet side and irradiated with ultraviolet rays having an illuminance of 1000 mW / cm ² for 5 seconds.

(Peeling process)
Then, when the photosensitive adhesive sheet and the conductive sheet were peeled off, the photosensitive adhesive sheet side wiring substrate to which the conductive material layer of the unexposed part was attached, and the conductive sheet side to which the conductive material layer of the exposed part was attached A wiring board was obtained. Each of these had a conductive pattern consisting of 100 μm lines and spaces.

It is process drawing which shows an example of the manufacturing method of the wiring board of this invention. It is a schematic sectional drawing which shows an example of the wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Photosensitive adhesive layer 3 ... Photosensitive adhesive sheet 4 ... Base | substrate 5 ... Conductive material layer 6 ... Conductive sheet 7 ... 1st conductive pattern layer 8 ... Photosensitive adhesive sheet side wiring board 9 ... Second conductive pattern layer 10 ... conductive sheet side wiring board 12 ... light 21 ... conductive pattern layer 22 ... adhesive strength reduction area 23 ... adhesive area a ... adhesive area b ... exposure area

Claims (2)

The photosensitive adhesive layer of the photosensitive pressure-sensitive adhesive sheet having the base material and the photosensitive pressure-sensitive adhesive layer formed on the base material, the adhesive strength of which is reduced by exposure, the base, and the conductive adhesive formed on the base. An adhesion step of closely adhering the conductive material layer of the conductive sheet having a conductive material layer containing a conductive material;
An exposure step of exposing the photosensitive adhesive layer in a pattern from a predetermined direction;
1st electroconductivity formed on the adhesion area | region which contains the said base material, the said photosensitive adhesive layer formed on the said base material, and the said electroconductive material, and is not exposed among the said photosensitive adhesive layers. A conductive adhesive sheet-side wiring board having a conductive pattern layer, the base, and the conductive material layer, and a second conductive pattern layer formed on the exposed exposed area of the base. A method for producing a wiring board, comprising: a peeling step for peeling off the conductive sheet side wiring board. A wiring board having a base material, a photosensitive adhesive layer formed on the base material, the adhesive strength of which decreases when exposed to light, and a conductive pattern layer formed in a pattern on the photosensitive adhesive layer There,
The photosensitive pressure-sensitive adhesive layer has an adhesive strength-reduced region where the adhesive strength is reduced by exposure and an unexposed adhesive region, and the conductive pattern layer is formed on the adhesive region. A characteristic wiring board.

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