JP2007064772A - Semiconductor inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device capable of automating setting/registration work for a contact pusher moving amount, capable of enhancing setting precision, and capable of reducing work for an operator. <P>SOLUTION: This semiconductor inspection device provided with a pusher operating means for moving a tape arranged with an inspection objective device to an inspection position contacting with a probe by a contact pusher, and a contact confirming means for detecting the contact of the tape with the probe, is provided with a moving amount detecting means for confirming a detection signal from the contact confirming means, by moving the contact pusher by a prescribed pitch with the pusher operating means to be moved by the next pitch when noncontact, and to be stopped when contacting. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor inspection apparatus including a pusher operating unit that moves a tape on which a device to be inspected is arranged to an inspection position in contact with a probe by a contact pusher, and a contact confirmation unit that detects contact between the tape and the probe. .

  3 and 4 are functional block diagrams showing a configuration example of a conventional semiconductor inspection apparatus. FIG. 3 shows a case where the contact pusher is in the initial position, and FIG. 4 shows a case where the contact pusher is moved downward and is in the inspection position.

  3 and 4, reference numeral 1 denotes a device tape. Devices to be inspected (not shown) are arranged on the tape at a predetermined interval and conveyed in the direction of arrow Q. A contact pusher 2 includes a pair of tape transport members 21a and 21b for contacting the device tape 1 and transporting it in the direction of arrow Q.

  3 is an inspection means, 4 is a probe card arranged opposite to the device tape 1, and 5 is a probe that contacts an electrode of the device to be inspected. Reference numeral 6 denotes a contact means disposed in the probe card 4, which opens and closes by detecting contact between the device tape 1 and the probe 5.

  The contact pusher 2 can be moved up and down in the direction of arrow D by a pusher operating means (not shown) driven by a pulse motor or the like. The upper level where the tape 1 is not in contact with the probe 5 is shifted to the initial position of L0. At this time, the contact means 6 is on.

  When the device to be inspected is set at a predetermined position, the contact pusher 2 is moved downward by the pusher operating means, and the inspection position at the level Lt where the device tape 1 comes into contact with the probe 5 as shown in FIG. Move to. At this time, the contact means 6 is turned off. The movement amount of the contact pusher 2 is registered as a set value in the pusher operating means.

  As the movement amount setting value of the contact pusher 2 to be registered, since the optimum movement amount differs for each lot of the device tape 1, it is necessary to determine and register the optimum value for each lot prior to the inspection. A conventional registration method will be described with reference to FIG.

  7 is a contact confirmation means for inputting an open / close signal of the contact means 6 and lighting the LED 8 when the contact is opened from the closed state to notify the operator. The operator starts the pulse motor of the pusher operating means at the initial position of FIG. 3, confirms that the LED 8 is turned on, and stops the pulse motor by manual operation.

  A counter that integrates the number of pulses sent to the pulse motor during the period from the start operation to the stop operation of the pulse motor by the operator is provided, and the integrated value of the counter is set for the movement amount of the current lot based on the registration command Registered as a value. Thereafter, in the inspection of this lot, the contact pusher 2 is moved according to the registered moving amount setting value.

  Patent Document 1 describes a TAB autohandler that automatically conveys an IC chip mounted on a TAB tape to a measurement position of an IC tester.

JP-A-9-92695

The conventional movement amount registration method has the following problems.
(1) The operation of confirming the lighting of the LED 8 and stopping the pulse motor is a manual operation by the operator. Therefore, the count value of the number of pulses varies due to the timing deviation, and it is difficult to set the movement amount with high accuracy.

(2) The operator needs to check the lighting of the contact confirmation LED and stop the operation while monitoring the image on the monitor TV for monitoring the positional relationship between the electrode of the device to be inspected and the probe, and the operation is complicated. Yes, skill is required.

  Therefore, the problem to be solved by the present invention is to realize a semiconductor inspection apparatus that automates the setting / registration work of the contact pusher movement amount, improves the setting accuracy, and reduces the work of the operator.

In order to achieve such an object, the configuration of the present invention is as follows.
(1) In an inspection semiconductor inspection apparatus comprising a pusher operating means for moving a tape on which a device to be inspected is arranged to an inspection position in contact with a probe by a contact pusher, and a contact confirmation means for detecting contact between the tape and the probe ,
A movement amount detecting means for moving the contact pusher by a predetermined pitch by the pusher operating means to check a detection signal of the contact confirming means, moving the next pitch if not contacting, and stopping the movement if contacting. A semiconductor inspection apparatus comprising:

(2) The movement amount detection means registers the integrated value of the pitch from the initial position of the contact pusher to the generation of the detection signal of the contact confirmation means as an operation set value of the pusher operation means. The semiconductor inspection apparatus according to (1).

(3) The semiconductor inspection apparatus according to (2), further comprising setting value correction means for adding a predetermined correction amount to the operation setting value.

(4) The semiconductor inspection apparatus according to any one of (1) to (3), wherein the pusher operating means is driven by a pulse motor, and the pitch is determined by the number of pulses supplied to the pulse motor. .

As is apparent from the above description, the present invention has the following effects.
(1) The operation of stopping the pulse motor is automatically executed by monitoring the contact confirmation signal for each movement operation of the contact pusher at a predetermined pitch, so that the accuracy of the stop position is maintained within the movement distance of one pitch. And high setting accuracy and reproducibility can be realized.

(2) The operator can concentrate on the monitoring operation of the image on the monitor TV that monitors the positional relationship between the electrode of the device to be inspected and the probe, and can reduce the troublesome operation of the operator.

  Hereinafter, the present invention will be described in detail with reference to the drawings. 1 and 2 are functional block diagrams showing an embodiment of a semiconductor inspection apparatus to which the present invention is applied. The same elements as those of the conventional apparatus described with reference to FIGS.

  FIG. 1 shows the case where the contact pusher is in the initial position, and FIG. 2 shows the case where the contact pusher is moved downward and is in the inspection position. 1 and 2, reference numeral 9 denotes a pusher operating means, which operates the contact pusher 2 in the vertical direction, and shows the level of the device tape 1 from the initial position L0 shown in FIG. Move to inspection position Lt.

  A pulse motor 10 drives the pusher operating means 9. The pusher operating means 9 receives the rotation output R of the pulse motor and converts it into a linear displacement in the direction of arrow D by a ball screw mechanism.

  A pusher control unit 100 to which the present invention is applied includes a driving unit 101 that outputs an operation signal M to the pulse motor 10, an operation amount setting unit 102, and a setting value correction unit 103 by a user. In the setting means 102, an operation setting value S passed from a movement amount detection means described later is registered.

  Reference numeral 200 denotes a movement amount detection unit to which the present invention is applied, and includes a detection control unit 201, a pulse generation unit 202, and an integration unit 203. This movement amount detection means detects the movement amount from the initial position level L0 (FIG. 1) of the device tape to the inspection position level Lt (FIG. 2) for each inspection lot of the device tape 1, and sets the pusher control means 100. The operation setting value S unique to the inspection lot is registered in the means 102.

  A procedure for registering the operation setting value S will be described. The detection control means 201 receives the contact detection signal C from the contact confirmation means 7 and constantly monitors the contact between the device tape 1 and the probe 5. At the initial position of the device tape shown in FIG. 1, the detection signal C has a non-contact status.

  The detection control means 201 confirms the non-contact status of the detection signal C and outputs a command signal F 1 to the pulse generation means 202. When the command signal F <b> 1 is input, the pulse generation unit 202 outputs a pulse P for moving the pusher operation unit 9 downward at a predetermined pitch to the drive unit 101.

  The movement amount of one pitch can be arbitrarily determined by the number of pulses to be generated. The minimum moving amount is a moving amount by one pulse, and a resolution of about several μm can be realized. The pulse P from the pulse generation unit 202 is input to the integration unit 203 and integrated.

  The detection control means 201 confirms the status of the detection signal C of the contact confirmation means 7 at the timing when the movement operation for one pitch is completed, and if not in contact, the pulse generation means 202 outputs a command signal F1 for moving the next one pitch. And the same operation sequence is continuously executed.

  The detection control means 201 monitors the status of the detection signal C of the contact confirmation means 7, and when it detects a status change from non-contact to contact, stops the output of the command signal F 1 and sends the latch signal F 2 to the integration means 203. Output.

  When the latch signal F2 is input, the integration means 203 obtains the integrated value of the pulse P from the first pulse at the initial position of the device tape 1 to the input of the latch signal F2, and the operation setting value S unique to the device tape of this lot. Is registered in the setting means 102 of the pusher control means 100.

  According to the present invention, the operator's operation is only a start command to the movement amount detecting means, and the operation set value S is automatically registered with extremely high accuracy. As a result, the variation of the operation setting value due to the conventional manual operation is improved, and the operator is freed from complicated work while watching the monitor TV.

  For the operation setting value S automatically registered in the setting means 102, the user empirically determines a predetermined pushing amount specific to the lot of the device tape 1, and sets the correction coefficient α by the setting value correction means 103. be able to. According to the present invention, since the operation set value S is extremely accurate, the accuracy of the additional setting of the push amount by the correction coefficient α is also improved.

It is a functional block diagram showing one embodiment of a semiconductor inspection device (initial position) to which the present invention is applied. It is a functional block diagram showing one embodiment of a semiconductor inspection device (inspection position) to which the present invention is applied. It is a functional block diagram which shows the structural example of the conventional semiconductor inspection apparatus (initial position). It is a functional block diagram which shows the structural example of the conventional semiconductor inspection apparatus (inspection position).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Device tape 2 Contact pusher 21a, 21b Tape conveyance member 22 Tape fixing member 3 Inspection means 4 Probe card 5 Probe 6 Contact means 7 Contact confirmation means 8 LED
DESCRIPTION OF SYMBOLS 9 Pusher operation means 10 Pulse motor 100 Pusher control means 101 Drive means 102 Setting means 103 Set value correction means 200 Movement amount detection means 201 Detection control means 202 Pulse generation means 203 Accumulation means

Claims (4)

In an inspection semiconductor inspection apparatus comprising a pusher operating means for moving a tape on which a device to be inspected is arranged to an inspection position in contact with a probe by a contact pusher, and a contact confirmation means for detecting contact between the tape and the probe.
A movement amount detecting means for moving the contact pusher by a predetermined pitch by the pusher operating means to check a detection signal of the contact confirming means, moving the next pitch if not contacting, and stopping the movement if contacting. A semiconductor inspection apparatus comprising:   2. The movement amount detection unit registers an integrated value of the pitch from an initial position of the contact pusher to a detection signal generation of the contact confirmation unit as an operation set value of the pusher operation unit. The semiconductor inspection apparatus described in 1.   The semiconductor inspection apparatus according to claim 2, further comprising a set value correction unit that adds a predetermined correction amount to the operation set value. 4. The semiconductor inspection apparatus according to claim 1, wherein the pusher operating means is driven by a pulse motor, and the pitch is determined by the number of pulses supplied to the pulse motor.

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